JPH01309219A - Terminal for electric apparatus made of cu alloy - Google Patents

Terminal for electric apparatus made of cu alloy

Info

Publication number
JPH01309219A
JPH01309219A JP1085326A JP8532689A JPH01309219A JP H01309219 A JPH01309219 A JP H01309219A JP 1085326 A JP1085326 A JP 1085326A JP 8532689 A JP8532689 A JP 8532689A JP H01309219 A JPH01309219 A JP H01309219A
Authority
JP
Japan
Prior art keywords
component
terminal
alloy
strength
conductibility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1085326A
Other languages
Japanese (ja)
Other versions
JPH0690887B2 (en
Inventor
Takeshi Suzuki
竹四 鈴木
Rensei Futatsuka
二塚 錬成
Seiji Kumagai
誠司 熊谷
Manpei Kuwabara
桑原 萬平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Shindoh Co Ltd
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd, Mitsubishi Metal Corp filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP1085326A priority Critical patent/JPH0690887B2/en
Publication of JPH01309219A publication Critical patent/JPH01309219A/en
Publication of JPH0690887B2 publication Critical patent/JPH0690887B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To make it possible to obtain a high strength, an excellent conductibility, and an excellent thermal creeping property by composing a Cu alloy including a specific amount of Mg and P, and Cu and inebitable impurities in the remaining component. CONSTITUTION:The terminal is composed of a Cu alloy including 0.3 to 2% of Mg, and 0.001 to 0.1% of P, and consisting of Cu and inebitable impurities in the remaining % (wt.%). The Mg component has a function to improve the strength and the thermal creeping property without losing the high conductibility the main component Cu alloy itself provides, by fusing solidly to the base material of the Cu. The P component has not only a deoxidization function, but also a function to improve the strength and the thermal creeping property on condition of coexisting with the Mg component. A high strength, an excellent conductibility, and an excellent thermal creeping property can be obtained, consequently.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、高強度を有し、かつ導電性および熱クリー
プ特性のすぐれたCu合金製電気機器用端子に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a terminal for electrical equipment made of a Cu alloy that has high strength and excellent conductivity and thermal creep properties.

〔従来の技術〕[Conventional technology]

一般に、各種の電気機器用端子の製造に、重量%で(以
下%は重量%を示す)、 S n:1.5〜9%、 P :0.03〜0,35%、 を有し、残りがCuと不可避不純物からなる組成を有す
るCu合金が用いられている。
Generally, in the production of terminals for various electrical devices, the following is used in weight% (hereinafter % indicates weight%): Sn: 1.5 to 9%, P: 0.03 to 0.35%, A Cu alloy having a composition in which the remainder consists of Cu and unavoidable impurities is used.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、上記の従来Cu合金製電気機器用端子は、高強
度をもつものの、導電性および熱クリープ特性が十分で
ないために、これを小型化あるいは形状複雑化した場合
、十分その機能を発揮し得ないのが現状である。
However, although the above-mentioned conventional Cu alloy terminals for electrical equipment have high strength, they do not have sufficient conductivity and thermal creep properties, so when they are made smaller or have a more complex shape, they cannot fully perform their functions. The current situation is that there is no such thing.

〔問題点を解決するための手段〕[Means for solving problems]

そこで、本発明者等は、上述のような観点から、すぐれ
た導電性と熱クリープ特性を具備した電気機器用端子を
開発すべく研究を行なった結果、電気機器用端子を、 Mg:0.3〜2%、 P :(1,0(11〜0.196、 を含有し、残りがCuと不可避不純物からなる組成を有
するCu合金で構成すると、この結果の端子は、高強度
を有し、かつすぐれた導電性と熱クリープ特性を具備す
るようになることから、小型化および形状複雑化に十分
対応でき、すぐれた性能を発揮するようになるという知
見を得たのである。
Therefore, from the above-mentioned viewpoints, the present inventors conducted research to develop a terminal for electrical equipment with excellent conductivity and thermal creep characteristics, and as a result, developed a terminal for electrical equipment with Mg: 0. 3-2%, P:(1,0(11-0.196, , as well as excellent conductivity and thermal creep properties, they found that they can fully cope with miniaturization and complex shapes, and exhibit excellent performance.

この発明は、上記知見にもとづいてなされたものであっ
て、以下に成分組成を上記の通りに限定した理由を説明
する。
This invention was made based on the above knowledge, and the reason why the component composition was limited as described above will be explained below.

(a)  Mg Mg成分には、Cuの素地に固溶することによって、主
要成分であるCu自体の具備する高導電性を損なうこと
なく、強度と熱クリープ特性を向上させる作用があるが
、その含有量が0.3%未満では前記作用に所望の効果
が得られず、一方その含有量が2%を越えると、導電性
が損なわれるようになることから、その含有量を0.3
〜2%と定めた。
(a) Mg The Mg component has the effect of improving strength and thermal creep properties by being dissolved in the Cu matrix without impairing the high conductivity of Cu itself, which is the main component. If the content is less than 0.3%, the desired effect cannot be obtained, while if the content exceeds 2%, the conductivity will be impaired, so the content should be reduced to 0.3%.
It was set at ~2%.

(b)  p P成分には、脱酸作用があるほか、Mg成分と共存した
状態で、強度および熱クリープ特性を向上させる作用が
あるが、その含有量がo、ooi%未満では前記作用に
所望の効果が得られず、一方その含有量が0.1%を越
えると、脆化傾向が現われるようになることから、その
含有量を0.001〜口、1%と定めた。
(b) p In addition to having a deoxidizing effect, the P component also has the effect of improving strength and thermal creep properties when coexisting with the Mg component; however, if its content is less than o, ooi%, the above effect will not be achieved. The desired effect cannot be obtained, and if the content exceeds 0.1%, a tendency towards embrittlement appears, so the content was set at 0.001 to 1%.

〔実 施 例〕〔Example〕

つぎに、この発明の電子機器用端子を実施例により具体
的に説明する。
Next, the terminal for electronic equipment according to the present invention will be specifically explained with reference to Examples.

通常の低周波溝型誘導炉を用い、それぞれ第1表に示さ
れるCu合金溶湯を調製し、半連続鋳造法にて、厚さ:
150mmX幅=400龍×長さ: 1500mmの寸
法をもった鋳塊に鋳造した後、この鋳塊に、710〜8
00℃の範囲内の所定の圧延開始温度にて熱間圧延を施
して厚さ:11m+eの熱延板とし、ついで水冷後、前
記熱延板の上下両面を0.5mmづつ面側して厚さ: 
1oinとした状態で、通常の条件にて冷間圧延と焼鈍
とを交互に繰り返し行ない、最終仕上圧延率ニア5%に
て厚さ: 0.25m+wの冷延板とし、最終的に25
0〜400℃の範囲内の所定の温度に30分間保持の条
件で歪取り焼鈍を施すことによって本発明端子素材1〜
5および従来端子索材1.2をそれぞれ製造した。
Molten Cu alloys shown in Table 1 were prepared using an ordinary low-frequency groove induction furnace, and casted by a semi-continuous casting method to a thickness of:
150mm x Width = 400mm x Length: After casting into an ingot with dimensions of 1500mm, 710~8
Hot rolling is performed at a predetermined rolling start temperature within the range of 00°C to obtain a hot rolled sheet with a thickness of 11 m+e, and then after water cooling, the upper and lower surfaces of the hot rolled sheet are side-faced by 0.5 mm each to give a thickness of 11 m+e. difference:
In the state of 1 oin, cold rolling and annealing were repeated alternately under normal conditions, and a cold rolled plate with a thickness of 0.25 m + w was obtained at a final finishing rolling rate of near 5%, and finally
Terminal materials of the present invention 1-
5 and conventional terminal cord material 1.2 were manufactured, respectively.

ついで、この結果得られた本発明端子素材1〜5および
従来端子1.2について、強度を評価する目的で、引張
強さとばね限界値を測定し、また導電性を評価する目的
で、導電率(IAcs%)を測定し、さらに熱クリープ
特性を評価する目的で、応力付加加熱後の応力緩和率を
測定した。
Next, for the terminal materials 1 to 5 of the present invention and the conventional terminal 1.2 obtained as a result, the tensile strength and spring limit value were measured for the purpose of evaluating the strength, and the conductivity was measured for the purpose of evaluating the conductivity. (IAcs%), and in order to further evaluate the thermal creep properties, the stress relaxation rate after stress application and heating was measured.

なお、ばね限界値は、JIS−H3130のモーメント
式試験により測定し、また応力緩和率は、幅=12.7
mmx長さ:120m1 (以下Loとする)の寸法を
もった試験片を使用し、この試験片を長さ7110m1
lX深さ:3m+++の水平縦長溝を有する治具に前記
試験片の中央部が上方に膨出するように彎曲セットしく
この時の試験片の両端部間の距離:110mmをLlと
する)、この状態で温度:150℃に1000時間保持
し、加熱後、前記治具から取りはずした状態する)を測
定し、計算式: (Lo−L2)/(Lo−Ll)X100(%)によっ
て算出することにより求めた。これらの結果を第1表に
示した。
The spring limit value is measured by the JIS-H3130 moment test, and the stress relaxation rate is width = 12.7.
mm x length: 120 m1 (hereinafter referred to as Lo), use a test piece with a length of 7110 m1.
The test piece is set in a jig having a horizontal longitudinal groove with a depth of 3 m+++ in a curved manner so that the center part of the test piece bulges upward. The distance between both ends of the test piece at this time: 110 mm is defined as Ll), In this state, the temperature is maintained at 150°C for 1000 hours, and after heating, it is removed from the jig) and calculated using the formula: (Lo-L2)/(Lo-Ll) x 100 (%) I asked for it. These results are shown in Table 1.

〔発明の効果〕〔Effect of the invention〕

第1表に示される結果から、本発明端子素材1〜5は、
いずれも従来端子素材1.2と同等の高強度を保持した
状態で、これより一段とすぐれた導電性および熱クリー
プ特性をもつことが明らかである。
From the results shown in Table 1, terminal materials 1 to 5 of the present invention are as follows:
It is clear that both of these materials maintain high strength equivalent to that of conventional terminal material 1.2, but have far superior conductivity and thermal creep properties.

上述のように、この発明の電気機器用端子は、高強度を
有し、かつすぐれた導電性と熱クリープ特性を具備した
Cu合金で構成されているので、これらの小型化および
形状複雑化に十分対応することができ、十分満足する性
能を発揮するばかりでなく、高価なSn成分を含有しな
いCu合金で構成されているので、比較的コストの安い
ものとなるなど工業上有用な特性を有するのである。
As mentioned above, the terminal for electrical equipment of the present invention is made of a Cu alloy that has high strength, excellent conductivity, and thermal creep properties, so it is suitable for miniaturization and complicated shapes. Not only does it have sufficient performance, it is made of a Cu alloy that does not contain the expensive Sn component, so it has industrially useful properties such as being relatively inexpensive. It is.

Claims (1)

【特許請求の範囲】 Mg:0.3〜2%、 P:0.001〜0.1%、 を含有し、残りがCuと不可避不純物からなる組成(以
上重量%)を有するCu合金で構成したことを特徴とす
る高強度を有し、かつ導電性および熱クリープ特性のす
ぐれたCu合金製電気機器用端子。
[Claims] Consisting of a Cu alloy containing Mg: 0.3 to 2%, P: 0.001 to 0.1%, and the remainder consisting of Cu and unavoidable impurities (the above weight %) A terminal for electrical equipment made of a Cu alloy, which has high strength and excellent conductivity and thermal creep properties.
JP1085326A 1989-04-04 1989-04-04 Cu alloy terminal for electrical equipment Expired - Fee Related JPH0690887B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1085326A JPH0690887B2 (en) 1989-04-04 1989-04-04 Cu alloy terminal for electrical equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1085326A JPH0690887B2 (en) 1989-04-04 1989-04-04 Cu alloy terminal for electrical equipment

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP6843786A Division JPS62227051A (en) 1986-03-28 1986-03-28 Terminal and connector made of cu alloy

Publications (2)

Publication Number Publication Date
JPH01309219A true JPH01309219A (en) 1989-12-13
JPH0690887B2 JPH0690887B2 (en) 1994-11-14

Family

ID=13855508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1085326A Expired - Fee Related JPH0690887B2 (en) 1989-04-04 1989-04-04 Cu alloy terminal for electrical equipment

Country Status (1)

Country Link
JP (1) JPH0690887B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030082704A (en) * 2002-04-18 2003-10-23 희성금속 주식회사 Electronic contact production method of agcu system compound metal
JP2009228013A (en) * 2008-03-19 2009-10-08 Dowa Metaltech Kk Copper alloy sheet and manufacturing method therefor
JP4516154B1 (en) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Cu-Mg-P copper alloy strip and method for producing the same
JP4563508B1 (en) * 2010-02-24 2010-10-13 三菱伸銅株式会社 Cu-Mg-P-based copper alloy strip and method for producing the same
JP2012007231A (en) * 2010-06-28 2012-01-12 Mitsubishi Shindoh Co Ltd Cu-Mg-P-BASED COPPER ALLOY BAR MATERIAL AND MANUFACTURING METHOD THEREFOR
CN103890205A (en) * 2011-11-14 2014-06-25 三菱综合材料株式会社 Copper alloy and copper alloy forming material
US9587299B2 (en) 2011-10-28 2017-03-07 Mitsubishi Materials Corporation Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
US10032536B2 (en) 2010-05-14 2018-07-24 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US10153063B2 (en) 2011-11-07 2018-12-11 Mitsubishi Materials Corporation Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6454420A (en) * 1987-08-25 1989-03-01 Matsushita Electric Ind Co Ltd Liquid crystal display element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6454420A (en) * 1987-08-25 1989-03-01 Matsushita Electric Ind Co Ltd Liquid crystal display element

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030082704A (en) * 2002-04-18 2003-10-23 희성금속 주식회사 Electronic contact production method of agcu system compound metal
JP2009228013A (en) * 2008-03-19 2009-10-08 Dowa Metaltech Kk Copper alloy sheet and manufacturing method therefor
US9255310B2 (en) 2009-12-23 2016-02-09 Mitsubishi Shindoh Co., Ltd. Cu—Mg—P based copper alloy material and method of producing the same
JP4516154B1 (en) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Cu-Mg-P copper alloy strip and method for producing the same
JP2011132564A (en) * 2009-12-23 2011-07-07 Mitsubishi Shindoh Co Ltd Cu-Mg-P-BASED COPPER-ALLOY MATERIAL AND METHOD OF PRODUCING THE SAME
JP4563508B1 (en) * 2010-02-24 2010-10-13 三菱伸銅株式会社 Cu-Mg-P-based copper alloy strip and method for producing the same
JP2011174127A (en) * 2010-02-24 2011-09-08 Mitsubishi Shindoh Co Ltd Cu-mg-p-based copper alloy bar stock and method for producing the same
WO2011104982A1 (en) * 2010-02-24 2011-09-01 三菱伸銅株式会社 Cu-mg-p-based copper alloy bar and method for producing same
US10032536B2 (en) 2010-05-14 2018-07-24 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US10056165B2 (en) 2010-05-14 2018-08-21 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
JP2012007231A (en) * 2010-06-28 2012-01-12 Mitsubishi Shindoh Co Ltd Cu-Mg-P-BASED COPPER ALLOY BAR MATERIAL AND MANUFACTURING METHOD THEREFOR
US9587299B2 (en) 2011-10-28 2017-03-07 Mitsubishi Materials Corporation Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
US10153063B2 (en) 2011-11-07 2018-12-11 Mitsubishi Materials Corporation Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices
CN103890205A (en) * 2011-11-14 2014-06-25 三菱综合材料株式会社 Copper alloy and copper alloy forming material
US10458003B2 (en) 2011-11-14 2019-10-29 Mitsubishi Materials Corporation Copper alloy and copper alloy forming material

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