JPH03115537A - Terminal-connector material made of high strength cu alloy - Google Patents
Terminal-connector material made of high strength cu alloyInfo
- Publication number
- JPH03115537A JPH03115537A JP21636290A JP21636290A JPH03115537A JP H03115537 A JPH03115537 A JP H03115537A JP 21636290 A JP21636290 A JP 21636290A JP 21636290 A JP21636290 A JP 21636290A JP H03115537 A JPH03115537 A JP H03115537A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- terminal
- high strength
- connector
- heat resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 title claims abstract description 23
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 abstract description 2
- 230000006698 induction Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、すぐれた導電性と耐熱性を有し、さらに高
強度を有するCu合金製端子・コネクター材に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a terminal/connector material made of a Cu alloy that has excellent electrical conductivity, heat resistance, and high strength.
一般に、重量%で(以下%は重量%を示す)、Sn::
0.5〜9%、
P :0.03〜0.35%、
を含有し、残りがCuと不可避不純物からなる組成を有
するCu合金(りん青銅)製端子・コネクター材が知ら
れている。Generally, in weight % (hereinafter % indicates weight %), Sn::
A terminal/connector material made of a Cu alloy (phosphor bronze) is known, which has a composition of P: 0.5 to 9%, P: 0.03 to 0.35%, and the remainder consisting of Cu and unavoidable impurities.
しかし、上記の従来Cu合金製端子・コネクター材は、
高強度をもつものの、導電性および耐熱性が十分でない
ために、近年の小型化あるいは複雑化した形状の端子・
コネクターに適用することができないのが現状である。However, the conventional Cu alloy terminal/connector materials mentioned above are
Although they have high strength, they do not have sufficient conductivity or heat resistance, so terminals and terminals have become smaller or more complex in recent years.
Currently, it cannot be applied to connectors.
そこで、本発明者等は、上述のような観点から、導電性
および耐熱性にすぐれ、かつ高強度を有する端子・コネ
クター材を開発すべく、特に高導電率を確保する目的で
Cu合金製端子・コネクター材に着目し研究を行なった
結果、
Mg : 0.3〜2%、
P : 0.QO1〜0,1%、
Ti:0.03〜0.5%、
を含有し、残りがCuと不可避不純物からなる組成を有
するCu合金で構成された端子・コネクター材は、高強
度と共に、すぐれた導電性と耐熱性を有し、すぐれた性
能を長期に亘って発揮するという研究結果を得たのであ
る。Therefore, from the above-mentioned viewpoint, the present inventors developed terminals and connectors made of Cu alloy with the aim of ensuring particularly high conductivity in order to develop terminal/connector materials that have excellent conductivity and heat resistance as well as high strength. - As a result of research focusing on connector materials, Mg: 0.3-2%, P: 0. The terminal/connector material is made of a Cu alloy containing QO 1~0.1%, Ti: 0.03~0.5%, and the rest is Cu and unavoidable impurities.It has high strength and excellent properties. Research results showed that it has excellent conductivity and heat resistance, and exhibits excellent performance over a long period of time.
この発明は、上記研究結果にもとづいてなされたもので
あって、以下に端子・コネクター材を構成するCu合金
の成分組成範囲を上記の通りに限定した理由を説明する
。This invention was made based on the above research results, and the reason why the composition range of the Cu alloy constituting the terminal/connector material was limited as described above will be explained below.
(a) Mg
Mg成分には、Cu合金の素地中に固溶することによっ
て、導電性を損なうことなく、強度および耐熱性を向上
させる作用があるが、その含有量が0.3%未満では前
記作用に所望の効果が得られず、一方その含有量が2%
を越えると、導電性が損なわれるようになると共に、C
u合金の鋳造性にも劣化現象が現われるようになること
から、その含有量を0.3〜2%と定めた。(a) Mg The Mg component has the effect of improving strength and heat resistance without impairing conductivity by forming a solid solution in the matrix of the Cu alloy, but if its content is less than 0.3%, The desired effect was not obtained in the above action, and on the other hand, the content was 2%.
If it exceeds C, the conductivity will be impaired and C
Since deterioration phenomena also appear in the castability of the u alloy, its content was set at 0.3 to 2%.
(b) p
P成分には、Cu合金溶湯に対する脱酸作用があるほか
、Mg成分と共存した状態で、強度および耐熱性を向上
させ、さらにTIと反応して化合物を形成し、Tl成分
のCu合金素地への固溶による導電性の低下を抑制する
作用があるが、その含有量がo、oot%未満では前記
作用に所望の効果が得られず、一方その含有量が0.1
%を越えると、Cu合金に脆化傾向が現われるようにな
ることがら、その含有量を0.001〜0.1%と定め
た。(b) p The P component not only has a deoxidizing effect on the molten Cu alloy, but also improves the strength and heat resistance when coexisting with the Mg component, and also reacts with TI to form a compound that improves the Tl component. It has the effect of suppressing the decrease in conductivity due to solid solution in the Cu alloy matrix, but if the content is less than o,oot%, the desired effect cannot be obtained;
%, the Cu alloy tends to become brittle, so its content was set at 0.001 to 0.1%.
(c) Tl
Tl成分には、上記のように化合物を形成して強度およ
び耐熱性を向上させる作用があるが、その含有量が、0
.03%未満では所望の高強度を確保することができず
、一方その含有量が、0.5%を越えると、導電性が損
なわれるようになって高導電性を確保するのが困難にな
ることから、その含有量を0.03〜0.5%と定めた
。(c) Tl The Tl component forms a compound as described above and has the effect of improving strength and heat resistance, but when its content is 0.
.. If the content is less than 0.03%, the desired high strength cannot be achieved, while if the content exceeds 0.5%, the electrical conductivity will be impaired and it will be difficult to ensure high electrical conductivity. Therefore, its content was determined to be 0.03 to 0.5%.
つぎに、この発明のCu合金製端子・コネクター材を実
施例により具体的に説明する。Next, the Cu alloy terminal/connector material of the present invention will be specifically explained with reference to Examples.
通常の低周波溝型誘導炉を用い、それぞれ第1表に示さ
れる成分組成をもったCu合金溶湯を調製し、半連続鋳
造法にて、厚さ:15OmmX幅:400龍×長さ:
1500關の寸法をもった鋳塊に鋳造した後、この鋳塊
に、710〜760℃の範囲内の所定の圧延開始湿度に
て熱間圧延を施して厚さ:ll龍の熱延板とし、ついで
水冷後、前記熱延板の上下両面を0.5+amづつ面側
して厚さ:10關とした状態で、通常の条件にて冷間圧
延と焼鈍とを交互に繰り返し行ない、最終仕上圧延率ニ
ア5%にて厚さ二〇、25m閣の冷延板とし、最終的に
250〜400℃の範囲内の所定の温度に30分間保持
の歪取り焼鈍を施すことによって本発明Cu合金製端子
・コネクター材1〜5をそれぞれ製造した。Molten Cu alloys having the compositions shown in Table 1 were prepared using an ordinary low-frequency groove induction furnace, and cast using a semi-continuous casting method to a thickness of 150mm x width of 400mm x length:
After casting into an ingot with dimensions of 1,500 degrees, this ingot was hot rolled at a predetermined rolling start humidity within the range of 710 to 760°C to form a hot rolled sheet with a thickness of 1. Then, after water cooling, the upper and lower sides of the hot-rolled sheet were turned side by side by 0.5+am to a thickness of 10 mm, and cold rolling and annealing were alternately repeated under normal conditions to give the final finish. The Cu alloy of the present invention is made into a cold-rolled sheet with a thickness of 20 to 25 m at a rolling reduction of 5%, and is finally subjected to strain relief annealing at a predetermined temperature within the range of 250 to 400°C for 30 minutes. Terminal/connector materials 1 to 5 were manufactured, respectively.
また、比較の目的で、従来Cu合金製端子・コネクター
材1,2として、同じく第1表に示される組成をもった
市販のりん青銅製のものを用意した。For the purpose of comparison, commercially available phosphor bronze materials having the compositions shown in Table 1 were also prepared as the conventional Cu alloy terminal/connector materials 1 and 2.
ついで、この結果得られた本発明Cu合金製端端子・コ
ネクター材1〜5、並びに従来Cu合金製端子・コネク
ター材:0.2について、強度を評価する目的で、引張
強さおよびばね限界値、並びに伸びを測定し、また導電
性を評価する目的で導電率(IAC3%)を測定し、さ
らに耐熱性を評価する目的で軟化温度、および応力付加
加熱後の応力緩和率を測定した。Next, for the purpose of evaluating the strength of the resulting Cu alloy end terminal/connector materials 1 to 5 of the present invention and the conventional Cu alloy terminal/connector material: 0.2, the tensile strength and spring limit value were determined. , and elongation were measured, and electrical conductivity (IAC 3%) was measured for the purpose of evaluating conductivity, and further, the softening temperature and stress relaxation rate after stress application heating were measured for the purpose of evaluating heat resistance.
なお、ばね限界値は、J I S −H3130のモー
メント式試験により1411定し、さらに、軟化温度は
、上記の各種Cu合金製端子・コネクター材をそれぞれ
種々の温度に30分間加熱保持し、加熱後のビッカース
硬さを加熱温度ごとに1lpJ定し、この測定結果にも
とづいて急激な硬さ低下が見られる温度を判定し、この
判定温度を軟化温度と定めた。The spring limit value was determined to be 1411 by the moment test of JIS-H3130, and the softening temperature was determined by heating and holding the various Cu alloy terminals and connector materials mentioned above at various temperatures for 30 minutes. The subsequent Vickers hardness was determined at 1 lpJ for each heating temperature, and the temperature at which a rapid decrease in hardness was observed was determined based on the measurement results, and this determined temperature was determined as the softening temperature.
また、応力緩和率は、幅: L2.7yam×長さ:1
20+u(以下り。とする)の寸法をもった試験片を使
用し、この試験片を長さ:110mmX深さ=3龍の水
平縦長溝を有する治具に前記試験片の中央部が上方に膨
出するように彎曲セットしくこの時の試験片の両端部間
の距離用0關をLlとする)、この状態で温度=150
℃に1000時間保持し、加熱後、前記治具から取りは
ずした状態における前記試験片の両端部間の距離(以下
L2とする)を測定し、計算式: (Lo−L2)/
(Lo−Ll)X100(%)によって算出すること
により求めた。これらの結果を第1表に示した。In addition, the stress relaxation rate is width: L2.7yam x length: 1
A test piece with the dimensions of 20+U (hereinafter referred to as "D") was used, and the test piece was placed in a jig having a horizontal longitudinal groove of length: 110 mm x depth = 3, with the center part of the test piece facing upward. The curve is set so that it bulges out, and the distance between both ends of the test piece at this time is Ll), and in this state, the temperature = 150.
℃ for 1000 hours, and after heating, the distance between both ends of the test piece (hereinafter referred to as L2) in the state of removing it from the jig was measured, and the calculation formula: (Lo-L2)/
It was calculated by (Lo-Ll)X100(%). These results are shown in Table 1.
第1表に示される結果から、本発明Cu合金製端子・コ
ネクター材1〜5は、いずれも従来Cu合金製端子・コ
ネクター材1,2と同等の高強度を保持した状態で、こ
れより一段とすぐれた導電性と耐熱性をもつことが明ら
かである。From the results shown in Table 1, Cu alloy terminal/connector materials 1 to 5 of the present invention all maintain the same high strength as conventional Cu alloy terminal/connector materials 1 and 2, but are even better than these. It is clear that it has excellent conductivity and heat resistance.
上述のように、この発明のCu合金製端子・コネクター
材は、すぐれた導電性と耐熱性を有し、さらに高強度を
有するので、これらの特性が要求される、特に小型化あ
るいは複雑化した形状のものに適用した場合にすぐれた
性能を十分に発揮し、また従来Cu合金製端子・コネク
ター材のように高価なSn成分を含有していないのでコ
ストの安いものであるなど工業上有用な特性を有するの
である。As mentioned above, the Cu alloy terminal/connector material of the present invention has excellent conductivity and heat resistance, and also has high strength. It fully demonstrates excellent performance when applied to shaped objects, and does not contain the expensive Sn component unlike conventional Cu alloy terminals and connector materials, making it a low-cost product that is industrially useful. It has characteristics.
代 理 人 昌 田 和 夫 外1名teenager Reason Man Chang Field sum husband 1 other person
Claims (1)
上重量%)を有するCu合金で構成したことを特徴とす
る導電性および耐熱性のすぐれた高強度Cu合金製端子
・コネクター材。[Claims] A composition containing Mg: 0.3 to 2%, P: 0.001 to 0.1%, Ti: 0.03 to 0.5%, with the remainder consisting of Cu and inevitable impurities. A terminal/connector material made of a high-strength Cu alloy with excellent conductivity and heat resistance, characterized in that it is made of a Cu alloy having a weight percentage of (by weight).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21636290A JPH03115537A (en) | 1990-08-16 | 1990-08-16 | Terminal-connector material made of high strength cu alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21636290A JPH03115537A (en) | 1990-08-16 | 1990-08-16 | Terminal-connector material made of high strength cu alloy |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3660786A Division JPS62196344A (en) | 1986-02-21 | 1986-02-21 | High-strength cu alloy for terminal and connector |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03115537A true JPH03115537A (en) | 1991-05-16 |
JPH0515773B2 JPH0515773B2 (en) | 1993-03-02 |
Family
ID=16687381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21636290A Granted JPH03115537A (en) | 1990-08-16 | 1990-08-16 | Terminal-connector material made of high strength cu alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03115537A (en) |
-
1990
- 1990-08-16 JP JP21636290A patent/JPH03115537A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0515773B2 (en) | 1993-03-02 |
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