JPH08250454A - Manufacture of semiconductor device and dicing jig used for the device - Google Patents

Abstract

PURPOSE: To divide a semiconductor wafer into chips at a high yield by dicing the semiconductor wafer with a dicing jig having through holes for vacuum chucking in recessed sections or recessed section forming areas or on the outside of the forming areas in an area facing the mobile section or protecting section of semiconductor devices. CONSTITUTION: A discoid semiconductor wafer 1 on which a plurality of semiconductor devices respectively having movable sections or projecting sections are formed in each chip is diced into the semiconductor devices with a dicing jig 2 having a movable section, project protective recessed sections 2a, through holes 2b which become wafer fixing vacuum chucking holes, an O-ring 2c for supporting the wafer 1, an air introducing port 2d, and an air blowing port 2e in accordance with a prescribed process flow. A dicing jig made of a high- rigidity material (metal, ceramic, etc.) is used as the jig 2, but it is suitable to use a ceramic material 'Macol' which can be worked easily is suitable. It is also possible to use a silicon wafer for the jig 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device having a movable portion such as a transistor type acceleration sensor or a pressure sensor in a chip, and a mechanical strength such as an air bridge wiring structure. The present invention relates to a method of manufacturing a semiconductor device and a structure of a dicing jig used for the same, in which a semiconductor device having a problematic protrusion is efficiently dicing cut.

[0002]

2. Description of the Related Art Conventionally, as a method of dividing a semiconductor integrated circuit element formed on a silicon wafer into chips, a silicon wafer placed on an adhesive sheet is usually dicing-cut by using a dicing-cutting device. Was there.

At this time, in order to remove chips of silicon and to radiate heat at the time of cutting, and also to cut easily, a wafer is cut into a chip shape while flowing a large amount of cutting water. Was there.

However, in the case where, for example, an element having a movable portion such as a transistor type acceleration sensor or a functional element having a protrusion having a weak mechanical strength such as an air bridge wiring structure is present in a chip, this large amount of cutting is performed. The functional element may be damaged or may not operate normally due to water pressure or surface tension.

To solve this problem, as a conventional technique, in regard to the air bridge structure, in Japanese Patent Laid-Open No. 106947/1990, a resist is applied on a wafer and dicing is cut in a cured state, and thereafter, ultraviolet irradiation is performed in an ozone atmosphere. Then, a method of removing the resist is proposed.

However, according to this method, the resist remains in a region not exposed to ultraviolet rays, and in an element having a movable portion, the movable portion is damaged due to the viscosity of the resist or the rotation (angular velocity) of the spinner during resist coating.
There are problems such that normal operation cannot be performed and there is no preferable method for removing the resist.

As described above, according to the conventional technique, it is not possible to divide a semiconductor device having a movable portion or a protrusion into chips with a high yield.

[0008]

SUMMARY OF THE INVENTION Therefore, the present invention has been made in view of the above points, such as a movable gate of a transistor type acceleration sensor or a diaphragm of a pressure sensor included in a functional element in a semiconductor device. A semiconductor device in which a movable portion or a protrusion such as an air bridge wiring structure is protected by dicing and cutting without using a liquid such as a resist when dicing and cutting, and thus chip division can be performed with high yield. It is an object of the present invention to provide a method for manufacturing the same and a dicing jig used for the method.

[0009]

According to the present invention, in order to solve the above problems, in a method of manufacturing a semiconductor device having a functional element having a movable portion or a protrusion on a surface of a semiconductor substrate, the movable portion or the protrusion is provided. Method for manufacturing a semiconductor device, characterized in that a semiconductor wafer is diced using a dicing jig in which a concave portion is formed in a region facing the concave portion and a through hole for a vacuum chuck is formed inside or outside the region where the concave portion is formed. Will be provided.

Further, according to the present invention, as the dicing jig, a jig made of a highly rigid material such as metal or ceramics, a silicon wafer having a plane orientation (110), or (100) and (110) is an insulator. Provided is a method for manufacturing a semiconductor device using a silicon wafer bonded via, for example.

Further, according to the present invention, a step of mounting a semiconductor wafer having a functional element having a movable portion or a protrusion on the surface of a semiconductor substrate on the dicing jig, and vacuuming from a stage of a dicing cut device. By sucking the semiconductor wafer through a through hole formed in the dicing jig by fixing the semiconductor wafer and the dicing jig, and by the dicing cut device, from the back surface of the semiconductor wafer surface direction After the step of cutting the thickness of the semiconductor wafer by more than half, a step of attaching an adhesive sheet to the back surface of the semiconductor wafer, and a step of attaching the adhesive sheet, a tensile force is applied to the adhesive sheet in a direction in which the cut of the semiconductor wafer spreads. Or give
Alternatively, there is provided a method of manufacturing a semiconductor device, which includes a step of applying an impact by heat or vibration to divide the chip into chips.

Further, according to the present invention, the first dicing jig is formed on the surface of the dicing jig in which the through hole is formed immediately below the recess.
A step of attaching the adhesive sheet, and a step of sucking the first adhesive sheet along the concave portion through a through hole formed in the dicing jig by vacuuming from a stage of a dicing cutting device, A step of sticking a semiconductor wafer having a movable portion or a protrusion on the front surface onto the first adhesive sheet, and after the sticking step, the semiconductor wafer is fully cut from the back surface toward the front surface in a dicing cut for each chip. And a step of attaching a second adhesive sheet to the back surface of the semiconductor wafer after the dicing step, and a step of reducing the adhesive force of the first adhesive sheet after attaching the second adhesive sheet. From the first adhesive sheet, the semiconductor wafer is peeled from the first adhesive sheet, and a tensile force is applied to the second adhesive sheet to which the semiconductor wafer is attached to apply the tensile force. The method of manufacturing a semiconductor device including the step of widening the intervals of flops are provided.

Further, according to the present invention, in a method of manufacturing a semiconductor device having a functional element having a movable portion or a protrusion on a surface of a semiconductor substrate, an adhesive or the like is provided so as to surround the periphery of the movable portion or the protrusion of the semiconductor device. The step of forming a wall on the surface of the semiconductor wafer with a printable material, the step of sticking an adhesive sheet on the wall formed on the surface of the semiconductor wafer, and the step of sticking the adhesive sheet to the surface from the back surface of the semiconductor wafer A semiconductor device including a step of cutting in the direction of half or more of the thickness of the semiconductor wafer, and a step of dividing the pressure-sensitive adhesive sheet into a chip shape by applying a tensile force or a shock due to heat or vibration in a direction in which the cut of the semiconductor wafer spreads. A method of manufacturing the same is provided.

According to the present invention, the functional element formed on the surface of the semiconductor wafer is formed at a portion facing the movable portion or the protruding portion, and the concave portion protects the movable portion or the protruding portion. A dicing jig is provided which is formed inside or outside the region where the recess is formed, and has a through hole for fixing the semiconductor wafer by vacuum suction from a vacuum chuck stage of a dicing device. .

Further, according to the present invention, there is provided a dicing jig having a groove into which packing is inserted in a peripheral portion of the jig and a structure for blowing gas upward from a bottom surface of the groove.

[0016]

According to one aspect of the method of manufacturing a semiconductor device of the present invention, during dicing cutting, the wafer is vacuumed from the vacuum chuck stage of the dicing cutting device through the wafer fixing vacuum chuck through hole in the dicing jig. It is fixed by suction.

At this time, the movable parts and the projections of the semiconductor device are protected by the recesses of the dicing jig.

With the above structure, since it is not necessary to use a liquid such as a resist to fix the movable portion, it is possible to eliminate the step of applying or removing the liquid such as the resist, and the semiconductor device having the movable portion or the protrusion. It becomes possible to efficiently perform the dicing cut.

Therefore, according to the present invention, the wafer on which the semiconductor device having the movable portion or the protruding portion is formed can be divided into chips with a high yield.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) In the first embodiment,
As shown in FIG. 1, a disk-shaped wafer 1 in which a plurality of semiconductor devices having movable parts and protrusions are formed in each chip 1
A dicing jig 2 having a movable part or a protrusion protecting recess 2a corresponding to the above, a through hole 2b serving as a wafer chucking vacuum chuck hole, a wafer supporting O-ring 2c, and an air inlet 2d and an air outlet 2e. The dicing cut is performed by using the process flow shown in FIG.

The dicing jig 2 used in the present invention
Although a material having high rigidity (metal, ceramics, etc.) is used as the material of (3), the ceramic material Macor, which is easy to process, is suitable.

A silicon wafer may be used as another material for the jig 2.

When a silicon wafer is used as the dicing jig 2, a azimuth plane (110) or a wafer in which (100) and (110) are bonded together through an oxide film or polycrystalline silicon may be used.

As a method of processing the insulating film holes and the recesses formed in the jig 2, there are alkaline anisotropic etching such as KOH and laser processing.

In addition, the O-ring 2c inserted into the groove as the air outlet 2e causes the peripheral edge of the dicing jig 2 to be higher than the central portion, so that the wafer 1 can be warped in preparation for warping. You may make it provide the protrusion part (not shown) of the required height in the center part of the jig 2 in the direction which suppresses the warp.

In the following description, the movable parts and protrusions of the functional elements formed on each chip of the wafer 1 will be collectively referred to as the sensor 1a.

Next, the process flow of the dicing cut according to the first embodiment will be described with reference to FIG.

(1) First, as shown in FIG. 2A, the dicing jig 2 is placed on the vacuum chuck stage (not shown) of the dicing cutting device.

(2) Subsequently, as shown in FIG. 2B, the wafer 1 on which the semiconductor device having the movable portion or the protrusion (sensor 1a) is formed is aligned and then placed on the dicing jig 2.

At this time, the concave portion 2a of the dicing jig 2 has a shape capable of sufficiently protecting the sensor 1a.

As a method of aligning the element pattern and the jig concave portion, both patterns are observed at the same time by an optical probe and an image recognition device is used for alignment, or the element is formed in advance. The wafer may be cut and formed along a dicing line, and a step may be provided on the jig side to match the step.

However, in the method of cutting with the dicing line, the sensor 1a needs to be fixed during the manufacturing process.

(3) Next, as shown in FIG. 2C, a vacuum chuck stage (not shown) of a dicing cutting device.
The dicing jig 2 and the wafer 1 are fixed by vacuum suction.

The position and number of the through holes 2b as the wafer chucking vacuum chuck holes of the dicing jig 2 are as follows.
It suffices that the wafer 1 be fixed without shifting during dicing cutting, and it may be formed anywhere as long as the conditions are satisfied.

Further, the O-ring 2c and the air outlet 2e provided on the outer peripheral edge of the dicing jig 2 are for preventing the entry of grinding water used during dicing cutting, but the grinding water must enter. For example, either the O-ring 2c or the air blow (the blow may be another gas) may be used, but it is preferable to provide both of them.

Then, the wafer 1 and the dicing jig 2
The dicing cut 1b is performed after the fixing of No. 1, but the cutting depth of the dicing cut 1b is made as deep as possible (a cutting depth of half or more of the wafer 1 is desirable) to facilitate the subsequent chip division.

(4) Next, as shown in FIG. 2D, dicing is performed in order to stop the vacuum absorption of the dicing and cutting device and make a notch to remove the weakened wafer 1 from the dicing and cutting device. Stick with the adhesive sheet 3 for cutting.

(5) After removing the wafer 1 from the dicing jig 2 as shown in FIG. 2 (e), it is divided into chips as shown in FIG. 2 (f).

As the method of dividing the chip, for example, a method by expanding, applying a heat shock, or rolling a roller or the like on the wafer 1 in a state as shown in FIG. There are methods such as dividing or cutting by irradiation with laser light.

(Second Embodiment) In the first embodiment shown in FIG. 2, since full cutting is not performed during dicing,
A step of dividing the chip after dicing and cutting is required.

Next, an example in which this chip dividing step is eliminated by full cutting will be described.

As shown in FIGS. 3 and 4, the dicing jig 2A used in this case has the through-hole 2 with the O-ring 2c, the air introduction hole 2d and the air outlet 2e removed from FIG.
d is formed immediately below the recess 2a.

The material of the dicing jig 2A is ceramics Macor, which can be easily micromachined, but can be processed by alkaline anisotropic etching such as KOH. The plane orientations (110) and (100) and (110) are made of an insulating material. It may be a silicon wafer bonded by, for example.

Next, the process flow of the dicing cut according to the second embodiment will be described with reference to FIG.

(1) First, as shown in FIG. 5A, a dicing jig 2A in which a through hole 2b is provided in a part of the recess 2a is used in this embodiment.

The recess is necessary when the diameter of the through hole is small due to the structure of the jig, but it may be only the through hole.

(2) Next, as shown in FIG. 5 (b), the thermosetting adhesive sheet 4 is set on the surface of the dicing jig 2A with the adhesive surface facing upward, and the jig is placed on a vacuum chuck (not shown). 2A is placed and the through hole 2b of the dicing jig 2A is placed.
The thermosetting adhesive sheet 4 is sucked by vacuum along the concave portion 2a.

(3) Next, as shown in FIGS. 5C and 5D, the wafer 1 is brought into close contact with the adhesive surface of the thermosetting adhesive sheet 4.

In this case, for example, the wafer pattern and the jig pattern are aligned by image recognition, and then the wafer 1 and the dicing jig 2A are brought into close contact with each other via an adhesive sheet.

(4) Next, as shown in FIG. 5E, from the back side of the wafer 1 until the blade of the dicing cutting device (not shown) reaches the thermosetting adhesive sheet 4, the wafer 1 is chip by chip. Perform a full cut 1c.

After that, the thermosetting adhesive sheet 4 is heated.
Then, an ultraviolet-curable adhesive sheet (not shown) is attached to the back surface of the wafer again, and the interval between chips is widened by ordinary expanding as shown in FIG. 5 (f).

In this case, the adhesive force of the thermosetting adhesive sheet 4 may be reduced by heating after attaching the ultraviolet curable adhesive sheet to the back surface of the wafer.

(Third Embodiment) Although the dicing jig is used for the dicing cut in the above embodiments, the jig is not used in the third embodiment shown in FIG. It is a method of cutting by dicing.

Next, the process flow of the dicing cut according to the third embodiment will be described with reference to FIG.

(1) First, as shown in FIG. 6 (a), a wall 1d surrounding a sensor 1a of a wafer 1 on which a semiconductor device such as a semiconductor sensor having a movable portion is formed.
An adhesive or the like is printed by, for example, a screen printing method to form the.

At this time, the height of the adhesive is increased as much as possible by inserting a filler or the like so that the pressure-sensitive adhesive sheet 5 to be attached in a later step does not touch the sensor 1a at the time of dicing cutting, and the sensor 1a and the adhesive are combined. As close as possible.

After that, the adhesive is hardened by heating with an oven or the like to form the wall 1d.

(2) Next, as shown in FIG. 6B, the wafer 1 is mounted on the wafer mounter vacuum chuck 6 and fixed.

(3) Next, as shown in FIG. 6C, the wall 1 formed by printing an adhesive on the front surface side of the wafer 1.
Stick the adhesive sheet 5 on d.

(4) Subsequently, as shown in FIG. 6D, the wafer 1 having the adhesive sheet 5 attached thereto is printed with an adhesive to form the wall 1d on the vacuum chuck 7 of the stage of the dicing cutting device. The fixed surface is placed on the vacuum chuck 7 side and fixed.

(5) Next, as shown in FIG. 6E, a dicing cut 1b is performed from the back surface of the wafer 1.

At this time, the depth of cut of the wafer is made as deep as possible (the depth of cut is not less than half the thickness of the wafer).

(6) Next, as shown in FIG. 6F, the wafer 1 is removed from the vacuum chuck 7, and the subsequent chip division is performed in the same manner as the method described in the first embodiment.

In the first embodiment, the easily deformable silicon rubber may be used in place of the O-ring 1c which serves as packing for mounting and sealing the wafer.

In the second embodiment, a thermosetting adhesive sheet having higher heat resistance than the thermosetting adhesive sheet 4 may be used instead of the ultraviolet curable adhesive sheet attached to the back surface of the wafer. .

In the second embodiment, the thermosetting adhesive sheet 4 and the dicing jig 2A are joined by vacuum suction from the through hole 2b of the dicing jig 2A.
At this time, the size, position, and number of diameters of the through holes 2b are determined according to the suction force of the vacuum, and if the thermosetting adhesive sheet 4 bends along the recesses 2a, the through holes 2b are It does not necessarily have to be provided in the recess 2a.

[0068]

Therefore, as described in detail above, according to the present invention, a movable part such as a movable gate of a transistor type acceleration sensor or a diaphragm of a pressure sensor or an air bridge wiring structure which a functional element in a semiconductor device has. A method of manufacturing a semiconductor device and a dicing treatment used for the same, which protects such a protrusion without using a liquid such as a resist at the time of dicing and dicing and cutting it so that the chip can be divided at a high yield. It becomes possible to provide a tool.

[Brief description of drawings]

FIG. 1 is a view showing a corresponding relationship between a dicing jig and a semiconductor wafer used in a first embodiment, each of which is cut in half.

FIG. 2 is a diagram showing a process flow of dicing according to the first embodiment.

FIG. 3 is a view showing a correspondence relationship between a dicing jig and a semiconductor wafer used in the second embodiment, each of which is cut in half.

FIG. 4 is a cross-sectional view of a dicing jig used in the second embodiment.

FIG. 5 is a diagram showing a process flow of dicing according to the second embodiment.

FIG. 6 is a diagram showing a process flow of dicing according to a third embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer with movable part or protrusion part, 1a ... Sensor (movable part or protrusion part), 2 ... Dicing jig, 2a
... Movable part or protrusion protection concave part, 2b ... Vacuum chuck through hole for fixing wafer, 2c ... O-ring, 2d ... Air introduction hole, 2e ... Air outlet (O-ring insertion groove), 3
… Adhesive sheet.

Claims (7)

[Claims] 1. A method of manufacturing a semiconductor device comprising a functional element having a movable portion or a protrusion on the surface of a semiconductor substrate, comprising: a concave portion in a region facing the movable portion or the protrusion and inside or outside the region where the concave portion is formed. A method of manufacturing a semiconductor device, which comprises dicing and cutting a semiconductor wafer using a dicing jig having a through hole for a vacuum chuck formed therein. 2. A jig made of a highly rigid material such as metal or ceramics as the dicing jig, or a silicon wafer having a plane orientation (110), or (100) and (11).
2. The method for manufacturing a semiconductor device according to claim 1, wherein a silicon wafer obtained by bonding (0) and (0) via an insulator or the like is used. 3. A step of mounting a semiconductor wafer having a functional element having a movable portion or a protrusion on a surface of a semiconductor substrate on the dicing jig, and the dicing jig by vacuuming from a stage of a dicing cut device. A step of sucking the semiconductor wafer through a through-hole formed in the semiconductor wafer and fixing the semiconductor wafer and the dicing jig, and the dicing cutting device from the back surface of the semiconductor wafer to the front surface direction of the semiconductor wafer. A step of cutting more than half the thickness, a step of attaching an adhesive sheet to the back surface of the semiconductor wafer, and a step of applying a tensile force to the adhesive sheet in a direction in which the cut of the semiconductor wafer spreads after the step of attaching the adhesive sheet, or And a step of giving a shock by heat or vibration to divide into chips. Method of manufacturing a conductor arrangement. 4. A step of attaching a first adhesive sheet to a surface of the dicing jig having the through hole formed immediately below the recess, and a step of vacuuming from a stage of a dicing cut device to form a dicing jig inside the dicing jig. A step of sucking the first adhesive sheet along the concave portion through the formed through-hole, and a step of attaching a semiconductor wafer having a movable portion or a protrusion portion on the surface on the first adhesive sheet, After the attaching step, a step of dicing and cutting the semiconductor wafer from the back surface to a front surface in a full cut for each chip, and a second step on the back surface of the semiconductor wafer after the dicing step.
The step of attaching the adhesive sheet, and after attaching the second adhesive sheet, reducing the adhesive force of the first adhesive sheet, peeling the semiconductor wafer from the first adhesive sheet, 2. The method for manufacturing a semiconductor device according to claim 1, further comprising a step of applying a tensile force to the second adhesive sheet to which the wafer is attached so as to widen the intervals between the chips. 5. A method of manufacturing a semiconductor device comprising a functional element having a movable portion or a protrusion on a surface of a semiconductor substrate, wherein a printable material such as an adhesive surrounds the periphery of the movable portion or the protrusion of the semiconductor device. The step of forming a wall on the surface of the semiconductor wafer, the step of sticking an adhesive sheet on the wall formed on the surface of the semiconductor wafer, and the step of sticking the adhesive sheet, and then the semiconductor wafer in the surface direction from the back surface of the semiconductor wafer And a step of dividing the pressure-sensitive adhesive sheet into chips by applying a tensile force or an impact of heat or vibration in the direction in which the cut of the semiconductor wafer spreads. 6. A concave portion for protecting the movable portion or the protrusion, which is formed in a portion of the functional element formed on the surface of the semiconductor wafer, the portion facing the movable portion or the protrusion.
Formed inside or outside the region where the recess is formed,
A dicing jig having a through hole for fixing the semiconductor wafer by vacuum suction from a vacuum chuck stage of a dicing device. 7. The dicing jig according to claim 6, further comprising: a groove into which packing is inserted in a peripheral portion of the jig, and a structure for blowing gas upward from a bottom surface of the groove.