JPH0466601A - Manufacture of fine metal balls - Google Patents
Manufacture of fine metal ballsInfo
- Publication number
- JPH0466601A JPH0466601A JP2179263A JP17926390A JPH0466601A JP H0466601 A JPH0466601 A JP H0466601A JP 2179263 A JP2179263 A JP 2179263A JP 17926390 A JP17926390 A JP 17926390A JP H0466601 A JPH0466601 A JP H0466601A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal wire
- core tube
- furnace core
- furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001111 Fine metal Inorganic materials 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000002184 metal Substances 0.000 claims abstract description 66
- 229910052751 metal Inorganic materials 0.000 claims abstract description 66
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 27
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Landscapes
- Powder Metallurgy (AREA)
- Wire Processing (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣチップの電極とＴＡＢテープのリード等
との間を接合する際に接合部材として利用される微細金
属球を製造するための方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention is a method for manufacturing fine metal balls used as a joining member when joining between an electrode of an IC chip and a lead of a TAB tape, etc. It is about the method.
ＩＣチップの電極と外部リードとの接続には多様な方法
が採用されている。Various methods are used to connect the electrodes of the IC chip and external leads.
配線用の極細ワイヤー（ボンディングワイヤー）を用い
て接続する方法もあるが、チップの電極とリードとの間
にバンブと呼ばれる金属突起を挟んで熱圧着する方法も
広く行われるようになっている。There is a method of connecting using ultra-thin wiring wire (bonding wire), but a method of thermocompression bonding by sandwiching a metal protrusion called a bump between the chip electrode and the lead is also becoming widely used.
Ｔ Ａ Ｂ （Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎ
ｄｉｎｇ）法は後者の代表として注目されている技術で
ある。この方法は、予めＩＣチップの電極部か、もしく
はＴＡＢテープ上のリード先端部のいずれかにバンブを
形成しておき、次にＩＣチップ電極部とリードを有する
ＴＡＢテープとをバンブを介して重ね合わせて両者を接
合するものである。またＴＡＢ法以外にフリップチップ
法においても、バンブが使用されている。T A B (Tape Automated Bon
ding) method is a technique that is attracting attention as a representative of the latter. In this method, a bump is formed in advance on either the electrode part of the IC chip or the lead tip part on the TAB tape, and then the IC chip electrode part and the TAB tape having the lead are stacked with the bump interposed therebetween. The two are then joined together. In addition to the TAB method, bumps are also used in the flip chip method.
このような用途に提供されるバンブのこれまでの作り方
は、メツキによる方法が主であった。すなわち、ＩＣチ
ップの電極部にバンブとなる金属（主に高純度の金）を
直接メツキして形成する力＼または一旦ガラス基盤上等
にメツキによって形成したバンブをＴＡＢテープ側のリ
ード先端部に転写する方法が主流となっている。Up until now, the method of making bamboo provided for such uses has mainly been the method of making bamboo sticks. In other words, the force is applied by directly plating the metal (mainly high-purity gold) that will become the bump on the electrode part of the IC chip, or by applying the force to form the bump once formed by plating on the glass substrate etc. to the lead tip on the TAB tape side. The mainstream method is transcription.
しかしながら、メツキによる方法は設備が大きくなる上
に、バンブとして使用する金属の組成にも制約を受ける
という欠点がある。また特にＩＣチップの電極部に直接
メツキしてバンブを形成する場合には、ＩＣチップその
ものがメツキ工程を通過することになって、ＩＣチップ
の歩留まりが悪化するという問題がある。However, the method using plating has the disadvantage that it requires large equipment and is also subject to restrictions on the composition of the metal used as the bump. In addition, particularly when forming bumps by directly plating the electrode portions of IC chips, there is a problem that the IC chips themselves have to go through the plating process, which deteriorates the yield of the IC chips.
これらの欠点を解消する方法として、メツキによらない
バンブ形成方法も考えられるようになってきた。本出願
人は先に、バンブ用の素材となる金属を微細線に加工し
、この金属線を定尺切断した後、互いの間隔を隔てた状
態で溶融・凝固させ、表面張力を利用して球形状のバン
ブを得る方法について出願した（特願平１−３２０２９
６号）、この方法で作られた球形状のバンブは、リード
先端部等に熱圧着して使用される（特願平１−２３４９
１７号）。As a method to overcome these drawbacks, bump forming methods that do not involve plating have come to be considered. The applicant first processed the metal that would be the material for the bump into fine wires, cut the metal wires to a specified length, melted and solidified them at intervals, and made the metal wires by using surface tension. An application was filed regarding a method for obtaining spherical bumps (Patent Application No. 1-32029).
No. 6), the spherical bump made by this method is used by thermocompression bonding to the tip of the lead, etc. (Japanese Patent Application No. 1-2349)
No. 17).
任意の金属線片を溶融してバンブとする新しい方法によ
れば、接合用部材としてふされしい特性を持った任意の
金属をバンブとして使用する可能性が太き（広がったこ
とになる。すなわち、金）他に銅や銀、並びにそれらを
ベースとする各種の合金を、容品にバンブとして成形す
ることができるようになったわけである。According to the new method of melting any piece of metal wire to make a bump, the possibility of using any metal with properties suitable for a joining member as a bump has been widened. In addition to copper, silver, and various alloys based on them, it became possible to mold containers into bumps.
従来の微細金属球の製造方法では、所定長さに切断した
金属線片を坩堝中に一定の間隔をとって配置した後、溶
融していた。これは、お互いの金属線片が接触したまま
、又は余りに近い位置に置かれたまま溶融工程に入ると
、溶融時にこれらの金属線片が合体してしまう戊がある
からである。In a conventional method for producing fine metal balls, pieces of metal wire cut into predetermined lengths are placed in a crucible at regular intervals and then melted. This is because if the metal wire pieces enter the melting process while remaining in contact with each other or placed too close to each other, these metal wire pieces may coalesce during melting.
この方法においては、金属線片がすべて一定の長さを有
すれば、均一なサイズの微細金属球を形成することがで
きた。しかしながら、この金属線片は長くても２〜３ｍ
ｍという微小なものなので、金属線片の配列作業及び微
細金属球の回収作業に手間がかかるという問題があった
。In this method, if all the metal wire pieces had a certain length, fine metal spheres of uniform size could be formed. However, this metal wire piece is 2 to 3 meters long at most.
Since the particles are as small as m, there is a problem in that arranging the metal wire pieces and collecting the fine metal balls takes time and effort.
本発明は上記事情に基づいてなされたものであり、簡易
な装置により、作業能率の向上を図ることができる微細
金属球の製造方法を提供することを目的とするものであ
る。The present invention has been made based on the above-mentioned circumstances, and an object of the present invention is to provide a method for manufacturing fine metal balls that can improve work efficiency using a simple device.
（課題を解決するための手段〕
上記の目的を達成するための本発明に係る微細金属球の
製造方法は、加熱手段において縦に配置された炉芯管内
を、金属線片を自由落下させ、前記金属線片に用いてい
る金属の融点以上の温度に前記金属線片を加熱して溶融
することにより、前記金属線片を球状化することを特徴
とするものである。(Means for Solving the Problems) A method for manufacturing fine metal spheres according to the present invention to achieve the above object includes the steps of: freely falling a piece of metal wire through a furnace core tube arranged vertically in a heating means; The method is characterized in that the metal wire piece is spheroidized by heating and melting the metal wire piece to a temperature equal to or higher than the melting point of the metal used in the metal wire piece.
そして、前記炉芯管の下端に蓋を設けることが望ましい
。Further, it is desirable to provide a lid at the lower end of the furnace core tube.
本発明は前記の構成によりて、炉芯管の中を自由落下す
る金属線片を、加熱手段によりその金属線片に用いてい
る金属の融点以上の温度に加熱して溶融する。溶融状態
の金属は表面張力が大きく、自ら球状化するので、金属
線片は炉芯管の中を落下中に球状に変形され、微細金属
球となる。In the present invention, with the above-described configuration, a piece of metal wire that freely falls inside the furnace core tube is heated and melted by a heating means to a temperature higher than the melting point of the metal used for the piece of metal wire. Metal in a molten state has a large surface tension and spheroidizes itself, so the metal wire pieces are deformed into a spherical shape while falling through the furnace core tube and become fine metal balls.
また、炉芯管の下端に蓋を設けることにより、管内に上
昇気流が発生するのを防止することができる。Furthermore, by providing a lid at the lower end of the furnace core tube, it is possible to prevent rising air current from occurring within the tube.
以下に本発明の一実施例を添付図面を参照して説明する
０図面は本発明の一実施例である微細金属球の製造方法
において使用する装置の概略図である０本実施例、にお
いでは、線径２５μｍ、長さ０．５５ｍｍの金線片（金
属線片）を使用しており、直径が８０μｍの金球（微細
金属球）を製造する。An embodiment of the present invention will be described below with reference to the accompanying drawings.The drawing is a schematic diagram of an apparatus used in a method for producing fine metal balls, which is an embodiment of the present invention. A gold wire piece (metal wire piece) with a wire diameter of 25 μm and a length of 0.55 mm is used to produce a gold ball (fine metal ball) with a diameter of 80 μm.
図面に示す装置は、金属線片１ｏの落下路である炉芯管
２と、金属線片１０を溶融するための加熱炉４と、形成
された微細金属球２０を回収するＩＦ５とからなる。炉
芯管２には、内径約５ｍｍ、長さ約１０００ｍｍの石英
ガラスを使用し、加熱炉４としては長さ５００ｍｍの縦
型環状電気炉を用いた。加熱炉４は下端近傍において最
高温度を有するような温度分布を持たせた。加熱炉４内
の最高温度は１３００℃である。加熱炉４の最高温度を
金の融点よりも高く設定しているのは、以下に説明する
ように、できるだけ短い炉芯管２によって、自由落下す
る金属線片を確実に融点以上の温度に加熱するためであ
る。！［６は石英ガラスで形成され、炉芯管２の下端に
はめ込まれている。The apparatus shown in the drawings includes a furnace core tube 2 which is a fall path for the metal wire piece 1o, a heating furnace 4 for melting the metal wire piece 10, and an IF 5 for collecting the formed fine metal spheres 20. The furnace core tube 2 was made of quartz glass with an inner diameter of about 5 mm and a length of about 1000 mm, and the heating furnace 4 was a vertical annular electric furnace with a length of 500 mm. The heating furnace 4 had a temperature distribution such that the highest temperature was near the lower end. The maximum temperature inside the heating furnace 4 is 1300°C. The reason why the maximum temperature of the heating furnace 4 is set higher than the melting point of gold is to ensure that the freely falling metal wire pieces are heated to a temperature above the melting point by using the shortest possible furnace core tube 2, as explained below. This is to do so. ! [6 is made of quartz glass and fitted into the lower end of the furnace core tube 2.
蓋６は高温の加熱炉４によって生ずる上昇気流を防ぐと
ともに、固化した微細金属球を回収するためのものであ
る。加熱炉４とＭ６との間隔は約２ＱＱｍｍである。尚
、炉芯管２の内部は通常の大気雰囲気を用いている。The lid 6 is used to prevent rising air currents generated by the high-temperature heating furnace 4 and to collect the solidified fine metal balls. The distance between the heating furnace 4 and M6 is approximately 2QQmm. Note that a normal atmospheric atmosphere is used inside the furnace core tube 2.
微細金属線の切断装置（不図示）で切断された金属線片
ｌＯは、炉芯管２の上方から落下され、炉芯管２に入る
。金属線片１０は炉芯管２内を落下し、加熱炉４に入る
と、温度が急激に上昇し始める。そして、金属線片は温
度がその金属の融点より高くなったときに溶融する。一
般に溶融金属は表面張力が大きいので、溶融状態では自
ら球形状に変化する。したがって、この溶融金属は加熱
炉４内を通過中に球形状に変化するが、加熱炉４を出る
と温度が急に下がり、この金属は凝固しはじめる。最後
に金属球が蓋６に落ち、固化した微細金属球２０が得ら
れる。The metal wire piece lO cut by a fine metal wire cutting device (not shown) is dropped from above the furnace core tube 2 and enters the furnace core tube 2. When the metal wire piece 10 falls through the furnace core tube 2 and enters the heating furnace 4, its temperature begins to rise rapidly. The piece of metal wire then melts when the temperature rises above the melting point of the metal. Generally, molten metal has a large surface tension, so it changes into a spherical shape by itself in the molten state. Therefore, this molten metal changes into a spherical shape while passing through the heating furnace 4, but when it exits the heating furnace 4, the temperature suddenly drops and the metal begins to solidify. Finally, the metal spheres fall into the lid 6, and solidified fine metal spheres 20 are obtained.
本発明者等が上記の装置及び金属線片を用いて実際に試
験を行ったところ、均一で綺麗な球形状の微細金属球を
得ることができた。When the present inventors actually conducted tests using the above-mentioned apparatus and metal wire pieces, they were able to obtain fine metal spheres with a uniform and beautiful spherical shape.
このように、本実施例の微細金属の製造方法においては
、金属線片を搬送するための装置を設けることなく、金
属線片を炉芯管に入れるだけで微細金属球の回収工程ま
で一度に行なうことができるので、作業能率の向上と、
量産性の向上を図ることが可能になる。さらに、本実施
例の装置に、たとえば微細金属線を一定の間隔で一本毎
に切断する装置を本実施例の炉芯管の上部に備えること
により、微細金属線の切断工程、切断された金属線片の
球状化工程及び微細金属球の回収工程を連続して行うこ
とができる。In this way, in the method for producing fine metal of this embodiment, the process of collecting fine metal balls can be completed all at once by simply putting the metal wire pieces into the furnace core tube, without providing any equipment for conveying the metal wire pieces. This improves work efficiency and
It becomes possible to improve mass productivity. Furthermore, by equipping the apparatus of this embodiment with a device for cutting fine metal wires one by one at regular intervals on the upper part of the furnace core tube of this embodiment, the cutting process of fine metal wires can be easily performed. The step of spheroidizing the metal wire piece and the step of collecting the fine metal spheres can be performed continuously.
また、本実施例の微細金属の製造方法では、従来取り上
げられなかった金属や合金にも適用することができるの
で、バンブとして適切な組成の微細金属球を能率良く製
造することができる。Furthermore, the method for producing fine metals of this embodiment can be applied to metals and alloys that have not been considered in the past, so that fine metal spheres having an appropriate composition as bumps can be efficiently produced.
尚、上記の実施例においては、金線片を用いて金球を製
造する場合について説明したが、本発明はこれに限定さ
れるものではなく、バンプに相応しい他の金属を使用し
てもよい。一般に、金属線片の落下初期速度から、加熱
炉内の通過速度を知ることができる。また、金属線片の
大きさとその金属の融点から、必要な加熱炉の長さと最
高温度とが決まる。したがって、他の金属を用いて微細
金属球を製造する場合には炉芯管と加熱炉の大きさ、加
熱炉の温度等を変更する必要がある。また、金属によっ
ては、高温の加熱炉内において化学反応が起こらないよ
うに炉芯管内を特定のガス雰囲気で置換する必要もある
。In addition, in the above embodiment, a case was explained in which a gold ball was manufactured using a piece of gold wire, but the present invention is not limited to this, and other metals suitable for the bump may be used. . Generally, the passing speed in the heating furnace can be determined from the initial falling speed of the metal wire piece. Further, the required length and maximum temperature of the heating furnace are determined from the size of the metal wire piece and the melting point of the metal. Therefore, when manufacturing fine metal balls using other metals, it is necessary to change the size of the furnace core tube and heating furnace, the temperature of the heating furnace, etc. Furthermore, depending on the metal, it may be necessary to replace the inside of the furnace core tube with a specific gas atmosphere to prevent chemical reactions from occurring in the high-temperature heating furnace.
また、上記の実施例では、炉芯管の下端部に蓋を被せた
場合について説明したが、本発明はこれに限定されるも
のではなく、たとえば蓋を用いずに、炉芯管の下端部を
テーパー状に加工し、下端の開口孔より微細金属球を回
収するようにしてもよい、これにより、たとえば炉芯管
の下方にベルトコンベア等を配置し、微細金属球を連続
的に回収することも可能になる。Further, in the above embodiment, a case has been described in which the lower end of the furnace core tube is covered with a lid, but the present invention is not limited to this. It is also possible to process the tube into a tapered shape so that the fine metal balls can be collected through an opening at the bottom end.In this way, for example, a belt conveyor or the like can be placed below the furnace core tube to continuously collect the fine metal balls. It also becomes possible.
以上説明したように本発明によれば、自由落下する金属
線片を加熱手段を用いて溶融し、溶融金属の大きな表面
張力を利用することによって、容易に微細金属球を製造
することができるので、部品な装置により作業能率の向
上を図り、量産性の向上を図ることができる微細金属球
の製造方法を提供することができる。As explained above, according to the present invention, fine metal balls can be easily manufactured by melting freely falling pieces of metal wire using heating means and utilizing the large surface tension of the molten metal. Accordingly, it is possible to provide a method for manufacturing fine metal balls that can improve work efficiency and mass productivity using a component-based device.
添付図面は本発明の一実施例である微細金属球の製造方
法において使用する装置の概略図である。
２・・・炉芯管、４・・・加熱炉、
６・・・蓋、１０・・・金属線片、
２０・・・微細金属球。The accompanying drawing is a schematic diagram of an apparatus used in a method for manufacturing fine metal spheres, which is an embodiment of the present invention. 2... Furnace core tube, 4... Heating furnace, 6... Lid, 10... Metal wire piece, 20... Fine metal ball.
Claims (2)
属線片を自由落下させ、前記金属線片に用いている金属
の融点以上の温度に前記金属線片を加熱して溶融するこ
とにより、前記金属線片を球状化することを特徴とする
微細金属球の製造方法。(1) A piece of metal wire is allowed to fall freely in a furnace core tube arranged vertically in a heating means, and the piece of metal wire is heated to a temperature higher than the melting point of the metal used for the piece of metal wire to melt it. A method for producing fine metal spheres, characterized in that the metal wire piece is spheroidized by:
細金属球の製造方法。(2) The method for manufacturing fine metal balls according to claim 1, wherein a lid is provided at the lower end of the furnace core tube.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2179263A JPH0466601A (en) | 1990-07-06 | 1990-07-06 | Manufacture of fine metal balls |
| PCT/JP1990/001591 WO1991008850A1 (en) | 1989-12-07 | 1990-12-06 | Method of manufacturing minute metallic balls uniform in size |
| KR1019910700856A KR960000332B1 (en) | 1989-12-07 | 1990-12-06 | Method of manufacturing minute metallic balls or minute alloy balls |
| EP91900363A EP0457920B1 (en) | 1989-12-07 | 1990-12-06 | Method of manufacturing minute metallic balls uniform in size |
| DE69032249T DE69032249T2 (en) | 1989-12-07 | 1990-12-06 | METHOD FOR PRODUCING TINY METALLIC BALLS OF EVEN SIZE |
| US08/596,694 US5761779A (en) | 1989-12-07 | 1996-02-05 | Method of producing fine metal spheres of uniform size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2179263A JPH0466601A (en) | 1990-07-06 | 1990-07-06 | Manufacture of fine metal balls |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0466601A true JPH0466601A (en) | 1992-03-03 |
Family
ID=16062796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2179263A Pending JPH0466601A (en) | 1989-12-07 | 1990-07-06 | Manufacture of fine metal balls |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0466601A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911618B1 (en) | 2004-02-03 | 2005-06-28 | Hitachi Metals, Ltd. | Method of producing minute metal balls |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63111101A (en) * | 1986-10-30 | 1988-05-16 | Daido Steel Co Ltd | Spheroidizing method for metal or alloy powder |
| JPS63130701A (en) * | 1986-11-20 | 1988-06-02 | Aisin Seiki Co Ltd | Production of metallic grain |
| JPH03281707A (en) * | 1990-03-29 | 1991-12-12 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine lead balls |
| JPH03281705A (en) * | 1990-03-29 | 1991-12-12 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine copper balls |
| JPH03281708A (en) * | 1990-03-29 | 1991-12-12 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine lead balls |
| JPH03281706A (en) * | 1990-03-29 | 1991-12-12 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine copper balls |
| JPH0426704A (en) * | 1990-05-22 | 1992-01-29 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine gold ball |
| JPH0426701A (en) * | 1990-05-21 | 1992-01-29 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine gold ball |
-
1990
- 1990-07-06 JP JP2179263A patent/JPH0466601A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63111101A (en) * | 1986-10-30 | 1988-05-16 | Daido Steel Co Ltd | Spheroidizing method for metal or alloy powder |
| JPS63130701A (en) * | 1986-11-20 | 1988-06-02 | Aisin Seiki Co Ltd | Production of metallic grain |
| JPH03281707A (en) * | 1990-03-29 | 1991-12-12 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine lead balls |
| JPH03281705A (en) * | 1990-03-29 | 1991-12-12 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine copper balls |
| JPH03281708A (en) * | 1990-03-29 | 1991-12-12 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine lead balls |
| JPH03281706A (en) * | 1990-03-29 | 1991-12-12 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine copper balls |
| JPH0426701A (en) * | 1990-05-21 | 1992-01-29 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine gold ball |
| JPH0426704A (en) * | 1990-05-22 | 1992-01-29 | Tatsuta Electric Wire & Cable Co Ltd | Manufacture of fine gold ball |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911618B1 (en) | 2004-02-03 | 2005-06-28 | Hitachi Metals, Ltd. | Method of producing minute metal balls |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101607360A (en) | Mass production method for ultra-fine bonding gold wire | |
| JP3248778B2 (en) | Method of forming ball part on solder wire | |
| JP3891346B2 (en) | Fine copper ball and method for producing fine copper ball | |
| JP3367544B2 (en) | Gold alloy fine wire for bonding and method of manufacturing the same | |
| JP2011511884A (en) | Glass-coated wire manufacturing apparatus and manufacturing method | |
| JPH0466601A (en) | Manufacture of fine metal balls | |
| JP2779299B2 (en) | Method and apparatus for producing fine metal spheres | |
| JPH0713273B2 (en) | Bonding wire for semiconductor device and manufacturing method thereof | |
| JPH04233243A (en) | Automatic tape-bonding method | |
| JPH0466602A (en) | Production of fine metal ball | |
| JPH0466603A (en) | Production of fine metal ball | |
| JPS6328851A (en) | Heat treatment for low-melting point metal | |
| JPH08295905A (en) | Production of fine metallic bead and device therefor | |
| KR100469018B1 (en) | method and apparatus for producing fine metal spheres of uniform sizes | |
| JPH03180401A (en) | Manufacture of fine metallic ball having uniform size | |
| JP3925792B2 (en) | Method for producing metal sphere for conductive spacer | |
| JP6459472B2 (en) | Pb-free Au-Ge solder alloy with controlled energy absorption and electronic component sealed or bonded using the same | |
| JP2016112588A (en) | Au-Sn-BASED SOLDER ALLOY WHERE SURFACE CONDITION IS CONTROLLED AND SEALED OR BONDED ELECTRONIC COMPONENT USING THE SAME | |
| KR100469019B1 (en) | method and apparatus for producing fine metal spheres using atomizing by gas flame | |
| CN207705170U (en) | A kind of multi-functional pressure mold device | |
| JPH07307341A (en) | Method of forming bumps | |
| JP2914351B2 (en) | Apparatus and method for producing metal micro-ball | |
| JP2002192383A (en) | Manufacturing method and device for soldering ball high in surface hardness | |
| JPS60113449A (en) | Manufacture of lead pin with difficultly processed solder | |
| JPH08118074A (en) | Production of soldering wire |