JPH0590784A - Chip electronic component supply apparatus - Google Patents

Abstract

PURPOSE:To prevent pick-up mistake of a chip electronic component by peeling an adhesive tape from a carrier tape by the returning operation of a tape feeding lever when the component, which adheres to the carrier tape, is attracted and picked up by a suction nozzle at the pick-up place. CONSTITUTION:A carrier tape with an adhesive tape fed from a supply reel 21 is intermittently sent to a pick-up position by a sprocket 31 to be driven by the reciprocation of a tape feeding lever 2 reciprocating. Here, the adhesive tape is peeled from the carrier tape of the pick-up position and wound by an adhesive tape winding reel 8 to be rotated by a link 5 connected to the lever at the time of returning of the lever. Accordingly, a stop of the chip mounter, a decrease in operability due to pick-up mistake can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape feeder type suitable for supplying chip electronic parts to a chip mounter from a carrier tape in which small chip electronic parts are held by an adhesive tape and arranged at equal intervals. The present invention relates to a chip electronic component supply device.

[0002]

2. Description of the Related Art In this type of chip electronic component supply apparatus, each chip electronic component is arranged in a longitudinal direction on a carrier tape, and holes formed in the carrier tape under the respective chip electronic components are arranged in the longitudinal direction. There is an adhesive tape attached to the lower side of the carrier tape, and each chip electronic component is bonded and fixed through the hole. 6 (a) and 6 (b) are a plan view and a side view of the tape for supplying such a chip electronic component taken along the line BB, respectively. Reference numeral 24 is a carrier tape having tape feed perforations 24A on both sides. P is a chip electronic component arranged on the carrier tape 24. 24
B is a hole of the carrier tape 24, which is opened below each chip electronic component P. A narrow adhesive tape 25 is attached to the lower surface of the carrier tape 24, and has a structure in which each chip electronic component P is adhered to and fixedly held through the hole 24B of the carrier tape. Therefore, the chip electronic component P can be freely separated from the carrier tape 24 by peeling the adhesive tape 25 from the carrier tape 24.

In the conventional chip electronic component supply apparatus, the tape holding the chip electronic components arranged in this manner is wound around a reel and installed in the supply apparatus, and engages with perforations 24A on both side edges of the tape. By intermittent rotation of the sprocket, the sprocket is intermittently fed at a pitch corresponding to the space between the holes (that is, the space between the chip electronic components), and when it reaches the suction position for taking out the chip electronic components of the supply device, While the adhesive tape 25 is attached to the carrier tape 24, when the suction nozzle of the chip mounter descends to adsorb the chip electronic components and rises, at the same time, the adhesive tape is pushed from below the adhesive tape 25 with the push-up pin. 25 is a mechanism for breaking the chip electronic component and releasing the chip electronic component from the adhesive tape 25. An example of this type of conventional chip electronic component supply apparatus is described in Japanese Utility Model Laid-Open No. 60-194398. In addition, there are some that use a paper tape instead of an adhesive tape and have a similar mechanism.
For example, there is one for embossed tape as described in Japanese Utility Model Laid-Open No. 57-148874. In any case, a push-up pin mechanism is used to remove the chip electronic component from the tape.

[0004]

In the above prior art, when the chip electronic component is sent to the suction position and the suction nozzle of the chip mounter descends to suck the chip electronic component and the nozzle rises, the push-up pin is used. Simultaneously rise to break through the adhesive tape, push up the chip part and release it from the adhesive tape, but if this operation is repeated, the adhesive may stick to the tip of the push-up pin and the adhesive tape may not break through. is there. This is one of the causes of the suction failure of the chip electronic component. In addition, since the chip electronic component is pushed up by the push-up pin, the chip electronic component is scratched or damaged and causes a failure. In addition, the tip of the push-up pin may be rounded and may not break through the adhesive tape. In addition, since the tape that has become empty after the chip electronic components have been adsorbed by the adsorption nozzle has an adhesive tape on the carrier tape, cut the empty tape with a cutter near the tape guide outlet of the chip electronic component supply device. In the cutting mechanism, the adhesive may adhere to the cutting edge of the cutter, making it impossible to cut off the adhesive tape. When the above phenomenon occurs, there arises a problem that it becomes impossible to feed the chip electronic component to the suction position by tape feeding.

The object of the present invention is to solve the above-mentioned conventional drawbacks, to feed the tape, to separate the chip electronic component sucked by the nozzle at the suction position from the adhesive tape, and to tape after the chip electronic component is sucked. It is an object of the present invention to provide a highly reliable adhesive tape feeder-type chip electronic component supply device capable of reliably performing the processing operation.

[0006]

A chip electronic component supply apparatus according to the present invention has a structure described in each of the claims.

[0007]

[Operation] The carrier tape to which the adhesive tape holding the chip electronic components is adhered and held is intermittently sent to the suction position and stopped, where the suction nozzle of the chip mounter descends to suction the chip electronic components. In this state, the adhesive tape is peeled off from the carrier tape and wound on the adhesive tape winding reel. After that, the suction nozzle moves up while sucking the electronic component. Such an operation is repeated each time the carrier tape is intermittently fed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an overall side view of a chip electronic component supply apparatus according to this embodiment. Reference numeral 1 is a frame, and 2 is a tape feeding lever having a feed claw 14 for a ratchet wheel mounted on a sprocket 31 axially supported by the frame 1 and can reciprocate up and down about the sprocket shaft 2A. Reference numeral 15 denotes a reverse rotation preventing claw which allows only rotation (clockwise rotation) of the sprocket in the tape feeding direction. 3 is a tape feed pusher which is moved up and down by the lever 3 ′ in synchronization with the operation of a lever 3 ′ of a chip mounter device (not shown), and 4 is a link 5 according to the movement of the pusher 3.
It is a lever for rotating the reel 8 for winding the adhesive tape via the. 4A is a main shaft of the lever 4, which is planted in the frame 1. Reference numeral 4'denotes a tension coil spring for returning the lever 4, which is hung between the lever 4 and the frame 1. In the lever 4, a pin 4B planted therein is slidably engaged with an elongated hole of the link 5. Reference numeral 5'denotes a tension coil spring hung between the pin 5B fixed to the link 5 and the pin 4B of the lever 4, and absorbs a change in the adhesive tape winding diameter of the adhesive tape winding reel 8 as described later. It is provided to do so. Adhesive tape winding reel 8
Is a reel spindle 7'rotatably mounted on the frame 1
Be attached to. The arm 7 can rotate left and right around the reel spindle 7 '.

The reel spindle 7'and the arm 7 are connected by a one-way clutch (not shown).
Is rotated counterclockwise in the figure, the one-way clutch idles and the main shaft 7 '(and therefore the reel 8 mounted on it) does not rotate, but when the arm 7 rotates clockwise, the one-way clutch operates. The main shaft 7 '(hence, the reel 8 mounted on the main shaft 7') to the arm 7 in the clockwise direction.
It is designed to rotate with it. Reference numeral 10 denotes a reverse rotation preventing claw that engages with the peripheral portion of the reel 8 in order to prevent the reel 8 from rotating counterclockwise, and is attached to the frame 1.

Reference numeral 21 is a supply tape reel containing a tape made up of a carrier tape holding chip electronic components in an array and an adhesive tape attached to the carrier tape, and is rotatably supported on the frame 1 by a frame 21 '. The carrier tape 24 drawn out from the supply tape reel 21 (on which the adhesive tape 25 is adhered and the chip electronic parts P are arranged and held as shown in FIG. 6) is guided by the tape guides 27, and both sides thereof are guided. It is sent by intermittent rotation of the sprocket 31 that engages with the perforation 24A. However, as will be described later, at a chip electronic component suction position slightly before the sprocket 31, chip electronic components are attracted and adhered by the suction nozzle N of the chip mounter. The tape 25 is peeled off, and only the empty carrier tape 24 passes through the tape retainer 16 and the empty tape guide 17, and is cut and discharged as necessary. Reference numeral 18 is a tape pressing spring attached to the tape pressing member 16. On the other hand, the adhesive tape 25 peeled off from the carrier tape 24 at the suction position is wound around the adhesive tape winding reel 8 as described later.
In addition, 19 and 20 are pins for mounting and positioning the present chip electronic component supply device on a chip electronic component supply table (not shown) of the chip mounter.

FIG. 3 is a view showing the structure in the vicinity of the above-mentioned chip electronic component suction position, (b) is a plan view,
(A) is a side view seen in the AA cross section of (b). Figure 1
Tape guide 2 pulled out from the supply tape reel 21 of
The carrier tape 24 guided by 7 and the adhesive tape 25 attached to the lower surface of the carrier tape 24 are provided in front of the sprocket 31 while holding the chip electronic components P arranged on the tape. Proceed over the support plate 40.
The tip portion of the tape support plate 40 is a forked portion as shown in the figure at the chip electronic component suction position where the suction nozzle N of the chip mounter descends, and the chip electronic component on the carrier tape 24 that has reached the suction position. P extends over the bifurcated portion. The groove width between the two-forked portions is slightly wider than the width of the adhesive tape 25. Here, the adhesive tape 25 is peeled off from the carrier tape 24 and bent back to the adhesive tape winding reel 8 shown in FIG. It is designed to be rolled. In this case, when the take-up reel 8 makes one take-up operation as described later, the adhesive tape 25 has its bending back point contacted with the root 41 of the forked portion of the tape support plate 40. The carrier tape 24 is peeled off.

Next, the operation will be described with reference to FIGS. 1, 2 and 3. FIG. 1 shows the state before feeding the tape, and FIG. 2 shows the state after feeding the tape. Now from the state shown in FIG.
When the lever 3'of the chip mounter pushes up the pusher 3, the pusher 3 pushes up the pin 35 provided on the tape feed lever 2, the tape feed lever 2 rotates clockwise, and the feed pawl 14 moves the ratchet wheel. The sprocket 31 is rotated in the clockwise direction through a predetermined angle to feed the carrier tape 24 and the adhesive tape 25 attached thereto by one pitch (arrangement pitch of chip electronic components on the carrier tape 24). As a result, one chip electronic component P on the carrier tape comes to the suction position (the position of the forked portion of the tape support plate 40 shown in FIG. 3). On the other hand,
By the pushing-up operation of the pusher 3, the lever 4 is rotated counterclockwise through the pin 35 against the force of the coil spring 4'with the shaft 4A as a fulcrum, and the pin 4B of the lever 4 (this is the link 5). The link 5 is pushed to the left via the left end portion of the elongated hole 5A) to rotate the arm 7 in the counterclockwise direction. At this time, between the reel spindle 7'and the arm 7. Due to the action of the idling and reverse rotation preventing pawls 10 of the above-mentioned one-way clutch that is inserted in the reel, the reel 8 for winding the adhesive tape does not rotate. Therefore, when the pusher 3 is pushed up, the adhesive tape 25 attached to the lower surface of the carrier tape 24 is sent to the chip electronic component suction position while being attached to the carrier tape 24, and the take-up reel 8
The bending back point of the adhesive tape 25 facing the tape support plate 40 is
Comes close to the tip 42 of the bifurcated part (the adhesive tape in this state is shown by an imaginary line 25 'in FIG. 3).

In the above state, the suction nozzle N of the chip mounter comes down to the chip electronic component P at the suction position and sucks it.

Next, the lever 3'of the chip mounter descends to its original position before the nozzle N that has adsorbed the chip electronic component rises. Then, the lever 4 is rotated in the clockwise direction by the returning force of the coil spring 4 ', the pusher 3 is pushed down via the pin 35, and the tape feeding lever 2 is rotated in the counterclockwise direction. The sprocket 31 does not rotate due to the action of the prevention claw 15, and the carrier tape 24 is not fed. On the other hand, the clockwise rotation of the lever 4 pulls the link 5 to the right through the pulling force of the tension coil spring 5 ', and rotates the arm 7 connected to the link 5 clockwise, so that the one-way clutch operates. Thus, the main shaft 7 ′ of the adhesive tape winding reel 8 (hence, the reel 8 mounted on the main shaft 7 ′) is rotated clockwise. As a result, as shown by the solid line in FIG. 3, the adhesive tape 25 is peeled off from the carrier tape 24 and wound onto the reel 8 until the bending back point comes into contact with the root 41 of the bifurcated portion of the tape support plate 40. In this case, the tension coil spring 5 ′ hung between the pin 4B of the lever 4 and the pin 5B of the link 5 has a winding amount due to a change in the winding diameter of the adhesive tape already wound on the reel 8. Of the adhesive tape 25, the adhesive tape 25 is not subjected to excessive tension during the winding operation, and there is no fear of breaking.

In this way, when the adhesive tape 25 is peeled off from the chip electronic component P and the carrier tape 24 at the suction position, the suction nozzle N moves upward while sucking the chip electronic component P. After that, the tape is fed one pitch at a time, and the same operation is repeated.

As described above, in the present embodiment, in one reciprocating movement of the tape feeding lever 2, the adhesive tape is attached to the carrier tape together with the carrier tape during the forward movement.
Reel for winding the adhesive tape by feeding only the pitch and peeling the adhesive-only tape for one pitch from the carrier tape without feeding the carrier tape while feeding the chip electronic component with the suction nozzle N when returning. Roll it up to 8.

In the chip electronic component supply device having the same mechanism as above, an embodiment in which the carrier tape is fed by one pitch of the arrangement of the chip electronic components by the two reciprocating movements of the tape feeding lever 2 is also possible. Is. This embodiment is a case where a tape having a pitch of the chip electronic component is twice as large as that of the above-mentioned embodiment.
In this embodiment, of the two reciprocating movements of the tape feeding lever 2, the adhesive tape is fed together with the carrier tape by a half pitch during each forward movement, and the carrier tape is fed during each backward movement. However, only the adhesive tape is peeled off from the carrier tape by a half pitch and wound on the adhesive tape winding reel 8.

Next, the structure of the tape retainer 16 of the tape feeding ratchet portion is shown in FIGS. 4 is a front view thereof, FIG. 5 is a side view thereof, and the same reference numerals as those in FIG. 1 indicate the same parts. The side plate 1a for attaching the sprocket 31 and the tape retainer 16 to the frame 1 is fixed with two bolts 1b and 1c. 17
Is a guide for an empty carrier tape. Reference numeral 17b is a bolt for attaching the tape guide 17 to the frame 1 with the bracket 17a. Reference numeral 16 is a tape retainer, and a tape retainer leaf spring 18 is fixed to the upper portion by bolts 18 ', and the tape retainer 16 is centered on the support shaft 16'.
It has a structure that opens and closes. Reference numeral 18a denotes a pin for holding the tape retainer 16 in an open state by contacting the end surface of the frame 1 when the tape retainer 16 is opened as shown in FIG. It has a coil spring 18b for letting out 18a. The protruding pin 18a is the frame 1 as described above.
The tape retainer 16 is kept open by abutting the end face of the tape. In this open state, the carrier tape can be easily loaded on the sprocket 31. The tape retainer 16 is constantly biased by the torsion coil spring 18c in the closing direction. When closing the tape holder 16, the pin 18
While pushing the tip of a into the inside of the frame 1 by pushing it in with a finger, the tape retainer 16 is twisted by a coil spring 16c.
You can use the power of to restore it. The tape retainer leaf spring 18 has a U-shape when viewed from the top, and when the tape retainer 16 is closed, the two opposing U-shaped leaf spring portions of the carrier tape of the sprocket 31 are engaged. It is designed to hold down the perforations on both sides.

[0019]

According to the chip electronic component supply device of the present invention, when the chip electronic components adhered to the adhesive tape attached to the carrier tape and arranged and held on the carrier tape are sent to the suction position, The chip electronic component is in a state of being adhered to the adhesive tape and held on the carrier tape,
Since the adhesive tape is stripped from the carrier tape by using the returning operation of the tape feeding lever when the suction nozzle is in the suction state at the suction position, the chip electronic component can be securely sucked. Therefore, it is possible to prevent the chip mounter from being stopped and the operating rate from being lowered due to a suction error such as when the adhesive tape is torn by the push-up pin to push up the chip electronic component as in the conventional case. Moreover, the timing for performing such tape feeding, stripping and winding of the adhesive tape can be obtained with an easy mechanism. Further, a highly reliable winding mechanism can be obtained by using a one-way clutch having a simple structure as the winding mechanism of the adhesive tape. By providing a tape pressing mechanism with a simple structure for the tape feeding sprocket, it is possible to improve usability and improve workability.

[Brief description of drawings]

FIG. 1 is an overall side view showing a state before a tape feeding operation of an embodiment of a chip electronic component supply device of the present invention,

FIG. 2 is a side view of an essential part showing a state after the tape feeding operation of the embodiment,

FIG. 3 is a side view and a plan view showing a structure in the vicinity of a chip electronic component suction position of the embodiment,

FIG. 4 is a front view of the tape pressing mechanism of the embodiment,

FIG. 5 is a side view of the tape holding mechanism when opened,

6A and 6B are a plan view and a side sectional view of a carrier tape in which chip electronic components used in the chip electronic component supply device of the present invention are arranged and held, and an adhesive tape bonded to the carrier tape.

[Explanation of symbols]

1 ... Frame 2 ... Tape feeding lever 3 ... Pusher 4 ... Lever 4A ... Spindle 4 '... Coil spring 5 ... Link 5' ... Coil spring 7 ... Arm 7 '... Winding reel Spindle 8 ... Winding reel 10 ... Reverse rotation preventing claw 14 ... Feeding claw 15 ... Reverse rotation preventing claw 16 ... Tape pressing tool 17 ... Empty tape guide 18 ... Tape pressing leaf spring 21 ... Supply reel 24 ... Carrier tape 25 ... Adhesive tape 27 ... Tape guide 31 ... Ratchet 40 … Tape support plate P… Chip electronic component N… Adsorption nozzle

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Genji Hiramoto 4, 6 Kanda Surugadai, Chiyoda-ku, Tokyo Inside the Industrial Equipment Division, Hitachi, Ltd. (72) Inventor Mitsuo Nakamura 4-6, Kanda Surugadai, Chiyoda-ku, Tokyo House number Industrial equipment division of Hitachi, Ltd.

Claims (3)

[Claims] 1. A chip electronic component is arranged at an equal pitch on the upper surface, and a hole is provided under each of these chip electronic components, and an adhesive for holding the chip electronic component adhesively through the hole on the lower face. Means for rotatably supporting a supply tape reel containing a carrier tape to which tapes are attached, and the chip electronic component drawn from the supply tape reel and the carrier tape with an adhesive tape are chipped. Guide means for guiding to the electronic component suction position, sprocket means for intermittently pulling the carrier tape downstream of the suction position, and adhesive tape take-up for winding the adhesive tape peeled off from the carrier tape at the suction position Reel and a tape feed for rotating the sprocket means so as to feed the carrier tape by the one pitch in the forward and backward reciprocating movements. When the tape feeding lever moves forward, the tape feeding lever is linked to the tape feeding lever, and the reel for winding the adhesive tape is made inoperative to feed the adhesive tape by one pitch together with the carrier tape. When the tape feeding lever returns, the adhesive tape take-up reel is set to 1
A chip electronic component supply device, comprising: an interlocking mechanism that rotates the tape so that it is peeled off from a carrier tape by a pitch and wound. 2. The chip electronic component supply apparatus according to claim 1, wherein the sprocket means is configured to feed the carrier tape by a half pitch instead of the one pitch when the tape feeding lever makes one reciprocating forward movement. When the tape feeding lever is rotated back and forth once, the adhesive tape
The adhesive tape take-up reel is rotated so that the adhesive tape take-up reel is wound up by peeling it from the carrier tape by a half pitch instead of the pitch, and thus the carrier tape is moved by two out of two reciprocations of the tape feed lever. Send only 1 pitch and 2
A chip electronic component supply device characterized in that the adhesive tape is wound up by one pitch in the backward movement. 3. The chip electronic component according to claim 1, wherein the interlocking mechanism has a one-way clutch mechanism that transmits only the rotation of the adhesive tape in the winding direction to the adhesive tape winding reel. Supply device.