JPH0627781B2 - Desktop type electronic parts heating test box - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact and convenient tabletop electronic component heating test box used for a heating test of electronic components such as ICs.

2. Description of the Related Art As one of the performance tests of an IC before factory shipment, a burn-in test is performed in which the IC is placed in a hermetically sealed predetermined heat atmosphere and a signal is input / output after a predetermined time has elapsed to measure the performance and determine the quality of the product. Has been.

In this burn-in test, the entire quantity is checked in principle. Therefore, IC makers are equipped with large-sized, heavy-weight thermostats that can burn-in a few thousand ICs at a time. This constant-temperature bath is a fairly large and extremely expensive device including the power supply and auxiliary equipment such as a control device.Since it has a large capacity, it takes time to start up when the operation is stopped. The temperature inside is kept constant.

On the other hand, from the viewpoint of the supply trend of ICs, there has been a tendency for a large number of kinds of conventional rated ICs to be produced in large numbers and to be used in combination by users. There is a trend toward a trend toward miniaturization of a wide variety of products centered on user-specific ICs having functions, for example, ASICs called gate array ICs and custom ICs.

Problems to be Solved by the Invention Therefore, in the constant temperature bath of the IC maker equipment, several thousand I
Although it was suitable for the burn-in test of C, there is a change in the IC supply trend as described above, and one type has a limited quantity, for example, for a burn-in test of several to several ICs. If you have to occupy a large-capacity thermostatic bath with the above-mentioned thousands of IC test capacities, and if you keep it in a constantly operating state, it will cause a large loss and lack economic efficiency, and it will be difficult to control the temperature inside the bath due to the quantity. There are also technical problems that make stable measurement difficult.

Further, in developing an ASIC for a specific user, the IC development department also needs a test in a laboratory stage before putting it on the production line. Further, recently, for the purpose of ensuring the reliability of ICs, most of the OA equipment manufacturers are in a state of conducting a burn-in test again as needed after purchase.

From the above background, there is a demand for efficient and convenient heating test of a small amount of ICs, and the present invention provides a compact and convenient desktop type electronic component heating test box that is highly mobile. At present, for the burn-in test of the IC, only the constant temperature bath is used, and there is no portable heating test device that satisfies the above demand.

MEANS FOR SOLVING THE PROBLEMS The present invention relates to a desk-top type electronic component heating test box suitable for a heating test of a limited number of electronic components such as ICs, which is unsuitable for a conventional constant temperature oven as described above. The main body is a rectangular portable sealed box. The portable airtight box includes a substrate supporting means for detachably mounting an electronic component test board in a closed space of the box, and a heating means such as a heating plate for heating the test board in the closed space. And a connector means arranged to connect the heating means from the outside to a commercial power source, in addition to a connector means arranged to measure the electronic components mounted on the electronic component test board from the outside. And a lid for opening the electronic component mounting surface of the electronic component test board installed in the sealed space of the portable sealed box, further including means on the outer wall of the box. It is formed so that the electronic component can be measured through the measurement work opening formed by opening the lid, and a stand-up protruding from the outer surface of the panel facing the lid. With the standoff, the portable airtight box is supported at the floor height and the electronic component test board is horizontally and stably placed during heating and measurement work, and the lid body is opened and closed on the upper surface side. The portable airtight box is provided with a handle at an appropriate position so that the heating test can be carried to a test work place at any time.

Function The tabletop electronic component heating test box is freely moved to the test work place by using the handle, and the test work is performed by, for example, installing the box on the desk by the standoff. When installed on a desk or the like, the test board is placed in a horizontal state by standoffs and placed in a state suitable for a heating test.
By connecting the commercial power source to the commercial power source connecting connector means, the heating means is energized to quickly raise the temperature in the closed space having a limited volume. When the above test substrate is placed in a horizontal state in the closed space of the box and subjected to a heating test,
The lid provided so as to face the test substrate is placed on the upper surface side of the same box, and in the above heating state, the lid is immediately opened and the electronic component mounting surface of the test substrate is opened to measure and check the electronic components. Done. That is, by opening the lid, a measurement work opening is formed on the upper surface side of the box installed by the standoff, and the opening opens the space above the electronic component mounting surface to measure the electronic component from above. To do.

Further, the measured electronic component is attached / detached from above through the measurement work opening, and similarly the electronic component to be measured from now on is also mounted on the test board through the measurement work opening. An electronic component socket is installed on the test substrate and connected to a test circuit formed on the surface of the substrate, and the electronic component is connected to the test circuit via the socket.

The test box can be moved freely to the work place by holding the handle, and the above test work can be performed immediately by connecting the commercial power supply near to the connector provided on the box. The above test can be performed without any restrictions on the location such as a room, development room, or office.

Since this test box is for measuring and testing a limited number of electronic components in a closed space with a limited volume,
By connecting the commercial power source through the connector, the temperature in the closed space can be efficiently raised to the required temperature in a short time, and the power loss can be prevented by turning off the power when not in use.

As described above, this test box is suitably used for a heating test of a limited small amount of electronic parts such as the above-mentioned ASIC,
The above heating test can be carried out immediately by using a commercial power source whenever necessary by placing it close to the user and providing a test box that is convenient and highly mobile.

Embodiment An embodiment of the present invention will be described in detail based on the embodiment shown in FIGS. 1 to 13.

This tabletop electronic component heating test box is intended for the heating test of a small amount of small electronic components that can be moved.
The main body is a rectangular portable closed box 1 as shown in FIGS.

The portable airtight box 1 includes a test substrate 30 that is detachably laterally supported in a closed space of the box 1, and has a wide panel (hereinafter referred to as front face) facing an electronic component mounting surface of the test substrate 30. A lid 2 for forming a measurement work opening 50 formed by a panel), and a stand for supporting the portable airtight box 1 on the floor height on a wide rear panel facing the lid 2. An off 25 is provided. This standoff 25 is preferably made of an electrically insulating material and an insulating material.

The lid body 2 is provided with a clasping means 27 for clogging or handles for convenient opening and closing work.

As described above, the test substrate 30 is installed so as to face the lid body 2, and the box 1 is placed on a desk or the like by the standoff 25 and subjected to a heating test. When the box 1 is placed on the desk, the test substrate 30 and the lid are placed. The body 2 is placed in a horizontal state, the lid 2 is arranged so as to face the upper surface of the test substrate 30, that is, the electronic component mounting surface, and by opening the lid 2, the upper space of the electronic component mounting surface. Is opened and a measurement work opening 50 is formed.

A handle 5 such as a handle or a belt is provided on an appropriate place of the box 1, preferably a narrow side panel adjacent to the front panel, and the box 5 can be carried to a test place at any time by holding the handle 5. A separate standoff 26 is provided on the narrow side panel facing the panel provided with the handle 5.
The box 1 is carried by the handle 5 and the standoff 26 is set for other than the test.

The portable airtight box 1 has substantially the same size as the outer shape of the test substrate 30 on which the electronic component 45 is mounted on the front panel side forming the lid body 2, and is relatively thin on the side panel side.

In the closed space in the box 1 closed by the lid body 2, there are provided a substrate supporting means for removably mounting the test substrate 30 and a heating means for heating the test substrate 30.

The substrate supporting means is formed by a pair of guide tracks 6 as shown in FIG. 3 as an example. The guide track 6 extends in parallel along the inner surfaces of the pair of side panels facing the thickness of the test substrate 30 of the closed box 1, and the test substrate 30 is guided from the one end of the track 6 by the guide of the track 6. 1, the edge portion of the test substrate 30 is engaged with the track 6 as shown in FIG.

As one means for inserting the test substrate 30 into the box 1, the side panel on one end side of the guide track 6 forms the gate plate 3. The gate plate 3 can be inserted into and removed from the front panel side forming the lid body 2, and in order to perform the insertion and removal, one end of each side panel provided with the guide track 6 is extended in the extending direction of the guide track 6. The guide grooves 43 extending in the perpendicular direction are arranged to face each other. The entrance of the guide groove 43 is closed by the lid body 2 and is opened by opening the lid body 2 so that the test substrate 30 can be inserted and removed. An insertion port 4 for the test substrate 30 is formed at one end of the guide track 6 in the extension region of the guide groove 43, the lid 2 is opened as shown in FIG. By removing from the guide groove 43, one side surface of the board insertion port 4 and the box 1 is opened so that the test board 30 can be inserted into and removed from the guide track 6, and as shown in FIG. By inserting 3 into the guide groove 43, the substrate insertion port 4 is closed to prevent the gas in the box from flowing in and out.

Further, as shown in FIGS. 2 and 3, connector means 11 is provided on the side panel facing the gate plate 3 at the end of the guide track 6 opposite to the board insertion port 4, and Signals are input and output through the connector means 11 to the signal circuit pattern 34 formed in close contact with the surface of the test substrate 30.
The connector means 11 has an insertion slot 12 for the test substrate 30 that opens to the inner surface of the box 1, and a contact 13 that is exposed on the outer surface side of the box 1 for inputting and outputting signals. When the test board 30 is inserted into the guide track 6 as described above, the connection plate portion 42 extending to the end portion of the board at the end of the insertion is inserted into the board insertion slot 12, and the surface of the connection plate portion 42 is inserted. Circuit terminals 41 arranged closely
Connect to the contact 13 in the slot 12. Reference numeral 40 is a socket mounted on the upper surface of the test substrate 30, the socket 40 is connected to the upper surface circuit pattern 34 via solder or the like, and an electronic component 45 such as an IC is connected to the socket 40. The circuit pattern 34 and the signal input / output connector 11 via the socket 40.
Connect with. A test substrate 30 horizontally mounted on the supporting means.
The electronic component mounting surface faces the lid body 2, and by opening the lid body 2, the entire mounting surface is opened upward to form a measurement work opening 50.

The heating means is a closed space in the box 1 closed by the lid 2 and a test substrate 30 in the closed space.
An electronic component 45 such as an IC mounted on the substrate 30 via the socket 40 is heated.

FIGS. 3, 4, and 6 show an example of the heating means in which the test substrate 30 itself also functions as a heating plate. As shown in FIG. 11, the test substrate 30 which also serves as the heating plate has an insulating layer 37 on the surface of a metal plate 31 such as aluminum having good thermal conductivity.
A wiring board 32 having a signal circuit pattern 34 on the front and back is layered on the back surface of the metal plate 31, and a heater circuit pattern 35 is provided on the back surface of the metal plate 31 via an insulating layer 33. The heater circuit pattern 35 is covered with a protective layer 38, the protective layer 38 is removed at the connection plate portion 42, the terminal 36 of the heater circuit pattern 35 is arranged in an exposed state, and a commercial power source is connected to the terminal 36. The configuration.

FIG. 12 shows a test substrate 30 which also serves as the heater plate.
Another example is shown. In the test substrate 30, a signal circuit pattern 34 is layered on the surface of an insulating plate 39 having good thermal conductivity represented by ceramics and the like, and a heater circuit pattern 35 is layered on the back surface thereof.

Each of the test substrates 30 shown in FIGS. 11 and 12 has a signal circuit pattern 34 on one surface and a heater circuit pattern 3 on the other surface.
5, the high heat conductive metal plate 31 or the high heat conductive insulating plate 39 is heated by the heater circuit pattern 35, and the signal is uniformly diffused by the metal plate 31 or the insulating plate 39 and layered on the surface thereof. The circuit pattern 34 for heating is uniformly heated, and the socket 40 and the electronic component 45 connected to the circuit pattern 34 are also uniformly heated. At the same time, the sealed space of the portable sealed box 1 occupied by the test substrate 30 is uniformly heated. In order to detect the temperature in the closed space, a connector 9 for the temperature sensor 10 is provided at an appropriate place in the box 1, and the temperature sensor 10 is placed in the box.

As another example of the heating means, as shown in FIG.
Separately from the test substrate 30, a heater plate 49 having a heater circuit pattern 35 dedicated to heating is formed, the heater plate 49 is placed inside the box 1, and the test substrate 30 is parallel to the substrate 30. To arrange. As shown in FIG. 13, the heater circuit pattern 35 is arranged in a meandering manner so that it is dense at both ends and sparse in the middle.

As means for energizing the heater plate 49 and the test substrate 30 which also serves as the heater plate, a connector means 8 for connecting a commercial power source is provided at an appropriate position of the portable sealed box 1.
To provide. For example, the connector means 8 is provided on a side panel other than the front panel forming the lid 2, and is externally connected to a commercial power source by a plug. The connector means 8 and the heater circuit 35 are directly connected by a conductive wire as shown in FIG. 10, or they can be connected and disconnected through a switch means. For example, when the test board 30 also serves as a heater plate, the test board 30 is connected to the connector means 8 via the switch means so that the test board 30 can be removed from the box 1, and the heater plate 49 shown in FIG. When the test board 30 is separated from the test board 30, the connector means 8 can be directly connected to the test board 30 by a conductive wire.

The switch means is provided in a suitable place of the box, for example, near the connector means 8. 3 and 6 show an example of the switch means. As shown, mounting piece 2
4 is provided with a switch lever 14 so that the switch lever 14 can be rotated about a shaft 22 as a fulcrum.
A movable block 15 made of an insulating material having a contact piece 16 on the surface thereof is disposed via the above, and the movable block 15 is arranged below the connection plate portion 42 of the test substrate 30 to make the contact piece 16 a heater circuit pattern. 35, the terminal 36 of the contact piece 16 of the movable block 15 and the connector means 8 are connected to each other by a conductor 21, and the movable block 15 is elastically supported by a spring 19 to contact the contact piece 16. Is urged in a direction to contact the heater circuit terminal 36, and the free ends of the movable block 15 and the switch lever 14 are connected by a connecting member 18, so that the lever 14 is moved in one direction as shown in FIG. 6A. By rotating it, the movable block 15 is lowered against the spring 19 through the connecting member 18 to separate (contact release) the contact piece 16 from the heater circuit terminal 36, and conversely, as shown in FIG. 6B. Switchable Over 14 to form a contact state between the push-up armature 16 a movable block 15 in the elastic force of the spring 19 and the heater circuit terminal 36 by rotational operation in the other direction in accordance with the spring 19. As a means for holding the switch lever 14 in each of the operation positions, for example, a means for selectively engaging a ball 23 held by a spring in the two holes is used.

By providing the switch means as described above, with the plug inserted in the connector means 8 for connecting the commercial power source,
It is possible to energize and de-energize the heater circuit pattern 35 from a commercial power source, and the test substrate 30 can be removed from the box 1 and replaced with another substrate. When removing the test substrate 30, as shown in FIG.
After opening the gate plate 3 and removing the gate plate 3 from the guide groove 43, the guide plate 6 may be slid and pulled out from the insertion port 4.

FIG. 8 and FIG. 9 show the case where the measurement work opening 50 formed by opening the lid 2 is used as a means for detachably mounting the test substrate 30 in the box 1.

As shown in the figure, a pair of substrate support seats 47 are provided along a pair of opposing side panels, and the test substrate 30 is accommodated from the measurement work opening 50 and placed on the support seat 47 to be in a horizontal state. As a means for engaging with the edge portion of the test substrate 30, a locking piece 46 having elasticity as shown in the drawing is provided at an appropriate position of the support seat 47. The locking piece 46 is the test substrate 30.
Is elastically displaced rearward when it is pushed into the inside of the locking piece 46 and is restored forward when the substrate 30 is placed on the support seat 47, and engages with the edge of the substrate. Further, by pulling up the test substrate 30 against the elasticity of the locking piece 46, the engagement by the locking piece 46 is released, and it can be taken out from the measurement work opening 50.

In this case, the measurement work opening 50 functions as an opening for measuring the electronic component 45 and for attaching and detaching the test substrate 30. The electronic component 45 such as an IC can be attached to and detached from the socket 40 through the opening 50.

When the structure for mounting the test board 30 through the measurement work opening 50 is used, the connector 48 is attached to the lower surface of the connection plate portion 42 of the test board 30, and the rear panel facing the lid body 2 of the other box 1 has the above-mentioned structure. The signal input / output connector 11 is mounted so as to face the connector 48. Both connectors 4
8 and 11 are coupled to each other when the test substrate 30 is fitted from the measurement work opening 50 and supported on the support seat 47.

As shown in FIG. 3, the lid body 2 is separable from the box body, and the lid body 2 and the box 1 are provided with lid locking means 7 such as a patch lock on the opening edge portion of the box 1 for the measurement work opening. 50 is closed and the sealed state is maintained.

As another example, as shown in FIGS. 7 and 8, one end of the lid body 2 is openably and closably attached to the box body through a hinge 44 such as a hinge, and the free end of the lid body 2 is locked by the above-mentioned patch lock or the like. It is locked and can be sealed via means 7.

In addition, the case where one test substrate 30 is provided in the box 1 is illustrated, but two or more test substrates 30 can be provided side by side, and
Further, according to the present invention, the substrate 30 is laterally supported in the inner cavity of the lid body 2 in the same manner as described above, and when the lid body 2 is opened, the substrate 3
An embodiment in which 0 is attached to the lid body 2 and opened is included.

For example, at the same time as mounting the test substrate 30 in the box body by the method described above, the lid 2 also holds the substrate 30.
When the lid body 2 is closed, both substrates are arranged in parallel in the closed space of the box 1 with a space above and below.

Then, the portable airtight box 1 is set to the standoff 25.
When installed at a floor height on a desk or the like, the test substrate 30 laterally supported in the box 1 is held in a horizontal state, and when the commercial power source is connected to the connector means 8 and the switch means is turned on, the heating means, That is, the heater circuit pattern 35
Is energized to the inside of the closed space of the box 1 and the test substrate 30.
Then, the electronic component 45 mounted on the board 30 is heated. After reaching the predetermined heating temperature, a signal is input / output through the contact 13 of the signal input / output connector means 11 to perform various checks and measurement tests of the electronic component 45.

In addition, when the predetermined heating temperature is reached, the lid 2 is opened to open the electronic component mounting surface of the test substrate 30 and the test detection is performed from the measurement work opening 50 formed by opening the lid 2. A child is inserted and brought into contact with each terminal of the socket 40 to perform various checks and measurement tests of electronic components.

Since the heating temperature decreases when the lid 2 is opened, the lid 2 is closed again after a lapse of a predetermined time, the lid 2 is opened again after the temperature rises, and the same measurement test as above is continued. After the measurement is completed, another electronic component is mounted on the socket 40 through the measurement work opening 50 and the same test as above is repeated.

EFFECTS OF THE INVENTION As described above, the test box can be freely moved to the test work place by using the handle, and the test work can be performed immediately by connecting the commercial power supply near the connector provided on the box. It is possible to carry out the test without being restricted by a place such as a laboratory, a development room, an office, etc. as long as the place has a commercial power source.

For example, the above box can be installed on a desk by standoffs for test work, and when installed on a desk, etc.,
The test substrate is allowed to stand in a horizontal state by the standoff, and can be placed in a state suitable for the heating test.

Further, as described above, when the test substrate is placed horizontally in the closed space of the box and is subjected to the heating test, the lid provided so as to face the test substrate is placed on the upper surface side of the box, The lid can be immediately opened in the above heating state to open the electronic component mounting surface of the test substrate, and the electronic component can be easily measured and checked. That is, by opening the lid, a measurement opening is formed on the upper surface side of the box installed by the standoff, and the opening makes the space above the electronic component mounting surface open so that the electronic component can be easily measured from above. Can be done.

Further, the measured electronic component can be attached / detached from above through the measurement-purpose opening, and similarly, the electronic component to be measured from now on can also be mounted on the test board through the measurement-operation opening.

Since this test box is for measuring and testing a limited number of electronic components in a closed space with a limited volume,
By connecting the commercial power source through the connector, the temperature in the closed space can be efficiently raised to the required temperature in a short time, and the power loss can be prevented by turning off the power when not in use.

As described above, this test box is suitably used for a heating test of a limited small amount of electronic parts such as the above-mentioned ASIC,
The above heating test can be carried out immediately by using a commercial power source whenever necessary by placing it close to the user and providing a test box that is convenient and highly mobile.

[Brief description of drawings]

The drawings show an embodiment of the present invention. FIG. 1 is a perspective view of the appearance structure of a tabletop electronic component heating test box as viewed from the front panel, and FIG. 2 is a perspective view of the appearance structure of the box as viewed from the rear panel. Fig. 3 is a perspective view of the box showing the internal structure by opening the lid made up of the front panel, Fig. 4 is a perspective view of the box showing the state in which the lid is opened and a test substrate is installed, and Fig. 5 is FIG. 6A is a plan view of the box, FIG. 6A is a sectional view showing the structure of the switch means when the switch is in a closed state, FIG. 6B is a sectional view when the switch is in an open state, and FIG. Fig. 8 is a box cross-sectional view showing another example of the opening / closing structure of Fig. 8, Fig. 8 is a horizontal cross-sectional view of the box showing another example of the support means for the test substrate, Fig. 9 is the same vertical sectional view, and Fig. 10 is another example of the heating means. Fig. 11 is a sectional view of the box showing FIG. 12 is an enlarged cross-sectional view of an essential part of the substrate, omitting a cross-sectional display, FIG. 12 is an enlarged cross-sectional view of an essential part showing another example of the heater plate, showing the cross-sectional display omitted, and FIG. It is a principal part enlarged plan view which illustrates a circuit pattern. 1 ... Portable closed box, 2 ... Lid, 5 ... Handle,
6 ... Board guide track, 8 ... Commercial power supply connector means, 11 ... Signal input / output connector means, 14 ... Switch lever forming switch means, 25 ... Standoff, 30 ... Test board , 34 ... Signal circuit pattern, 35 ... Heater circuit pattern, 40 ... Socket,
45 ... Electronic parts, 47 ... Substrate support seat, 49 ... Heater plate, 50 ... Measurement work opening.

 ─────────────────────────────────────────────────── --- Continuation of the front page (72) Kenjiro Ogawa Inventor Kenjiro Ogawa 2-8-16 Chidori, Ota-ku, Tokyo Yamaichi Electric Industrial Co., Ltd. Denki Industry Co., Ltd. Hiratsuka Plant (72) Inventor Somasa Jimbo 5-1-9 Higashi-Hachiman, Hiratsuka City, Kanagawa Furukawa Denki Industry Co., Ltd. Hiratsuka Plant

Claims (3)

[Claims] 1. A square portable sealed box and a test substrate mounted in the portable sealed box, wherein the portable sealed box has a test substrate detachably mounted in the sealed space of the box. In addition to a board supporting means extending horizontally and a heating means for heating the test board, a connector means for connecting and outputting the signal to the test board provided inside and a heating means for commercial power supply are provided. And a connector means for connecting to the electronic component, and a lid is formed by a panel facing the electronic component mounting surface of the test substrate of the portable sealed box, and the electronic component is opened by opening the lid. An opening for measurement work that opens the mounting surface is formed, and a standoff that supports the portable closed box at the floor height is provided on the panel facing the lid, and the box is placed at a suitable position of the portable closed box. Tabletop electronic component heating test box, characterized in that it comprises a handle for carrying Chi. 2. The table for electronic table heating test according to claim 1, further comprising a switch means for a commercial power source for supplying the heating means to an appropriate place of the portable sealed box. 3. The desktop electronic part heating test box according to claim 1, wherein the test substrate forms a heating plate.