KR100435209B1 - Semiconductor chip package loading/unloading apparatus with socket pressing plate - Google Patents

Abstract

PURPOSE: A semiconductor chip package loading/unloading apparatus is provided to prolong the lifetime of a burn-in socket and to reduce the process time of chip package loading/unloading by using a socket pressing plate with a plurality of guide holes corresponding to burn-in sockets. CONSTITUTION: A plurality of burn-in sockets(120) are installed on a burn-in board(130). Each burn-in socket includes a recess on the top. An X-Y table(160) capable of moving to X and Y directions is used for loading the burn-in board. A socket pressing plate(250) with a plurality of guide holes(253) corresponding to each recess of the sockets is installed over the X-Y table to press simultaneously the sockets. A plurality of driving tools(140a,140b) are used for loading and unloading semiconductor chips to and from sockets.

Description

Loading / unloading device for semiconductor chip package with socket press plate

The present invention relates to a loading / unloading device for a semiconductor chip package, and more particularly, a socket pressing plate capable of simultaneously opening a plurality of burn-in sockets for loading / unloading a semiconductor chip package into a burn-in socket on a burn-in board. A loading / unloading device for a semiconductor chip package.

In general, after the semiconductor chip package is manufactured, various reliability tests are performed to confirm the reliability of the product. Reliability test is conducted by connecting all the input and output terminals of the semiconductor chip with the test signal generator to test the normal operation and disconnection, and by connecting several input and output terminals such as the power input terminal of the semiconductor chip package with the test signal generator. There is a burn-in test that checks the lifespan and defects of semiconductor chips by applying stress at temperatures, voltages, and currents higher than operating conditions.

The semiconductor chip package in which the manufacturing process is completed is generally put into a burn-in apparatus in a state of being inserted into a burn-in socket of a burn-in board, and a burn-in test process is performed.

At this time, in order to burn-in a plurality of semiconductor chip packages at the same time, the semiconductor chip package before the burn-in test is loaded into the burn-in socket of the burn-in board, or the loaded semiconductor chip package is unloaded from the burn-in socket of the burn-in board according to the test result. (Unloading) to sort through. As such, a device for loading / unloading a semiconductor chip package having a driving tool is used as a device for loading / unloading a semiconductor chip package from a burn-in socket on a burn-in board.

Hereinafter, a loading / unloading apparatus of a semiconductor chip package according to the related art will be described with reference to the accompanying drawings.

1 is a schematic view showing a semiconductor chip package loading / unloading apparatus according to the prior art.

Referring to FIG. 1, a loading / unloading device according to the related art will be described. The loading / unloading device 100 may include a supply tray 70, an XY table 60, a burn-in board 30, and a storage tray ( 80), the sorting unit 90, the drive tool 40.

Burn-in board 30 is a plurality of burn-in socket 20 is inserted into the upper surface of the main board 31, the socket lead (29 in Figure 2) of the burn-in socket is a circuit pattern 33 formed on the main board 31 ) Has a structure electrically connected to each other. In addition, an electrical connection part 35 (Connector) connected to the circuit pattern 33 is formed at one side of the main board 31.

Burn-in by drive tool 40 having adsorption portion (45 in FIG. 2) capable of adsorbing the semiconductor chip package for loading / unloading the semiconductor chip package onto burn-in board 30 located on XY table 60. The semiconductor chip package 10a is loaded into the socket 20 or the burned-in semiconductor chip package 10b is separated.

Here, the driving tool for loading the semiconductor chip package 10a into the burn-in board 30 is called an insertion tool 40a, and the driving tool for unloading the semiconductor chip package 10b from the burn-in board 30 is removed. Let's say 40a). The semiconductor chip package before the burn-in test stored in the supply tray 70 is referred to as a first semiconductor chip package 10a, and the semiconductor chip package where the burn-in test is completed is referred to as a second semiconductor chip package 10b.

A state in which the first semiconductor chip package 110a is accommodated in the burn-in socket 20 installed in the burn-in board 30 of FIG. 1 will be described in more detail with reference to FIG. 2. The adsorption part 45 which adsorb | sucks the package 10a, and the press part 43 which can press the upper body 21 of a socket body to both sides of the adsorption part 45 are comprised. Of course, the structure of the removal tool (40b of FIG. 1) is also the same.

Referring to the process of loading the first semiconductor chip package 10a into the burn-in socket 20, the first semiconductor chip package 10a is sucked after the second semiconductor chip package 10b of FIG. 1 is unloaded. When the pressing portion 43 of the insertion tool presses the upper body 21 of the socket body, the socket lead 29 connected to one side of the upper body 21 is separated from the upper surface of the lower body 23 to open. You lose. At this time, the adsorption part 45 which adsorbs the first semiconductor chip package 10a places the first semiconductor chip package 10a on the upper surface of the lower body 23. Then, when the pressing portion 43 of the insertion tool 40a is raised above the burn-in socket 20, the upper body 21 returns to its original position by the elastic force of the socket lead 29, and the socket lead 29 Is mechanically connected to the lead 12 of the first semiconductor chip package.

In addition, the removing tool 40b may perform the process of separating the second semiconductor chip package 10b of FIG. 1 from the burn-in socket 20 in the opposite process to the inserting process. At this time, the process of loading / unloading the semiconductor chip package is performed at the same time, but when observed on the burn-in board 30, the first semiconductor chip package 10a is first loaded after the second semiconductor chip package 10b is unloaded. 2 is loaded into the unloaded burn-in socket 20 of the semiconductor chip package 10b.

The semiconductor chip package loading / unloading device 100 having such a structure unloads the second semiconductor chip package 10b into the burn-in socket 20 by one operation of the removal tool 40b. By one operation of the 40a, the first semiconductor chip package 10a is loaded into the burn-in socket 20.

Therefore, the time for pressing the upper body 21 of the burn-in socket and the time for loading / unloading the semiconductor chip package 10 by using the adsorption part 45 must be accurately matched. In order to accurately match the loading / unloading time of the semiconductor chip package 10, it is necessary to adjust the process time according to the type of the burn-in socket 20 and the degree of use of the burn-in socket 20. Not easy

In addition, since the replacement cycle of the burn-in socket 20 is closely related to the number of times of pressing of the loading tool 40 according to the loading / unloading of the semiconductor chip package, the smaller the number of times of pressing of the burn-in socket 20 is, the more burn-in socket ( The replacement cycle of 20 may be extended.

However, in order to load / unload the semiconductor chip package 10 into one burn-in socket 20, the press-in of the loading tool 40 exerts a force on the second burn-in socket 20, so that the replacement of the burn-in socket 20 is performed. Naturally, the replacement cycle is longer compared to loading / unloading the semiconductor chip package 10 by pressing once.

The driving time of the loading tool 40 is to pressurize the burn-in socket 20 and to load / unload the semiconductor chip package 10 to be independently performed at each burn-in socket 20. This has a long disadvantage.

Accordingly, an object of the present invention is to provide a loading / unloading device of a semiconductor chip package provided with a socket pressing plate capable of extending the replacement period of a burn-in socket and simultaneously pressing a plurality of burn-in sockets.

Another object of the present invention is to provide a loading / unloading apparatus for a semiconductor chip package provided with a socket press plate, which can shorten a process time for loading / unloading a semiconductor chip package into a burn-in socket of a burn-in board.

1 is a schematic view showing a loading / unloading device of a semiconductor chip package according to the prior art;

2 is a cross-sectional view illustrating a state in which a semiconductor chip package is accommodated in a burn-in socket installed on the burn-in board of FIG. 1;

3 is a schematic diagram illustrating a semiconductor chip package loading / unloading device having a socket pressing plate according to an embodiment of the present invention;

4 is a cross-sectional view illustrating a state in which the burn-in socket installed on the burn-in board of FIG. 3 is pressed and opened by the socket pressing plate;

FIG. 5 is a cross-sectional view illustrating a state in which the second semiconductor chip package is unloaded in the burn-in socket opened in FIG. 4;

6 is a cross-sectional view illustrating a state in which a first semiconductor chip package is accommodated in a burn-in socket in which the second semiconductor chip package of FIG. 5 is removed;

FIG. 7 is a cross-sectional view illustrating a state in which a socket pressing plate is raised after storage of a first semiconductor chip package is completed; FIG.

8 is a schematic diagram illustrating a semiconductor chip package loading / unloading device having a socket pressing plate according to another embodiment of the present invention.

※ Description of the main parts of the drawings ※

110: semiconductor chip package 120: burn-in socket

130: burn-in board 140: drive tool

150, 250: socket press plate 153, 253: guide hole

160: XY table 170: supply tray

180: storage tray 190: classification unit

200, 300: semiconductor chip package loading / unloading device

In order to achieve the above object, among the burn-in sockets of the burn-in board transferred to the XY table, a socket pressing plate having a guide hole corresponding to one row of burn-in sockets is installed on the burn-in board, or the guide holes corresponding to all burn-in sockets are provided. Provided is a device for loading / unloading a semiconductor chip package by installing the formed socket press plate on the burn-in board, and loading / unloading the semiconductor chip package into the burn-in socket with one or all of the burn-in sockets on the burn-in board open. . Here, the semiconductor chip package passes through the guide hole of the socket press plate when loaded / unloaded. Therefore, the guide hole is formed at least larger than the size of the insertion hole of the socket.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

3 is a schematic diagram illustrating a state in which a semiconductor chip package is accommodated in a burn-in board in a semiconductor chip package loading / unloading apparatus having a socket pressing plate according to an exemplary embodiment of the present invention.

Referring to Figure 3 with reference to the loading / unloading device of the semiconductor chip package according to an embodiment of the present invention, the loading / unloading device 200 is a supply tray 170, XY table 160, burn-in board 130, a storage tray 180, a sorting unit 190, a driving tool 140, and a socket pressing plate 150.

The installation relationship of the components of the loading / unloading device 200 will be described. On the XY table 160, the burn-in board 130 into which the second semiconductor chip package 110b having completed the burn-in test is inserted is mounted, and the XY table is mounted. The supply tray 170 in which the first semiconductor chip package 110a is stored is supplied to one side of the 160, and the storage tray in which the second semiconductor chip package 110c is accommodated in the other side of the XY table 160. 180 is supplied. In addition, an insertion tool 140a for loading the first semiconductor chip package 110a from the supply tray 170 to the burn-in socket 120 is installed at an upper portion between the supply tray 170 and the burn-in board 130. The removal tool 140b for unloading the second semiconductor chip package 110b from the burn-in socket 120 is installed at an upper portion between the storage tray 180 and the burn-in board 130. In addition, a sorting unit 190 in which a defective second semiconductor chip package 110d is loaded is provided near a portion where the storage tray 180 is supplied.

The burn-in board 130 has a plurality of burn-in sockets 120 arranged on the upper surface of the main board 131 in rows and rows at predetermined intervals, and the burn-in sockets 120 are electrically connected to the main board 131. A circuit pattern 133 is formed to connect with each other. The socket lead 129 of the burn-in socket has a structure electrically connected to each other by a circuit pattern 133 formed on the main board 131. In addition, an electrical connection unit 135 connected to the circuit pattern 133 is formed at one side of the main board. Here, the connection part 135 of the burn-in board is connected to a burn-in device (not shown), and transmits a test signal sent from the burn-in device to test the semiconductor chip package through a circuit pattern to the semiconductor chip package loaded in the burn-in socket. And it sends the output signal for the transmitted test signal to the burn-in device again through the circuit pattern.

When the burn-in socket 120 installed on the burn-in board 130 is described with reference to FIG. 4, the burn-in socket 120 includes an upper body 121 and an upper body 121 in which the insertion hole 124 of the semiconductor chip package is formed. It is installed spaced apart from the), and includes a socket body of the lower body 123 having an upper surface on which the semiconductor chip package is mounted, and a socket lead 129 installed inside the socket body.

The socket lead 129 protrudes with respect to the lower surface of the lower body 123 and includes an electrical connection part 129b inserted into the burn-in board 130 and an elastic part 129d integrally formed with the electrical connection part 129b. It is formed integrally with the elastic portion 129d, and is integrally formed with the lead connecting portion 129c and the electrical connecting portion 129b and the lead connecting portion 129c in contact with the edge portion of the upper surface of the lower body 123. It has a fixing portion (129a) that is inserted and fixed to the lower surface of the upper body 121.

The burn-in board 130 in which the burn-in socket 120 is installed is mounted on the XY table 160, and the XY table 160 is mounted on the XY table 160 by a planar motion in the X-axis or the Y-axis. A device that assists in loading / unloading the semiconductor chip package 110 into the burn-in socket 120 of the burn-in board.

The socket press plate 150 is installed above the burn-in socket 120 of the burn-in board, and has a structure in which a guide hole 153 is formed to correspond to the insertion hole 124 of the upper body of the burn-in socket 120. As shown in FIG. 3, the socket pressing plate 150 has guide holes 153 corresponding to one row of the burn-in socket 120 installed on the burn-in board 130. And, the guide hole 153 is formed at least larger than the size of the insertion hole 124 of the burn-in socket.

Here, the socket pressing plate 250 of the loading / unloading device 300 according to another embodiment of the present invention illustrated in FIG. 8 has guide holes corresponding to the entire burn-in socket 120 installed on the burn-in board 130. 253 is formed, and the rest of the structure is the same as that shown in FIG. Of course, the guide hole 253 of the socket press plate is also formed larger than the size of the insertion hole of the burn-in socket 120 at least.

Meanwhile, driving methods of the socket press plates 150 and 250 illustrated in FIGS. 3 and 8 are different. That is, it is preferable that the socket pressing plate 250 of FIG. 8 moves in the same manner as the movement of the burn-in board 130 according to the movement of the XY table 160.

However, since the socket pressing plate 150 of FIG. 3 has guide holes 153 formed to correspond to the row of the burn-in socket 120, the socket pressing plate 150 is the same as the movement of the burn-in board 130 as shown in FIG. 8. ), The semiconductor chip package 110 may not be loaded / unloaded into the burn-in socket 120 in which the socket pressing plate 150 is not installed. Therefore, the socket presser plate 150 moves in the same manner as the burn-in board 130 when the burn-in board 130 moves in the X-axis direction, and the burn-in board 130 moves in the Y-axis structure. Have Of course, the movement distance of the Y-axis of the burn-in board 130 should have a movement distance in which the row of the next-in socket 120 corresponds to the socket press plate 150, and the movement of the burn-in board 130 drives the XY table 160. Is made by.

Since the socket pressing plate according to the present invention pressurizes the upper body of the single row or the whole burn-in socket on the burn-in board so that the socket lead can be separated from the upper surface of the lower body, the driving tool 140 does not need a separate pressing part. Only the adsorption part 145 which can adsorb | suck a semiconductor chip package is provided.

Here, the loading / unloading process of the semiconductor chip package 110 using the loading / unloading apparatus 100 of the semiconductor chip package according to the present invention will be described with reference to FIGS. 4 to 7.

Referring to FIG. 4, in a state where the burn-in board 130 in which the second semiconductor chip package 110b having the burn-in test process is completed is transferred to the XY table 160, the socket pressing plate installed on the burn-in board 130 ( When the upper body 121 of the plurality of burn-in sockets 120 simultaneously presses downward, the upper body 121 of the burn-in sockets 120 is lowered. At this time, as the fixing portion 129a of the socket lead inserted and fixed through the upper body 121 and the lower surface is lowered, the lead connecting portion 129c is formed on the lower body 123 by contraction of the elastic portion 129d. The upper surface of the lower body 123 is detached from the lead 112 of the second semiconductor chip package 110b seated in and to unload the second semiconductor chip package 110b through the insertion hole 124. Exposed. At this time, as shown in FIG. 5, the second semiconductor chip package 110b mounted on the burn-in socket 120 is unloaded by the removal tool 140b and loaded into the storage tray (180 of FIG. 3). Here, when the second semiconductor chip package 110b unloaded by the removal tool 140b is a good product (110c in FIG. 3), the second semiconductor chip package 110b is loaded into the storage tray 180, but in the case of a defective product 110d, the classification unit. Loaded to 190.

Next, as shown in FIG. 6, the first semiconductor chip package 110a adsorbed by the supply tray (170 of FIG. 3) is inserted into the burn-in socket 120 in which the second semiconductor chip package 110b is removed. The insertion tool 140a is lowered while the tool 140a is attracted and aligned with the tooth insertion hole 124 of the burn-in socket, thereby loading the first semiconductor chip package 110a on the upper surface of the lower body 123 of the burn-in socket. Done. In addition, as shown in FIG. 7, the process as shown in FIGS. 4 to 6 is repeatedly performed in the other burn-in socket 120 to complete the loading / unloading process of the semiconductor chip package 110. The first semiconductor chip package, in which the upper body 121 of the burn-in socket rises and rises to its original position by the elastic force of the elastic portion 129d of the contracted socket lead, is seated on the upper surface of the upper body 121. The lead 112 and the lead connecting portion 129c of the socket lead are simultaneously connected by mechanical contact.

Conventionally, the loading or unloading process of the semiconductor chip package has been performed in one burn-in socket. However, the above-described process of loading / unloading the semiconductor chip package 140 is performed by a row of burn-in sockets 120 on the burn-in board 130. In the case of FIG. 8, the loading / unloading process of the semiconductor chip package 110 is performed in the burn-in board 130.

Therefore, according to the structure of the present invention, since the plurality of burn-in sockets on the burn-in board are simultaneously pressed by the socket holding plate and the loading / unloading process of the semiconductor chip package proceeds simultaneously with the socket lead opened, The loading / unloading process of the semiconductor chip package is simultaneously performed to extend the life of the burn-in socket, and at the same time, the loading / unloading process of the semiconductor chip package is shortened.

Claims (6)

A burn-in board having a burn-in socket in which a circuit pattern is formed and a row-column is arranged in rows and columns at predetermined intervals on the upper surface of the substrate body, and a tooth-inserting hole is formed in the upper surface to which the semiconductor chip package is inserted ; An XY table on which the burn-in board is mounted, the XY table providing mobility in an X-Y axis direction for accommodating a semiconductor chip package in the burn-in socket; A guide hole is formed on the XY table to correspond to the insertion hole of the burn-in socket. The semiconductor chip package may be loaded / unloaded on the burn-in socket by simultaneously pressing the upper surfaces of the plurality of burn-in sockets. A socket presser plate for opening; And And a driving tool for loading / unloading a semiconductor chip package into the burn-in socket while the socket press plate presses the burn-in socket. The semiconductor chip package loading / unloading apparatus of claim 1, wherein the guide hole has a size at least such that the insertion hole of the socket is exposed through the guide hole. The semiconductor chip package loading / unloading apparatus of claim 1, wherein the socket press plate is formed with a guide hole corresponding to a row of burn-in sockets on the burn-in board. The apparatus of claim 1, wherein the driving tool comprises a removal tool for unloading a semiconductor chip package from the burn-in socket, and an insertion tool for loading a semiconductor chip package into the burn-in socket in which the semiconductor chip package is unloaded. A device for loading / unloading a semiconductor chip package. The apparatus of claim 1, wherein the driving tool comprises: a removal tool for unloading the semiconductor chip package received in the burn-in socket of the burn-in board; And a insertion tool for loading the semiconductor chip package into the burn-in socket of the burn-in board. 6. The device for loading / unloading a semiconductor chip package according to any one of claims 1, 4, and 5, wherein the driving tool has an adsorption portion capable of absorbing the semiconductor chip package.

Images