JPS5283070A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5283070A JPS5283070A JP15917675A JP15917675A JPS5283070A JP S5283070 A JPS5283070 A JP S5283070A JP 15917675 A JP15917675 A JP 15917675A JP 15917675 A JP15917675 A JP 15917675A JP S5283070 A JPS5283070 A JP S5283070A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- type
- layer
- laminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 230000010354 integration Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lasers (AREA)
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To provide produce semiconductor devices of high scale of integration by laminating a P type layer on an type substrate and connecting active elements formed on the P type and layer surface through conductive through-holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15917675A JPS5283070A (en) | 1975-12-29 | 1975-12-29 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15917675A JPS5283070A (en) | 1975-12-29 | 1975-12-29 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5283070A true JPS5283070A (en) | 1977-07-11 |
Family
ID=15687947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15917675A Pending JPS5283070A (en) | 1975-12-29 | 1975-12-29 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5283070A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS582059A (en) * | 1981-06-26 | 1983-01-07 | Nec Corp | Integrated circuit |
JPS5817636A (en) * | 1981-07-23 | 1983-02-01 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
JPS6052046A (en) * | 1983-06-27 | 1985-03-23 | テレタイプ コ−ポレ−シヨン | Method of producing integrated circuit device |
JPS6052048A (en) * | 1983-06-27 | 1985-03-23 | テレタイプ コ−ポレ−シヨン | Method of producing integrated circuit device |
JPS6052047A (en) * | 1983-06-27 | 1985-03-23 | テレタイプ コ−ポレ−シヨン | Method of producing integrated circuit device |
JPS6074432A (en) * | 1983-09-29 | 1985-04-26 | Nec Corp | Manufacture of semiconductor device |
JPS63278368A (en) * | 1987-05-11 | 1988-11-16 | Nec Corp | Forming method for viahole of semiconductor substrate |
-
1975
- 1975-12-29 JP JP15917675A patent/JPS5283070A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS582059A (en) * | 1981-06-26 | 1983-01-07 | Nec Corp | Integrated circuit |
JPS5817636A (en) * | 1981-07-23 | 1983-02-01 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
JPS6052046A (en) * | 1983-06-27 | 1985-03-23 | テレタイプ コ−ポレ−シヨン | Method of producing integrated circuit device |
JPS6052048A (en) * | 1983-06-27 | 1985-03-23 | テレタイプ コ−ポレ−シヨン | Method of producing integrated circuit device |
JPS6052047A (en) * | 1983-06-27 | 1985-03-23 | テレタイプ コ−ポレ−シヨン | Method of producing integrated circuit device |
JPH053133B2 (en) * | 1983-06-27 | 1993-01-14 | Teletype Corp | |
JPH055169B2 (en) * | 1983-06-27 | 1993-01-21 | Teletype Corp | |
JPS6074432A (en) * | 1983-09-29 | 1985-04-26 | Nec Corp | Manufacture of semiconductor device |
JPS63278368A (en) * | 1987-05-11 | 1988-11-16 | Nec Corp | Forming method for viahole of semiconductor substrate |
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