JPH03152060A - Chip electronic part supply device - Google Patents

Abstract

PURPOSE:To prevent an electronic part from jumping at absorbing position (opening position) or from springing out from a pocket, by providing such a function that an electronic part is fed to the absorbing position with an upper tape and an adhesive tape being attached thereto, and the upper tape and the adhesive tape are removed therefrom after a stop. CONSTITUTION:A tension roller 20 serves as a link mechanism when the feed of a tape is started, and accordingly, the roller 20 moves away from an upper tape 19 bit by bit. When a chip part comes to a stop on an absorbing position, the tension of the upper tape 19 becomes zero completely. By moving this tension roller 20, the upper tape 19 is prevented from being peeled of during feeding thereof. After the chip part is fed to the absorbing position, a tape feed lever 3 is returned to its original position by means of a spring force. In association with the motion of the lever 3 on return, a wind-up reel is rotated for winding by the link mechanism.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a chip feeding mechanism suitable for supplying chip electronic components to a chip mounter that mounts minute chip electronic components without lead wires on a printed circuit board. The present invention relates to an electronic component supply device.

[Conventional technology]

In this type of chip electronic component supply device, each chip electronic component is accommodated one by one in pockets arranged in the longitudinal direction of a carrier tape made of paper, for example, and is attached to the upper surface of the carrier tape. It is said to be a state.

The carrier tape with chip electronic components encapsulated in each pocket is placed on the supply device while being wound on a reel, and the above-mentioned The upper tape is fed intermittently at a pitch corresponding to the interval between the pockets, and when it reaches the opening position for taking out the chip electronic components on the feeding device, the upper tape is peeled off from the carrier tape and the exposed chip electronic components are removed. was attracted by the vacuum suction nozzle of the chip mounter and removed from the pocket of the carrier tape. On the other hand, the upper tape peeled off from the carrier tape is wound onto the upper tape by a take-up reel.

As described in Japanese Patent Application Laid-Open No. 63-133893, in this type of conventional chip electronic component supply device, when the chip electronic components are fed to the adsorption position, the upper tape is peeled off at the same time. Because the electronic components are open, they dance or fly out of pockets when the vehicle is stopped. Therefore, the suction nozzle of the mounter generates suction errors.

Japanese Unexamined Patent Application Publication No. 1986 (1986) as a method to prevent chip electronic components from dancing during feeding.
As described in Japanese Patent No. 3-178591, there is a structure in which a shutter is provided at a suction position of a chip electronic component, and the shutter is kept closed when the tape is fed, thereby suppressing dancing. The structure is such that when the nozzle descends and is suctioning, the shutter is opened by pressing a lever, and the shutter is opened by pressing the lever at the tip of the head where the nozzle is attached. However, when the head receives a reaction force, vibration occurs, and the nozzle swings accordingly. The center position of the chip component cannot be picked up, and if the component is standing up, a mistake will occur. Since the one-shutter type has different dimensions in the thickness direction depending on the type of chip component, there is a gap between the shutter surface and the top surface of the chip component. Particularly in the case of small parts, there is a drawback that the gap becomes large and tends to move. Adding a shutter mechanism to suppress the movement of chip components is not very effective for small components, and the single component supply device becomes complicated and reliability decreases. Furthermore, the structure becomes complicated and the manufacturing cost increases.

[Problem to be solved by the invention]

The above-mentioned prior art has a mechanism in which the upper tape is peeled off when the chip component is sent to the suction position, and the chip component is left open, causing it to dance or fly out of the pocket due to the residual vibration in the vertical direction of the tape. especially,
As chip electronic components become smaller, they tend to move more easily, so they occur frequently.

Furthermore, as the supply tact increases, residual vibrations become larger and vibrations or jumping out of pockets occur frequently. Furthermore, depending on the conditions when the upper tape is removed, static electricity may be generated and chip electronic components may adhere to other parts.

The above-mentioned conventional technology does not take into account dancing or popping out during component feeding, which causes errors in suction of chip components.

SUMMARY OF THE INVENTION An object of the present invention is to provide a mechanism for peeling off the upper tape after feeding and stopping chip components at a suction position.

[Means to solve the problem]

The above purpose is to send the taping tape to the suction nozzle position by pressing the tape feed lever, but the upper tape is fed as is without being peeled off, and the upper tape is removed when the tape feed lever returns to its original position. Let's do it. The tape feeding and the peeling off of the upper tape can all be accomplished by one reciprocating motion of the tape feeding lever.

[Effect]

By pressing the tape feed lever, the ratchet rotates and feeds the chip components to the suction position. The upper tape is wound up when the tape feed lever returns to its original position.

The operation of the upper tape includes a tension roller that applies tension to the upper tape at the peeling position and the winding reel, and this roller is interlocked with the tape feed lever.

When this tension roller starts feeding the tape, it becomes a ring mechanism and the re-roller gradually moves away from the upper tape, which is at its maximum when stopped.When the chip part stops at the adsorption position, the tension roller completely removes the tension of the upper tape. It has a structure of O. By moving the tension roller, the upper tape is not peeled off during feeding.

After sending the chip component to the suction position, the tape feed lever returns to its original position using the spring force. This movement of the returning lever causes the reel to rotate and wind up the winding material using a link mechanism. At that time, the tension roller moves to the upper tape side and the tension increases, making it easier to peel off. Immediately after the upper tape is completely peeled off, the suction nozzle descends to suction the chip components. Alternatively, there is a method in which the suction nozzle is lowered while the upper tape is being peeled off, thereby preventing the parts from moving due to the generation of static electricity and at the same time adsorbing the parts.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an overall side view of a chip electronic component supply device according to an embodiment of the present invention. 2 is a reel of carrier tape 17 containing chip electronic components sealed with upper tape; 3 is a tape feed lever that moves up and down in synchronization with the operation of a chip mounter (not shown); and 4 is a lever 3. This is a lever that can transmit the movement of the lever 3 by pin-engaging with the long hole 5 of the lever 4, and a pawl 6 for driving a ratchet 7 is attached to the lever 4. The ratchet 7 is connected to a sprocket that engages the perflation of the tape 17. Reference numeral 8 denotes a pawl bearing on the main body 1, which prevents the ratchet 7 from rotating backward.

9 is a guide for guiding the tape 17; 10 is the tape 1;
This is a holding plate for holding down 7 from above.

Reference numeral 11 designates a tension spring having one end locked to the lever 3 and the other end locked to the main body 1, 12 a reel drive lever for winding up the upper tape, and 6 a pawl for pushing up and rotating the ratchet 7. The rotation of the ratchet 7 rotates the sprocket and feeds the tape intermittently. The pawl 8 prevents the ratchet from reversing. The upper tape is peeled off from the carrier tape 17 at the tip of the tape press plate 10 and wound onto a reel 16 rotated by levers 12, 13, and links 14. Arrow A is the direction pushed by a link (not shown) from the mounter side.

The lever 3 is returned to the illustrated position by the force of the spring 11, and the above operation is repeated by pushing the arrow A again. In this way, the carrier tape 17 is intermittently and sequentially fed, the electronic components are successively attracted, and the upper tape 17 is peeled off.
is sequentially wound on the reel 16.

The tape feeding of chip components and the upper tape winding reel 16 will be explained in more detail. In addition to Figure 1, Figure 2,
The explanation will be made using FIGS. 3 and 4, and the same reference numerals as in FIG. 1 indicate the same things.

The chip component a taped to the tape is sent to the suction nozzle position 18' by tape feeding.

17' indicates the position of the pocket where the chip component a is placed;
In the figure, 17 is a carrier tape without chip components. 1
Reference numeral 3 denotes a lever for transmitting the movement of the lever 12, which is rotatable around a pivot 13'.

Reference numeral 14 indicates an upper tape interlocking link for transmitting the movement of the levers 12 and 13. Reference numeral 15 indicates a tension spring hooked between the levers 12 and 13. Lever 1
3 moves while touching the upper part of the guide bin 12' attached to the lever 12. The force in contact with the guide pin 12' is applied by a spring force of 15.

16 is a reel for winding up the upper tape, and 19 is an upper tape. 18 is the suction nozzle of the chip mounter;
25 is a guide for the empty tape after the chip electronic components are attracted.

To explain the operation, the carrier tape 17 containing the chip electronic components and covered with the upper tape is unwound from the reel, passes through the guide 9 and under the press 10, and passes through the sprocket (not shown) connected to the ratchet 7. )
engage with. When the lever 3 is pushed in the direction of arrow A by a tape feeding cam from a chip mounter (not shown), the lever 4 moves upward and the carrier tape attached to the lever 4 is shown.

FIG. 3 shows a state in which the chip component is sent to the suction nozzle position 18'. At this time, as can be seen from FIG. 3, the structure is such that the upper tape 19 is fed without being peeled off from the carrier tape 17. The upper tape 19 is peeled off by utilizing the action of the tape feed lever 3 shown in FIG. 1 returning to the lower part (to its original position). The situation is shown in Figure 4. The structure may be such that the suction nozzle 18 descends to suck the chip component a after the upper tape 19 is peeled off, or the upper tape may be peeled off after the suction nozzle has descended. This operation is shown by broken lines in FIGS. 3 and 4. The details of the operation of the structure described above are explained in Section 5. 6th
This will be explained using figures.

The same symbols as in FIG. 1 indicate the same things. First, the operation of feeding the chip component to the suction nozzle position will be explained using FIG. When the tape feed lever 3 is pushed in the direction of arrow A by a lever from the mounter side, the tapered feed pawl 6 attached to the lever 4 rotates the ratchet and feeds the tape 17. The movement of the upper tape 9 at this time is such that when the tape feed lever 3 moves upward, the guide pin 21 installed on the lever 12 also moves upward. The guide plate B which is set as fulcrum B' is also fulcrum B
When the tape is rotated to the right in the drawing with the center point ', the tension roller 20, which applies tension to the upper tape 19 downward, moves upward. Therefore, upper tape 1
The tension on the carrier tape 9 is eliminated, and the carrier tape 17 can be fed as shown in FIG. The operation just described, as shown in FIG. 6, shows the operating position when the tape feed lever 3 pushes up in the direction of arrow A and feeds one chip component, and the solid line 19 of the upper tape The state before sending is shown, and the broken line 19' shows the state after sending. In this way, the upper tape 19 can be tensioned freely and appropriately using the movement of the tension roller 2o. Guide plate B is lever 12
Since it operates in conjunction with the operation of the upper tape 19, the operation of feeding and peeling off the upper tape 19 at the chip component suction position can be ensured. The guide plate B is connected to the tape feed lever 12 by a spring 21'. The upper tape 19 is wound by using the downward movement of the tape feed lever 3. The take-up reel 16 (see FIG. 1) for the upper tape 19 is of a one-unit clutch type, so when the lever 14 is lowered, the take-up reel 16 rotates and takes up the upper tape. On the other hand, if static electricity is generated when the upper tape is peeled off, the timing at which the suction nozzle comes down may be advanced so that the suction nozzle is adsorbed while the upper tape is being peeled off. As described above, when a chip component is sent to the suction nozzle position as shown in FIG. 3, the structure is such that the upper tape 19 can be fed without being peeled off from the carrier tape 17. As shown in FIGS. 5 and 6, the tape can be fed by simply moving the tape feed lever 3 up and down once and back and forth. The above description applies to tapes on which chip components are taped.

Next, application examples are shown in Figures 7, 8, 9, 10, and 1.
This will be explained using FIG. 1 and FIG. 12.

The tape compatible with the component supply device described below is generally called adhesive tape, and it is used for a tape with a combination structure of adhesive tape on the top surface of the carrier tape and adhesive tape on the back surface of the chip component to hold the component. explain. 7th
The chip component feeding apparatus shown in the figure is different in that the adhesive tape is peeled off from the underside of the carrier tape, and otherwise the chip components are fed in exactly the same manner. A description of the entire structure will be omitted. Components with the same reference numerals as in FIG. 1 indicate the same or equivalent components.

This type of situation is almost the same as that shown in FIGS. 2, 3, and 4, using FIG. 8, FIG. 9, and FIG. , are the same except that the upper tape has been changed to adhesive tape.

The feeding of chip components will be explained using FIGS. 8, 9, and 10. Note that the same reference numerals as in the previous time indicate the same things. First, explanation will be given in the order of the figures. Figure 8 shows
This shows the state before the chip component 4 is sent to the suction nozzle position, and FIG. 9 shows the state where the chip component a is sent to the suction nozzle position, and at this time, the adhesive tape is not removed. It is sent stuck together with carrier tape. When the tape feed lever 3 (see Figure 7) descends and returns to its original position, the adhesive tape 1 is moved as the lever 3 moves.
9a has a structure that can be peeled off from the carrier tape 17. This situation is shown in FIG. 10. Although the timing of suctioning the chip component is not shown, immediately after the chip component a is sent to the suction nozzle position, the suction nozzle 18 descends and suctions it.
In this state, when the tape feed lever returns to its original position, the take-up reel rotates and peels off the adhesive tape, and then the suction nozzle suctions the chip component and ascends. To briefly describe this operation, the suction nozzle rises from the state in which the chip component is suctioned after the adhesive tape is peeled off. Adhesive tape 1
The peeling operation of 9a is such that the carrier tape 17 is sent to the suction position while remaining attached to the carrier tape 17, and is peeled off immediately after being sent. The operation before sending the chip component to the suction nozzle position is shown in FIG. 11, and the adhesive tape 19a is under tension by the tension roller 21. The position of the lever when the chip component has been sent to the suction position is shown in FIG. 12, but since the tension roller 21 moves upward from the adhesive tape 19a, no tension is applied to the adhesive tape and it returns to the suction position. It is structured so that it can be sent. The operation of each part is explained in the sections of Figures 5 and 6, so here,
I will explain in detail. The state in which the adhesive tape 19a is fed to the suction nozzle position and peeled off is the first state before the chip component is sent.
The lever position will be as shown in Figure 1.

〔Effect of the invention〕

According to the chip component supply device of the present invention, when the chip component taped to the tape is sent to the suction nozzle position,
Since the chips are fed in a taped state and then peeled off from the carrier tape, the chip parts do not dance around in the suction position (opening position) or fly out of the pocket. therefore,
Even if the supply tact becomes faster, it is highly effective in preventing chip parts from dancing. In operation, the drive source for one reciprocation of the tape feed lever is used to reliably feed the upper tape to the suction nozzle position using a link mechanism, and the return force of the lever is used to peel off the upper tape, and the upper tape is wound onto a reel while being peeled off. Complicated movements such as the timing of the movements to be taken are also synchronized using this simple mechanical mechanism.In particular, the movement of the tape feed lever (drive lever) is synchronized, so there is no timing discrepancy. Therefore, operation reliability is high, and
This method can be used not only for taping tapes but also for parts supply devices for adhesive tapes. By using the method of the present invention, it is possible to prevent chip components from dancing at the suction position or flying out of pockets, thereby greatly reducing the number of chip component suction errors, ensuring reliable component supply to the chip mounter, and increasing supply efficiency. It is possible to improve the operating efficiency of the chip mounter.

[Brief explanation of the drawing]

FIG. 1 is an overall side view of a chip electronic component supply device according to an embodiment of the present invention, FIG. 2 is a diagram showing the state of the tape at the suction position, and FIG. 3 is a diagram showing the state of the tape when feeding it. , 4th
The figure shows the state of the suction nozzle just before chip adsorption.
The figure shows a detailed view of the lever and upper tape when feeding parts,
Fig. 6 is a diagram showing the state of the upper tape and link mechanism when parts are sent to the suction nozzle position, Fig. 7 is an overall structural diagram of an application example, and Figs. 8, 9, and 10 are: An explanatory diagram of the operation at the suction position, FIG. 11 is an explanatory diagram of the link mechanism before sending the parts, and FIG. 12 is an explanatory diagram of the operation after the parts are sent. DESCRIPTION OF SYMBOLS 1... Main body, 2... Carrier tape, 3... Tape feed lever, 4... Lever, 5... Long hole, 6...
・Claw, 7...Ratchet, 8...Claw, 9...Guidance guide, 10...Press plate, 11...Spring, 12...
・Lever, 12'...Spring. 13... Lever, 14... Link, 16... Reel, 17... Tape, 18... Suction nozzle, 19...
... Upper tape, 20 ... Tension roller, 2
1...Guide pin, 25...Guide, a...Chip parts, B...Ga''''Q 40th rod 5 Figure 1)

Claims (4)

[Claims] 1. A carrier tape that has recesses lined up in the longitudinal direction that house chip electronic components and has a removable upper tape affixed to the top surface, or a carrier tape that holds chip electronic components on the top surface and chip electronic components on the back surface. A means for rotatably supporting a reel around which a tape made of adhesive tape is wound, a guide means for guiding the holding tape pulled out from the reel to an opening position of the chip electronic component extraction means, and the opening position. A chip electronic component supply device comprising an intermittent driving means for intermittently pulling the holding tape on the downstream side of the chip electronic component supplying device, and a means for peeling the upper tape from the carrier tape at the opening position,
1. A chip electronic component feeding device, characterized in that, when a chip electronic component is fed to a suction position, a mechanism is provided for feeding the chip electronic component with the upper tape and adhesive tape attached thereto, and then peeling off the upper tape and the adhesive tape after stopping the chip electronic component. 2. When feeding the tape to the suction position, a cam mechanism is installed between the position where the upper tape is peeled off and the reel where the upper tape is wound, which transmits power from the tape feed drive lever on the mounter side to the tape feed drive lever of the tape feeder. In synchronization with the operation, the tension of the top tape is zero when sending the chip component to the suction position, and after feeding, the top tape is stripped off by a tension roller operating in synchronization with the tape feed lever. A chip electronic component supply device according to claim 1. 3. In the prescribed tape feeding mechanism, the adhesive tape is taken up under the carrier tape, unlike upper tape, so by changing the position of the take-up reel, the adhesive tape can be peeled off after the chip components are sent to the suction position. The chip electronic component supply device according to claim 1, which enables the chip electronic component supply device. 4. The chip electronic component supply device according to claim 1, wherein the predetermined tape feeding mechanism includes a mechanism capable of moving a plate from which the upper tape is to be peeled off in a forward and backward direction in synchronization with a tape feeding lever using a link mechanism. .