JPH11108848A - Paste coating correction apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a paste coating correction apparatus capable of continuously correcting coating by a simple command when a long open flaw is corrected. SOLUTION: The flow of the substrate placed on an XY table 6 is photographed by a laser optical system and the photographed image is displayed on a monitor 10 and the start point and terminal point of the disconnection flaw part of the substrate are designated on a monitor screen to move the XY table 6 so as to apply conductive paste to the space between the start point and terminal point of the disconnection flaw part by the coating needle of a paste coating mechanism 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste application / integration apparatus, and more particularly to a paste application / correction apparatus for correcting a defect such as a broken pattern in a PDP substrate, a liquid crystal substrate, a printed circuit board, or the like.

[0002]

2. Description of the Related Art Flat displays such as a plasma display (PDP) and a liquid crystal display (LCD) have been developed with higher definition. Along with this, the width of the electrode pattern of the substrate constituting them has become increasingly narrower, and the probability of occurrence of a so-called open defect in which the electrode is cut has increased. As a method of correcting such an open defect, a technique of attaching a paste to a coating needle and transferring the paste to a defective portion has been proposed in Japanese Patent Application Laid-Open No. 8-292442.

In this method, a paste is applied to an open defect and the paste is corrected, and the procedure is as follows. First, the XY table is moved, and a defective portion of the substrate placed on the table is displayed on a monitor. next,
One point of a defect to be applied with the paste is indicated by a cursor, and an application operation is instructed. Since the center of the optical system axis of the CCD camera capturing the defect image is offset from the position of the paste application needle, the XY table is driven so that the paste application needle matches the position indicated by the cursor. .
After applying the paste on the substrate, the table is driven again to return to the original position, so that the state of the applied portion can be confirmed on the monitor. The defect is corrected by changing the application position as required and repeating the same operation thereafter.

[0004]

In the above-mentioned method, when the length of the open defect is short, coating is completed once or several times, but when the length is long, coating and table movement are repeated many times. It takes time because it is necessary. In addition, since there is a variation in the command position, there occurs a problem that uniform coating cannot be performed.

SUMMARY OF THE INVENTION Therefore, a main object of the present invention is to provide a paste coating and repairing apparatus capable of continuously performing a coating repair by a simple command when correcting a long open defect.

[0006]

The invention according to claim 1 is
A table on which the substrate is placed and movable horizontally, a needle for applying a conductive paste to a defective portion of the substrate,
In a paste coating and repairing apparatus including a driving mechanism capable of moving a needle in a vertical direction, an optical system for imaging a defect of a substrate, and a monitor for displaying the captured image, the defect is a disconnection defect, and the defect is conductive by the needle. Control means for moving a needle or a table so that the conductive paste is applied between the start point and the end point of the disconnection defect.

In the invention according to the second aspect, the start point and the end point of the disconnection defect part in the first aspect are manually input on the monitor screen.

According to the third aspect of the present invention, the start point and the end point of the disconnection defect portion are input by processing the photographed image.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an external view of an entire paste coating and correcting apparatus according to an embodiment of the present invention. In FIG. 1, the devices are roughly classified into a CCD camera 11, a laser optical system 1 comprising a laser and its optical system, a paste application mechanism 2 comprising a needle for applying paste or ink, and an image processing mechanism for recognizing defects. 3 and a control computer 4 for controlling the apparatus and a host computer 5 for communicating with an external or control computer. In addition, an XY table 6 on which a substrate is mounted
And a chuck table 7 for holding a substrate on an XY table 6
And a Z-axis table 8 for driving the laser optical system 1 up and down
And an IR light source 9 for drying the paste, a monitor 10, and the like.

FIG. 2 is a specific mechanism diagram of the paste application mechanism 2 shown in FIG. In FIG. 2, the paste application mechanism 2 includes an application needle 12 and a positioning actuator 13 for driving the needle in a vertical direction. The application needle 12 is provided at the tip of the drive shaft of the actuator 13 via the slide mechanism 14. Further, the paste applying mechanism 2 includes a rotating disk 15 provided horizontally and a plurality of paste containers 16 to 16 arranged sequentially in the circumferential direction on the rotating disk 15.
19, a needle washing unit 20 and an air purge unit 21. The rotating disk 15 is rotated via a rotating shaft 23 by an index motor 22. In addition, a notch 24 is formed in the rotating disk 15 to allow a needle to pass during paste application.

Next, the operation of one embodiment of the present invention will be described. FIG. 3 shows a pattern on the substrate captured by the CCD camera 11 shown in FIG. Here, the defect part 25 is the electrode pattern 26
This is a so-called open defect in which a part of is broken.

First, both ends of the defective portion 25, that is, a start point 27 and an end point 28 are designated on the monitor 10 by using a cursor. The size of the application needle 12, the application diameter 29 when using the application needle 12 and the paste having the designated viscosity (for example, the application diameter φ60 μm when the application diameter φ50 μm is used), and the application pitch 30 are input to the host computer 5 in advance. I have. Based on this, the number of application times and the application position are calculated and stored in the host computer 50. The calculation result is also displayed on the screen of the monitor 10 so that the operator can confirm it.

The application is automatically performed by the host computer 5 sequentially sending the above-described application positions the number of times of application to the control computer 4. This coating operation will be described below. First, the XY table 6 and the Z-axis table 8 are driven to move the application needle 12 to a predetermined position above a defective portion of the substrate. Subsequently, the rotating disk 15 is rotated, and the paste container 16 in which the paste to be applied is stored is positioned below the application needle 12. The application needle 12 is lowered by the positioning actuator 13, and the application needle 1
After the paste is applied to the tip of No. 2, the application needle 12 is lowered from the notch 24 of the rotating disk 15 to apply the paste to the defective portion. The application is repeated in the same manner according to the above-described position information, and the open defect portion 25 is connected. During this time, XY
The table 6 merely performs fine movement for paste application, and does not perform offset movement for confirming the applied state. Since the offset movement is performed only when a series of coating is completed, coating can be performed in a short time. Note that the application needle 12 may be moved instead of moving the XY table 6.

In the description so far, the operator manually inputs the start point and the end point while looking at the image on the monitor screen. However, these positions are automatically input using the image processing device 3. You may do so.

Next, the flow of image processing will be described with reference to FIG. The electrode pattern is based on a combination of continuous linear shapes. First, the image captured from the CCD camera 11 is binarized, and the electrode patterns 31 to 33 and the non-pattern portion 34 are separated. Next, the electrode patterns 31 to 33
The presence or absence of an open defect is determined based on how the outline 35 is connected on the screen of the monitor 30. For example, since the electrode patterns 31 and 33 form one block having a contour including two sides among the four sides of the monitor 10 screen, it is determined that no defect exists in this case. On the other hand, if there are blocks 32a and 32b having outlines including only one side of the screen of the monitor 10, it is determined that an open defect exists between both blocks.

Next, the center lines A and B of each block are obtained,
Points at which the center line intersects with the outlines of the blocks 32a and 32b are calculated, and these are set as a start point 36 and an end point 37.
When the angle α between the center lines A and B is smaller than a certain value,
The blocks 32a and 32b determine that the electrode pattern on the straight line is broken, but if the electrode pattern is large as shown in FIG.
After calculating 8, the number of application and the application position are calculated.

[0017]

As described above, according to the present invention, a long open defect can be automatically removed by moving the needle or the table so that the conductive paste is applied between the start point and the end point of the disconnection defect by the needle. It can be applied and corrected quickly and in a short time.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing an entire apparatus according to an embodiment of the present invention.

FIG. 2 is an external view showing a paste application mechanism shown in FIG.

FIG. 3 is a diagram showing a pattern on a substrate, which is imaged by a CCD camera and displayed on a monitor.

FIG. 4 is a diagram for explaining a method of correcting an open defect.

[Explanation of symbols]

 Reference Signs List 1 laser light source 2 paste coating mechanism 3 image processing mechanism 4 control computer 5 host computer 6 XY table 7 chuck table 8 Z-axis table 9 IR light source 10 monitor 11 CCD camera 12 coating needle 13 positioning actuator 14 slide mechanism 15 rotating disk 16 -19 paste container 20 needle washing unit 21 air purge unit

Claims (3)

[Claims] 1. A table on which a substrate is placed and movable in a horizontal direction, a needle for applying a conductive paste to a defective portion of the substrate, and a driving mechanism capable of moving the needle in a vertical direction. An optical system for imaging a defect of the substrate, and a monitor for displaying the captured image, wherein the defect is a disconnection defect; A paste application correcting device, comprising: a control unit that moves the needle or the table so as to apply a material between a start point and an end point. 2. The paste application correcting device according to claim 1, wherein a start point and an end point of the disconnection defect portion are manually input on the monitor screen. 3. The paste application correcting device according to claim 1, wherein a start point and an end point of the disconnection defect portion are input by processing the photographed image.