JP5301955B2 - Defect correction device - Google Patents

Description

  The present invention relates to a defect correction apparatus for correcting defects of a substrate such as a flat panel display (FPD) and a semiconductor wafer with a laser beam.

  2. Description of the Related Art Conventionally, a technique has been used in which a substrate is irradiated with laser light emitted from a laser light source and a defect of the substrate is corrected. As an apparatus for correcting such a defect, for example, a laser processing apparatus in which a laser oscillator and a processing head are connected by an optical fiber is known (see Patent Document 1).

The laser processing apparatus described in Patent Document 1 includes a laser oscillator fixed to the end of the apparatus, and a movable processing head that can move in two horizontal directions on the workpiece. Between the laser oscillator and the processing head, Are connected by an optical fiber.
JP-A-9-239578

  However, since the laser processing apparatus described in Patent Document 1 moves only the processing head among the laser oscillator and the processing head separated by the optical fiber, the deformation of the optical fiber is repeated as the processing head moves.

  If the deformation of the optical fiber is repeated, the durability deteriorates, and there is a problem that the core wire of the optical fiber is cracked and the workpiece cannot be processed with laser light having a uniform intensity distribution.

  In addition, when the optical fiber is repeatedly deformed, the reflection conditions in the optical fiber change, so the quality of the laser light transmitted through the optical fiber changes, and the substrate can be processed with laser light having a uniform intensity distribution. There is inconvenience that we cannot do it.

  The subject of this invention is providing the defect correction apparatus which can irradiate a laser beam which has uniform intensity distribution to a board | substrate.

  In order to solve the above problems, a defect correction apparatus of the present invention includes a laser light source, an optical fiber connected to the laser light source, a processing head that irradiates a substrate with laser light guided by the optical fiber, A plurality of mode scramblers that meander the optical fibers in different directions, and the laser light source, the optical fiber, the processing head, and the plurality of mode scramblers as a single unit. The optical fiber is formed with a linear portion extending in a straight line at the end on the processing head side.

  In the present invention, since the laser light source, the optical fiber, the processing head, and the plurality of mode scramblers move integrally, the relative distance between the laser light source and the processing head is constant, and the optical fiber is not deformed.

  In the present invention, the plurality of mode scramblers meander the optical fiber in different directions, and the optical fiber is formed with a straight line portion that extends in a straight line at the end on the processing head side.

  Therefore, according to the present invention, the substrate can be irradiated with laser light having a uniform intensity distribution.

Hereinafter, a defect correction apparatus according to an embodiment of the present invention will be described with reference to the drawings.
1A and 1B are a plan view and a front view showing a defect correcting apparatus 1 according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram for explaining the internal structure of the machining head 5 of the defect correcting apparatus 1.
3A and 3B are a schematic side view and a schematic front view for explaining the optical fiber 8 and the mode scramblers 11 and 12 of the defect correcting device 1.

  For example, the defect correction apparatus 1 detects defects such as a short circuit of a wiring portion or a protrusion of a photoresist on a glass substrate A on which a circuit pattern is formed in a photolithography process in a manufacturing process of an FPD such as a liquid crystal display (LCD). In such a case, it is used for repair processing such as removing defects with laser light.

  As shown in FIG. 1A and FIG. 1B, the defect correction apparatus 1 includes a levitation stage 2 that levitates the substrate A while maintaining a horizontal plane state, and one side edge of the substrate A at the side of the levitation stage 2. A suction transfer stage 3 that holds and holds the substrate in the X direction, a portal gantry (moving mechanism) 4 that spans the floating stage 2 in the Y direction perpendicular to the substrate transfer direction, and the gantry 4 A machining head 5 and a laser unit (laser power source 6, laser light source 7, optical fiber 8, and two mode scramblers 11 and 12) that integrally move in the Y direction along the horizontal beam 20 are provided.

  The gantry 4 includes a moving mechanism that moves along a horizontal beam 20 a head mounting portion 18 to which the machining head 5 is mounted and a laser unit mounting portion 19 to which the laser power source 6 and the laser light source 7 are mounted. The head mounting portion 18 is provided in a cantilever shape on the side of the horizontal beam 20 constituting the gantry 4 and is movable in the Y direction by a linear guide rail and a linear motor (not shown). The processing head 5 is attached to the head attachment portion 18 with the objective lens 9 facing vertically downward.

  The laser unit mounting portion 19 is a slider supported so as to be slidable in the Y direction along a rail 21 provided on the upper surface of the horizontal beam 20. A laser power source 6 having a relatively heavy weight is disposed vertically above the horizontal beam 20. In addition, a laser light source 7 is arranged.

The head mounting portion 18 and the laser unit mounting portion 19 are moved together in the Y direction by being fixed to each other.
In order to perform microscopic inspection and laser processing of the glass substrate A, which will be described later, using the defect correction apparatus 1, the substrate alignment mechanism is placed in a state where the substrate A is placed on the floating stage 2 and floated by a transfer robot (not shown). Position by 23. After the positioning, the suction conveyance stage 3 is raised, the glass substrate A is sucked by the suction portion 3a, the linear motor of the suction conveyance stage 3 is driven, and is transported in the X direction along the linear guide rail.

  The processing head 5 is moved in the Y direction and the suction conveyance stage 3 is moved in the X direction based on the defect position information of the glass substrate A specified by the pattern inspection apparatus or the like arranged on the FPD production line, and a microscopic inspection or laser to be described later. By performing the processing, it is possible to perform microscopic inspection and laser processing over almost the entire surface of the glass substrate A.

  Here, in the optical fiber 8, the incident side end face 8a is connected to the laser light source 7, and the output side end face 8b is connected to the incident port side where the projection lens (projection optical system) 41 of the processing head 5 is arranged.

  As shown in FIGS. 3A and 3B, the optical fiber 8 is provided with two mode scramblers 11 and 12 and a linear portion 8c extending linearly toward the emission-side end face 8b.

  The incident-side mode scrambler 11 has three screws 11a, 11b, and 11c that extend in the Y-axis direction and press the optical fiber 8 at the tip. The central screw 11b presses the optical fiber 8 in the negative direction of the X axis, and the screws 11a and 11c at both ends press the optical fiber 8 in the positive direction of the X axis. Thereby, the optical fiber 8 extending in the Y axis direction from the incident side end face 8a meanders in the X axis direction on the XY plane.

  The output-side mode scrambler 12 has three screws 12a, 12b, and 12c that extend in the Z-axis direction and press the optical fiber 8 at the tip. The central screw 12b presses the optical fiber 8 in the positive direction of the Z axis, and the screws 12a and 12c at both ends press the optical fiber 8 in the negative direction of the Z axis. Thereby, the optical fiber 8 extending in the Y-axis direction meanders in the Z-axis direction on the YZ plane.

  Each screw of the mode scramblers 11 and 12 can be adjusted by, for example, screwing into a screw hole formed in a housing or the like (not shown) of the mode scramblers 11 and 12. Yes.

  As described above, in the present embodiment, the incident-side mode scrambler 11 and the emitting-side mode scrambler 12 meander the optical fiber 8 in directions perpendicular to each other (X-axis direction and Z-axis direction). Yes.

  Here, the optical fiber 8 is meandered by the mode scramblers 11 and 12 to apply a bending stress to the optical fiber 8, thereby removing higher-order modes of the laser light incident on the optical fiber 8 which is a multimode optical fiber. Thus, a stable mode distribution can be obtained. Therefore, the substrate A can be irradiated with a laser beam having a uniform intensity distribution by the processing head 5 described later.

  Furthermore, in this embodiment, since the two mode scramblers 11 and 12 meander the optical fiber 8 in a direction orthogonal to each other, the two mode scramblers meander the optical fiber in the same direction. However, it is possible to reliably remove higher-order modes, and thus a more stable mode distribution can be obtained.

  In the present embodiment, since the mode scramblers 11 and 12 that meander the optical fiber 8 are used, it is more stable especially when the optical fiber 8 is thicker than the mode scrambler that turns the fiber. Mode distribution can be obtained.

In the present embodiment, since the two mode scramblers 11 and 12 meander the optical fiber 8 in a direction orthogonal to each other, a very stable mode distribution can be obtained. Of the plurality of mode scramblers, If the directions in which the two mode scramblers meander the optical fiber 8 are different from each other, it is desirable that the angle between them is close to the vertical, but higher order modes are effectively removed than meandering in the same direction. It is possible to do.

  Further, in this embodiment, the optical fiber 8 is meandered by the screws of the mode scramblers 11 and 12, but if the optical fiber 8 can be meandered, for example, a pin, a protrusion, or the optical fiber 8 is inserted. A member formed by meandering holes and grooves can be used, but it is desirable to use a member that is difficult to damage the optical fiber 8.

Further, in the present embodiment, an example in which each mode scrambler 11 and 12 uses three screws has been described, but two or four or more screws may be used.
The straight portion 8c of the present embodiment is not forcibly formed by a fixing member that fixes the optical fiber 8, but extends linearly due to the positional relationship between the mode scramblers 11 and 12 and the processing head 5. For example, the linear portion 8c may be forcibly formed by fixing the optical fiber 8 with a fixing member.

The length L of the straight portion 8c is preferably 50 mm or more, more preferably 100 mm or more in order to make the intensity distribution of the laser light uniform.
In the present embodiment, when the head mounting portion 18 is driven, the head mounting portion 18 and the laser unit mounting portion 19 are integrally driven in the Y direction. As a result, the machining head 5 and the laser unit (laser power source 6) are driven. The laser light source 7, the optical fiber 8, and the mode scramblers 11, 12) are integrally moved in the Y direction. That is, even if the machining head 5 is moved, the optical fiber 8 is not deformed and can be moved while maintaining a certain form.

  Therefore, even if the processing head 5 moves, the laser light source 7, the optical fiber 8, and the mode scramblers 11 and 12 move together, so that the optical fiber 8 is not deformed, and the reflection condition in the optical fiber 8 is It is always kept constant, and the intensity distribution of the laser light applied to the substrate A can be stabilized. As a result, high-precision laser processing can be continued by always irradiating laser light with a uniform intensity distribution.

Further, since it is not necessary to deform the optical fiber 8, it is possible to prevent the optical fiber 8 that is easily damaged by repeated use from being deteriorated.
Further, in the present embodiment, only the relatively light processing head 5 is attached to the cantilevered head mounting portion 18, and the relatively heavy laser power source 6 and laser light source 7 are connected to the gate-shaped horizontal beam 20. Since it is arranged vertically above, the load applied to the head mounting portion 18 when the machining head 5 is moved can be minimized. Therefore, the machining head 5 can be moved with high accuracy, and laser machining can be performed with high accuracy.

  In the present embodiment, the glass substrate A is levitated by the levitation stage 2, moved in the X direction by the suction conveyance stage 3, and the processing head 5 is moved in the Y direction by the gantry 4, thereby almost the entire surface of the substrate A. However, instead of this, the substrate A is fixed, the gantry 4 is moved to move in the X direction, and the processing head 5 and the laser unit are moved to the horizontal beam 20 of the gantry 4. You may decide to move in the Y direction along.

Hereinafter, the internal configuration of the machining head 5 of the defect correction apparatus 1 will be described with particular reference to FIG.
The laser light source 7 is a light source for repair processing. In this embodiment, as shown in FIGS. 3A and 3B, a laser oscillator 7a, a coupling lens 7b, a half mirror 7c, and an LED light source 7e.
The structure which has is adopted.

  The laser oscillator 7a oscillates a laser beam whose wavelength and output are set so that defects on the glass substrate A can be removed. For example, a YAG laser capable of pulse oscillation can be preferably used. The oscillation wavelength can be switched among a plurality of oscillation wavelengths according to the repair target.

The laser oscillator 7 a is electrically connected to the control unit 22, and oscillation is controlled according to a control signal from the control unit 22.
The half mirror 7c reflects the laser beam oscillated by the laser oscillator 7a in the negative X-axis direction toward the coupling lens 7b in the negative Y-axis direction. The half mirror 7c transmits light emitted in the Y-axis negative direction from the LED light source 7e toward the coupling lens 7b.

  Since the half mirror 7c reflects the laser light oscillated by the laser oscillator 7a toward the coupling lens 7b, the oscillation direction of the laser oscillator 7a can be determined in accordance with the apparatus configuration, and the degree of freedom of design increases. Space can be saved.

The coupling lens 7 b is an optical element for optically coupling the laser beam emitted from the laser oscillator 7 a to the fiber 3.
The optical fiber 8 propagates the laser beam optically coupled to the fiber end surface 8a by the coupling lens 7b, guides it into the processing head 5, and emits the laser beam 60 from the fiber end surface 8b. Since the laser light 60 is emitted after propagating through the optical fiber 8, even if the laser light of the laser oscillator 7a has a Gaussian distribution, it is a diffused light with a uniform light amount distribution.

  2 is a schematic diagram, the optical axis of the laser light emitted from the laser oscillator 7a is shown as if it is along the Z direction. In this embodiment, as shown in FIG. 3B. Along the X-axis direction. However, the arrangement position and orientation of the laser oscillator 7a are not limited to these.

  Further, in addition to the above-described mode scramblers 11 and 12, as laser beam uniformizing means, other optical elements such as a fly-eye lens, a diffractive element, an aspherical lens, and a kaleido type rod are used. It is good also as a structure using the homogenizer etc. of various structures.

  The processing head 5 includes optical elements such as a projection lens (projection optical system) 41, a spatial modulation element 42, an irradiation optical system 43, an observation light source 44, an observation imaging lens 45, and an imaging element 46 in a housing 5a. And holding the device.

  The projection lens 41 has an arrangement in which the fiber end surface 8b of the optical fiber 8 fixed to the housing 5a of the processing head 5 and the reference surface of the spatial modulation element 42 have a conjugate relationship, and spatially modulates the image of the fiber end surface 8b. It is a lens or a lens group in which the projection magnification is set so that the entire modulation region of the element 42 can be irradiated.

In FIG. 2, the optical axis P <b> 1 of the projection lens 41 is set in an oblique direction from the Z-axis positive direction to the negative direction as it goes from the Y-axis positive direction to the negative direction on the ZY plane.
The spatial modulation element 42 spatially modulates the laser light 61 projected from the projection lens 41, and is composed of a DMD (Digital Mirror Device) that is a micromirror array, and a plurality of micromirrors that can be controlled to swing are rectangular. Two-dimensionally arranged in the modulation region at an equal pitch.

In the present embodiment, a mirror 47 is disposed on the optical path of the laser beam 61, and the optical axis P1 of the laser beam 61 is reflected in the direction of the optical axis P2. Then, the laser light 61 is reflected with respect to the normal of the reference surface of the spatial modulation element 42 so that the laser light 61 is reflected as the ON light 62 along the optical axis P3 along the normal of the reference surface of the spatial modulation element 42. It is arranged to enter at an angle. The optical axes P1 and P2 and the optical axis P3 of the on light 62 are located on the same plane.

  The irradiation optical system 43 is an optical element that forms an imaging optical system that forms an image on the glass substrate A with a desired magnification by the ON light 62 that is spatially modulated by the spatial modulation element 42 and reflected in a certain direction. The imaging lens 48 is disposed on the spatial modulation element 42 side, and the objective lens 9 is disposed on the glass substrate A side.

  The objective lens 9 is composed of a plurality of objective lenses such as an ultraviolet objective lens for processing the resist pattern of the glass substrate A. The plurality of objective lenses are switchably held by a revolver mechanism, and have different magnifications. Therefore, the magnification of the irradiation optical system 8 can be changed by switching the objective lens 9 by rotating the revolver mechanism. Hereinafter, unless otherwise specified, the objective lens 9 refers to a lens selected to constitute the irradiation optical system 43.

In the present embodiment, the optical axis P4 of the imaging lens 48 is arranged in parallel to the Y-axis direction, and the optical axis P5 of the objective lens 9 is arranged in parallel to the Z-axis direction.
Therefore, a mirror 49 is provided between the spatial modulation element 42 and the imaging lens 48 to reflect the ON light 62 and make it incident along the optical axis P4. Between the imaging lens 48 and the objective lens 9, there is provided a half mirror 51 that reflects the light transmitted through the imaging lens 48 and makes it incident along the optical axis P5.

  Thus, the optical axes P4 and P5 are located on the same plane as the optical axes P1, P2, and P3. That is, the optical axes P1 to P5 constituting the first optical axis that is reflected from the laser light source 7a by the on-state micromirror of the spatial modulation element 42 and reaches the substrate A through the irradiation optical system 43 are all located on the same plane. doing.

Further, both the mirror 49 and the half mirror 51 are inclined only around the X axis.
The observation light source 44 is a light source that generates observation light 70 for illuminating the processable area on the glass substrate A, and is provided on the side of the optical path between the half mirror 51 and the objective lens 9. Yes.

  On the optical path between the half mirror 51 and the objective lens 9, the ON light 62 reflected by the half mirror 51 is transmitted to a position facing the observation light source 44, and the observation light 70 is directed toward the objective lens 9. A reflecting half mirror 52 is provided. A condensing lens 53 is provided between the observation light source 44 and the half mirror 52 to collect the observation light 70 into an illumination light beam having an appropriate diameter. Note that the optical axis P6 of the condensing lens 53 may be on a plane on which the first optical axis is located or may be at a crossing position.

  As the observation light source 44, for example, an appropriate light source such as a xenon lamp or LED that generates visible light can be used. An autofocus unit having an autofocus light source may be provided to control the front focal position of the objective lens 9.

The observation imaging lens (imaging optical system) 45 is disposed on the upper side of the half mirror 51 and coaxially with the optical axis P5 of the objective lens 9, and is reflected from the glass substrate A illuminated by the observation light 70 to be objective. This is an optical element for forming an image of the light collected by the lens 9 on the imaging surface of the imaging element (imaging unit) 46. For this reason, the optical axis P5 also serves as the second optical axis from the substrate A through the imaging optical system to the imaging unit. Note that the image sensor 46 photoelectrically converts an image formed on the imaging surface, and includes, for example, a CCD.

  In the present embodiment, the control unit 22 is configured by a combination of a computer including a CPU, a memory, an input / output unit, an external storage device, and the like and appropriate hardware. The control unit 22 controls the operation of the defect correction apparatus 1 based on an operation input from a user interface including appropriate operation input means such as an operation panel, a keyboard, and a mouse. It is electrically connected to the modulation element 42 and the image pickup element 46 so that the operation and operation timing of each can be controlled.

  The control unit 22 sends a control signal for oscillating the laser beam to the laser oscillator 7a, and oscillates the laser beam from the laser oscillator 7a based on the irradiation condition preselected according to the substrate A. Examples of laser light irradiation conditions include wavelength, optical output, oscillation pulse width, and the like.

  The oscillated laser light is optically coupled to the fiber end surface 8a of the optical fiber 8 by the coupling lens 7b, and the divergent light whose light intensity distribution is made uniform from the fiber end surface 8b by the above-described mode scramblers 11 and 12 and the linear portion 8c. A laser beam 60 is emitted.

  In the present embodiment, the defect correction apparatus 1 that corrects a defect of the glass substrate A manufactured in the FPD manufacturing process has been described. However, the defect correction apparatus 1 is also used to correct a defect of a semiconductor wafer substrate. be able to. However, when the defect correcting apparatus 1 is used for correcting a defect of a semiconductor wafer substrate, it is necessary to prepare a mounting table or the like suitable for the semiconductor wafer substrate in place of the floating stage 2 and the suction transfer stage 3.

4A and 4B are schematic side views for explaining the laser light source 17 of the defect correction apparatus according to the modification of the embodiment of the present invention.
In FIGS. 4A and 4B, the movable directions of the coupling lens 17b, the half mirror 17c, and the mirror 17d are denoted by reference numerals in parentheses.

  The laser light source 17 of this modification includes a laser oscillator 17a, a coupling lens 17b, and a half mirror 17c and a mirror 17d as reflecting members. The difference from the laser light source 7 of the above-described embodiment is mainly that the mirror 17d is disposed and that the coupling lens 17b, the half mirror 17c, and the mirror 17d are movable. Similar to the embodiment, mode scramblers 11 and 12 are arranged in the optical fiber 8 and a straight portion 8c is formed.

  As shown in FIG. 4B, the laser beam emitted from the laser oscillator 17a in the negative X-axis direction is reflected in the positive Z-axis direction by the mirror 17d as shown in FIG. 4A, and further, in the negative Y-axis direction by the half mirror 17c. It is reflected and enters the coupling lens 17b. The half mirror 17c transmits light emitted from the LED light source 17e toward the coupling lens 7b in the negative Y-axis direction.

  Incidentally, when the micromirrors of the spatial modulation element 42 shown in FIG. 2 are arranged at an equal pitch and tilted in the same direction, they act as a diffraction grating on the laser beam P2. The laser beam 61 reflected by the mirror 47 is diffracted according to the wavelength and the arrangement pitch of the micromirrors of the spatial modulation element 42.

  Therefore, by adjusting the tilts of the projection optical system 41, the spatial modulation element 42, and the mirror 47 and guiding the diffracted light to the optical axis P4 of the imaging lens 48, laser light with high diffraction efficiency can be obtained.

  In this respect, the optical fiber 8 shown in FIGS. 4A and 4B of this modification is similar to the optical fiber 8 shown in FIGS. 3A and 3B of the above-described embodiment from the laser light source 7 to the projection optical system 41. In addition to the meandering and the formation of the straight portion 8c, no extra slack is drawn. Further, it is difficult to move the optical fiber 8 together with the laser light source 7 in accordance with the inclination of the projection optical system 41, and therefore the projection optical system 41 connected to the optical fiber 8 cannot be freely tilted.

  Therefore, the coupling lens 17b of this modification can be moved in the Y-axis direction (optical axis direction) independently of the half mirror 17c, the mirror 17d, and the laser oscillator 17a. In other words, the half mirror 17c, the mirror 17d, and the laser oscillator 17a. Can be adjusted, and the incident-side end face 8a of the optical fiber 8 can be allowed to move in the Y-axis direction as the inclination of the projection optical system 41 is adjusted.

  Further, the coupling lens 17b and the half mirror 17c can move integrally in the Z-axis direction that is the optical axis direction of the laser light reflected by the mirror 17d independently of the mirror 17d and the laser oscillator 17a, in other words, the mirror 17d. The relative position with respect to the laser oscillator 17a can be adjusted, and the incident-side end face 8a of the optical fiber 8 can be allowed to move in the Z-axis direction as the tilt of the projection optical system 41 is adjusted.

  Furthermore, the coupling lens 17b, the half mirror 17c, and the mirror 17d can be moved integrally in the Z-axis direction (the optical axis direction of the laser beam emitted from the laser oscillator 7a) independently of the laser oscillator 17a. The relative position with respect to the laser oscillator 17a can be adjusted, and the incident side end face 8a of the optical fiber 8 can be allowed to move in the X-axis direction in accordance with the inclination adjustment of the projection optical system 41.

  As described above, in the present modification, the coupling lens 17b is arranged so that the relative position with the laser oscillation unit 17a can be adjusted. Further, the coupling lens 17b and the reflecting member (half mirror 17c and mirror 17d) are arranged so that the relative position with respect to the laser oscillation unit 17a can be adjusted.

  Therefore, by appropriately moving the coupling lens 17b, the half mirror 17c, and the mirror 17d independently of the laser oscillation unit 17a, the movement of the incident side end face 8a of the optical fiber 8 in the three axis directions of the XYZ axes is allowed.

  Therefore, in this modification, the projection optical system 41 connected to the optical fiber 8 can be freely tilted. Therefore, by guiding the diffracted light to the optical axis P4 of the imaging lens 48, the diffraction efficiency is high. Laser light can be obtained.

It is a top view which shows the defect correction apparatus which concerns on one embodiment of this invention. It is a front view which shows the defect correction apparatus which concerns on one embodiment of this invention. It is a schematic block diagram for demonstrating the internal structure of the process head of the defect correction apparatus which concerns on one embodiment of this invention. It is a schematic side view for demonstrating the optical fiber and mode scrambler of the defect correction apparatus which concern on one embodiment of this invention. It is a schematic front view for demonstrating the optical fiber and mode scrambler of the defect correction apparatus which concern on one embodiment of this invention. It is a schematic side view for demonstrating the laser light source of the defect correction apparatus which concerns on the modification of one embodiment of this invention. It is a schematic front view for demonstrating the laser light source of the defect correction apparatus which concerns on the modification of one embodiment of this invention.

Explanation of symbols

A Glass substrate 1 Defect correction device 4 Gantry (movement mechanism)
DESCRIPTION OF SYMBOLS 5 Processing head 7 Laser light source 7a Laser oscillator 7b Coupled lens 7c Half mirror 7e LED light source 8 Optical fiber 8a Incident side end surface 8b Emission side end surface 8c Straight line part 10 Incident illumination light source 11,12 Mode scramblers 11a-11c, 12a-12c Screw 17 laser light source 17a laser oscillator 17b coupling lens 17c half mirror 17d mirror 17e LED light source 41 projection optical system 42 spatial modulation element 47 mirror

Claims (1)

In a defect correction apparatus comprising: a laser light source; an optical fiber connected to the laser light source; and a processing head that irradiates a substrate with laser light guided by the optical fiber.
A plurality of mode scramblers that meander the optical fibers in different directions;
A moving mechanism for integrally moving the laser light source, the optical fiber, the processing head, and the plurality of mode scramblers;
With
In the optical fiber, a linear portion extending in a straight line is formed at the end on the processing head side ,
The laser light source includes a laser oscillation unit that oscillates a laser beam, a coupling lens that couples the laser beam oscillated from the laser oscillation unit to an end of the optical fiber, and a laser beam oscillated from the oscillation unit. A reflecting member that reflects the coupling lens;
The coupling lens and the reflection member are arranged so that the relative position with the laser oscillation unit can be adjusted,
The coupling lens is disposed so that the relative position with the reflecting member can be adjusted.
A defect correction apparatus characterized by the above.