JP5746927B2 - Semiconductor substrate, semiconductor device, and method of manufacturing semiconductor substrate - Google Patents

Description

  The present invention relates to a semiconductor substrate, a semiconductor device, and a method for manufacturing a semiconductor substrate.

  Nitride semiconductors such as GaN and AlGaN have features such as a high breakdown voltage, a high saturation drift velocity, chemical and thermal stability, and a large band gap. For this reason, nitride semiconductors such as GaN and AlGaN are expected to be used for power switching devices, devices capable of operating at high temperatures, blue or green light-emitting devices, etc., taking advantage of these characteristics.

  When epitaxially growing a nitride semiconductor, it is preferable to use an inexpensive silicon substrate as a base substrate for crystal growth. However, there is a problem that the difference in thermal expansion coefficient between the silicon crystal and the nitride semiconductor crystal is large, and cracks are likely to occur in the epitaxially grown crystal layer. As one of solutions to this problem, a technique has been proposed in which a nitride semiconductor crystal layer is not partially grown on the entire surface of a silicon substrate but is partially formed.

For example, Patent Document 1 discloses a technique for epitaxially growing a group III nitride semiconductor composed of Al _x Ga _y In _1-xy N (where 0 ≦ x, y ≦ 1, 0 ≦ x + y ≦ 1) on a Si substrate. Is disclosed. In Patent Document 1, when a group III nitride semiconductor is epitaxially grown on a Si substrate, a mask made of a Si thermal oxide film is formed on the Si substrate, and a group III nitride semiconductor is selectively epitaxially grown on the exposed portion of Si. Is described.
Patent Document 1 Japanese Patent Application Laid-Open No. 11-274082

  As described in Patent Document 1, if a silicon oxide film is formed on a silicon substrate and an opening reaching the silicon substrate is formed in an arbitrary region of the silicon oxide film, the silicon oxide film causes epitaxial growth of a nitride semiconductor crystal. It functions as an inhibition layer to inhibit, and a nitride semiconductor crystal can be epitaxially grown selectively only inside the opening. Since the epitaxially grown nitride semiconductor crystal is formed not only on the entire surface of the silicon substrate but inside the opening, the effect of suppressing the occurrence of cracks in the nitride semiconductor crystal can be expected.

  However, in the method of selectively epitaxially growing the semiconductor crystal layer inside the inhibition layer opening using the inhibition layer as a mask, atoms constituting the inhibition layer may be taken into the epitaxial growth layer. It is well known that atoms taken into the semiconductor crystal layer function as impurities. For example, when Si or O is taken into a GaN crystal or AlGaN crystal, it becomes an n-type impurity.

FIG. 1 is secondary ion mass spectrometry (SIMS) data that was experimentally evaluated to evaluate how much Si and O atoms are incorporated into the GaN layer. FIG. 1 is a SIMS depth profile of a GaN layer that has been selectively epitaxially grown using a silicon oxide film as an inhibition layer. The solid line shows the depth profile of O atoms, the broken line shows Si atoms, and the alternate long and short dash line shows Ga atoms. For O atoms and Si atoms, the concentration scale on the left side of the vertical axis corresponds to the scale of secondary ion intensity on the right side of the vertical axis for Ga atoms. The vicinity of a depth of 0.5 μm where the secondary ion intensity of Ga atoms is reduced is the interface between the substrate and the GaN layer. The GaN layer is from the depth of about 0.5 μm to the surface of the depth of 0 μm. Although it is not uniform in the depth direction of the GaN layer, O atoms and Si atoms are not less than 1 × 10 ¹⁸ cm ⁻³ , and depending on the depth, impurity atoms near 1 × 10 ²⁰ cm ⁻³ may be incorporated. Recognize.

  These impurity atoms clearly affect the conductivity of the crystal layer. In a GaN crystal, both Si atoms and O atoms act as donors that generate n-type conduction carriers (free electrons), so it is difficult to increase the resistance of the selective epitaxial crystal layer. Further, it is difficult to use the selective epitaxial crystal layer for an electronic device crystal that requires precise control of resistance. The object of the present invention is to increase the resistance even when a semiconductor crystal contains Si atoms or O atoms in the crystal, such as a nitride semiconductor crystal selectively epitaxially grown using an inhibition layer. It is an object of the present invention to provide a semiconductor crystal that can be used for an electronic device that needs to be controlled.

  In order to solve the above-described problem, in a first aspect of the present invention, a base substrate and a first crystal layer formed on or above the base substrate are included, and the first crystal layer includes oxygen atoms and Provided is a semiconductor substrate which is a group 3-5 compound semiconductor layer including a first atom which is at least one atom selected from the group consisting of silicon atoms and a second atom which is at least one atom which functions as an acceptor. . In this specification, “on the top” means that it is formed on the top in contact with the “to”, and corresponds to “on” when expressed in English. “To be formed above” means that it is formed above and apart from ~, and corresponds to “above” when expressed in English.

  For example, the second atom is at least one atom selected from the group consisting of Mg atom, Zn atom, Be atom and C atom. The semiconductor substrate may further include a second crystal layer formed above the first crystal layer and a third crystal layer formed between the first crystal layer and the second crystal layer. For example, the second crystal layer and the third crystal layer are Group 3-5 compound semiconductor layers, the third crystal layer has a second atom, and the total number of second atoms contained in the third crystal layer is the first Less than the total number of second atoms contained in the crystal layer. The second crystal layer may function as an active layer of a semiconductor active element formed using the semiconductor substrate. The third crystal layer may be a depleted crystal layer.

  The first crystal layer, the second crystal layer, and the third crystal layer may be a group 3-5 nitride semiconductor layer. The semiconductor substrate may further include an inhibition layer formed on or above the base substrate. The inhibition layer has an opening, the inhibition layer inhibits crystal growth, the inhibition layer includes first atoms, and the first crystal layer is formed in the opening. The inhibition layer may be a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer.

  According to a second aspect of the present invention, there is provided a base substrate, a first crystal layer formed on or above the base substrate, and an active layer formed on or above the first crystal layer, One crystal layer includes a first atom that is at least one atom selected from the group consisting of an oxygen atom and a silicon atom, and a group 3-5 compound semiconductor that includes a second atom that is at least one atom that functions as an acceptor. A semiconductor device that is a layer is provided.

  In the third aspect of the present invention, an inhibition layer containing a first atom which is at least one atom selected from the group consisting of an oxygen atom and a silicon atom on or above a base substrate and inhibits crystal growth A step of forming an opening in the inhibition layer, and a second atom, which is at least one atom functioning as an acceptor, of the first crystal layer of the group 3-5 compound semiconductor is introduced into the opening. A method for manufacturing a semiconductor substrate is provided.

  In the fourth aspect of the present invention, the inhibition layer includes a first atom which is at least one atom selected from the group consisting of an oxygen atom and a silicon atom on or above the base substrate and inhibits crystal growth. , Forming an opening in the inhibition layer, forming a first crystal precursor layer of a Group 3-5 compound semiconductor in the opening by epitaxial growth, and at least one atom functioning as an acceptor And forming a first crystal layer by doping the first crystal precursor layer with a second atom that is a semiconductor substrate. In the method for manufacturing a semiconductor substrate, the inhibition layer may be a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer.

It is the secondary ion mass spectrometry (SIMS) data which experimented in order to evaluate how much Si atom and O atom are taken in in a GaN layer. An example of a cross section of a semiconductor substrate 100 is shown. An example of a cross section of a semiconductor substrate 200 is shown. An example of a cross section of a semiconductor substrate 300 is shown. An example of a cross section of a field effect transistor 400 is shown. The IV characteristic of a dope transistor is shown. The IV characteristic of an undoped transistor is shown.

  FIG. 2 shows an example of a cross section of the semiconductor substrate 100. The semiconductor substrate 100 has a base substrate 102 and a first crystal layer 104. An arbitrary crystal layer may be formed between the base substrate 102 and the first crystal layer 104.

  The base substrate 102 is a support substrate that supports an epitaxial growth layer formed thereon. Examples of the base substrate 102 include a substrate whose surface is silicon, a sapphire substrate, a silicon carbide substrate, a zinc oxide substrate, and a GaAs substrate. Here, “the surface is silicon” means that at least the surface of the substrate has a region composed of silicon. For example, the base substrate 102 may be composed entirely of silicon such as a Si wafer, or may have a structure having a silicon layer on an insulating layer such as a SOI (silicon-on-insulator) wafer. . The base substrate 102 may be a substrate in which a silicon layer is formed on a substrate made of an element different from silicon, such as a sapphire substrate, a glass substrate, a silicon carbide substrate, a zinc oxide substrate, or a GaAs substrate. The silicon of the base substrate 102 may contain impurities. An extremely thin silicon oxide layer or silicon nitride layer such as a natural oxide layer may be formed on the silicon layer on the surface of the base substrate 102.

The first crystal layer 104 is formed on or above the base substrate 102. That is, the first crystal layer 104 may be formed in contact with the surface of the base substrate 102 or may be formed with another layer interposed between the first crystal layer 104 and the surface of the base substrate 102. The first crystal layer 104 is a group 3-5 compound semiconductor layer. Examples of the first crystal layer 104 include GaAs, AlGaAs, InGaAs, InGaP, AlN, GaN, and AlGaN. The first crystal layer 104 includes a first atom that is at least one atom selected from the group consisting of O atoms and Si atoms. The concentration of the first atoms in the first crystal layer 104 is 2 × 10 ¹⁷ cm ⁻³ or more and 1 × 10 ²¹ cm ⁻³ or less.

  The first crystal layer 104 includes a second atom that is at least one atom that functions as an acceptor. Examples of the second atom include at least one atom selected from the group consisting of Mg atom, Zn atom, Be atom, and C atom. The second atom functions as an acceptor that generates holes in the first crystal layer 104. The first crystal layer 104 includes both the first atom serving as a donor and the second atom serving as an acceptor, so that electrons generated by the first atom are compensated by holes generated by the second atom, The resistivity of the first crystal layer 104 can be increased. As a result of the high resistivity of the first crystal layer 104, the current flowing through the first crystal layer 104 is suppressed, and the characteristics of the first crystal layer 104 or the device formed thereon can be improved. For example, in the case of a field effect transistor, pinch-off characteristics or breakdown voltage is improved.

The concentration of the second atoms included in the first crystal layer 104 is preferably an excessive concentration sufficient to compensate for the mixed first atoms. In addition to compensating for the first atom, the excessive concentration also captures newly generated carriers (electrons) by voltage application during transistor operation, and makes the first crystal layer 104 highly insulating during the transistor operation. Concentration that can be maintained. By using such a concentration, an improvement in the pinch-off property of the transistor and an improvement in the on / off ratio can be expected. In general, the concentration of the second atom can be determined in the range of 1 × 10 ¹⁴ cm ⁻³ to 1 × 10 ²¹ cm ⁻³ .

  Note that the concentration of the second atoms included in the first crystal layer 104 is a concentration that is just enough to compensate for the mixed first atoms, a concentration that is slightly insufficient to compensate the first atoms, or the first atoms. However, the concentration may be such that the excess amount is excessively small. In these cases, the first crystal layer 104 has an n-type or p-type conductivity which is insulative or low in conductivity, and even in such a case, an effect can be expected.

  FIG. 3 shows a cross-sectional example of the semiconductor substrate 200. The semiconductor substrate 200 includes a base substrate 102, a first crystal layer 104, a second crystal layer 202, and a third crystal layer 204. The base substrate 102 and the first crystal layer 104 in the semiconductor substrate 200 are the same as the base substrate 102 and the first crystal layer 104 in the semiconductor substrate 100.

  The second crystal layer 202 is formed above the first crystal layer 104. The second crystal layer 202 functions as an active layer of the semiconductor active element. The semiconductor active element refers to an element formed using the semiconductor substrate 200. In other words, when the semiconductor active element is formed using the semiconductor substrate 200, the second crystal layer 202 has a characteristic that can function as an active layer of the semiconductor active element. The third crystal layer 204 is formed between the first crystal layer 104 and the second crystal layer 202. The second crystal layer 202 and the third crystal layer 204 are Group 3-5 compound semiconductor layers. Examples of the second crystal layer 202 include GaAs, AlGaAs, InGaAs, InGaP, AlGaN, or GaN. The second crystal layer 202 may not be a single layer. For example, it may be a heterojunction crystal layer such as GaAs / InGaAs, AlGaN / GaN, GaN / AlGaN / GaN, or InAlN / GaN. Examples of the third crystal layer 204 include GaAs, AlGaAs, InGaAs, InGaP, AlN, GaN, and AlGaN.

  The total number of second atoms contained in the third crystal layer 204 is less than the total number of second atoms contained in the first crystal layer 104. When a plurality of types of second atoms are included in the crystal layer, the total number of second atoms indicates the sum of the numbers of the second atoms. The third crystal layer 204 is in a depletion state. Here, the “depletion state” means that the same number of free electrons and holes in the third crystal layer 204 exist, so that free electrons and holes recombine and cancel each other, so that carriers are substantially absent. The state that is. For example, there is a case where the number of free electrons and holes generated from the donor and acceptor existing in the third crystal layer 204 is approximately the same.

As described above, the concentration of the second atoms contained in the first crystal layer 104 is preferably an excessive concentration sufficient to compensate for the mixed first atoms. However, when the concentration of the second atoms contained in the first crystal layer 104 becomes excessive, carriers in the layer formed on the first crystal layer 104 are also captured. Therefore, when the second crystal layer functioning as the active layer is formed over the first crystal layer 104, the second atoms in which carriers that should form channels in the second crystal layer are excessively contained in the first crystal layer 104 are formed. And may adversely affect the modulation characteristics of the transistor. On the other hand, in the semiconductor substrate 200, the third crystal layer 204 in which the concentration of the second atom as the compensation impurity is lower than that of the first crystal layer 104 is inserted between the first crystal layer 104 and the second crystal layer 202. . In general, as shown in the SIMS depth profile of FIG. 1, the concentration of the first atom tends to show a more constant concentration profile in the upper layer (the surface side of the layer). Therefore, in the third crystal layer 204 above the first crystal layer 104, carrier electrons from the first atoms can be compensated with high accuracy without excessive doping of the second atoms. By adjusting the doping amount of the second atom so that the first atom is compensated and the concentration of holes generated by the second atom is at a very low level, the third crystal layer 204 can be depleted. it can. The carrier concentration of the third crystal layer 204 is 1 × 10 ¹⁷ cm ⁻³ or less, preferably 1 × 10 ¹⁶ cm ⁻³ or less, and particularly preferably 1 × 10 ¹⁴ cm ⁻³ or less. The carrier concentration refers to the carrier concentration when measured by SIMS. The thickness of the third crystal layer 204 is preferably 50 nm or more.

  The presence of the third crystal layer 204 in the depletion state between the first crystal layer 104 and the second crystal layer 202 causes electrons or holes traveling in the second crystal layer 202 to exist in the first crystal layer 104. Or it will not interact with holes. As a result, when a field effect transistor is formed using the second crystal layer 202 as an active layer, it is possible to prevent an abnormal operation of the element such as a kink appearing in a current-voltage curve (IV curve) of the field effect transistor.

  Note that an interface control layer may be formed between the first crystal layer 104 and the base substrate 102 for the purpose of controlling the properties of the interface. For example, when Si is used as the base substrate 102 and a GaN layer is formed as the first crystal layer 104, Ga and Si may react to deteriorate the crystallinity of GaN. In such a case, AlN may be disposed as the interface control layer.

  FIG. 4 shows a cross-sectional example of the semiconductor substrate 300. The semiconductor substrate 300 includes a base substrate 102, a first crystal layer 104, a third crystal layer 204, an inhibition layer 302, a fourth crystal layer 304, and a fifth crystal layer 306. The base substrate 102, the first crystal layer 104, and the third crystal layer 204 of the semiconductor substrate 300 are similar to the base substrate 102, the first crystal layer 104, and the third crystal layer 204 of the semiconductor substrate 100 and the semiconductor substrate 200. The fourth crystal layer 304 is a crystal layer that can be applied to a channel layer of a field effect transistor. The fifth crystal layer 306 is a crystal layer applicable to a Schottky layer of a field effect transistor. The fourth crystal layer 304 and the fifth crystal layer 306 correspond to the second crystal layer 202 in the semiconductor substrate 200 of FIG. In this example, the fourth crystal layer 304 is formed on the third crystal layer 204, and the fifth crystal layer 306 is formed on the fourth crystal layer. In FIG. 4, the lower portion of the first crystal layer 104 is formed inside the opening, and the upper portion protrudes from the opening.

  The first crystal layer 104, the third crystal layer 204, the fourth crystal layer 304, and the fifth crystal layer 306 are partially formed on the base substrate 102. “Partially formed” as used herein refers to a state in which crystals are grown not on the entire surface of the base substrate 102 but in a limited range. That is, the inhibition layer 302 is formed on or above the base substrate 102, and the first crystal layer 104, the third crystal layer 204, the fourth crystal layer 304, and the fifth crystal layer 306 are formed in the openings formed in the inhibition layer 302. Is formed.

  The inhibition layer 302 inhibits crystal growth. The inhibition layer 302 includes the same atoms as the first atoms included in the first crystal layer 104. As the inhibition layer 302, a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer can be given.

  The fourth crystal layer 304 forms a channel of the field effect transistor when the field effect transistor is manufactured. Examples of the material of the fourth crystal layer 304 include GaAs, AlGaAs, InGaAs, InGaP, GaN, AlGaN, InGaN, and InAlGaN. The thickness of the fourth crystal layer 304 may be in the range of 100 nm to 10,000 nm.

  The fifth crystal layer 306 forms a heterointerface with the fourth crystal layer 304, and induces a channel charge at the heterointerface when a field effect transistor is manufactured. Examples of the fifth crystal layer 306 include materials that can form a heterointerface with the fourth crystal layer 304, such as GaAs, AlGaAs, InGaAs, InGaP, GaN, AlGaN, InAlN, AlN, and InAlGaN. The thickness of the fifth crystal layer 306 can be determined in consideration of the on-resistance, breakdown voltage, etc. of the transistor within a range in which the stress due to the lattice constant difference generated in the heterojunction crystal is kept within the elastic limit of the crystal. Examples of the thickness of the fifth crystal layer 306 include a range of 1 nm to 300 nm.

  A method for manufacturing the semiconductor substrate 300 will be described. First, the inhibition layer 302 is formed in contact with the base substrate 102. As the inhibition layer 302, for example, a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer is formed by vapor deposition, sputtering, thermal CVD, plasma CVD, or the like, and an opening is formed by etching. The opening is formed with a depth reaching the base substrate 102. Alternatively, the inhibition layer 302 can be formed by forming a mask made of Ni or the like on the base substrate 102 and oxidizing, nitriding or oxynitriding the Si surface exposed at the bottom of the mask opening. For the oxidation, thermal oxidation, plasma oxidation, or the like can be used. Nitriding can be performed by introducing a nitrogen source such as ammonia into the surface of the base substrate 102 and performing thermal nitriding or plasma nitriding.

  Next, the first crystal layer 104, the third crystal layer 204, the fourth crystal layer 304, and the fifth crystal layer 306 are stacked in this order on the base substrate 102 at the bottom of the opening of the inhibition layer 302. These crystal layers are preferably formed by epitaxial growth. As the epitaxial growth method, for example, metal organic chemical vapor deposition method (hereinafter sometimes referred to as MOCVD method), molecular beam epitaxy method (hereinafter sometimes referred to as MBE method), halide vapor phase growth method (HVPE method). Is mentioned. Note that a crystal layer is not formed on the inhibition layer 302 in the process of epitaxial growth. Therefore, the first crystal layer 104, the third crystal layer 204, the fourth crystal layer 304, and the fifth crystal layer 306 are formed only in the opening of the inhibition layer 302.

When the MOCVD method is used, trimethylgallium (TMG), trimethylaluminum (TMA), trimethylindium (TMI), or the like can be used as a Group 3 element material. Ammonia (NH ₃ ) or the like can be used as the nitrogen raw material. High purity hydrogen and high purity nitrogen can be used as a carrier gas for the raw material. The epitaxial growth conditions are, for example, a reactor internal pressure of 0.1 atm, a growth temperature of 1000 ° C., and a growth rate of 0.1 μm / hr to 3 μm / hr.

  In the epitaxial growth step described above, at the time of growing the first crystal layer 104 and the third crystal layer 204, at least one atom selected from the group consisting of Mg atom, Zn atom, Be atom and C atom is simultaneously introduced as an impurity. Dopes as atoms. That is, the crystal layer is formed by epitaxial growth while doping the second atoms. At this time, the dope source gas may be introduced into the reaction furnace together with the group 3 source and the group 5 source. As a dope raw material, biscyclopentadienyl magnesium, carbon tetrachloride, diethyl zinc, bismethylcyclopentadienyl beryllium, or the like can be used. In addition, after forming the first crystal precursor layer and the third crystal precursor layer not containing the second atom which is an impurity atom by epitaxial growth, the impurity layer is doped into the precursor layer by ion implantation or thermal diffusion. Thus, the first crystal layer 104 and the third crystal layer 204 may be formed.

  FIG. 5 shows a cross-sectional example of the field effect transistor 400. The field effect transistor 400 includes a base substrate 102, a first crystal layer 104, a third crystal layer 204, an inhibition layer 302, a channel layer 402, a Schottky layer 404, an ohmic electrode 406, and a gate electrode 408. The base substrate 102, the first crystal layer 104, the third crystal layer 204, and the inhibition layer 302 of the field effect transistor 400 are the base substrate 102, the first crystal layer 104, and the third substrate 302 of the semiconductor substrate 100, the semiconductor substrate 200, and the semiconductor substrate 300. This is the same as the crystal layer 204 and the inhibition layer 302.

  The channel layer 402 and the Schottky layer 404 are the same as the fourth crystal layer 304 and the fifth crystal layer 306 in the semiconductor substrate 300, and the fourth crystal layer 304 and the fifth Schottky layer 404 are formed by forming the ohmic electrode 406 and the gate electrode 408. The crystal layers 306 become the channel layer 402 and the Schottky layer 404, respectively. The ohmic electrode 406 connects the field effect transistor 400 and an external circuit. An example of the ohmic electrode 406 is a laminated metal structure of Ti / Au from the Schottky layer 404 side. The gate electrode 408 inputs a signal to the field effect transistor 400. An example of the gate electrode 408 is a Ni / Au laminated metal structure from the Schottky layer 404 side.

  A method for manufacturing the field effect transistor 400 will be described. The field effect transistor 400 is manufactured using the semiconductor substrate 300. On the fifth crystal layer 306 in the semiconductor substrate 300, two ohmic electrodes 406 are formed so as to be separated from the gate electrode 408 and sandwich the gate electrode 408.

  The metal constituting the ohmic electrode 406 and the gate electrode 408 is formed by, for example, a vapor deposition method, a sputtering method, or a CVD method. Photolithography can be used to form a desired shape. The ohmic electrode 406 and the gate electrode 408 can be formed by a combination of the photolithography method and the lift-off method. The ohmic electrode 406 is preferably annealed to obtain better ohmic contact. Annealing conditions include a heat treatment at 800 ° C. for 30 seconds in a nitrogen atmosphere.

  As the base substrate 102, a 2-inch Si substrate having a (111) plane as a main surface was prepared. A silicon oxide layer was deposited as an inhibition layer 302 on the entire surface of the Si substrate. The silicon oxide layer was deposited with a thickness of 150 nm by a sputtering method. A photosensitive resin having an opening of 100 μm square was formed on the silicon oxide layer by photolithography, and the silicon oxide layer and the natural oxide film were wet etched using the photosensitive resin as a mask to expose the Si substrate.

After removing the photosensitive resin, the Si substrate is carried into an epitaxial growth furnace, and after the surface pretreatment, a source gas is supplied into the furnace, and the interface control layer, the buffer layer as the first crystal layer 104, the third crystal The depletion crystal layer, the channel layer 402, and the Schottky layer 404 as the layer 204 were formed by epitaxial growth. Table 1 shows the composition, thickness, and Mg atom doping concentration of each layer.

  For comparison, a substrate having a crystal structure similar to that described in Table 1 and in which the layers corresponding to the buffer layer and the depletion crystal layer are not doped with Mg atoms was manufactured. Hereinafter, a substrate doped with Mg atoms is referred to as a “doped substrate”, and a substrate not doped with Mg atoms is referred to as an “undoped substrate”.

Trimethyl gallium (TMG), trimethyl aluminum (TMA), biscyclopentadienyl magnesium and ammonia (NH ₃ ) were used as source gases. The pressure in the growth furnace was kept at 30 kPa. Hydrogen was used as a carrier gas for the source gas. The growth of each layer was performed while controlling the supply amount of each raw material and the substrate temperature.

When the crystal layers of the doped substrate and the undoped substrate were analyzed by SIMS, the buffer layer and the depleted crystal layer had 5 × 10 ¹⁷ cm ⁻³ to 1 × 10 ¹⁸ cm ⁻³ Si atoms and 5 × 10 ¹⁷ cm ^−. O atoms of ³ to 1 × 10 ¹⁸ cm ⁻³ were mixed.

  An ohmic electrode, element isolation, and a gate electrode were formed in this order on a doped substrate and an undoped substrate, and a field effect transistor was fabricated. The ohmic electrode was Ti (10 nm) / Al (150 nm) / Ni (20 nm) / Au (300 nm) from the crystal side. The ohmic electrode was formed using vapor deposition, photolithography, and lift-off. The ohmic electrode was annealed in a nitrogen atmosphere at 800 ° C. for 60 seconds after formation.

Element isolation was performed by implanting nitrogen ions. The acceleration voltage for implantation was 20 KeV and 100 KeV. Both doses of nitrogen ions were 1 × 10 ¹⁴ cm ² . The gate electrode was Ni (15 nm) / Au (200 nm) from the crystal side. The gate electrode was formed using an evaporation method, photolithography, and a lift-off method. As for the manufactured transistor, a transistor using a doped substrate is called a doped transistor, and a transistor using an undoped substrate is called an undoped transistor.

  FIG. 6 shows the IV characteristics of the doped transistor. FIG. 7 shows the IV characteristics of the undoped transistor. For IV characteristics, one of the ohmic electrodes (source) was grounded, and the voltage applied to the other ohmic electrode (drain) was changed from 0 V to 10 V, and the current flowing through the drain during that time was evaluated. The IV characteristics were evaluated by changing the gate voltage Vg from 0V to -5V in 1V steps.

  In the undoped transistor, the drain current was modulated only in a limited voltage range within the range of 0V to -5V in which the gate voltage was changed. In the undoped transistor, the drain voltage was not pinched off even when a negative voltage was applied as the gate voltage.

  On the other hand, in the doped transistor, it was possible to observe the modulation of the drain current over the entire range of the applied gate voltage (0 V to −5 V). This shows good controllability of the drain current by the gate voltage. In the doped transistor, the drain voltage was pinched off and showed good pinch-off characteristics. Such a difference in performance between the undoped transistor and the doped transistor is an effect obtained by doping the buffer layer and the depleted crystal layer with Mg atoms.

  In the above-described embodiment, the field effect transistor is exemplified as the semiconductor device, but other active devices such as a bipolar transistor and an LED may be used.

  DESCRIPTION OF SYMBOLS 100 ... Semiconductor substrate, 102 ... Base substrate, 104 ... First crystal layer, 200 ... Semiconductor substrate, 202 ... Second crystal layer, 204 ... Third crystal layer, 300 ... Semiconductor substrate, 302 ... Inhibitory layer, 304 ... Fourth Crystal layer, 306 ... fifth crystal layer, 400 ... field effect transistor, 402 ... channel layer, 404 ... Schottky layer, 406 ... ohmic electrode, 408 ... gate electrode

Claims (9)

A base substrate;
A first crystal layer formed on or above the base substrate ;
A second crystal layer formed above the first crystal layer;
A third crystal layer formed between the first crystal layer and the second crystal layer ,
The first crystal layer includes a first atom that is at least one atom selected from the group consisting of an oxygen atom and a silicon atom, and a group 3-5 that includes a second atom that is at least one atom functioning as an acceptor. compound semiconductor layer der is,
The second crystal layer and the third crystal layer are group 3-5 compound semiconductor layers,
The third crystal layer has the second atom;
The total number of the second atoms contained in the third crystal layer is less than the total number of the second atoms contained in the first crystal layer;
The third crystal layer is a semiconductor substrate in a depleted state . The semiconductor substrate according to claim 1, wherein the second atom is at least one atom selected from the group consisting of Mg atom, Zn atom, Be atom, and C atom. The second crystal layer, the semiconductor substrate according to claim 1 or claim 2 functions as an active layer of the semiconductor active device. The first crystal layer, the second crystal layer and the third crystal layer, the semiconductor substrate according to any one of claims 1 to 3 is a group III-V nitride semiconductor layer. Further comprising an inhibition layer formed on or over the base substrate;
The inhibition layer has an opening;
The inhibition layer inhibits crystal growth;
The inhibition layer comprises the first atoms;
The first crystal layer, a semiconductor substrate according to any one of claims 1 to 4 which is formed in the opening. The semiconductor substrate according to claim 5 , wherein the inhibition layer is a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer. A base substrate;
A first crystal layer formed on or above the base substrate;
A second crystal layer formed above the first crystal layer;
A third crystal layer formed between the first crystal layer and the second crystal layer;
Have
The first crystal layer includes a first atom that is at least one atom selected from the group consisting of an oxygen atom and a silicon atom, and a group 3-5 that includes a second atom that is at least one atom functioning as an acceptor. compound semiconductor layer der is,
The second crystal layer and the third crystal layer are group 3-5 compound semiconductor layers,
The third crystal layer has the second atom;
The total number of the second atoms contained in the third crystal layer is less than the total number of the second atoms contained in the first crystal layer;
The third crystal layer is in a depleted state;
Said second semiconductor device crystal layer Ru active layer der. Forming an inhibition layer that inhibits crystal growth, on or above the base substrate, including a first atom that is at least one atom selected from the group consisting of oxygen atoms and silicon atoms;
Forming an opening in the inhibition layer;
Forming a first crystal precursor layer of a Group 3-5 compound semiconductor by epitaxial growth inside the opening;
Forming a first crystal layer by doping the first crystal precursor layer with a second atom, which is at least one atom that functions as an acceptor, and
A method for manufacturing a semiconductor substrate. The method for manufacturing a semiconductor substrate according to claim 8 , wherein the inhibition layer is a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer.

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