JPS57113245A - Sample conveying method into vacuum device - Google Patents

Sample conveying method into vacuum device

Info

Publication number
JPS57113245A
JPS57113245A JP18798280A JP18798280A JPS57113245A JP S57113245 A JPS57113245 A JP S57113245A JP 18798280 A JP18798280 A JP 18798280A JP 18798280 A JP18798280 A JP 18798280A JP S57113245 A JPS57113245 A JP S57113245A
Authority
JP
Japan
Prior art keywords
container
vacuum device
vacuum
sample
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18798280A
Other languages
Japanese (ja)
Inventor
Katsuyuki Arii
Shinya Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18798280A priority Critical patent/JPS57113245A/en
Publication of JPS57113245A publication Critical patent/JPS57113245A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

PURPOSE:To suppress the drop of a contaminant on a sample to minimum by filling the samples one by one in a cleaned small container, evacuating the container, filling the container in a vacuum device, and evacuating the vacuum device. CONSTITUTION:A sample is contained in a small container 5 cleaned completely with the surface to be treated upside. A cover 6 is closed, and the container 5 is evacuated by a vacuum pump. Then, the container 5 is conveyed and disposed in the vacuum device 1. The cover 3 is then closed, and the vacuum device 1 is evacuated by a vacuum pump 8. When the degree of vacuum of the device 1 approaches that to be treated for the sample, the cover 6 of the container 5 is automatically opened.
JP18798280A 1980-12-29 1980-12-29 Sample conveying method into vacuum device Pending JPS57113245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18798280A JPS57113245A (en) 1980-12-29 1980-12-29 Sample conveying method into vacuum device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18798280A JPS57113245A (en) 1980-12-29 1980-12-29 Sample conveying method into vacuum device

Publications (1)

Publication Number Publication Date
JPS57113245A true JPS57113245A (en) 1982-07-14

Family

ID=16215538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18798280A Pending JPS57113245A (en) 1980-12-29 1980-12-29 Sample conveying method into vacuum device

Country Status (1)

Country Link
JP (1) JPS57113245A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62106628A (en) * 1985-11-01 1987-05-18 Fujitsu Ltd Vacuum processing device
JPS62169347A (en) * 1985-10-24 1987-07-25 テキサス　インスツルメンツ　インコ−ポレイテツド Integrated circuit wafer carrier
JPS62181440A (en) * 1985-10-24 1987-08-08 テキサス　インスツルメンツ　インコ−ポレイテツド Load locking and manufacture of integrated circuit
JPH0269957A (en) * 1988-09-06 1990-03-08 Canon Inc Mask cassette
JPH06104328A (en) * 1992-08-04 1994-04-15 Internatl Business Mach Corp <Ibm> Fully-automatic and computerized conveyor-based production line
JPH06104333A (en) * 1992-08-04 1994-04-15 Internatl Business Mach Corp <Ibm> Pressurized interface device
JPH06268045A (en) * 1985-10-24 1994-09-22 Texas Instr Inc <Ti> Manufacture of integrated circuit
JPH07307378A (en) * 1994-05-11 1995-11-21 Shin Etsu Handotai Co Ltd Packing structure for semiconductor wafer housing container, and packing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5487477A (en) * 1977-12-23 1979-07-11 Kokusai Electric Co Ltd Device for etching and stripping semiconductor wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5487477A (en) * 1977-12-23 1979-07-11 Kokusai Electric Co Ltd Device for etching and stripping semiconductor wafer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169347A (en) * 1985-10-24 1987-07-25 テキサス　インスツルメンツ　インコ−ポレイテツド Integrated circuit wafer carrier
JPS62181440A (en) * 1985-10-24 1987-08-08 テキサス　インスツルメンツ　インコ−ポレイテツド Load locking and manufacture of integrated circuit
JPH0629369A (en) * 1985-10-24 1994-02-04 Texas Instr Inc <Ti> Wafer treatment station
JPH0640517A (en) * 1985-10-24 1994-02-15 Texas Instr Inc <Ti> Transfer of wafer and integrated circuit station
JPH0645425A (en) * 1985-10-24 1994-02-18 Texas Instr Inc <Ti> Wafer transfer method and wafer treatment module
JPH06268045A (en) * 1985-10-24 1994-09-22 Texas Instr Inc <Ti> Manufacture of integrated circuit
JPS62106628A (en) * 1985-11-01 1987-05-18 Fujitsu Ltd Vacuum processing device
JPH0269957A (en) * 1988-09-06 1990-03-08 Canon Inc Mask cassette
JPH06104328A (en) * 1992-08-04 1994-04-15 Internatl Business Mach Corp <Ibm> Fully-automatic and computerized conveyor-based production line
JPH06104333A (en) * 1992-08-04 1994-04-15 Internatl Business Mach Corp <Ibm> Pressurized interface device
JPH07307378A (en) * 1994-05-11 1995-11-21 Shin Etsu Handotai Co Ltd Packing structure for semiconductor wafer housing container, and packing method thereof

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