JPS5487477A - Device for etching and stripping semiconductor wafer - Google Patents

Device for etching and stripping semiconductor wafer

Info

Publication number
JPS5487477A
JPS5487477A JP15538377A JP15538377A JPS5487477A JP S5487477 A JPS5487477 A JP S5487477A JP 15538377 A JP15538377 A JP 15538377A JP 15538377 A JP15538377 A JP 15538377A JP S5487477 A JPS5487477 A JP S5487477A
Authority
JP
Japan
Prior art keywords
etching
semiconductor wafer
stripping semiconductor
stripping
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15538377A
Other languages
Japanese (ja)
Inventor
Hitoshi Ogi
Takeshi Naitou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP15538377A priority Critical patent/JPS5487477A/en
Publication of JPS5487477A publication Critical patent/JPS5487477A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP15538377A 1977-12-23 1977-12-23 Device for etching and stripping semiconductor wafer Pending JPS5487477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15538377A JPS5487477A (en) 1977-12-23 1977-12-23 Device for etching and stripping semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15538377A JPS5487477A (en) 1977-12-23 1977-12-23 Device for etching and stripping semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5487477A true JPS5487477A (en) 1979-07-11

Family

ID=15604737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15538377A Pending JPS5487477A (en) 1977-12-23 1977-12-23 Device for etching and stripping semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5487477A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713743A (en) * 1980-06-30 1982-01-23 Toshiba Corp Plasma etching apparatus and etching method
JPS5731151A (en) * 1980-08-04 1982-02-19 Toshiba Corp Automatic continuous treating device for semiconductor substrate
JPS5766641A (en) * 1980-10-09 1982-04-22 Mitsubishi Electric Corp Plasma etching
JPS57113245A (en) * 1980-12-29 1982-07-14 Fujitsu Ltd Sample conveying method into vacuum device
JPS57128928A (en) * 1980-12-22 1982-08-10 Perkin Elmer Corp Device for pretreating, etching and stripping silicon wafer
JPS57134946A (en) * 1981-02-16 1982-08-20 Toshiba Corp Carrying device for semiconductor substrate
JPS57145312A (en) * 1981-01-27 1982-09-08 Instruments Sa Semiconductor producing material treating facility
JPS57170519A (en) * 1981-03-27 1982-10-20 Western Electric Co Device and method for coating molecle beam
JPS58170017A (en) * 1982-03-31 1983-10-06 Tokuda Seisakusho Ltd Plasma etching device
JPS6037129A (en) * 1983-08-10 1985-02-26 Hitachi Ltd Equipment for manufacturing semiconductor
JPS63137169A (en) * 1986-11-27 1988-06-09 Nec Corp Vacuum treatment apparatus
JPH0332U (en) * 1990-05-25 1991-01-07
JPH0936106A (en) * 1996-08-22 1997-02-07 Hitachi Ltd Plasma treatment device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220766A (en) * 1975-08-04 1977-02-16 Texas Instruments Inc Method of removing phtoresist layer and processing apparatus thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220766A (en) * 1975-08-04 1977-02-16 Texas Instruments Inc Method of removing phtoresist layer and processing apparatus thereof

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713743A (en) * 1980-06-30 1982-01-23 Toshiba Corp Plasma etching apparatus and etching method
JPS5731151A (en) * 1980-08-04 1982-02-19 Toshiba Corp Automatic continuous treating device for semiconductor substrate
JPS5766641A (en) * 1980-10-09 1982-04-22 Mitsubishi Electric Corp Plasma etching
JPS57128928A (en) * 1980-12-22 1982-08-10 Perkin Elmer Corp Device for pretreating, etching and stripping silicon wafer
JPS57113245A (en) * 1980-12-29 1982-07-14 Fujitsu Ltd Sample conveying method into vacuum device
JPS57145312A (en) * 1981-01-27 1982-09-08 Instruments Sa Semiconductor producing material treating facility
JPS57134946A (en) * 1981-02-16 1982-08-20 Toshiba Corp Carrying device for semiconductor substrate
JPS57170519A (en) * 1981-03-27 1982-10-20 Western Electric Co Device and method for coating molecle beam
JPS58170017A (en) * 1982-03-31 1983-10-06 Tokuda Seisakusho Ltd Plasma etching device
JPS6037129A (en) * 1983-08-10 1985-02-26 Hitachi Ltd Equipment for manufacturing semiconductor
JPS63137169A (en) * 1986-11-27 1988-06-09 Nec Corp Vacuum treatment apparatus
JPH0332U (en) * 1990-05-25 1991-01-07
JPH0936106A (en) * 1996-08-22 1997-02-07 Hitachi Ltd Plasma treatment device

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