JPH0823163A - Mounting method for substrate - Google Patents

Abstract

PURPOSE:To provide a method of mounting a substrate in a three-dimensional way without using connection media to cope with a multiplicity of future mounting methods for electronic parts. CONSTITUTION:In this mounting method for a substrate, one end of a substrate 1 to be packaged is a through hole part which is half divided, and the other connection part of the substrate is attached by soldering or with a conductive bonding agent 6 to another substrate 2 in a upright position at the half-divided through hole part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board mounting method for electrically connecting boards, and more particularly to a three-dimensional board mounting method.

[0002]

2. Description of the Related Art Conventionally, as a method of electrically connecting substrates and mounting electronic parts such as IC packages, they are generally mounted in parallel vertically as shown in FIGS. In FIG. 9, a board (hereinafter referred to as A board) 2 to be mounted or an electronic component is arranged in parallel above a mother board (hereinafter referred to as B board) 1, and lead pins 5 are provided in through holes 3 and 4 of both boards 1 and 2.
Is inserted, the lead pins 5 are connected to the through holes 3 and 4 with the solder 6, and the A substrate 2 or the electronic component is mounted. In FIG. 10, the IC package 7 to be mounted is arranged in parallel above the B substrate 1, and the lead wire 8 of the IC package 7 is arranged.
Is connected to the terminals of the B board 1 by the solder 6, and the IC package 7 is mounted. In FIG. 11, CR components to be mounted, LCCs, etc. 9 are arranged in parallel above the B board 1, and the side ends of these are connected to the solder 6 on the B board 1 to form the CR components, LC
This is an implementation of C etc. 9. FIG. 12 shows a ball grid array 11 in which a ball grid array 11 is arranged above a B substrate 1 via solder balls 10 and connected by the solder balls 10.
It is an implementation of 11. Thus, on the B substrate 1, the A substrate 2, electronic components, IC packages, etc. 7, CR components, LC
The reason why the ball grid array 11 is mounted vertically in parallel with C and the like 9 is that it is limited in terms of thermal dimensional shrinkage characteristics and mounting efficiency between the B board and each of the above-mentioned mounted components.
As a method of vertically mounting the A board 2 on the B board 1, as shown in FIG. 13, the lead pin 13 of the connector 12 is inserted into the through hole 3 of the B board 1 and the lead pin 13 is connected to the through hole 3 by the solder 6. Then, there is a method of mounting the A substrate 2 by inserting the side end of the A substrate 2 into the connector 12. Also,
As a special case, there are cases in which the lead pin of the connector is bent at a right angle, inserted into the through hole of the B board and soldered to mount the A board, or a wire harness or FPC (flexible mounting) is used as a connection medium. Since both require a connection medium, the range of use is limited to cameras and the like. However, since the mounting styles of electronic parts will be diversified in the future, it is not possible to deal with the mounting methods so far.

[0003]

SUMMARY OF THE INVENTION Therefore, the present invention is to provide a mounting method of a substrate which can be mounted without using a connecting medium so as to cope with the mounting of electronic parts which will be diversified in the future.

[0004]

According to a method of mounting a board of the present invention for solving the above-mentioned problems, one end of one board to be mounted is halved by a through hole and the other board is connected. It is characterized in that one of the substrates is erected in the portion and is connected by brazing or a conductive adhesive at the half-through hole portion. In this board mounting method,
Legs are formed by leaving the both sides of the half-divided through-hole uncut, and holes are drilled through both sides of the connection part on the other board, and the legs are inserted into these holes and temporarily fixed to stand up. After that, it can be connected to the connection portion of the other substrate at the portion of the half through hole by brazing or conductive adhesive. The one substrate and the other substrate are made of an organic material, and are preferably double-sided printed circuits or multilayer printed circuits.

[0005]

According to the board mounting method of the present invention, it is possible to mount one board directly on the other board without using a connection medium. In particular, the legs are formed by leaving both sides of the half-through hole portion of one substrate uncut, and correspondingly, holes are bored through both sides of the connecting portion of the other substrate, and the legs are inserted into the holes. By inserting the part and temporarily fixing it,
Since one of the boards is accurately positioned, the board mounting accuracy is increased. Further, in the board mounting method of the present invention, by increasing the hole diameter of the through hole on one of the boards, the one through board can be tilted up to about 80 degrees to the left and right. Since it can be connected by brazing or a conductive adhesive, it is possible to cope with diversification of mounting.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the board mounting method of the present invention will be described with reference to the drawing. As shown in FIG. 1, one side end of one A board 2 to be mounted is formed in a straight line at regular intervals. In the state where the through hole 3 is halved by router processing and one A board 2 is erected on the connection 1a of the other B board 1 as shown in FIG. 2, as shown in FIG. Then, the A substrate 2 was mounted vertically on the B substrate 1 by brazing with solder 6 at the portion. In the board mounting method of the above-described embodiment, the diameter of the through hole 3 that divides one A board 2 in half is increased as shown in FIG. Also, as shown by the alternate long and short dash line, solder can be brazed at the portion of the half-through hole 3a even if it is arbitrarily inclined up to about 80 degrees to the left and right, so that it is possible to cope with diversified mounting. Next, another embodiment of the board mounting method of the present invention will be described with reference to the drawings. As shown in FIG. 6, one side end portion of one A board 2 to be mounted is formed in a straight line at regular intervals. The through hole 3 is halved by router processing, and both sides of this through hole 3a are left uncut to form leg portions 15, and the connecting portion 1a of the other B substrate 1 is formed as shown in FIG. A circular hole 16 having the same thickness as that of the leg portion 15 is formed by drilling on both side portions of the base plate, and the leg portion 15 of the A substrate 2 is inserted into the circular hole 16 as shown in FIG. After temporarily fixing and standing up,
The half through hole 3a was brazed and connected to the connection 1a of the B board 1 with the solder 6 and the A board 2 was vertically mounted on the B board 1. In each of the above embodiments, the B substrate 1 and the A substrate 2 are
Although soldering is performed to connect the through holes 3 at the through holes 3, a conductive adhesive material may be used instead. Further, the brazing lands of the A board 2 and the B board 1 have a round shape, an oval shape, a square shape, a rectangular shape, a rhombic shape, a polygonal shape, etc., but the oval type and the track type are preferable in terms of mounting strength. In each of the above embodiments, the through hole 3 of the A substrate 2 is used.
Although it is done by router processing to divide the part in half, press processing is also good. Further, the holes 16 penetratingly formed on both sides of the connecting portion 1a of the B board 1 shown in FIG.
Although it is a drilling process, it may be a router process or a die punching process, and its shape is not limited to a circular shape and may be a square shape.

[0007]

As can be seen from the above description, according to the board mounting method of the present invention, it is possible to mount one board directly on the other board without using a connecting medium. The legs are formed by leaving both sides of the half-through hole of the board uncut, and correspondingly, holes are penetrated through both sides of the connection part of the other board, and the legs are inserted into the holes. Then, by temporarily fixing, one of the boards is accurately positioned, so that the board mounting accuracy is improved. Also, by increasing the hole diameter of the through-hole that is halved on one of the substrates, one substrate can be brazed or connected with a conductive adhesive at the halved through-hole even if the substrate is tilted up to approximately 80 degrees to the left and right. Therefore, it is possible to cope with diversification of implementation.

[Brief description of drawings]

FIG. 1 is a plan view showing one A board to be mounted.

FIG. 2 is a perspective view showing a state in which the A substrate of FIG. 1 is erected at the connection portion of the other B substrate.

FIG. 3 is a view showing that the A substrate in FIG.
FIG. 3 is a perspective view showing a state in which a soldering process is performed on a connection portion of a substrate by soldering and the device is vertically mounted.

FIG. 4 is a plan view showing a state in which a half of a through hole of one A board to be mounted has a large diameter.

FIG. 5 is a side view showing a state in which the A board of FIG. 4 is mounted on the connection portion of the other B board while being tilted.

FIG. 6 is a plan view showing the other side of the A board to be mounted.

FIG. 7 is a perspective view showing another example of the other B board on which the A board of FIG. 6 is mounted.

8 is a perspective view showing a state in which the A board of FIG. 6 is soldered to the B board of FIG. 7 and vertically mounted.

FIG. 9 is a diagram showing a conventional method for mounting a board or an electronic component.

FIG. 10 is a diagram showing a conventional method of mounting an IC package or the like.

FIG. 11 is a diagram showing a conventional mounting method for a CR component, LCC, and the like.

FIG. 12 is a diagram showing a mounting method of a conventional ball grid array.

FIG. 13 is a diagram showing a conventional method in which an A substrate is vertically mounted on a B substrate.

[Explanation of symbols]

 1 B board 1a Connection part 2 A board 3 Through hole 3a Half through hole 6 Solder 15 Leg 16 hole

Claims (5)

[Claims] 1. One side end of one board to be mounted is half-divided by a through-hole portion, and one board is erected at a connecting portion of the other board. A method for mounting a substrate, characterized by connecting with an adhesive. 2. The method for mounting a board according to claim 1, wherein leg portions are formed by leaving both side portions of the through hole portion to be cut in half, and holes are formed by penetrating both side portions of the connecting portion of the other substrate. A mounting method for a substrate, characterized in that the legs are inserted into the holes and temporarily fixed. 3. The board mounting method according to claim 1, wherein the one board and the other board are made of an organic material and are double-sided printed circuits or multilayer printed circuits. 4. The method for mounting a substrate according to claim 1, wherein the one substrate and the other substrate are connected to the half-divided through hole portion by brazing or a conductive adhesive in a state of being at a right angle. . 5. The board mounting method according to claim 1, wherein the brazing is soldering.