JP2001091918A - Method for manufacturing liquid crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing technique capable of decreasing the damages of wiring of a liquid crystal device having reflection electrodes and wiring composed of metallic films consisting of soft metals. SOLUTION: Alignment layers 16 are formed so as to completely cover protective films 15 on a first mother substrate 11 as well as the wiring 14 and connecting terminals 150 of planned overhanging regions 11B. The alignment layers 16 are formed by printing of a polyimide resin by a flexographic printing method or the like, then baking the resin. The alignment layers 16 are formed so as to completely cover the planned overhanging regions 11B as well in addition to planned liquid crystal sealing regions 11A and are subjected to a rubbing treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal device, and more particularly to a technology for manufacturing a liquid crystal device having a reflective electrode and a wiring made of a metal film.

[0002]

2. Description of the Related Art Generally, when a liquid crystal panel having a relatively small display area is manufactured, a plurality of panel scheduled areas are set on the surface of a large mother substrate called mother glass or the like. A plurality of electrodes and wirings are formed each time, a protective film made of an inorganic insulating film is formed on these electrodes, and then an alignment film made of a polyimide resin or the like is formed. The alignment film is subjected to a rubbing treatment to give an alignment ability to liquid crystal molecules.

When a reflective liquid crystal panel is manufactured, a reflective electrode is formed on the surface of one panel substrate, a transparent electrode is formed on the surface of the other panel substrate, and a predetermined electrode is formed between the reflective electrode and the transparent electrode. The mainstream is a configuration in which the drive voltage is applied. In this case, the reflective electrode is often formed of aluminum or an alloy obtained by adding titanium oxide, zirconium oxide, or the like to aluminum to increase the reflectance.

[0004]

When aluminum or an alloy mainly composed of aluminum is used as the reflective electrode as described above, the wiring formed together with the reflective electrode is formed of the same material. Usually, the wiring is drawn out to the surface of an overhang region where one substrate is overhanged from the other substrate, and the leading end portion becomes an external terminal portion. However, since the metal film made of aluminum constituting the wiring is soft, the wiring may be damaged during the manufacturing process. In particular, when rubbing treatment is performed on the surface of the alignment film after forming the alignment film on the reflective electrode, the wiring not covered with the alignment film may be damaged by rubbing. If the wiring is damaged, disconnection or corrosion (corrosion, electrolytic corrosion) due to application of a voltage is likely to occur, and the reliability of the liquid crystal device is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a liquid crystal device having a reflective electrode and a wiring formed of a metal film made of a soft metal and a manufacturing technique capable of reducing damage to the wiring. Is to provide.

[0006]

In order to solve the above-mentioned problems, a method of manufacturing a liquid crystal device according to the present invention comprises a first substrate having a reflective electrode made of a metal film on a surface thereof, and a transparent substrate facing the first substrate. And a liquid crystal device sandwiching liquid crystal between the first substrate and the second substrate, wherein a conductive material is provided on the surface of the first substrate and the reflective electrode. An electrode forming step of connecting and forming a wiring forming an external terminal portion by using the same material as the reflective electrode, extending to an external connection portion set on the overhang region of the first substrate; Forming an alignment film so as to cover the entire wiring, and performing an rubbing process on the alignment film; and an alignment film removing step of removing a portion of the alignment film covering the external connection portion. It is characterized by the following.

According to the present invention, since the alignment film is formed so as to cover not only the reflective electrode but also the wiring, even if rubbing is performed on the alignment film, the wiring may be damaged by rubbing or foreign matter may be removed. Since no adhesion is caused, disconnection of wiring and occurrence of electrolytic corrosion can be reduced.

Further, a method of manufacturing a liquid crystal device according to the present invention includes a first substrate provided with a reflective electrode made of a metal film on a surface thereof, and a transparent second substrate opposed to the first substrate. A method for manufacturing a liquid crystal device comprising a liquid crystal sandwiched between one substrate and said second substrate, comprising: using a first mother substrate including a plurality of panel scheduled regions corresponding to said first substrate; The wiring that is conductively connected to the reflective electrode for each of the panel scheduled regions of the mother substrate and extends to an external connection portion set at a portion corresponding to the overhang region of the first substrate to form an external terminal portion that reflects the wiring An electrode forming step of forming the same material as the electrode, an alignment film forming an alignment film so as to cover the reflective electrode and the wiring, and a rubbing process on the alignment film; Removing a portion covering the external connection portion. And wherein the door.

In the present invention, in the electrode forming step, an alignment mark is formed on the first mother substrate together with the reflective electrode and the wiring using the same material, and in the alignment film forming step, the alignment film is It is preferable that the alignment mark is formed so as to cover the entire alignment mark.

According to the present invention, when the alignment mark is formed on the first mother substrate together with the reflection electrode and the wiring, the alignment mark is formed so as to cover the entire alignment mark, so that the rubbing process for the alignment film is performed. Even if the alignment is performed, the alignment marks will not be damaged, so that the alignment of the first mother substrate during the manufacturing process can be performed without any trouble and more accurately.

In the present invention, in the step of forming an alignment film, it is preferable that the alignment film is formed on the entire surface of the first mother substrate.

According to the present invention, the alignment film is formed on the entire surface of the first motherboard, so that the reflective electrodes and the wiring formed on the first motherboard can be arranged or arranged in the panel predetermined area according to the arrangement or shape. Irrespective of this, the alignment film forming step can be always performed under constant conditions, so that consideration and preparation for the alignment film formation pattern are not required, and the first mother substrate other than the above-described reflective electrodes and wirings is not required. In the case where an alignment mark or the like formed in the above is formed, such damage can also be avoided.

In the present invention, it is preferable that the reflective electrode and the wiring are formed of aluminum or an alloy mainly containing aluminum.

According to the present invention, aluminum or an alloy mainly composed of aluminum is liable to be oxidized, easily susceptible to electric contact, is easily damaged by mechanical damage, is easily broken, and is eluted in hot water or the like. Therefore, a particularly great effect can be obtained when the reflective electrode and the wiring are formed of these materials.

In the present invention, there is provided a substrate removing step of removing a portion of the second substrate facing the overhanging region after the alignment film forming step and exposing the overhanging region. Is preferably applied to the exposed overhang region.

According to the present invention, the alignment film on the overhanging region is removed by exposing the overhanging region after bonding the substrates and then performing the substrate removing step to remove the alignment film on the overhanging region. Only the film can be easily removed without using a mask or the like. In this case, it is desirable to remove the alignment film by an ashing process using oxygen plasma treatment.

In the present invention, it is preferable that a protective film made of an inorganic insulator is formed on the surface of the reflective electrode avoiding the external terminal portion, and the alignment film is formed so as to completely cover the protective film. According to the present invention, the protective film for preventing vertical conduction of the liquid crystal panel and mixing of impurities into the liquid crystal,
By forming avoiding the external terminal portion, since only the alignment film may be removed from the external terminal portion in a later step,
The alignment film removing step can be easily performed, and since the alignment film is formed so as to completely cover the protective film, the rubbing cloth or the like does not contact the protective film during rubbing, thereby preventing rubbing unevenness. In addition, the alignment state can be made uniform.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a method for manufacturing a liquid crystal device according to the present invention will be described in detail with reference to the accompanying drawings. FIGS. 1A and 1B are schematic plan views schematically showing the surface structures of a first mother substrate 11 and a second mother substrate 12 used in the method for manufacturing a liquid crystal device of the present embodiment. FIG. 2 is schematic explanatory diagrams (a) to (h) showing the flow of the manufacturing process of the present embodiment. Further, FIG. 3 is a schematic cross-sectional view (a) showing the liquid crystal panel 100 formed by the manufacturing process of the present embodiment, and an enlarged partial plan view (b) mainly showing the overhang region. In this embodiment, a plurality of scheduled panel regions 11x are set on the first mother substrate 11 as shown in FIG.

As shown in FIG. 1A, the first mother substrate 11
Is coated with aluminum by a sputtering method or a vapor deposition method, and is patterned by a photolithography method, so that a plurality of reflective electrodes 13, wirings 14, and connection terminals 150 are formed in each panel expected region 11x. The plurality of reflection electrodes 13 are arranged in each panel scheduled area 1.
It is formed in the 1x liquid crystal encapsulation scheduled area 11A. Although not shown, each of the reflection electrodes 13 has a stripe shape,
They are formed so as to be parallel to each other. Multiple wiring 14
Is formed so as to be drawn out from the liquid crystal encapsulation scheduled area 11A of each panel scheduled area 11x to the projected projected area 11B. The plurality of connection terminals 150 are formed so as to be arranged in parallel with the projected area 11B.

Next, the reflection electrode 13 in the liquid crystal sealing area 11A
In addition, a protective film 15 made of a hard inorganic insulator such as SiO ₂ or TiO _{2 is} formed on a part of the wiring 14 by applying a silica slurry liquid by, for example, flexographic printing or the like and baking it. The protective film 15 is also called a top coat film. In a liquid crystal panel structure described later, short-circuit failure between electrodes due to dust being mixed between the transparent electrode and the reflective electrode, and elution of impurities from the substrate to the liquid crystal layer. It is for preventing. The protective film 15 may be any pattern as long as it does not cover the projected area 11B.
As shown in FIG. 1 (a), it may be formed so as to integrally cover a plurality of liquid crystal encapsulation planned areas 11A adjacent in the vertical direction in the figure.

Next, an alignment film 16 is formed so as to completely cover the protective film 15 and the wirings 14 and the connection terminals 150 in the projected area 11B. The alignment film 16 is formed by printing a polyimide resin by a flexographic printing method or the like and baking it. The alignment film 16 may basically be formed so as to completely cover the projected area 11B in addition to the liquid crystal sealing intended area 11A. For example, as shown in the example of FIG. Panel scheduled area 11
It may be formed so as to integrally cover x. In addition, as shown in FIG. 1A, when an alignment mark 11a for alignment is formed on the surface of the first mother substrate 11 at the same time as the reflective electrode 13, the wiring 14, and the connection terminal 150 using the same material. , This alignment mark 1
Preferably, it is formed so as to cover also 1a. For example, it may be formed so as to cover the entire surface of the first motherboard 11. In this case, it is not necessary to change the formation pattern depending on the arrangement, position, dimensions, and the like of the panel scheduled area.

Next, a rubbing cloth provided with bristles having an appropriate length close to the surface is attached to the peripheral surface of the roller to form a rubbing roller, and the rubbing roller is rotated to rub the substrate surface. While moving, the alignment film 16 is subjected to a rubbing process. At this time, since the reflective electrode 13, the wiring 14, and the connection terminal 150 are all covered with the protective film 15 and the alignment film 16, even if they are rubbed by the rubbing roller, they are not damaged.

On the other hand, also in the first mother substrate 12 shown in FIG. 1B, a plurality of liquid crystal encapsulation areas 12A corresponding to the above liquid crystal encapsulation areas 11A are set. Numerous transparent electrodes 17 composed of a transparent conductor made of (indium tin oxide) or the like
Is formed. The transparent electrodes 17 are each formed in a stripe shape, and are patterned in respective regions in a state where they are arranged in parallel with each other. Further, an alignment film 18 similar to the above is formed on the transparent electrode 17, and a rubbing process is performed as described above.

On the first mother substrate 11 formed as described above, as shown in FIG. 1A, a sealing material 19 is formed so as to surround each liquid crystal enclosing area 11A. Each sealing material 19 thus formed has a liquid crystal sealing opening 10a. The first motherboard 11 is bonded to the second motherboard 12 via the sealing material 19 as shown in FIGS. 2B and 2C. Then, pressure is applied so that the bonding state becomes a predetermined gap between the substrates (for example, about 5 to 10 μm), and in this state, heating or light irradiation is performed to cure the sealing material 19. Thus, the mother panel 10 shown in FIG. 2C is formed.

Next, as shown in FIG. 2D, the mother panel 10 is cut into strips (scribe-break) to form strip panels 20. By forming the strip-shaped panel 20, the liquid crystal injection port 19a of the sealing material 19 shown in FIG. 1A is exposed, and the liquid crystal is injected from the liquid crystal injection port 19a. The liquid crystal can be injected by immersing the liquid crystal injection port 19a in the liquid crystal under reduced pressure or
The liquid crystal is injected into the panel by closing the liquid crystal injection port 19a with the liquid crystal by dropping the liquid crystal into the liquid crystal a, and increasing the ambient pressure toward the atmospheric pressure in this state, thereby causing the liquid crystal to enter the panel by the difference between the inside and outside pressures. When the liquid crystal injection is completed, the liquid crystal injection port 19 a is sealed with a sealing resin to confine the liquid crystal inside the sealant 19.

Next, the rectangular panel 20 shown in FIG.
On the other hand, a part of the second motherboard 12 is cut and removed as shown in the figure, and as shown in FIG. Are formed in a protruding state. Furthermore, this strip-shaped panel 2
0 is cut into each of the liquid crystal encapsulation scheduled areas 11A and 12A, and separated into individual liquid crystal panels 100. In this state, as shown in FIG. 3A showing a cross section of the liquid crystal panel 100, a substrate 110 which is a part of the first mother substrate 11 is provided.
Of the substrate 120, which is a part of the second motherboard 12, extends outside the outer edge of the substrate 120 to form an overhang region 11B '. Then, a plurality of wirings 14 are drawn out on the surface of the overhang region 11B 'as described above, and these are connected to the alignment film 1B.
6 are coated.

FIG. 3B shows the overhang area 11B '.
FIG. 2 shows a plan view of a liquid crystal panel 100 in the vicinity. Liquid crystal sealed region 11 in which substrate 110 and substrate 120 are bonded to each other
In A ′ (corresponding to the above-described liquid crystal encapsulation scheduled area 11A), an extraction wiring 14a made of aluminum and conductively connected to the reflective electrode 13 is extended to the overhang area 11B ′.

On the outside of the sealing material 19 disposed between the substrate 110 and the substrate 120, conductive particles (for example, plating is applied to the surface of a resin ball in a resin material substantially similar to the sealing material 19). ) Are arranged. The vertical conductive member 21 is formed of the first mother substrate 11
And the second motherboard 12 are bonded together and when pressed,
An anisotropic conductor configured to exhibit conductivity only in the cell thickness direction (substrate thickness direction) by the conductive particles.

A base end of a connecting wiring 14b made of aluminum and formed together with the reflection electrode 13 is formed at a portion where the vertical conductive material 21 contacts the substrate 110. The connection wiring 14b extends from the base end in contact with the vertical conductive material 21 onto the overhang region 11B '. On the other hand, a wiring 17 made of a transparent conductor integrally formed with the transparent electrode 17 is provided at a portion where the vertical conductive material 21 contacts the substrate 120.
a is formed. As a result, the transparent electrode 17 formed on the surface of the substrate 120 and the connection wiring 14b on the overhang region 11B 'are conductively connected via the vertical conductive material 21.

Note that, unlike the present embodiment, the sealing material 1
By dispersing conductive particles in 9 itself and forming it as an anisotropic conductor, it is also possible to make the above-mentioned vertical conducting material 21 unnecessary. That is, a part of the sealing material 19 serves as the above-mentioned vertical conductive material 21.

When the liquid crystal panel 100 is completed as described above, the entire liquid crystal panel 100 is washed with pure water or the like. In this case, even if cleaning is performed using, for example, hot water, the wiring 14 on the overhang region 11B ′ of the liquid crystal panel 100 is
Is covered with the alignment film 16, so that the elution and damage of the wiring 14 can be avoided. Then, FIG.
As shown in FIG. 7, ashing is performed by bringing O ₂ plasma into contact with the liquid crystal panel to decompose and remove the alignment film 16 exposed on the overhang region 11B ′. In this step, for example, an oxygen gas is mixed into an inert gas such as a nitrogen gas or an Ar gas, a high electric field is applied to generate a plasma, and the plasma-converted active gas is sprayed onto the overhang region 11B ′. It is preferably performed by a pressure plasma device.

In this case, as shown in FIG. 3 (b), only the external connection portion 11C shown in the overhang region 11B 'is necessary for conductively connecting electronic components and wiring members. Therefore, in this step, the overhang area 11
Instead of removing all of the alignment film 16 formed on B ′, only the alignment film 16 formed on the external connection portion 11C may be removed. By doing so, the external connection portion 11C
Since the wirings 14 formed in other portions remain covered with the alignment film 16, the deterioration and damage of the wirings can be better prevented. Conversely, if all of the alignment film 16 exposed on the overhang region 11B 'is removed in this step, the liquid crystal panel 100 can be put into an ashing device or the like as it is, and the processing can be performed. The process can be omitted, and the handling is simplified.

Next, as shown in FIG. 2 (g), a voltage is applied by bringing the inspection probe 131 into contact with the wiring 14 formed on the overhang region 11B ', and the inspection device 130 applies a voltage to the liquid crystal panel. Perform a lighting test. Wiring 1 as described above
4 is electrically conductively connected to the reflective electrode 13 on the substrate 110 and the transparent electrode 17 on the substrate 120, respectively. It is possible to test whether or not the liquid crystal portion (pixel region) sandwiched between the pixel and the transparent electrode 14 receives a predetermined electric field and operates as designed in advance (that is, whether or not to light).

When the lighting test shown in FIG. 2G is completed, electronic components and wiring members are mounted on the liquid crystal panel 100 configured as described above. Here, usually, prior to the mounting process of the electronic components and the wiring members, the liquid crystal panel 1 is mounted.
00 is washed again. Then, as shown in FIG. 2H, the electronic component 140 is mounted on the overhang area 11B ′.
The electronic component 140 is, for example, an integrated circuit chip having a built-in liquid crystal drive circuit, and is mounted in the external connection portion 11C shown in FIG. For example, an anisotropic conductive film is adhered on the end of the wiring 14, and the electronic component 140 is thermocompression-bonded to the external connection portion 11C via the anisotropic conductive film.
Utilizing the property of conductive connection only in the thickness direction of the anisotropic conductive film, each connection terminal of the electronic component 140 and a large number of wirings 14 are reliably conductively connected.

Thereafter, for example, a wiring member such as a flexible wiring board is conductively connected to the external terminal 150 shown in FIG. 3B, and finally, the electronic component 140 and the wiring member are covered with silicone over the overhang region 11B '. Resin molding with resin or the like.

According to the present embodiment described above, each manufacturing process is sequentially performed in a state where the overhang region 11B 'is covered with the alignment film 16, and finally the overhang region 11B' is connected to another member (electronic component). Before electrical connection to the external connection portion 11C, mounting is performed after at least the alignment film 16 formed on the external connection portion 11C is removed. Therefore, the overhang area 11
Since the wiring formed on B 'is hardly scratched during rubbing treatment or the like, and a foreign substance is hardly adhered to the wiring, electrical corrosion of the wiring and other wiring defects are unlikely to occur. In particular, when the wiring is formed of aluminum or its alloy, electric corrosion is easily generated, and oxidation is easily generated.
This embodiment is very effective because it is hardly damaged.

Further, since the wiring composed of a thin film made of aluminum or its alloy has the property of being easily dissolved even by warm water of about 60 degrees, the wiring is formed by an alignment film as in this embodiment. When covered, do not consider the risk of melting the wiring,
The cleaning operation can be sufficiently performed.

In the present embodiment, since the protective film 15 is formed only in the liquid crystal enclosing region 11A ', alignment is performed from the overhang region 11B' (or from the external connection portion 11C) in a later step. Since it is sufficient to remove only the film 16, the step of removing the alignment film can be easily performed.

Further, since the protective film 15 is formed so as to be completely covered by the alignment film 16, that is, the outer edge of the protective film 15 is always covered by the alignment film 16, the rubbing roller is used during rubbing. Does not contact the protective film 15. Therefore, the surface of the rubbing cloth is affected by the protective film 15 and the alignment film 16
Rubbing unevenness can be prevented from occurring. In particular, when the protective film 15 is formed by a printing method (for example, flexographic printing), since the outer edge of the protective film 15 is locally thick, the rubbing cloth is habitated by the outer edge in the conventional method, Rubbing unevenness sometimes occurred. In this embodiment, the outer edge of the protective film 15 is
By being covered by rubbing, it is possible to reduce the variation in the alignment state of the liquid crystal due to such rubbing unevenness.

[Detailed Structure of Liquid Crystal Device] In the embodiment described above, in order to improve the display mode of the liquid crystal device, fine irregularities are formed on the surface of the reflective electrode, and external light is generated on the surface of the reflective electrode. It is preferable to configure so that the light is scattered to some extent. If the surface of the reflective electrode is a flat mirror surface, when viewed from the direction in which the specular reflection of external light is viewed, the reflection of the background and the illusion caused by the light from the light source deteriorate visibility,
This is because the display looks dark when viewed from an azimuth where regular reflection is not visually recognized. FIGS. 5A and 5B show a structure in which fine irregularities are provided on the surface of the reflective electrode.

In the structure shown in FIG. 5A, a mask pattern (not shown) made of a resist or the like is formed on the surface of the first mother substrate 11 by photolithography, and the first mother substrate 11 is formed through this mask pattern. By etching the surface with a hydrofluoric acid-based etchant,
A plurality of fine concave portions 11d are formed on the surface of the first mother substrate 11, and the reflective electrodes 13 are formed on the surface of the first mother substrate 11 where the concave portions 11d are formed.
Are formed with a large number of fine concave portions 13b. In this case, the lead wiring 14a, the connection wiring 14b, and the connection terminal 150, which are conductively connected to the reflective electrode 13, are simultaneously formed in each panel scheduled area 11x of the first mother substrate 11,
The conductive connection portion (for example, the external connection portion 11C shown in FIG. 3B) of the lead-out wiring 14a, the connection wiring 14b, and the connection terminal 150 to at least the upper and lower conductive material, the integrated circuit chip, the wiring member, and the like is formed by the concave portion 11d. It is formed on the surface of the flat substrate 11 that has not been formed, and as a result, these surfaces are formed flat. Therefore, the lead wiring 1
4a between an external terminal formed at the tip end portion and an integrated circuit chip such as a driver IC, between the connection wiring 14b and the upper and lower conductive material 21, or between the connection terminal 150 and a wiring member such as a flexible wiring board. The conductive contact between them does not become unstable, and the electrical connection can be reliably achieved.

In the structure shown in FIG.
The convex portion 11e made of resist is formed on the surface of the first electrode 1 by photolithography, and the reflective electrode 13 is formed on the convex portion 11e, thereby forming the convex portion 13c on the surface of the reflective electrode 13. . For example, the convex portion 11e is coated with a photosensitive resin, and is selectively left by exposure and development as shown in the drawing. Even in this case, at least the conductive connection portions (for example, the external connection portion 11C shown in FIG. 3B) of the lead-out wires 14a, the connection wires 14b, and the connection terminals 150 to the upper and lower conductive members 21, the integrated circuit chip, the wiring members, and the like The protrusions 11e are formed on the flat surface of the substrate 11 where the protrusions 11e are not formed. As a result, these surfaces are formed flat.

It should be noted that the manufacturing process of the liquid crystal device of the present invention is not limited to the illustrated example described above, and it is needless to say that various changes can be made without departing from the gist of the present invention.

For example, in the above embodiment, the reflection electrode 13 and the wiring 14 are formed of aluminum. However, the reflection electrode 13 and the wiring 14 are formed by adding titanium oxide or zirconium oxide to aluminum to reduce the light reflectance of visible light. It may be formed using an increased alloy. In addition, the reflection electrode 13
In addition, silver or an alloy mainly composed of silver may be used as a material forming the wiring 14.

The removal of the alignment film may be performed at the stage when the liquid crystal panel 100 shown in FIG. 2F is formed as in the above-described embodiment. However, in the strip-shaped panel shown in FIG. It may be performed at the stage where the exit area is exposed,
It may be performed immediately after the rubbing process on the first mother substrate 11 is completed.

[0046]

As described above, according to the present invention,
Since the alignment film is formed so as to cover not only the reflective electrode but also the wiring, even if rubbing treatment is performed on the alignment film, the rubbing does not cause damage to the wiring or adhesion of foreign substances. Disconnection and the occurrence of electrolytic corrosion can be reduced. Therefore, the electrical reliability of the liquid crystal device can be improved.

[Brief description of the drawings]

FIGS. 1A and 1B are schematic plan views schematically showing a planar structure of a first mother substrate and a second mother substrate used in an embodiment of a method for manufacturing a liquid crystal device according to the present invention.

FIGS. 2A to 2H are schematic process explanatory views showing schematic processes of the embodiment. FIGS.

FIGS. 3A and 3B are a schematic cross-sectional view schematically showing a structure of a liquid crystal panel before an alignment film removing step in the same embodiment, and a schematic plan view showing an outline of a planar structure near an overhang region. .

FIG. 4 is an enlarged cross-sectional view showing an enlarged cross-sectional structure of a reflective electrode and a wiring in the same embodiment.

[Explanation of symbols]

 11 First mother board 12 Second mother board 11x Planned panel area 11A, 12A Planned liquid crystal filling area 11A 'Liquid crystal filled area 11B Planned projected area 11B' Projected area 13 Reflective electrode 14 Wiring 14a Leading wiring 14b Connecting wiring 15 Protective film DESCRIPTION OF SYMBOLS 16 Alignment film 17 Transparent electrode 17a Wiring 18 Alignment film 19 Sealing material 19a Liquid crystal injection port 110, 120 Substrate

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H088 EA02 FA16 FA27 FA28 HA02 HA03 HA06 MA20 2H089 KA10 KA17 NA38 QA16 TA03 TA04 TA17 2H092 GA33 GA35 GA41 GA43 GA44 GA45 HA19 HA28 MA10 NA15 NA17 NA29 PA02 PA13

Claims (7)

[Claims] A first substrate having a reflective electrode made of a metal film on a surface thereof, and a transparent second substrate facing the first substrate, wherein a first substrate is provided between the first substrate and the second substrate. A method for manufacturing a liquid crystal device comprising a liquid crystal interposed therebetween, wherein the liquid crystal device is electrically connected to the reflective electrode on a surface of the first substrate,
An electrode forming step of forming a wiring forming an external terminal part by using the same material as the reflective electrode by extending to an external connection part set on the overhang region of the first substrate; Forming an alignment film to cover the alignment film and performing a rubbing process on the alignment film; and an alignment film removing step of removing a portion of the alignment film covering the external connection portion. Of manufacturing a liquid crystal device. 2. A semiconductor device comprising: a first substrate having a reflective electrode made of a metal film on a surface; and a transparent second substrate facing the first substrate, wherein a first substrate is provided between the first substrate and the second substrate. A method for manufacturing a liquid crystal device having liquid crystal sandwiched therein, comprising: using a first motherboard including a plurality of panel scheduled regions corresponding to the first substrate, for each of the panel scheduled regions of the first motherboard; Forming an electrode, which is conductively connected to the reflection electrode and extends to an external connection portion set in a portion corresponding to the overhang region of the first substrate to form a wiring constituting an external terminal portion with the same material as the reflection electrode; Forming an alignment film so as to cover all of the reflective electrode and the wiring, and performing an rubbing process on the alignment film; and removing a portion of the alignment film covering the external connection portion. And a method for manufacturing a liquid crystal device. Law. 3. The method according to claim 2, wherein in the electrode forming step, an alignment mark is formed on the first mother substrate together with the reflective electrode and the wiring using the same material, and in the alignment film forming step, the alignment mark is formed. A method for manufacturing a liquid crystal device, comprising: forming a film so that the alignment mark is entirely covered. 4. The method for manufacturing a liquid crystal device according to claim 2, wherein in the step of forming an alignment film, the alignment film is formed on the entire surface of the first mother substrate. 5. The method according to claim 1, wherein:
3. The method for manufacturing a liquid crystal device according to item 1, wherein the reflective electrode and the wiring are formed of aluminum or an alloy mainly containing aluminum. 6. A substrate removing step according to claim 1, wherein after the step of forming an alignment film, a portion of the second substrate facing the overhanging region is removed to expose the overhanging region. A method of manufacturing a liquid crystal device, wherein the processing in the alignment film removing step is performed on the exposed overhang region. 7. One of claims 1 to 6
In the liquid crystal device according to the item, a protective film made of an inorganic insulator is formed on the surface of the reflective electrode so as to avoid the external terminal portion, and the alignment film is formed so as to completely cover the protective film. Production method.