JP6084592B2 - Probe member for pogo pins - Google Patents

Description

  The present invention relates to a probe member for pogo pin, and more particularly to a probe member for pogo pin that is in reliable contact with a terminal of a semiconductor device and has excellent electrical conductivity.

  Generally, in order to inspect the electrical characteristics of a semiconductor device, the electrical connection between the semiconductor device and the test apparatus must be performed stably. Generally, a test socket is used as an apparatus for connecting a semiconductor device and a test apparatus.

  The role of such a test socket is to connect the terminals of the semiconductor device and the pads of the test apparatus to each other so that electrical signals can be exchanged bidirectionally. Therefore, a pogo pin is used as a contact means used inside the test socket. Such a pogo pin is provided with a spring inside, which facilitates the connection between the semiconductor device and the test equipment and can buffer the mechanical shock that can occur during the connection, and is used in most test sockets. ing.

In FIG. 1, a pogo pin according to the prior art is schematically illustrated.
The semiconductor device 1 to be tested is provided with an external connection terminal 2, and a test substrate 8 and a substrate pad 9 provided therein are provided at positions facing the external connection terminal 2. The pogo pin 3 is located between the two and electrically connects both sides. In FIG. 1, the test socket body is omitted. As shown in the figure, the pogo pin 3 is provided with an upper plunger 5 and a lower plunger 6 at both ends of the main body 4, and a spring 7 is inserted into the internal space of the main body 4. Thereby, the upper plunger 5 and the lower plunger 6 receive an elastic force in a direction away from each other by the spring 7. At that time, the upper plunger 5 is connected to the external connection terminal 2 of the semiconductor device 1, and the lower plunger 6 is connected to the substrate pad 9 of the test substrate 8, and as a result, the external connection terminal 2 and the substrate pad 9 are connected. Are electrically connected to each other. That is, if one end of the upper plunger 5 is in contact with the external connection terminal 2 of the semiconductor device 1 and one end of the lower plunger 6 is in contact with the substrate pad 9 of the test substrate 8, the external connection terminal 2 and the substrate pad 9 are connected. It is electrically connected.

  Another prior art pogo pin is disclosed in Patent Document 1. Specifically, FIGS. 2 and 3 illustrate semiconductor device test pogo pins that electrically connect a semiconductor device (not shown) and a test substrate (not shown) for testing the semiconductor device. Has been. Such a pogo pin includes a first plunger 20, a second plunger 30, and an elastic member 40. The first plunger 20 is formed with a moving space penetrating on both sides. The second plunger 30 is made of a conductive material, is inserted into the movement space of the first plunger 20, and one end thereof selectively protrudes through the upper end of the first plunger 20. The elastic member 40 is inserted between the first plunger 20 and the second plunger 30 and provides the first plunger 20 and the second plunger 30 with an elastic force in a direction away from each other. One end of the second plunger 30 is connected to a substrate pad of the test substrate (not shown), and the other end is connected to the first plunger 20 through relative movement between the first plunger 20 and the second plunger 30. 20 is exposed through one side and is connected to an external connection terminal of the semiconductor device (not shown).

Such conventional pogo pins have the following problems.
That is, in general, the semiconductor device contacts the pogo pin while being lowered in a state of being inserted into the insert, but the terminal of the semiconductor device is hardly positioned at the center of the pogo pin in the process of lowering the insert. In particular, recently, there has been a tendency that the size and interval of the terminals of the semiconductor device have become smaller, and it has become even more difficult for the center of the terminals of the semiconductor device to descend while being coaxial with the center of the pogo pin.

  As shown in FIG. 4, if the terminal 2 of the semiconductor device 1 cannot be lowered while being coaxial with the center of the first plunger 20, and if it is lowered with a certain distance P in the horizontal direction. As shown in FIG. 5, there is a problem that the terminal 2 of the semiconductor device 1 is difficult to reliably contact the probe portion of the first plunger 20. That is, even if contact is made, it is impossible to contact a large number of probes, and a part of the probes are contacted, resulting in a problem that substantial contact performance is greatly hindered.

  If the contact between the pogo pin and the terminal of the semiconductor device is not reliably performed, a problem arises in the reliability of the inspection result for the semiconductor device, which is not desirable.

Korean Published Patent No. 10-2011-0127010

  The present invention was created to solve the above-described problems, and more particularly, even when the terminal of the semiconductor device cannot be lowered in accordance with the center of the pogo pin, the pogo pin and the semiconductor are provided. It is an object of the present invention to provide a pogo pin probe member that reliably contacts a terminal of a device.

  A probe member for pogo pins of the present invention for achieving the above-mentioned object is a probe member for pogo pins used for inspection of a semiconductor device, and at least a part of the probe member is inserted into a cylindrical main body, and is formed by an elastic member. A probe member for pogo pins that is supported and whose upper end is in contact with the terminal of the semiconductor device, and a plurality of probes that are in contact with the terminal of the semiconductor device are provided at the upper end, and extended downward from the probe unit And a coupling portion that is inserted into the cylindrical body and coupled to the cylindrical body, wherein the probe is arranged in the center and is in contact with the terminals of the semiconductor device. A guide surface is provided so as to guide the probe and the terminal of the semiconductor device disposed adjacent to and in contact with the first probe toward the first probe. Includes a 2 probe, the.

  In the pogo pin probe member, the protruding height of the second probe is higher than the protruding height of the first probe.

  In the pogo pin probe member, the second probe is disposed so as to face the first probe.

  In the pogo pin probe member, the second probe is disposed at an upper end edge of the probe portion.

  In the pogo pin probe member, a third probe having a protruding height higher than the protruding height of the first probe and lower than the protruding height of the second probe is disposed between the first probe and the second probe. The

  In the pogo pin probe member, the second probe may have a right triangle cross section.

  The probe member for pogo pins of the present invention for achieving the above-mentioned object is a probe member for pogo pins used for inspection of a semiconductor device, and at least a part thereof is inserted into a cylindrical body, and the upper end is a semiconductor. A probe member for a pogo pin that contacts a terminal of a device, wherein a plurality of probes that contact a terminal of a semiconductor device are provided at an upper end, and extended downward from the probe unit, A plurality of first probes that are disposed at the center of the upper end of the probe unit and that contact the terminals of the semiconductor device; A second probe that is disposed at an upper end edge of the probe unit and has a higher protruding height than the first probe.

  In the pogo pin probe member, the second probe is disposed so that a pair of the second probe faces each other with the first probe interposed therebetween.

  In the pogo pin probe member, a third probe having a protruding height higher than the protruding height of the first probe and lower than the protruding height of the second probe is disposed between the first probe and the second probe. The

  In the pogo pin probe member, the second probe may have a right triangle cross section.

  In the pogo pin probe member according to the present invention, the second probe for guiding the terminal of the semiconductor device toward the first probe is arranged around the first probe arranged in the center. Ensure contact with pogo pins.

1 is a schematic diagram of a pogo pin according to the prior art. It is the isolation | separation perspective view of the pogo pin by a prior art. FIG. 3 is a cross-sectional view of FIG. 2. FIG. 3 is an operation diagram of a pogo pin according to the prior art. FIG. 3 is an operation diagram of a pogo pin according to the prior art. It is a perspective view of the pogo pin comprised including the probe member for pogo pins by one Embodiment of this invention. FIG. 7 is a connection diagram of FIG. 6. It is an operation | movement figure of the pogo pin of FIG. It is an operation | movement figure of the pogo pin of FIG. It is an operation | movement figure of the pogo pin of FIG. 5 is a drawing of a probe member for pogo pins according to another embodiment of the present invention. 1 is a diagram illustrating a method for manufacturing a pogo pin probe member according to the present invention. 1 is a diagram illustrating a method for manufacturing a pogo pin probe member according to the present invention. 1 is a diagram illustrating a method for manufacturing a pogo pin probe member according to the present invention. 1 is a diagram illustrating a method for manufacturing a pogo pin probe member according to the present invention. 1 is a diagram illustrating a method for manufacturing a pogo pin probe member according to the present invention. 1 is a diagram illustrating a method for manufacturing a pogo pin probe member according to the present invention. 1 is a diagram illustrating a method for manufacturing a pogo pin probe member according to the present invention. 1 is a diagram illustrating a method for manufacturing a pogo pin probe member according to the present invention.

  Hereinafter, a pogo pin probe member according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  The pogo pin probe member 110 according to the present invention is used for inspecting the semiconductor device 150, and at least a part thereof is inserted into the cylindrical main body 120 and supported by the elastic member 130, and the upper end thereof is the semiconductor device 150. This is in contact with the terminal 151.

  Such a pogo pin probe member 110 includes a probe portion 111 and a coupling member 115.

  The probe unit 111 is provided with a number of probes at the upper end, which are in contact with the terminals 151 of the semiconductor device 150. At that time, the probe includes the first probe 112 and the second probe 113.

  The first probes 112 are arranged at the center of the upper end of the probe unit 111 and are arranged in the horizontal direction while having substantially the same height. Each of the first probes 112 preferably has a substantially triangular shape, but is not limited thereto, and may have various shapes such as a trapezoidal shape or a square shape. Each of the first probes 112 has a shape extending in the horizontal direction while having a triangular cross-sectional shape.

  The first probe 112 is made of a strong nickel alloy material having excellent electrical conductivity. That is, although it consists of nickel-cobalt, it is not limited to it, A various raw material is used as needed.

  The second probe 113 is disposed adjacent to the first probe 112, and is provided with a guide surface 113a that can guide the terminal 151 of the semiconductor device 150 in contact with the first probe 112 so that the terminal 151 faces the first probe 112. . The guide surface 113 a has a shape of an inclined surface that is tapered toward the first probe 112.

At this time, the protruding height _{S 2} of the second probe 113 is higher than the protruding height _{S 1} of the first probe 112. In addition, a pair of the second probes 113 are arranged so as to face each other with the first probe 112 interposed therebetween. A pair of such second probes 113 is arranged at the upper end edge of the probe unit 111.

  The second probe 113 is arranged such that the inclined guide surface 113a faces the first probe 112, and the outer side has a right-angled triangular cross-sectional shape having a vertical surface. The second probe 113 is extended along the horizontal direction. That is, it extends in the same direction as the first probe 112.

Meanwhile, the first probe 112 is provided between the second probe 113, higher than the projection height _{S 1} of the first probe 112 has a lower projecting height _{S 3} than the projecting height _{S 2} of the second probe 113 A third probe 114 is arranged.

  The coupling member 115 extends downward from the probe unit 111, is inserted into the cylindrical main body 120, and is coupled to the cylindrical main body 120.

  The coupling member 115 is provided with a concave portion 115a that is cut in a concave shape on the inside, and a part of the cylindrical main body 120 is constricted in the concave portion 115a. The cylinder body 120 is fixedly installed.

  Meanwhile, the overall configuration of the pogo pin 100 including the pogo pin probe member 110 of the present invention will be described as follows. The pogo pin includes the above-described pogo pin probe member 110, a cylindrical main body 120, an elastic member 130 that is disposed in the cylindrical main body 120, and biases the pogo pin probe member 110 upward. The lower probe member 140 is at least partially protruded through the lower opening of the main body 120 and supported by the elastic member 130. At this time, the pogo pin 100 is inserted into a housing (not shown) in which an opening is formed in the vertical direction.

Such a pogo pin probe member according to the present invention has the following effects.
First, as shown in FIG. 8, when the center of the terminal 151 of the semiconductor device 150 does not coincide with the center of the pogo pin probe member 110 and moves downward in the horizontal direction, it is shown in FIG. As shown, the terminal 151 of the semiconductor device 150 first contacts the second probe 113. At that time, if the terminal 151 of the semiconductor device 150 is further lowered, the terminal 151 of the semiconductor device 150 is guided toward the center of the probe portion 111 along the guide surface 113a of the second probe 113, thereby FIG. As shown in FIG. 1, the first probe 112 disposed at the center of the upper end of the probe unit 111 is reliably contacted. At this time, since the first probe 112 is configured in a number of concave and convex shapes, the terminals 151 of the semiconductor device 150 are surely in contact with the plurality of probes.

  Thus, according to the pogo pin probe member of the present invention, the terminal of the semiconductor device 150 is guided to the center of the pogo pin 100 even when the terminal of the semiconductor device 150 is lowered in a state of being horizontally separated from the center of the pogo pin 100. By making contact with the plurality of first probes 112, it is possible to reliably make contact with a large number of contacts and to ensure the reliability of the inspection.

  The pogo pin probe member 110 according to an embodiment of the present invention is manufactured as shown in FIG.

  First, as shown in FIG. 12A, a substrate 160 made of a silicon material is prepared, and a conductive layer 161 is formed on the upper surface of the substrate 160 as shown in FIG. 12B. As shown, the dry film 162 is disposed on the conductive layer 161. Thereafter, as shown in FIG. 12D, a predetermined groove 162 a is formed in the dry film 162. The groove 162a formed at that time has a shape corresponding to the shape of the manufactured pogo pin probe member. Thereafter, as shown in FIG. 12E, the groove 162a formed by the dry film 162 is filled with a plating material to form a plating layer 163, and then the planarization operation is performed as shown in FIG. 12F. To implement. Thereafter, as shown in FIG. 12G, the dry film 162 formed on the substrate is removed, and finally, the probe member 110 that has been manufactured is removed from the substrate 160.

  The pogo pin probe member according to the present invention is not limited to the above-described shape, and various shapes can be realized. Specifically, as shown in FIG. The shape of the second probe 113 ′ arranged around 112 ′ may be manufactured to have an isosceles triangle cross-sectional shape that is not a right triangle.

  The present invention has been described in detail above with reference to preferred embodiments, but the present invention is not necessarily limited to such embodiments, and various modifications can be made without departing from the technical idea of the present invention. To be implemented.

  The pogo pin probe member of the present invention can be effectively applied to, for example, a technical field related to a semiconductor element test.

DESCRIPTION OF SYMBOLS 1,150 Semiconductor device 2 External connection terminal 3,100 Pogo pin 4,120 Main body 5 Upper probe part 6 Lower probe part 7 Spring 8 Test board 9 Substrate pad 20 First plunger 30 Second plunger 40, 130 Elastic member 110 Probe member 111 , Probe portion 112, 112 ′ first probe 113, 113 ′ second probe 113a guide surface 114 third probe 115 coupling member 115a recess 140 lower probe member 151 terminal 160 substrate 161 conductive layer 162 dry film 162 groove 163 plating layer

Claims (9)

A probe member for pogo pins used for inspection of a semiconductor device, wherein at least a part thereof is inserted into a cylindrical body and supported by an elastic member, and an upper end of the probe member is in contact with a terminal of the semiconductor device And the probe member is
A plurality of probes that are in contact with the terminals of the semiconductor device, and a probe portion provided at an upper end;
Extending downward from the probe portion, inserted into the cylindrical body, and a coupling member coupled to the cylindrical body,
A plurality of first probes arranged in the center and in contact with the terminals of the semiconductor device;
The first is disposed adjacent to the probe, see contains a second probe wherein said terminal guide flat surface to guide toward the first probe of the second device is provided for contacting,
The guide plane is a pogo pin probe member that extends along a horizontal direction orthogonal to a direction in which the probe portion and the coupling member are arranged .   2. The pogo pin probe member according to claim 1, wherein a protruding height of the second probe is higher than a protruding height of the first probe.   The pogo pin probe member according to claim 1, wherein the second probe is disposed so as to face each other with the first probe interposed therebetween.   4. The pogo pin probe member according to claim 1, wherein the second probe is disposed at an upper end edge of the probe portion. 5.   The third probe having a protruding height higher than a protruding height of the first probe and lower than a protruding height of the second probe is disposed between the first probe and the second probe. The probe member for pogo pins according to any one of -4.   The probe member for pogo pins according to any one of claims 1 to 5, wherein the second probe has a right-angled triangular cross-sectional shape.   The probe member for pogo pins according to claim 1, wherein the first probe is integrated with the second probe. Said guide flat surface, the first is an inclined plane having a height that decreases toward the probe, pogo pin probe member according to any one of claims 1-7. The probe member for pogo pins according to any one of claims 1 to 8, wherein the plurality of first probes extend along the horizontal direction.

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