JPH0398082A - Liquid crystal display panel - Google Patents
Liquid crystal display panelInfo
- Publication number
- JPH0398082A JPH0398082A JP23644889A JP23644889A JPH0398082A JP H0398082 A JPH0398082 A JP H0398082A JP 23644889 A JP23644889 A JP 23644889A JP 23644889 A JP23644889 A JP 23644889A JP H0398082 A JPH0398082 A JP H0398082A
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminal
- liquid crystal
- substrate
- crystal display
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 26
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000005520 cutting process Methods 0.000 claims abstract description 23
- 239000003566 sealing material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 210000002858 crystal cell Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野)
本発明はマトリクス形液晶表示パネルに関し、特に電極
端子部の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a matrix type liquid crystal display panel, and particularly to the structure of electrode terminal portions.
液晶表示パネルの低電圧・低消費電力といった特徴を活
かし、情報端末等にマトリクス形液晶表示パネルが用い
られている。Matrix-type liquid crystal display panels are used in information terminals and the like, taking advantage of the characteristics of liquid crystal display panels such as low voltage and low power consumption.
このマトリクス形表示パネルは、複数ラインの縦電極が
配設された上基板と複数ラインの横電極が配設された下
基板の構成、または共通電極が配設された上基板と複数
ラインの縦電極と横電極が交叉した下基板とで構成され
ており、表示部の縦電極と横電極に相当する本数の電極
端子部が液晶表示パネルの外周に配置され、マトリクス
表示を緻密にすればする程、その本数も増加し、また微
細パターンとなる。This matrix type display panel has an upper substrate with multiple lines of vertical electrodes and a lower substrate with multiple lines of horizontal electrodes, or an upper substrate with a common electrode and multiple lines of vertical electrodes. It consists of a lower substrate on which electrodes and horizontal electrodes intersect, and a number of electrode terminals corresponding to the vertical and horizontal electrodes of the display section are arranged around the outer periphery of the liquid crystal display panel, making it possible to create a dense matrix display. As the pattern increases, the number of lines increases and the pattern becomes finer.
第3図は従来の液晶表示パネルの電極端子部を示す図で
ある。上電極が形成された上基板31と下電極および下
電極端子部34が形成された下基板32との間をシール
材層33でシールし、内部に液晶材を封入後、電極端子
部34の一端に設けてある導通部35を切断して液晶表
示パネルは完成する。FIG. 3 is a diagram showing an electrode terminal portion of a conventional liquid crystal display panel. A sealing material layer 33 is used to seal between the upper substrate 31 on which the upper electrode is formed and the lower substrate 32 on which the lower electrode and the lower electrode terminal part 34 are formed, and after sealing the liquid crystal material inside, the electrode terminal part 34 is sealed. The conductive portion 35 provided at one end is cut to complete the liquid crystal display panel.
この電極端子部34の切断は、下基板32の切断位置の
裏面にスクライブ線を入れた後、スクライブ線に引っ張
り応力がかかるように折り曲げるか、または下基板32
の切断位置の表面にスクライブ線を入れた後、スクライ
ブ線に引っ張り応力がかかるように折り曲げて行なわれ
る。しかし、下基板32を切断する時、電極端子部34
を形成している金属膜にも応力がかかり、金属膜は切断
位置近傍に剥がれを起す。The electrode terminal section 34 can be cut by inserting a scribe line on the back surface of the lower substrate 32 at the cutting position and then bending the scribe line so as to apply tensile stress, or by cutting the lower substrate 32
After a scribe line is placed on the surface at the cutting position, the scribe line is bent so that tensile stress is applied to the scribe line. However, when cutting the lower substrate 32, the electrode terminal portion 34
Stress is also applied to the metal film that forms the cut, and the metal film peels off near the cutting location.
上述した従来の液晶表示パネルは、電極端子部を切断す
る時電極端子部を形成している金属膜に剥がれが起こり
、電極端子部を損傷して外部回路との接続不良を起こし
、製品の信頼性に重大な悪影響を与えるという欠点があ
る。In the conventional liquid crystal display panel described above, when the electrode terminal section is cut, the metal film forming the electrode terminal section peels off, damaging the electrode terminal section and causing a connection failure with the external circuit, reducing the reliability of the product. It has the disadvantage of having a serious negative impact on sexuality.
本発明の目的は、電極端子部を切断する時、電極端子部
を形成している金属膜に剥れが生じることがない液晶表
示パネルを提供することである。An object of the present invention is to provide a liquid crystal display panel in which the metal film forming the electrode terminal portion does not peel off when the electrode terminal portion is cut.
本発明の液晶表示パネルは、対向する電極基板間にシー
ル材層を形成し、両電極基板を一定の間隙に保持して接
着後、シール材層から突出している複数本の電極端子部
の一端を切断して形成される液晶表示パネルにおいて、
前記電8i14子部の切断位置とその近傍の基板表面に
凹凸部か設けられ、該凹凸部を横断して電極端子部が配
設されている。In the liquid crystal display panel of the present invention, a sealing material layer is formed between opposing electrode substrates, and after both electrode substrates are held at a constant gap and bonded, one end of a plurality of electrode terminal portions protrudes from the sealing material layer. In the liquid crystal display panel formed by cutting the
An uneven portion is provided on the surface of the substrate at and in the vicinity of the cutting position of the electrode 8i14 child portion, and an electrode terminal portion is provided across the uneven portion.
切断位置とその内側の基板表面に凹凸部を設けた後、金
属膜を形成することで、金属膜と下地表面との密着面積
が増大し、この部分の金属膜の密着強度か高まり、金属
膜の剥れが阻止される。By forming a metal film after providing uneven parts at the cutting position and on the substrate surface inside the cutting position, the adhesion area between the metal film and the underlying surface increases, the adhesion strength of the metal film in this area increases, and the metal film peeling is prevented.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第1図(a) . (b) , (c)は本発明の第1
の実施例の掖晶表示パネルの電極端子部の電極基板の切
断位置とその内側に凹凸部13が形成された基板の部分
的模式図である。Figure 1(a). (b) and (c) are the first
FIG. 3 is a partial schematic diagram of the cutting position of the electrode substrate of the electrode terminal portion of the liquid crystal display panel of the embodiment and the substrate with the uneven portion 13 formed inside the cutting position.
第1図(a)に示すように下基板12表面をフォトレジ
スト法でパターニング後、1:100に希釈したフッ化
水素酸水溶液でエッチングし、電極端子部切断位置に1
μの凹凸部13を形成する。As shown in FIG. 1(a), the surface of the lower substrate 12 is patterned using a photoresist method, and then etched with a 1:100 diluted hydrofluoric acid aqueous solution.
A concavo-convex portion 13 of μ is formed.
次に、第1図(b)に示すように、下基板12表面に金
属クロム膜をスパッタ法で1200A形成、フォトレジ
スト法でパターニング後エッチングして、表示部の縦電
極または横電極(図示せず)と電極端子部14および導
通部15を形成する。さらに、ITO(酸化インジウム
スズ)膜をスバッタ法で800入成膜、エッチングして
表示電極(図示せず)を形成する。次に、下基板12の
表示電極の周辺部に、スベーサ材が混合されたシール材
層16を配置、上基板11と重ね合せて圧力をかけ、シ
ール材層16で上基板11.12を接着して形成された
液晶セルに液晶材を充填後、注入孔を封止する。最後に
、第1図(C)に示すように下基板12の電極端子部の
一端の切断位置の裏面(表面には凹凸部13が設けてあ
る)にスクライブ線を入れた後、このスクライブ線に引
っ張り応力をかけて導通部15を分断し本実施例の液晶
表示パネルが完成する。Next, as shown in FIG. 1(b), a metal chromium film of 1200 mm is formed on the surface of the lower substrate 12 by sputtering, patterned by a photoresist method, and then etched. 1) to form electrode terminal portions 14 and conductive portions 15. Further, an ITO (indium tin oxide) film is deposited by a sputtering method and etched to form a display electrode (not shown). Next, a sealing material layer 16 mixed with a substrate material is placed around the display electrodes of the lower substrate 12, and the sealing material layer 16 is overlapped with the upper substrate 11 and pressure is applied to bond the upper substrates 11 and 12 with the sealing material layer 16. After filling the formed liquid crystal cell with a liquid crystal material, the injection hole is sealed. Finally, as shown in FIG. 1(C), a scribe line is placed on the back surface (the surface is provided with an uneven portion 13) of the cutting position of one end of the electrode terminal portion of the lower substrate 12, and then the scribe line is A tensile stress is applied to the conductive portions 15 to separate them, and the liquid crystal display panel of this example is completed.
第2図(a) . (b) , (c)は本発明の第2
の実施例の液晶表示パネルの電極端子部の電極基板の切
断位置とその内側に凹凸部23が形成された基板の部分
的模式図である。Figure 2(a). (b) and (c) are the second
FIG. 3 is a partial schematic diagram of the cutting position of the electrode substrate of the electrode terminal portion of the liquid crystal display panel of Example 1, and the substrate on which uneven portions 23 are formed inside the cutting position.
第2図(a)に示すように、下基板22表面にプラズマ
CVD法により窒化シリコンII5!30を6000A
形成、フォトレジスト法でバターニング後エッチングし
て電極端子部24の切断位置に600OAの凹凸部23
を形成する。次に、第1の実施例の第1図(b) .
(c)と同様にしてシール材層26で上下基板21.2
2を接着して形成された液晶セルに液晶材を充填後、下
基板22の電極端子部の一端の切断位置の裏面(表面に
は窒化シリコン膜で凹凸部23が設けてある)にスクラ
イブ線を入れた後、このスクライブ線に引っ張り応力を
かけて導通部25を分断し第2の実施例の液晶表示パネ
ルが完成する。As shown in FIG. 2(a), silicon nitride II5!30 is deposited at 6000A on the surface of the lower substrate 22 by plasma CVD.
After formation and patterning using a photoresist method, etching is performed to form a 600 OA uneven portion 23 at the cutting position of the electrode terminal portion 24.
form. Next, FIG. 1(b) of the first embodiment.
Similarly to (c), the upper and lower substrates 21.2 are coated with the sealing material layer 26.
After filling the liquid crystal cell formed by gluing 2 together with a liquid crystal material, a scribe line is placed on the back surface (the surface is provided with an uneven portion 23 of silicon nitride film) at the cutting position of one end of the electrode terminal portion of the lower substrate 22. After applying tensile stress to the scribe line, the conductive portion 25 is separated to complete the liquid crystal display panel of the second embodiment.
この第2の実施例における窒化シリコン膜30の凹凸部
23の形成は、パターニングエッチングにドライ法が使
用できるため、裏面の損傷が無いことと、基板表面にか
けるアンダーコート膜を利用できる利点がある。In the formation of the uneven portions 23 of the silicon nitride film 30 in this second embodiment, a dry method can be used for patterning etching, which has the advantage that there is no damage to the back surface and that an undercoat film applied to the substrate surface can be used. .
(発明の効果〕
以上説明したように本発明は、電極端子部の一端の切断
位置とその内側の基板表面に凹凸部を設けた基板を用い
て、この凹凸部を横断するように電極端子部用金属膜を
形成することにより、金属膜と下地表面との密着面積を
増大させ、この部分の金属膜の密着強度を高めることで
、電極端子部を切断する時、この部分の剥れを阻止する
ことができ、従って、製作した液晶表示パネルは、外部
回路との接続不良が無く配線の信頼性が高いことから、
表示品位の優れた液晶表示パネルを提供できる効果があ
る。(Effects of the Invention) As described above, the present invention uses a substrate in which an uneven portion is provided at the cutting position of one end of the electrode terminal portion and on the surface of the substrate inside the cutting position, and the electrode terminal portion is formed so as to cross the uneven portion. By forming a protective metal film, the adhesion area between the metal film and the underlying surface is increased, and the adhesion strength of the metal film in this area is increased to prevent peeling of this area when cutting the electrode terminal part. Therefore, the manufactured liquid crystal display panel has no connection failures with external circuits and has high wiring reliability.
This has the effect of providing a liquid crystal display panel with excellent display quality.
第1図(a) , (b) . (c)は本発明の第1
の実施例の基板を用いた液晶表示パネルの部分断面図、
第2図(a) . (b) . (c)は本発明の第2
の実施例の基板を用いた液晶表示パネルの部分断面図、
第3図は従来法による基板を用いた液晶表示パネルの部
分断面図である。
]1,21.31−−−−−−上基板、12.22.3
2−−−−下基板、13.23・・・・・・・・・凹凸
部、+4.24.34・・・・・・電極端子部15,2
5.35・・・・・・導通部、+6.26.33・・・
・・・シール材層30・・・・・・・・・・・・・・・
窒化シリコン膜。Figure 1 (a), (b). (c) is the first aspect of the present invention.
A partial cross-sectional view of a liquid crystal display panel using the substrate of the example,
Figure 2(a). (b). (c) is the second aspect of the present invention.
A partial cross-sectional view of a liquid crystal display panel using the substrate of the example,
FIG. 3 is a partial sectional view of a liquid crystal display panel using a conventional substrate. ]1, 21.31-----Top substrate, 12.22.3
2----Lower substrate, 13.23...... Uneven portion, +4.24.34... Electrode terminal portion 15, 2
5.35... Continuity part, +6.26.33...
・・・Seal material layer 30・・・・・・・・・・・・・・・
Silicon nitride film.
Claims (1)
基板を一定の間隙に保持して接着後、シール材層から突
出している複数本の電極端子部の一端を切断して形成さ
れる液晶表示パネルにおいて、前記電極端子部の切断位
置とその近傍の基板表面に凹凸部が設けられ、該凹凸部
を横断して電極端子部が配設されていることを特徴とす
る液晶表示パネル。1. Form a sealing material layer between opposing electrode substrates, hold both electrode substrates with a certain gap and bond them together, and then cut one end of a plurality of electrode terminals protruding from the sealing material layer. A liquid crystal display panel characterized in that an uneven portion is provided on the surface of the substrate at and in the vicinity of the cutting position of the electrode terminal portion, and the electrode terminal portion is disposed across the uneven portion. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23644889A JPH0398082A (en) | 1989-09-11 | 1989-09-11 | Liquid crystal display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23644889A JPH0398082A (en) | 1989-09-11 | 1989-09-11 | Liquid crystal display panel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0398082A true JPH0398082A (en) | 1991-04-23 |
Family
ID=17000899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23644889A Pending JPH0398082A (en) | 1989-09-11 | 1989-09-11 | Liquid crystal display panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0398082A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001018596A1 (en) * | 1999-09-08 | 2001-03-15 | Matsushita Electric Industrial Co., Ltd. | Display device and method of manufacture thereof |
JP2005128303A (en) * | 2003-10-24 | 2005-05-19 | Sony Corp | Device, method for manufacturing semiconductor device, and method for manufacturing liquid crystal display element |
WO2006129741A1 (en) * | 2005-05-31 | 2006-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
-
1989
- 1989-09-11 JP JP23644889A patent/JPH0398082A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001018596A1 (en) * | 1999-09-08 | 2001-03-15 | Matsushita Electric Industrial Co., Ltd. | Display device and method of manufacture thereof |
US6961111B1 (en) | 1999-09-08 | 2005-11-01 | Matsushita Electric Industrial Co., Ltd. | Display device and method of producing same |
JP2005128303A (en) * | 2003-10-24 | 2005-05-19 | Sony Corp | Device, method for manufacturing semiconductor device, and method for manufacturing liquid crystal display element |
WO2006129741A1 (en) * | 2005-05-31 | 2006-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8101990B2 (en) | 2005-05-31 | 2012-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
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