Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co LtdfiledCriticalToshiba Corp
Priority to JP3424377ApriorityCriticalpatent/JPS53119669A/en
Publication of JPS53119669ApublicationCriticalpatent/JPS53119669A/en
PURPOSE: To positively prevent cracking of the insulation layer at chip ends by beforehand providing grooves of defined depth and width in the chip isolating regions of a substrate prior to the formation of an oxide film on the semiconductor substrate surface.
COPYRIGHT: (C)1978,JPO&Japio
JP3424377A1977-03-281977-03-28Production of semiconductor device
PendingJPS53119669A
(en)