JPH07201428A - Mechanism for bringing many tsop type ic's into simultaneous contact - Google Patents

Abstract

PURPOSE:To obtain a mechanism for bringing multiple TSOP type IC's into simultaneous contact. CONSTITUTION:Many carriers 2 are idly held by an IC container 3. In the condition that many IC's 1 are housed in the IC container 3, when the IC container 3 is lowered, the carriers 2 are finely moved with a guide of an IC socket 4a, a lead of the IC1 and a contact 4 of the socket 4 are separately positioned. Furthermore, a pressure plate 5 presses the lead of the IC1 against the contact 4c of the IC socket 4 secure the contact.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mechanism for simultaneously contacting a large number of TSOP type ICs with an IC socket. An automatic handler is an example of an apparatus that uses the simultaneous contact mechanism of multiple TSOP type ICs.

[0002]

2. Description of the Related Art TSOP type ICs include an IC 11 with a lead frame 11A shown in FIG. 7A and an IC 1 without a lead frame shown in FIG. Regarding the contact mechanism of the IC with the lead frame,
It is disclosed in the specification of 4-88172. Further, a multi-contact mechanism for ICs with lead frames at high and low temperatures is disclosed by the applicant in the specification of Japanese Patent Application No. 5-27844.

In both of the above-mentioned specifications, the IC socket is provided with a guide pin, and the hole 11 provided in the lead frame 11A is provided.
A guide pin is put in B, and the lead of the IC 11 and the contact of the IC socket are aligned. As mentioned above, an IC with a lead frame facilitates the electrical testing process of the IC. That is, an IC with a lead frame is an IC
After the electrical test, the lead frame 11A is removed and the product is shipped.

On the other hand, after the lead frame 11A is removed, the IC may be electrically tested and a process of shipping as a product may be selected. TSO without lead frame
Although the transport or contact mechanism of the P-type IC is not easy, the following two contact mechanisms have been considered.

Next, the structure of the first contact mechanism according to the prior art will be described with reference to FIG. 1 in FIG. 8 is a TSOP type I
C and 6 are suction devices, 7 is an alignment stage, 8 is a housing stage, 13 is an IC socket, and 14 is a pressing plate.

In FIG. 8A, the IC 1 is housed in the concave portion 7A of the alignment stage 7, and the IC 1
C1 is correctly positioned. The suction device 6 is arranged on the alignment stage 7. The suction device 6 has a rubber suction pad 6A at the tip, and the suction device 6 is connected to a vacuum pump (not shown). That is, the suction pad 6 is changed by switching the pneumatic circuit connected to the vacuum pump.
The inside of A becomes a negative pressure and comes into contact with IC1, and the adsorption device 6 becomes IC.
Adsorb 1 It should be noted that the suction device 6 protects the IC 1 when adsorbing the IC 1 by driving the suction device 6 and the spring 6 to protect the IC 1.
B is elastically held.

From the state shown in FIG. 8A, the adsorber 6 is lowered by a driving device (not shown). When the suction device 6 sucks the IC 1 in the alignment stage 7, the suction device 6 moves up. The suction device 6 moves onto the IC socket 13 while holding the IC 1. Adsorber 6 descends and IC socket 1
After desorption of the IC 1 on the 3, the adsorber 6 moves up.

The IC socket 13 is provided with taper guides 13A standing upright for guiding the four corners of the IC1. That is, when the suction device 6 detaches the IC1, the IC1 is guided by the taper guide 13A, and the leads of the IC1 and the IC socket 1 are guided.
The three contactors 13B are positioned. IC socket 13
The pressing plate 14 is arranged on the upper side. A convex portion 14A is formed on the lower surface of the pressing plate 14, and when the pressing plate 14 descends,
The convex portion 14A presses the lead of the IC1 against the contact 13B of the IC socket 13.

FIG. 8A shows a state in which the pressing plate 14 is lowered and the IC 1 is pressed against the IC socket 13. In the state of FIG. 8A, the IC1 is electrically tested by the IC tester connected to the IC socket 13. When the electrical test is completed, press plate 1
4 rises.

In FIG. 8C, the IC 1 at the end of measurement is attached to the adsorber 6
It is adsorbed by and is moved to the accommodation stage 8. The suction device 6 attaches / detaches the IC 1 to / from the concave portion 8A provided in the housing stage 8.
In FIG. 8, a series of operations from FIG. 8A to FIG.
C1 is conveyed and measured.

Next, the structure of the second contact mechanism according to the prior art will be described with reference to FIGS. 9 and 10. 9 in FIG. 9 is a carrier formed of a synthetic resin material. Carrier 9 has TSO
A recess 9A in which the P-type IC1 is inserted is formed, and two leaf springs 9B for elastically holding the IC1 from the side surface are provided in the recess 9A.

FIG. 9A shows a state before the IC1 is mounted on the carrier 9, and FIG. 9A shows a state in which the IC1 is mounted on the carrier 9 and the IC1 is elastically held by the leaf spring 9B. The carrier 9 has four notches 9C on its side surface. In the second contact mechanism shown in FIG. 9, the IC 1 is mounted on the carrier 9 before the electrical test. Second
In the contact mechanism, the IC with carrier 1 is transported.

Reference numeral 15 in FIG. 10 denotes an IC socket, which is an IC
A tapered guide 15A for guiding the notch 9C shown in FIG. In Figure 10a,
The IC with carrier 1 is integrated by a carrier mechanism (not shown).
Move to socket 15. The carrier 9 in FIG. 10A is a state in which the carrier 9 in FIG. 9A is inverted.

When the carrier 9 descends from the state of FIG. 10A, the taper guide 15A is inserted into the notch 9C of the carrier 9, and the lead of the IC 1 and the contact 15B of the IC socket 15 are inserted.
Is positioned and the state shown in FIG. In FIG. 10A, a pressing plate (not shown) is arranged on the IC socket 15. When the pressing plate descends, the leads of the IC1 are pressed against the contacts 15B of the IC socket 15.

[0015]

SUMMARY OF THE INVENTION In the first contact mechanism,
Since the ICs 1 are conveyed by the suction device 6 one by one, the efficiency is low. A plurality of IC sockets 15 shown in FIG.
In the case of simultaneously measuring a large number of samples, if the IC1 is sequentially moved by the adsorber 6, the IC1 cannot be measured during the moving time, resulting in a problem of poor processing capacity. In the second contact mechanism, it is necessary to mount the IC 1 on the carrier 9 in advance, and there is a problem that the mounting or removing work is troublesome.

According to the present invention, a recess is formed in the IC container in the vertical and horizontal directions, and a TS is held on a carrier that is finely movable with the recess.
A large number of TSOP type ICs that accommodate OP type ICs, and each IC has a positioning pin that is erected on the IC socket so that the leads of the IC and the contacts of the IC socket are aligned and the ICs are pressed against the IC sockets by a pressing plate. The purpose is to provide a simultaneous contact mechanism.

[0017]

In order to achieve this object, the present invention forms an inclined portion 2A for guiding a TSOP type IC1 at four corners, and forms a concave portion 2B for accommodating the TSOP type IC1, A hole 2C is provided in the recess 2B so as to escape the lead of the TSOP type IC1, a reference hole 2D is provided in the first corner, and a fine adjustment hole 2E is provided in the second corner diagonally opposite to the first corner, A carrier 2 having a reference corner hole 2F in a third corner and a recess 3A for accommodating the carrier 2 are formed vertically and horizontally.
Erect the reference pin 3B that enters the reference hole 2D in the first corner of
The fine adjustment hole 2E is formed in the first corner of the concave portion 3A and the second corner diagonally above.
IC container 3 in which a guide pin 3C that enters is installed upright, a guide prism 4A that enters the reference square hole 2F, and a guide prism 4B that enters the hole 2C
And a plurality of I's arranged at positions corresponding to the recesses 3A.
The C socket 4 and the plurality of pressing plates 5 that form the protrusions 5A that come into contact with the leads of the TSOP type IC1 and are arranged at the positions corresponding to the recesses 3A are provided. When the IC container 3 descends in a state where the individual carriers are accommodated, the carrier 2 is guided by the guide prisms 4A and 4B, so that the carrier 2 slightly moves and the TSO.
The lead of the P-type IC 1 and the contactor 4C of the IC socket 4 are aligned with each other, the pressing plate 5 is lowered, and the TSOP-type IC
The lead No. 1 is pressed against the contact 4C of the IC socket 4.

[0018]

According to the above construction, the reference pin 3B and the guide pin 3C provided in the recess 3A of the IC container 3 are inserted into the reference hole 2D and the fine adjustment hole 2E of the carrier 2, and the carrier 2 is I.
It is movably held in the C container 3. I in the IC container 3
When a large number of C1 are accommodated and the IC container 3 descends, the carrier 2 guides the guide prisms 4A and 4A of the IC socket 4.
The carrier 2 is slightly moved by being guided by B and I
The lead of C1 and the contactor 4C of the IC socket 4 are individually aligned. Further, the pressing plate 5 presses the lead of the IC1 against the contactor 4C of the IC socket 4 to ensure the contact. As described above, according to the present invention, a large number of ICs are brought into contact with each other surely at the same time, so that the processing capability of the ICs is improved.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the structure of a contact mechanism according to the present invention is shown in FIG.
Example will be described. 1A is a plan view and FIG.
B is a sectional exploded view of FIG. In FIG. 1, 2 is a carrier, 3 is an IC container, and 4 is an IC socket.

In FIG. 1, the carrier 2 is a TSOP type IC.
Inclined portions 2A for guiding 1 at the four corners are formed. A recess 2B for accommodating the IC 1 is provided in the center of the carrier 2.
Is formed, and a hole 2C is provided in the recess 2B so as to escape the lead of the IC1. Reference hole 2 in the first corner of carrier 2
D is provided, and the fine adjustment hole 2E is provided at the second corner diagonally opposite the first corner. The fine adjustment holes 2E are diagonally elongated holes. A reference square hole 2F is provided in the third corner of the carrier 2.

In the IC container 3, a recess 3A for accommodating the carrier 2 is formed vertically and horizontally. In FIG. 1, only one recess 3A is enlarged in order to facilitate the description of the configuration.
At the first corner of the recessed portion 3A of the carrier 2, a reference pin 3B that stands in the reference hole 2D is provided upright. Guide pins 3C that enter the fine adjustment holes 2E are provided upright at the first corner and the second corner diagonally opposite the recess 3A.

The guide prism 4A that enters the reference square hole 2F of the carrier 2 and the guide prism 4B that enters the hole 2C of the carrier 2 are integrated into an IC.
The socket 4 is erected. Further, a plurality of IC sockets 4 are arranged at positions corresponding to the recesses 3A of the IC container 3.

Next, the operation of FIG. 1 will be described with reference to FIGS. In FIG. 2A, the IC 1 is moved onto the carrier 2 with the suction device 6 sucking the IC 1. Next, the adsorber 6 is IC1
When the IC1 is removed, the IC1 drops, is guided by the inclined portion 2A, and the IC1 is accommodated in the concave portion 2B to be in the state of FIG.
When the ICs 1 are successively accommodated in the plurality of carriers 2, the IC container 3 descends toward the IC socket 4.

FIG. 3A shows the same state as FIG. 2A, and FIG. 3A shows the state in which the IC container 3 is joined to the IC socket 4 from the state of FIG. 3A. In FIG. 3A, the carrier 2 is slightly moved by being guided by the guide prism 4A and the guide prism 4B, and the leads of the IC 1 and the IC socket 4 are moved.
The contactor 4C of 4 is aligned.

Reference numeral 5 in FIG. 4 is a pressing plate, and a comb-shaped convex portion 5A corresponding to the lead of the IC 1 is formed on the bottom of the pressing plate 5. Further, a plurality of pressing plates 5 are arranged at positions corresponding to the concave portions 3A of the IC container 3. When the state of FIG. 3A is completed, the plurality of pressing plates 5 are integrally lowered.
FIG. 4A is a state diagram before the pressing plate 5 is lowered, and FIG. 4A is a state where the pressing plate 5 is lowered, and the convex portion 5A connects the lead of the IC1 to the IC.
The contactor 4C of the socket 4 is pressed to secure the contact. In FIG. 4A, a large number of IC1s are simultaneously electrically tested.

FIG. 5 is an external view of the IC container 3.
The container 3 can accommodate eight ICs 1 vertically and horizontally. Also, IC
A reference hole 3D is formed in the center of the container 3, and the reference hole 3D
Two elliptical guide holes 3E are formed on the same straight line as the center of D. The reference hole 3D is guided to a reference pin 20A of the measurement board 20 described later.

In FIG. 5, the IC container 3 is the IC carrier 10.
The four are arranged vertically and horizontally. That is, if this IC carrier 10 is used, 32 ICs 1 can be carried simultaneously.
In FIG. 5, the IC container 3 is held in the recess 10A so as to be horizontally movable in the IC carrier 10, and the upper surface of the IC container 3 is covered with the lid 10C. Further, rollers 10B are rotatably held at the four corners of the IC carrier to facilitate the transfer of the IC carrier.

Next, an embodiment in which the contact mechanism according to the present invention is incorporated in an apparatus will be described with reference to FIG. Reference numeral 20 in FIG. 6 is a measurement board on which eight IC sockets 4 shown in FIG. 1 are mounted. As shown in FIG. 5, since four IC containers 3 are mounted on the IC carrier 10, four measurement substrates 20 are also arranged in the apparatus. Similarly, four pressing units 21 each having eight pressing plates 5 are arranged in the apparatus.

In FIG. 6, the IC carrier 10 accommodating the IC 1 is carried into the constant temperature bath 22 and held by the elevating mechanism 23. Next, the elevating mechanism 23 descends, and the IC container 3 is positioned with respect to the measurement substrate 20 by the reference pin 20A. Further, when the elevating mechanism 23 descends, the state shown in FIGS. 2 to 3 is established, and the leads of the IC 1 and the contacts 4C of the IC socket 4 are positioned. Next, when the pressing mechanism 24 lowers the pressing unit 21, the pressing plate 5 presses the IC1 to ensure the contact of the IC1.

[0030]

As described above, according to the present invention, a recess is formed in the IC container in the vertical and horizontal directions, and the carrier which is held so as to be finely movable with the recess is T-shaped.
SOP type ICs are housed, and each IC has a positioning pin that is erected on the IC socket so that the leads of the IC and the contacts of the IC socket are aligned, and the pressing plate presses the IC into the IC socket. Since a large number of sheets are transported in a batch, the processing time can be shortened.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of a contact mechanism according to the present invention.

FIG. 2 is an operation explanatory diagram of FIG.

FIG. 3 is a state change diagram of FIG.

FIG. 4 is a state change diagram of FIG.

FIG. 5 is an external view of the IC container 3.

FIG. 6 is a view showing an embodiment in which the contact mechanism according to the present invention is incorporated in an apparatus.

FIG. 7 is an external view of a TSOP type IC.

FIG. 8 is a configuration diagram of a first contact mechanism according to the related art.

FIG. 9 is an external view of a carrier 9 used for a second contact mechanism according to the related art.

FIG. 10 is a configuration diagram of a second contact mechanism according to the related art.

[Explanation of symbols]

 1 IC 2 Carrier 2A Inclined Part 2B Recess 2C Hole 2D Reference Hole 2E Fine Adjustment Hole 2F Reference Square Hole 3 IC Container 3A Recess 3B Reference Pin 3C Guide Pin 4 IC Socket 4A Guide Square 4B Guide Square 4C Contact 5 Press Plate 5A Convex

Claims (1)

[Claims] 1. A TSOP type IC (1) is formed with inclined portions (2A) for guiding the IC (1) at four corners, and a first recess (2B) is formed to accommodate the TSOP type IC (1). The hole (2C) is provided in the first recess (2B) to escape the lead of the IC (1), the reference hole (2D) is provided in the first corner, and the second corner diagonally opposite the first corner. A fine adjustment hole (2E) is provided at the corner of the carrier, and a reference square hole (2F) is provided at the third corner. A carrier (2) and a second recess (3A) for accommodating the carrier (2) are formed vertically and horizontally. , A reference pin (3B) that enters the reference hole (2D) is erected at the first corner of the second recess (3A), and a second corner diagonally opposite the first corner of the second recess (3A). In the IC container (3) that vertically installs the guide pin (3C) that enters the fine adjustment hole (2E), and the first guide prism (4A) and hole (2C) that enter the reference square hole (2F) The second guide prism (4B) to be inserted is erected, and a plurality of IC sockets (4) are arranged at positions corresponding to the second recesses (3A), and a lead of the TSOP type IC (1). And a plurality of pressing plates (5) which are arranged at positions corresponding to the second recesses (3A) and which form a convex part (5A) that comes into contact with the IC container (3). ) Are stored in the IC container (3) and the carrier
The carrier (2) is slightly moved by being guided by the first guide prism (4A) and the second guide prism (4B), and the carrier (2) is slightly moved.
Type IC (1) lead and IC socket (4) contactor (4C)
Are aligned and the pressing plate (5) descends to press the leads of the TSOP type IC (1) against the contacts (4C) of the IC socket (4) at the same time. Contact mechanism.