JPH01237510A - Opto-electronic device - Google Patents
Opto-electronic deviceInfo
- Publication number
- JPH01237510A JPH01237510A JP6339188A JP6339188A JPH01237510A JP H01237510 A JPH01237510 A JP H01237510A JP 6339188 A JP6339188 A JP 6339188A JP 6339188 A JP6339188 A JP 6339188A JP H01237510 A JPH01237510 A JP H01237510A
- Authority
- JP
- Japan
- Prior art keywords
- transparent body
- seat
- optically transparent
- optical
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005693 optoelectronics Effects 0.000 title claims description 6
- 239000013307 optical fiber Substances 0.000 claims abstract description 21
- 230000003287 optical effect Effects 0.000 claims abstract description 15
- 230000003321 amplification Effects 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 2
- 230000010287 polarization Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、光ファイバを介して光の結合をさせる光電子
装置に係り、特に光ファイバ端面に密着させる光学的透
明体を光部品に固定するに好適な光電子装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an optoelectronic device that couples light through an optical fiber, and in particular to an optical transparent body that is brought into close contact with an end face of an optical fiber and is fixed to an optical component. The present invention relates to an optoelectronic device suitable for.
従来、たとえば、半導体レーザからの光を光ファイバに
結合する装置において、倒えば、特開昭６１−６０８号
公報に記載のようにファイバ入射面からの反射を抑える
ために光ファイバの入射端面とガラス板とを屈折率のほ
ぼ等しいエポキシ、シリコン樹脂等で固定したものとな
っていた。Conventionally, for example, in a device that couples light from a semiconductor laser to an optical fiber, if it falls over, the input end face of the optical fiber is connected to suppress reflection from the fiber entrance face, as described in Japanese Patent Laid-Open No. 61-608. The glass plate was fixed with epoxy, silicone resin, or the like having approximately the same refractive index.
上記従来技術は、第４図に示すように、半導体レーザ１
０から出射した光ビームをロッドレンズ３１により光フ
ァイバコネクタのプラグ３２の光ファイバ先端入射面３
３に位置するように調整されている。光ファイバコネク
タのプラグ３２内には、光ファイバ３５の入射端面３３
の前には透明ガラス板３４が固定されており入射端面３
３とガラス板の間はエポキシ３６で固定されている。こ
のようにすると収束された光ビームは光ファイバの入射
端面３３での光の反射率が０〜０．１２％となり、半導
体レーザ１０の発振を不安定にさせることはない。The above conventional technology, as shown in FIG.
The light beam emitted from the optical fiber connector plug 32 is connected to the optical fiber tip entrance surface 3 by the rod lens 31.
It has been adjusted to position 3. In the plug 32 of the optical fiber connector, an input end surface 33 of the optical fiber 35 is provided.
A transparent glass plate 34 is fixed in front of the incident end surface 3.
3 and the glass plate are fixed with epoxy 36. In this way, the converged light beam has a light reflectance of 0 to 0.12% at the incident end face 33 of the optical fiber, and the oscillation of the semiconductor laser 10 is not made unstable.
しかし、光ファイバコネクタのプラグ３２は標準とは異
なった特殊なものとなり、また、プラグの脱着を繰り返
した時のエポキシ樹脂部あるいはガラス板での破壊が問
題となる可能性があった。However, the plug 32 of the optical fiber connector is special and different from the standard, and there is a possibility that the epoxy resin portion or the glass plate may break when the plug is repeatedly attached and detached.
本発明の目的は、光ファイバを介して光の結合をさせる
光電子装置において、光ファイバ端面に密着させる光学
的透明体を光部品に固定するに好適な光電子装置を提供
することにある。An object of the present invention is to provide an optoelectronic device that couples light through an optical fiber and is suitable for fixing an optically transparent body to an optical component in close contact with the end face of the optical fiber.
上記目的は、例えば第１図にその模式図を示す如く、Ｌ
ＤＩ・レンズ２及び光学的透明体３をケース６に固定し
、しかも光学的透明体３の片面あるいは両面に座４を設
けることにより、達成される。The above purpose is, for example, as shown in the schematic diagram in Figure 1.
This is achieved by fixing the DI lens 2 and the optically transparent body 3 to the case 6, and providing a seat 4 on one or both sides of the optically transparent body 3.
本発明の光電子装置は、光ファイバを介して光の結合を
ならしめる受光１発光、光増幅、減衰変調、偏光、スイ
ッチ、アイソレータその他の機能をもつ光部品を内在し
てなる構造体であって、この光ファイバ端面に密着する
ように配置した光学的透明体とこの透明体に圧接し設置
した座を有することを特徴とする。尚、この光ファイバ
と前記構造体とは光コネクタ装着構造を形成しており。The optoelectronic device of the present invention is a structure that includes optical components having functions such as light reception, light emission, light amplification, attenuation modulation, polarization, switch, isolator, etc., which smoothes the coupling of light through an optical fiber. It is characterized by having an optically transparent body disposed in close contact with the end face of the optical fiber, and a seat disposed in pressure contact with the transparent body. Note that this optical fiber and the structure form an optical connector mounting structure.
着脱が可能となっていることが望ましい、またこの場合
、光ファイバコネクタ装着圧により塑性変形しない剛性
を有する材料で形成された座を有することが好ましい、
更には、パイコニック型ファイバコネクタ構造体と光フ
ァイバコネクタ装着圧により弾性変形の生ずる剛性の材
料により形成された座を有することが好ましい。It is preferable that the optical fiber connector can be attached and detached, and in this case, it is preferable that the optical fiber connector has a seat made of a rigid material that does not undergo plastic deformation due to mounting pressure.
Furthermore, it is preferable to have a piconic type fiber connector structure and a seat formed of a rigid material that is elastically deformed by the optical fiber connector mounting pressure.
第１図に示すように、光学的透明体３とケース６との間
に座４をそう人し、さらに光学的透明体３をそう入した
後、ねじ込みあるいは圧入によりリング７を入れる。こ
のようにするとねじ込み力あるいは圧入力は座を通して
光学的透明体３に加わるため過大な力は座の変形で吸収
でき光学的透明体３は破壊することがない、また、ケー
ス６側に光学的透明体３を固定することにより標準のコ
ネクタ５を使用することができる。もちろん、コネクタ
５の端面と光学的透明体３は密着するように配置されて
おり、レーザ光の集光点であるコネクタ端面における反
射光が半導体レーザ１に戻ることはなく、安定した発振
が得られる。As shown in FIG. 1, a seat 4 is placed between the optically transparent body 3 and the case 6, and after the optically transparent body 3 is inserted, a ring 7 is inserted by screwing or press fitting. In this way, since the screwing force or pressing force is applied to the optically transparent body 3 through the seat, excessive force can be absorbed by the deformation of the seat, and the optically transparent body 3 will not be destroyed. By fixing the transparent body 3, a standard connector 5 can be used. Of course, the end face of the connector 5 and the optical transparent body 3 are arranged so as to be in close contact with each other, so that the reflected light at the end face of the connector, which is the focal point of the laser beam, does not return to the semiconductor laser 1, resulting in stable oscillation. It will be done.
以下１本発明の一実施例を第２図により説明する。半導
体レーザ１は円形ステム１０で中心軸方向に発振するよ
うに搭載されており、この発振光を集光するため及び半
導体レーザ１の保護を行うため、マイクロレンズ付キャ
ップ２で気密封止されている。レセプタクル９はＦＣ−
ＰＣコネクタ（ＮＴＴ仕様の標準コネクタでセラミック
キャピラリ形フェルール使用のもの）が脱着できる構造
である。レセプタクル９への光学的透明体（石英ガラス
）３の固定は、まず、リング状で光学的透明体３より剛
性が低く塑性変形しやすいＡＱ。An embodiment of the present invention will be described below with reference to FIG. The semiconductor laser 1 is mounted on a circular stem 10 so as to oscillate in the central axis direction, and is hermetically sealed with a microlens-equipped cap 2 to condense the oscillated light and to protect the semiconductor laser 1. There is. Receptacle 9 is FC-
It has a structure that allows the PC connector (an NTT standard connector using a ceramic capillary type ferrule) to be attached and detached. The optical transparent body (quartz glass) 3 is fixed to the receptacle 9 using AQ, which is ring-shaped and has lower rigidity than the optical transparent body 3 and is more susceptible to plastic deformation.
Ｃｕなどからなる材料の座１１を光学的透明体３の片面
あるいは両面にそう入配置後、リング１１をねじ込みあ
るいは圧入することにより行う、このように固定された
光学的透明体３は、コネクタ先端５に密着し１−の接触
荷重で押されている。After placing a seat 11 made of a material such as Cu on one or both sides of the optically transparent body 3, the ring 11 is screwed or press-fitted, and the optically transparent body 3 fixed in this way is attached to the connector tip. 5 and is pressed with a contact load of 1-.
この荷重ではリング状の座１１は変形せず一定の位置に
保たれる０本実施例によれば、半導体レーザ１から発振
した光はマイクロレンズによってコネクタ先端５に集光
され、しかも光学的透明体３が配置されることにより、
レーザ集光点と反射面の分離を行うことができ、半導体
レーザ１への戻り光はない、しかも、光学的透明体３は
座１１を入れることにより、コネクタの着脱に対しある
いはレセプタクルへ固定する時破壊することはなく安定
した固定が得られる。Under this load, the ring-shaped seat 11 is not deformed and is kept at a constant position.According to this embodiment, the light oscillated from the semiconductor laser 1 is focused on the connector tip 5 by the microlens, and is optically transparent. By placing body 3,
The laser condensing point and the reflecting surface can be separated, and there is no return light to the semiconductor laser 1. Moreover, by inserting a seat 11 into the optically transparent body 3, it is possible to attach and detach the connector or fix it to the receptacle. Stable fixation can be obtained without breaking during operation.
第１の実施例の変形例として、第２図と同構造で光学的
透明体３の半導体レーザ１側の面６にたとえば多層薄膜
からなる無反射コーティングをほどこしたものがある。As a modification of the first embodiment, there is a device having the same structure as that shown in FIG. 2, but having a non-reflective coating made of, for example, a multilayer thin film applied to the surface 6 of the optically transparent body 3 on the semiconductor laser 1 side.
これは、集光点よりはずれた光学的透明体からの反射を
減少させ半導体レーザ１への戻り光を除くものである。This is to reduce the reflection from the optically transparent body away from the focal point and eliminate the light returning to the semiconductor laser 1.
第２の実施例を第３図に示す、このコネクタはパイコニ
ック型でＡＴＴが開発したものである。A second embodiment is shown in FIG. 3, and this connector is of the piconic type and was developed by ATT.
第１の実施例と大きく異なる点はコネクタ部の形状にあ
り、コネクタ２１がテーパ状でテーパ状の穴にそう入す
るためコネクタからの荷重はコネクタ先端２２には加わ
らない、したがって光学的透明体３の半導体レーザ１側
にリング状で板バネの座２３をそう入しねじ込みあるい
は圧入によりリング７を入れる。このような構成にする
ことにより、光学的透明体３とコネクタ先端２２とは板
バネ力により密着することができ、半４体レーザ１への
戻り光はない。The major difference from the first embodiment lies in the shape of the connector part.Since the connector 21 is tapered and inserted into the tapered hole, no load from the connector is applied to the connector tip 22.Therefore, the optical transparent body A plate spring seat 23 in a ring shape is inserted into the semiconductor laser 1 side of 3, and the ring 7 is inserted by screwing or press fitting. With this configuration, the optically transparent body 3 and the connector tip 22 can be brought into close contact with each other by the leaf spring force, and no light returns to the half-quadruple laser 1.
本発明によれば、光学的透明体の片面あるいは両面に変
形しやすいバネあるいは金屑からなる座をそう入固定す
ることにより、破壊することはなく、安定した固定を得
られる効果がある。もちろん光学的透明体とコネクタ先
端の密着によりレーザ集光点と反射面の分離を行い戻り
光がなくなる効果も同様に得られるのは明らかである。According to the present invention, by fixing a seat made of an easily deformable spring or metal scrap on one or both sides of an optically transparent body, it is possible to prevent breakage and to obtain stable fixation. Of course, it is obvious that the close contact between the optically transparent body and the connector tip can also achieve the same effect of separating the laser condensing point and the reflecting surface and eliminating the return light.
第１図は本発明の一実施例を説明する模式図、第２図は
本発明の第１の実施例の正面半断面図、第３図は本発明
の第２の実施例の正面半断面図、第４図は従来技術の反
射戻り光防止の断面図である。
１・・・半導体レーザ、２・・・マイクロレンズキャッ
プ。
３・・・光学的透明体、４・・・コネクタ、１１・・・
座、９・・・レセプタクル、１０・・・ステム。
′＃Ｊ １ 国
７・・ リンク゛
第 ２ 国
口口FIG. 1 is a schematic diagram for explaining one embodiment of the present invention, FIG. 2 is a front half-sectional view of the first embodiment of the present invention, and FIG. 3 is a front half-sectional view of the second embodiment of the present invention. FIG. 4 is a cross-sectional view of a conventional technique for preventing reflected return light. 1... Semiconductor laser, 2... Micro lens cap. 3... Optical transparent body, 4... Connector, 11...
Seat, 9... Receptacle, 10... Stem. '#J 1 Country 7... Link 2nd Kokuguchi Exit
Claims (1)
光、光増幅、減衰変調、偏光、スイッチ、アイソレータ
その他の機能をもつ光部品を内在してなる構造体であつ
て、該光ファイバ端面に密着する様配置した光学的透明
体と該透明体に圧接し設置した座を有することを特徴と
する光電子装置。1. A structure that includes optical components having functions such as light reception, light emission, light amplification, attenuation modulation, polarization, switch, isolator, etc. that smooth the coupling of light through an optical fiber, and the end face of the optical fiber. 1. An optoelectronic device comprising: an optical transparent body disposed in close contact with the transparent body; and a seat disposed in pressure contact with the transparent body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6339188A JPH01237510A (en) | 1988-03-18 | 1988-03-18 | Opto-electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6339188A JPH01237510A (en) | 1988-03-18 | 1988-03-18 | Opto-electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01237510A true JPH01237510A (en) | 1989-09-22 |
Family
ID=13227960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6339188A Pending JPH01237510A (en) | 1988-03-18 | 1988-03-18 | Opto-electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01237510A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0455939A2 (en) * | 1990-05-07 | 1991-11-13 | Corning Incorporated | Method and module for coupling from a light emitting diode |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5747823B2 (en) * | 1976-11-08 | 1982-10-12 | ||
| JPS61143701A (en) * | 1984-12-18 | 1986-07-01 | Fujitsu Ltd | Reflected light attenuator |
| JPH06338263A (en) * | 1993-05-31 | 1994-12-06 | Toshiba Corp | Traveling wave tube device |
-
1988
- 1988-03-18 JP JP6339188A patent/JPH01237510A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5747823B2 (en) * | 1976-11-08 | 1982-10-12 | ||
| JPS61143701A (en) * | 1984-12-18 | 1986-07-01 | Fujitsu Ltd | Reflected light attenuator |
| JPH06338263A (en) * | 1993-05-31 | 1994-12-06 | Toshiba Corp | Traveling wave tube device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0455939A2 (en) * | 1990-05-07 | 1991-11-13 | Corning Incorporated | Method and module for coupling from a light emitting diode |
| EP0455939A3 (en) * | 1990-05-07 | 1992-05-13 | Corning Incorporated | Method and module for coupling from a light emitting diode |
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