JPS54150333A - Continuously sputtering apparatus - Google Patents

Continuously sputtering apparatus

Info

Publication number
JPS54150333A
JPS54150333A JP5915578A JP5915578A JPS54150333A JP S54150333 A JPS54150333 A JP S54150333A JP 5915578 A JP5915578 A JP 5915578A JP 5915578 A JP5915578 A JP 5915578A JP S54150333 A JPS54150333 A JP S54150333A
Authority
JP
Japan
Prior art keywords
slit
valve
wafers
moved
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5915578A
Other languages
Japanese (ja)
Inventor
Sueo Tsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5915578A priority Critical patent/JPS54150333A/en
Publication of JPS54150333A publication Critical patent/JPS54150333A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PURPOSE:To continuously sputter substrates one by one and make the film thickness uniform by introducing the substrates into a sputtering mechanism and taking them out of the mechanism through the slits of valves for sealing the vacuum chamber side. CONSTITUTION:Semiconductor wafers 14 are introduced into slit 15 made in vacuum chamber side valve 4 of introduction machanism A. Atmosphere side valve 3 is moved to isolate slit 15 from the external atmosphere, and the inside of slit 15 is evacuated. Valve 4 is moved to set wafers 14 in guide rail 6, and by moving valve 4 again the vacuum side is sealed to return the inside of slit 15 to atmospheric press. Wafers 19 reaching sputtering mechanism B are fed by belt 5 and coated with sputtering source 7. When wafers 19 enter slit 15' of valve 10 of taking-out mechanism C, valve 10 is moved to isolate the vacuum chamber side. After returning the inside of slit 15' to atmospheric press. atmospheric side valve 11 is moved to take out wafers 14.
JP5915578A 1978-05-17 1978-05-17 Continuously sputtering apparatus Pending JPS54150333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5915578A JPS54150333A (en) 1978-05-17 1978-05-17 Continuously sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5915578A JPS54150333A (en) 1978-05-17 1978-05-17 Continuously sputtering apparatus

Publications (1)

Publication Number Publication Date
JPS54150333A true JPS54150333A (en) 1979-11-26

Family

ID=13105176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5915578A Pending JPS54150333A (en) 1978-05-17 1978-05-17 Continuously sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS54150333A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2475579A1 (en) * 1979-12-21 1981-08-14 Varian Associates THIN SUBSTRATE TRAINING MACHINE AND ITS HEAT TRANSPORT AND TRANSMISSION DEVICES
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2475579A1 (en) * 1979-12-21 1981-08-14 Varian Associates THIN SUBSTRATE TRAINING MACHINE AND ITS HEAT TRANSPORT AND TRANSMISSION DEVICES
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US5281320A (en) * 1979-12-21 1994-01-25 Varian Associates Inc. Wafer coating system

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