JPH0677644A - Formation of terminal part for electronic component having three-dimensional structure - Google Patents
Formation of terminal part for electronic component having three-dimensional structureInfo
- Publication number
- JPH0677644A JPH0677644A JP22852492A JP22852492A JPH0677644A JP H0677644 A JPH0677644 A JP H0677644A JP 22852492 A JP22852492 A JP 22852492A JP 22852492 A JP22852492 A JP 22852492A JP H0677644 A JPH0677644 A JP H0677644A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- printed wiring
- dimensional structure
- mounting
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は上下方向に配列した電子
部品をプリント配線板で両側から挟んで成る三次元構造
電子部品を、マザーボード（プリント配線板）に接続す
るための三次元構造電子部品の端子部形成方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional structure electronic component for connecting a three-dimensional structure electronic component formed by sandwiching vertically arranged electronic components with a printed wiring board from both sides to a mother board (printed wiring board). The method for forming a terminal portion of
【０００２】現在、電子機器を小型化することが要望さ
れており、これに対応するため、電子部品をプリント配
線板上に高密度に実装する技術の開発が要望されてい
る。現在は、電子部品を平面的に配列して実装している
が、これでは大きさが限られたプリント配線板上に実装
できる部品数に限界がある。At present, there is a demand for miniaturization of electronic equipment, and in order to meet this demand, development of a technique for mounting electronic parts on a printed wiring board at a high density is demanded. Currently, electronic components are arranged and mounted in a plane, but this limits the number of components that can be mounted on a printed wiring board of a limited size.
【０００３】そこで、上下方向に配列した電子部品をプ
リント配線板で両側から挟んで成る三次元構造電子部品
を、マザーボードに接続して高密度実装化を図ることが
考えられている。Therefore, it has been considered to connect a three-dimensional structure electronic component in which electronic components arranged in the vertical direction are sandwiched from both sides by a printed wiring board to a mother board for high density mounting.
【０００４】[0004]
【従来の技術】本出願人は、先に、図５に示すように、
複数の電子部品が三次元的に組み込まれた構造を有し、
一つの部品として取り扱われ、マザーボード上に実装さ
れる三次元構造電子部品１を提案した。2. Description of the Related Art The applicant of the present invention, as shown in FIG.
Having a structure in which multiple electronic components are three-dimensionally incorporated,
The three-dimensional structure electronic component 1 which is treated as one component and mounted on the motherboard is proposed.
【０００５】この三次元構造電子部品１は、図５の
（Ａ）〜（Ｃ）に示すように、直立して相対向して配さ
れた一対のプリント配線板２，２の間に、複数の電子部
品（Ｔ−ＳＯＰ：Thin-Small Outline Package）４が、
段積み状態で組み込まれた構造である。As shown in FIGS. 5 (A) to 5 (C), a plurality of the three-dimensional structure electronic components 1 are arranged between a pair of printed wiring boards 2 and 2 arranged upright and facing each other. Electronic parts (T-SOP: Thin-Small Outline Package) 4 of
It is a structure that is assembled in a stacked state.
【０００６】各電子部品４は、電子部品本体５より両側
に延出しているリード６，６を、プリント配線板２，２
のスルーホール８，８に接続させて、プリント配線板
２，２間に支持されている。Each electronic component 4 has leads 6, 6 extending from both sides of the electronic component body 5 on the printed wiring boards 2, 2.
Are connected to the through holes 8 and 8 and are supported between the printed wiring boards 2 and 2.
【０００７】プリント配線板２，２の下端２ａ，２ａに
は、実装用接続部であるスタッドピン１１，１１が設け
てある。上記構造の三次元構造電子部品１は、図５
（Ｃ）に示すように、スタッドピン１１，１１を、マザ
ーボード１３のスルーホール１４，１４に挿入して半田
付けされて実装される。また、リード６，６とスルーホ
ール８，８とは半田付けされている。At the lower ends 2a, 2a of the printed wiring boards 2, 2 are provided stud pins 11, 11 which are mounting connection portions. The three-dimensional structure electronic component 1 having the above structure is shown in FIG.
As shown in (C), the stud pins 11 and 11 are inserted into the through holes 14 and 14 of the motherboard 13 and soldered and mounted. The leads 6 and 6 and the through holes 8 and 8 are soldered.
【０００８】この他、図６に示すように、プリント配線
板２，２の下端に、前記したスタッドピン１１，１１の
代わりに、端子２０，２０を設け、マザーボード２２表
面に設けられたパッド２３に、端子２０，２０を半田付
け実装する方法も先に提案した。In addition, as shown in FIG. 6, terminals 20 and 20 are provided at the lower ends of the printed wiring boards 2 and 2 instead of the stud pins 11 and 11 and pads 23 provided on the surface of the mother board 22. In addition, a method of soldering and mounting the terminals 20, 20 was also previously proposed.
【０００９】[0009]
【発明が解決しようとする課題】ところで、上述した図
５及び図６に示す三次元構造電子部品においては、マザ
ーボードに実装するためのスタッドピン１１及び端子２
０を、プリント配線板２下端部の端子接続部分表裏面に
メッキされた銅パッドに取りつけるようになっている。By the way, in the above-mentioned three-dimensional structure electronic component shown in FIGS. 5 and 6, the stud pin 11 and the terminal 2 for mounting on the motherboard are used.
0 is attached to copper pads plated on the front and back surfaces of the terminal connection portion at the lower end of the printed wiring board 2.
【００１０】このようにスタッドピン１１又は端子２０
を取りつけることは、三次元構造電子部品としての部品
点数や組立工数が増加するといった問題がある。また、
スタッドピン１１による実装にあっては、マザーボード
１３への実装後に、三次元構造電子部品自体が立体的で
電子部品単体よりも重量があるために折れたり、プリン
ト配線板２下端部から外れたりするといった信頼性に欠
ける問題がある。また、スタッドピン１１のピン形状で
はマザーボード１３に両面実装できない。In this way, the stud pin 11 or the terminal 20
There is a problem in that the number of parts as a three-dimensional structure electronic part and the number of assembling steps increase. Also,
In the mounting by the stud pin 11, after mounting on the motherboard 13, the three-dimensional structure electronic component itself is three-dimensional and has a weight larger than that of the electronic component alone, so that it may be broken or may be detached from the lower end portion of the printed wiring board 2. There is a problem of lack of reliability. Also, the pin shape of the stud pin 11 cannot be double-sided mounted on the motherboard 13.
【００１１】本発明は、このような点に鑑みてなされた
ものであり、部品点数や組立工数を削減することがで
き、且つマザーボードへの実装の信頼性を向上すること
ができる三次元構造電子部品の端子部形成方法を提供す
ることを目的としている。The present invention has been made in view of the above circumstances, and it is possible to reduce the number of parts and the number of assembling steps and to improve the reliability of mounting on a motherboard. An object is to provide a method for forming a terminal portion of a component.
【００１２】[0012]
【課題を解決するための手段】上下方向に配列した電子
部品を、この電子部品のリードが、その所定配線部に接
続されるように２枚のプリント配線板で両側から挟んで
成る三次元構造電子部品を、マザーボードに実装するた
めの三次元構造電子部品の端子部の形成方法であって、
プリント配線板のマザーボードに実装する側の端部に、
複数のスルーホールを、マザーボードへの実装端面に沿
って一列に形成し、複数のスルーホールの概略中心を接
続する直線に沿って、プリント配線板の下端部を切断
し、この切断によって得られるスルーホールの概略半円
形部分を端子部とする。A three-dimensional structure in which electronic components arranged vertically are sandwiched from both sides by two printed wiring boards so that the leads of the electronic components are connected to predetermined wiring portions thereof. A method of forming a terminal portion of a three-dimensional structure electronic component for mounting an electronic component on a mother board, comprising:
At the end of the printed wiring board to be mounted on the motherboard,
A plurality of through holes are formed in a line along the mounting end surface on the motherboard, and the lower end of the printed wiring board is cut along a straight line that connects the approximate centers of the through holes. The semicircular portion of the hole will be the terminal.
【００１３】[0013]
【作用】上述した本発明によれば、プリント配線板に、
一列に配列した複数のスルーホールを形成し、その概略
中心を接続する直線に沿って、プリント配線板の下端部
を切断するだけで複数の端子部を形成することができ
る。According to the present invention described above, the printed wiring board is
A plurality of terminal portions can be formed by forming a plurality of through holes arranged in a line and cutting the lower end portion of the printed wiring board along a straight line connecting the approximate centers thereof.
【００１４】このような端子部が設けられた三次元構造
電子部品をマザーボードに実装する場合には、各端子部
をマザーボードのパッドに載置して半田付けすればよ
い。When mounting a three-dimensional structure electronic component having such terminal portions on a motherboard, each terminal portion may be placed on a pad of the motherboard and soldered.
【００１５】[0015]
【実施例】以下、図面を参照して本発明の一実施例につ
いて説明する。図１〜図４は本発明の一実施例による三
次元構造電子部品の端子部形成方法を説明するための図
である。これらの図において図５及び図６に示す従来例
の各部に対応する部分には同一符号を付し、その説明を
省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 to 4 are views for explaining a method of forming a terminal portion of a three-dimensional structure electronic component according to an embodiment of the present invention. In these figures, parts corresponding to respective parts of the conventional example shown in FIGS. 5 and 6 are designated by the same reference numerals, and description thereof will be omitted.
【００１６】図１は三次元構造電子部品の２枚のプリン
ト配線板２，２の下端部に端子部２４を設け、その端子
部２４をマザーボード２２のパッド２３に半田２５で半
田付けすることにより実装した図である。FIG. 1 shows that a terminal portion 24 is provided at the lower end portions of two printed wiring boards 2 and 2 of a three-dimensional structure electronic component, and the terminal portion 24 is soldered to a pad 23 of a mother board 22 with a solder 25. It is the mounted figure.
【００１７】プリント配線板２に端子部２４を形成する
本発明の方法を以下に説明する。図２は図１に示すプリ
ント配線板２の下端部を図１に示す矢印Ｙ方向から見た
図である。The method of the present invention for forming the terminal portion 24 on the printed wiring board 2 will be described below. FIG. 2 is a view of the lower end portion of the printed wiring board 2 shown in FIG. 1 viewed from the direction of the arrow Y shown in FIG.
【００１８】この図から分かるように、プリント配線板
２の端子部２４がマザーボード２２のパッド２３に載置
され、半田２５で半田付けされている。各端子部２４を
形成する場合、まず、基板製造工程において、図３に示
すように、プリント配線板２の下端部に、形成したい端
子部の数に対応したスルーホール３１を形成する。As can be seen from this figure, the terminal portion 24 of the printed wiring board 2 is placed on the pad 23 of the mother board 22 and soldered with the solder 25. When forming each terminal portion 24, first, in the substrate manufacturing process, as shown in FIG. 3, through holes 31 corresponding to the number of terminal portions to be formed are formed in the lower end portion of the printed wiring board 2.
【００１９】スルーホール３１の符号３２は、銅メッキ
部を示す。このように複数のスルーホール３１を形成し
た後、一点鎖線による斜線部分で示すように、スルーホ
ールの半分を、図４の（Ｄ）に示す状態にする。プリン
ト基板の製造工程にて、基板外形をこのように製作す
る。Reference numeral 32 of the through hole 31 indicates a copper plated portion. After forming the plurality of through holes 31 in this manner, half of the through holes are brought into the state shown in FIG. 4D as shown by the hatched portion of the one-dot chain line. In the printed circuit board manufacturing process, the board outer shape is manufactured in this way.
【００２０】この図に示す半円形となったスルーホール
３１の部分が端子部２４となる。図４（Ｅ）は、図４
（Ｄ）に示すプリント配線板２を下端面から見た図であ
り、斜線部分はスルーホール３１の内面の銅メッキされ
た部分を示すものである。The semi-circular through hole 31 shown in this figure serves as the terminal portion 24. FIG. 4E is the same as FIG.
It is the figure which looked at the printed wiring board 2 shown in (D) from the lower end surface, and the hatched portion shows the copper-plated portion of the inner surface of the through hole 31.
【００２１】以上の工程でプリント配線板２に端子部２
４を形成することができるので、従来のように、図５及
び図６に示したスタッドピン１１又は端子２０を取りつ
ける必要がなくなる。従って、その分、部品点数を削減
することができ、また、スルーホール３１を形成して、
カットするだけの工程でよいので、組立工数も削減する
ことができる。Through the above steps, the printed wiring board 2 is connected to the terminal portion 2
4 can be formed, there is no need to attach the stud pin 11 or the terminal 20 shown in FIGS. 5 and 6 as in the conventional case. Therefore, the number of parts can be reduced accordingly, and the through hole 31 can be formed,
Since only the step of cutting is required, the number of assembling steps can be reduced.
【００２２】更には、スタッドピン１１のようにマザー
ボードへの実装後にプリント配線板２下端部から外れた
りするといったことも無くなるので、マザーボードへの
実装の信頼性を向上させることができる。Further, since the stud pin 11 does not come off from the lower end portion of the printed wiring board 2 after being mounted on the mother board, the reliability of mounting on the mother board can be improved.
【００２３】[0023]
【発明の効果】以上説明したように、本発明によれば、
部品点数や組立工数を削減することができ、且つマザー
ボードへの実装の信頼性を向上することができる効果が
ある。As described above, according to the present invention,
The number of parts and the number of assembly steps can be reduced, and the reliability of mounting on the motherboard can be improved.
【図１】本発明の一実施例による三次元構造電子部品の
端子部形成方法により端子部を形成してマザーボードに
実装した際の図である。FIG. 1 is a diagram when a terminal portion is formed by a method of forming a terminal portion of a three-dimensional structure electronic component according to an embodiment of the present invention and mounted on a motherboard.
【図２】図１に示す矢印Ｙ方向からプリント配線板の下
端部周辺を見た場合の図である。FIG. 2 is a view of the periphery of the lower end portion of the printed wiring board viewed from the direction of arrow Y shown in FIG.
【図３】本発明の一実施例による三次元構造電子部品の
端子部形成方法を説明するための図である。FIG. 3 is a diagram illustrating a method of forming a terminal portion of a three-dimensional structure electronic component according to an embodiment of the present invention.
【図４】本発明の一実施例による三次元構造電子部品の
端子部形成方法を説明するための他の図である。FIG. 4 is another diagram illustrating a method of forming a terminal portion of a three-dimensional structure electronic component according to an exemplary embodiment of the present invention.
【図５】本出願人が先に提案した三次元構造電子部品を
示す図である。FIG. 5 is a diagram showing a three-dimensional structure electronic component previously proposed by the applicant.
【図６】本出願人が先に提案した他の三次元構造電子部
品を示す図である。FIG. 6 is a diagram showing another three-dimensional structure electronic component previously proposed by the applicant.
２ プリント配線板 ４ 電子部品 ６ 電子部品のリード ２２ マザーボード ２３ マザーボードのパッド ２４ プリント配線板の端子部（三次元構造電子部品の
端子部） ３１ スルーホール2 Printed wiring board 4 Electronic component 6 Electronic component lead 22 Motherboard 23 Motherboard pad 24 Printed wiring board terminal (terminal of three-dimensional structure electronic component) 31 Through hole
Claims (1)
電子部品(4) のリード(6) が、その所定配線部に接続さ
れるように２枚のプリント配線板(2) で両側から挟んで
成る三次元構造電子部品を、マザーボード(22)に実装す
るための三次元構造電子部品の端子部の形成方法であっ
て、 前記プリント配線板(2) の該マザーボードに実装する側
の端部に、複数のスルーホール(31)を、該マザーボード
への実装端面に沿って一列に形成し、 該複数のスルーホール(31)の概略中心を接続する直線に
沿って、該プリント配線板(2) の下端部を切断し、 この切断によって得られるスルーホール(31)の概略半円
形部分を端子部(24)とすることを特徴とする三次元構造
電子部品の端子部形成方法。1. An electronic component (4) arranged vertically is formed by two printed wiring boards (2) so that a lead (6) of the electronic component (4) is connected to a predetermined wiring portion thereof. A method for forming a terminal portion of a three-dimensional structure electronic component for mounting a three-dimensional structure electronic component sandwiched from both sides on a mother board (22), the side of the printed wiring board (2) being mounted on the mother board. A plurality of through holes (31) are formed in a line along the mounting end surface of the motherboard at the end of the printed wiring board, and the printed wiring is connected along a straight line connecting the approximate centers of the plurality of through holes (31). A method of forming a terminal portion of a three-dimensional structure electronic component, comprising cutting a lower end portion of a plate (2) and using a substantially semicircular portion of a through hole (31) obtained by the cutting as a terminal portion (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22852492A JPH0677644A (en) | 1992-08-27 | 1992-08-27 | Formation of terminal part for electronic component having three-dimensional structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22852492A JPH0677644A (en) | 1992-08-27 | 1992-08-27 | Formation of terminal part for electronic component having three-dimensional structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0677644A true JPH0677644A (en) | 1994-03-18 |
Family
ID=16877771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22852492A Withdrawn JPH0677644A (en) | 1992-08-27 | 1992-08-27 | Formation of terminal part for electronic component having three-dimensional structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0677644A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999051071A1 (en) * | 1998-03-31 | 1999-10-07 | Tyco Electronics Logistics Ag | Smd-capable hybrid circuit |
| US6190425B1 (en) | 1998-11-03 | 2001-02-20 | Zomaya Group, Inc. | Memory bar and related circuits and methods |
| US6295220B1 (en) | 1998-11-03 | 2001-09-25 | Zomaya Group, Inc. | Memory bar and related circuits and methods |
| US6404043B1 (en) | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
| US6426549B1 (en) | 1999-05-05 | 2002-07-30 | Harlan R. Isaak | Stackable flex circuit IC package and method of making same |
| US6762487B2 (en) | 2001-04-19 | 2004-07-13 | Simpletech, Inc. | Stack arrangements of chips and interconnecting members |
| WO2006082620A1 (en) * | 2005-01-31 | 2006-08-10 | Spansion Llc | Layered semiconductor device and layered semiconductor device manufacturing method |
| GB2458299A (en) * | 2008-03-13 | 2009-09-16 | Zarlink Semiconductor Ltd | Printed circuit board assembly |
| US7675155B2 (en) | 2006-06-14 | 2010-03-09 | Entorian Technologies, Lp | Carrier structure stacking system and method |
| US7902651B2 (en) | 2001-05-25 | 2011-03-08 | Stec, Inc. | Apparatus and method for stacking integrated circuits |
-
1992
- 1992-08-27 JP JP22852492A patent/JPH0677644A/en not_active Withdrawn
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999051071A1 (en) * | 1998-03-31 | 1999-10-07 | Tyco Electronics Logistics Ag | Smd-capable hybrid circuit |
| US6190425B1 (en) | 1998-11-03 | 2001-02-20 | Zomaya Group, Inc. | Memory bar and related circuits and methods |
| US6295220B1 (en) | 1998-11-03 | 2001-09-25 | Zomaya Group, Inc. | Memory bar and related circuits and methods |
| US6426549B1 (en) | 1999-05-05 | 2002-07-30 | Harlan R. Isaak | Stackable flex circuit IC package and method of making same |
| USRE39628E1 (en) * | 1999-05-05 | 2007-05-15 | Stakick Group, L.P. | Stackable flex circuit IC package and method of making same |
| US6404043B1 (en) | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
| US6544815B2 (en) | 2000-06-21 | 2003-04-08 | Harlan R. Isaak | Panel stacking of BGA devices to form three-dimensional modules |
| US6566746B2 (en) | 2000-06-21 | 2003-05-20 | Dpac Technologies, Corp. | Panel stacking of BGA devices to form three-dimensional modules |
| US6762487B2 (en) | 2001-04-19 | 2004-07-13 | Simpletech, Inc. | Stack arrangements of chips and interconnecting members |
| US7902651B2 (en) | 2001-05-25 | 2011-03-08 | Stec, Inc. | Apparatus and method for stacking integrated circuits |
| US8686572B2 (en) | 2001-05-25 | 2014-04-01 | Stec, Inc. | Apparatus for stacking integrated circuits |
| US8344518B2 (en) | 2001-05-25 | 2013-01-01 | Stec, Inc. | Apparatus for stacking integrated circuits |
| WO2006082620A1 (en) * | 2005-01-31 | 2006-08-10 | Spansion Llc | Layered semiconductor device and layered semiconductor device manufacturing method |
| US7696616B2 (en) | 2005-01-31 | 2010-04-13 | Spansion Llc | Stacked type semiconductor device and method of fabricating stacked type semiconductor device |
| US7675155B2 (en) | 2006-06-14 | 2010-03-09 | Entorian Technologies, Lp | Carrier structure stacking system and method |
| GB2458299A (en) * | 2008-03-13 | 2009-09-16 | Zarlink Semiconductor Ltd | Printed circuit board assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
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