JP3485736B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin semiconductor device and its manufacturing method.

[0002]

2. Description of the Related Art Conventionally, in integrated circuit packages in which semiconductor elements such as semiconductor integrated circuits are packaged, there is an increasing demand for miniaturization and thinning. In particular, portable terminals and memories typified by electronic notebooks and the like. 0.5 to 2 mm in thickness when used for thin storage media such as cards
A very thin package structure is required.

In recent years, in order to meet such demands, for example, JP-A-63-33853 and JP-A-7-37.
A device such as that described in Japanese Patent No. 931 has been proposed, and in particular, an attempt has been made to use it as an integrated circuit package (hereinafter referred to as “IC card module”) for mounting it on an IC card. There is.

FIG. 10 is a perspective view of such a conventional semiconductor device, and FIG. 11 is a sectional view taken along the line AA of FIG.

As shown in these figures, the IC card module 1 is to be mounted on an IC card, and has a plurality of lead terminals 2 each having a connection portion 2a exposed to the outside, and a semiconductor element mounting plate. Element mounting portion 3 and semiconductor element 5 fixed to the element mounting portion 3 with an adhesive 4
And have. The semiconductor element 5 and the plurality of lead terminals 2 are connected by a wire 6 and are molded by a sealing resin 7 made of a resin such as epoxy.

Further, as shown in FIG. 12, particularly in a thin semiconductor device, a common wiring portion is connected by an anisotropic conductive sheet 14 without using a wire for connecting an element and a lead terminal. A proposal has been made for connection by using the No. 13, and it is particularly preferably used for a tape carrier type semiconductor device. In FIG. 12, 15 is a tape carrier and 16 is an external lead terminal.

[0007]

However, in the conventional semiconductor device shown in FIG. 10 and FIG. 11 described above, when the sealing resin 7 is molded by encapsulation, the resin is injected to the surface of the lead terminal 2 due to the injection pressure of the resin. Since it wraps around and becomes thin, which causes a problem in practical use, and because the wire 6 is used to connect the semiconductor element 5 and the lead terminal 2, it is difficult to reduce the thickness to a certain level or more. I couldn't get what I could.

Also, in the conventional technique shown in FIG. 12, in a limited field of the tape carrier 15, an anisotropic conductive sheet is used as a method for connecting an element and a lead terminal (a tape in the conventional technique). Only by using it, we could not expect a remarkable improvement as high-density mounting.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device which eliminates the above-mentioned problems, can be made thin, and can be easily mounted at a high density, and a manufacturing method thereof.

[0010]

In order to achieve the above object, the present invention provides: (1) In a method of manufacturing a semiconductor device, a step of attaching a semiconductor element to an adhesive tape; and a back surface side of the semiconductor element is sealed. A step of coating with a sealing resin and sealing and molding, a step of peeling the adhesive tape, and then attaching an anisotropic conductive sheet to the exposed semiconductor element surface side, and the anisotropic conductive sheet as a lead terminal. The process of thermocompression-bonding and fixing is performed.

(2) In the method of manufacturing a semiconductor device, a step of attaching a semiconductor element to an adhesive tape, a step of covering the back surface side of the semiconductor element with a sealing resin, and sealing-molding the step.
After peeling off the adhesive tape, a step of attaching an anisotropic conductive sheet to the exposed surface side of the semiconductor element and a step of thermocompression-bonding the anisotropic conductive sheet to a printed board are performed. is there.

(3) In the method of manufacturing a semiconductor device, a step of attaching a semiconductor element to an adhesive tape, a step of covering the back surface side of the semiconductor element with a sealing resin, and sealing-molding the step.
After peeling the adhesive tape, a step of attaching an anisotropic conductive sheet to the exposed surface of the semiconductor element, a step of thermocompression-bonding the anisotropic conductive sheet to a lead, and a tip of the lead to a printed board. And the step of mounting on.

(4) In a semiconductor device, a step of attaching a semiconductor element to an adhesive tape, a step of covering the back surface side of the semiconductor element with a sealing resin and sealing-molding, and a step of peeling the adhesive tape, A step of attaching an anisotropic conductive sheet to the exposed surface of the semiconductor element, a step of thermocompression-bonding the anisotropic conductive sheet to a lead, and a step of forming a bump on the lead Is.

(5) In a semiconductor device, a module formed by exposing a pad of a semiconductor element and molding with a sealing resin, an anisotropic conductive sheet attached to the pad, and a heat applied to the anisotropic conductive sheet. A connection member to be crimped and fixed is provided.

(6) In the semiconductor device described in (5), the connecting member is a lead terminal.

(7) In the semiconductor device described in (5) above, the connecting member is a printed board.

(8) In the semiconductor device described in (5) above, the connecting member is a printed board with leads interposed therebetween.

(9) In the semiconductor device described in (5) above, the connecting member is a bump via a lead.

(10) In the semiconductor device described in (8), the modules to be thermocompression-bonded and fixed to each other with the leads sandwiched therebetween are provided.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a manufacturing process diagram (1) of a semiconductor device showing a first embodiment of the present invention, and FIG. 2 is a manufacturing process diagram (2) of a semiconductor device showing a first embodiment of the present invention. FIG. 3 is a manufacturing process diagram (3) of the semiconductor device showing the first embodiment of the present invention.

(1) First, as shown in FIG. 1A, a semiconductor element 22 is prepared. Pads 23 are formed on the surface thereof.

(2) Next, as shown in FIG. 1B, the semiconductor element 22 is attached to the adhesive of the strip-shaped adhesive tape 21 so that the surface side on which the pad 23 is formed is turned down. As a material of the adhesive tape 21, a heat resistant tape such as polyimide is desirable in consideration of a heating process described later.

(3) Next, as shown in FIG. 1 (c), the adhesive tape 21 is sandwiched by a molding die 30 composed of an upper die 31 and a lower die 32 from above and below, and then sealed. A resin 24 is injected to cover the back surface of the semiconductor element 22 and sealing molding is performed.

(4) Then, as shown in FIG.
The semiconductor element 2 which has been removed from the molding die 30 and peeled off the adhesive tape 21 to complete the resin sealing.
A module 25 containing 2 is obtained.

(5) Next, as shown in FIG. 2A, the anisotropic conductive sheet 26 is provided on the front surface side of the module 25 having the semiconductor element 22 incorporated therein (the surface where the surface of the semiconductor element 22 is exposed). Correspond to.

(6) Next, as shown in FIG. 2B, an anisotropic conductive sheet 26 is attached to the module 25 and attached. The anisotropic conductive sheet 26 is a thin film material that has adhesiveness by thermocompression bonding or the like and is electrically conductive only in the front and back directions.

(7) Next, as shown in FIG. 2C, the semiconductor element 22 is built in at a predetermined position of the frame 27 on which the lead terminals 28 and the like are formed by using the above-mentioned thermocompression bonding method. The module 25 (see FIG. 2B) is fixed.

(8) In this way, as shown in FIGS. 3A and 3B, the module 25 is attached to the frame 27.
The one fixed at is obtained.

(9) Next, as shown in FIG. 3C, the lead terminal 28 [FIG.
[Reference] and cut into individual pieces.

(10) In this way, the IC card module is completed as shown in FIGS. 3 (d) and 3 (e).

As described above, the pads 23 formed on the surface of the semiconductor element 22 and the lead terminals 28 are electrically connected to each other through the anisotropic conductive sheet 26, and can function as an IC card module. .

As described above, according to the first embodiment, conventionally,
Plate-like parts (frames) with lead terminals and element mounting parts
A semiconductor element is directly mounted on the IC card module, and the IC card module obtained by sealing and molding after wiring connection with a wire is sealed and molded with resin after covering the element surface with an adhesive tape or the like. Since the tape is peeled off and then connected to the lead terminal via an anisotropic conductive sheet, there is no problem such as resin flash on the surface of the lead terminal, and the lead terminal is made of a sheet material much thinner than the wire loop. Since it is designed to be connected to, it is advantageous in reducing the thickness, and since the lead terminal does not need to be plated for wire bonding, a remarkable effect in terms of cost can be expected.

Next, a second embodiment of the present invention will be described.

FIG. 4 is a manufacturing process diagram of a semiconductor device showing a second embodiment of the present invention.

(1) First, as shown in FIG. 4A, a semiconductor element 41 is prepared. Pads 42 are formed on the surface thereof. Therefore, the state after the module is formed by covering the back surface of the semiconductor element 41 with the sealing resin 43 by using the adhesive tape and the molding die in the same manner as in the first embodiment and performing the sealing molding is shown. And then the first
Similar to the embodiment, the anisotropic conductive sheet 44 is made to correspond to the exposed surface of the semiconductor element 41.

(2) Next, as shown in FIG. 4B, the module 45 containing the semiconductor element 41 and the anisotropic conductive sheet 44 are attached together.

(3) Then, as shown in FIG.
The printed board 46 having a wiring pattern or the like on its surface is adhered and fixed to a predetermined position by a method such as thermocompression bonding, and the module
45 mounting is completed.

The module 45 containing the semiconductor element thus obtained has a pad 42 and a printed board 46 formed on the surface of the semiconductor element 41, as in the first embodiment.
Is electrically connected through the anisotropic conductive sheet 44, and can function as a semiconductor device.

As described above, according to the second embodiment, a semiconductor device (so-called CSP: Chip.
Because it is easy to get Scale / Package),
It is extremely advantageous when applied to a field where high-density mounting is required.

Also, compared with the case of so-called bare chip mounting, in which the semiconductor element is directly mounted on the printed board, in the present embodiment, the pads on the surface of the element do not need bumps for connection and the like, and the back surface of the element is Since it is covered and reinforced with a resin, it has many advantages such as an advantage in testing for checking electrical characteristics and confirmation of operation guarantee, and a great effect can be expected as a high-density mounting semiconductor device.

Next, a third embodiment of the present invention will be described.

FIG. 5 is a manufacturing process diagram of a semiconductor device showing a third embodiment of the present invention.

(1) First, as shown in FIG.
Reference numeral 1 is a module obtained by the same method as in the first and second embodiments described above, and an anisotropic conductive sheet 54 is attached to the front surface side in which the semiconductor element 52 is incorporated. The leads 55 are associated with the anisotropic conductive sheet 54. 5
Reference numeral 3 is a pad of the semiconductor element 52.

(2) Next, as shown in FIG. 5B, the module 51 and the lead 55 are aligned with each other and bonded and fixed by a technique such as thermocompression bonding.

(3) After that, as shown in FIG.
The tips of the leads 55 are inserted and mounted on the printed board 56 to complete the mounting of the module.

The module 51 containing the semiconductor element 52 thus obtained has the semiconductor element 52 and the lead 5
5 is electrically connected through the anisotropic conductive sheet 54 and is connected to the printed board 56 by the lead 55, and can function as a semiconductor device.

As described above, according to the third embodiment, it is possible to easily obtain a semiconductor device in which the mounting area on the printed board is extremely reduced.

Next, a fourth embodiment of the present invention will be described.

FIG. 6 is a manufacturing process diagram of a semiconductor device showing a fourth embodiment of the present invention.

(1) First, as shown in FIG. 6A, a module 61 incorporating a semiconductor element 62 obtained by the same method as in the above-mentioned first, second and third embodiments is prepared, An anisotropic conductive sheet 64 is attached to the front surface side in which the semiconductor element 62 is incorporated. On the side of the anisotropic conductive sheet 64, a lead 65 and a module 66 having another semiconductor element built therein are made to correspond. Incidentally, 63 is a pad of the semiconductor element.

(2) Next, as shown in FIG. 6B, the leads 65 are bonded and fixed to the anisotropic conductive sheet 64 of the module 61 by a method such as thermocompression bonding as in the third embodiment. .

Thereafter, another module 66 obtained by using a method similar to that of the third embodiment is formed on the opposite surface of the lead 65 so as to face the module 61 by thermocompression bonding as in the third embodiment. Adhesion is fixed using a method such as.

(3) Next, as shown in FIG. 6C, similarly to the third embodiment, the leads 65 are inserted and mounted in the printed board 67, and the mounting of the module is completed.

The modules 61 and 66 having the semiconductor element 62 thus obtained built therein are composed of a plurality of semiconductor elements 62.
Each of them is electrically connected to the lead 65 through the anisotropic conductive sheet 64, and is connected to the printed board 67 by the lead 65, and can function as a semiconductor device.

As described above, according to the fourth embodiment, it is possible to easily obtain a semiconductor device in which the mounting area on the printed board is extremely reduced and the functional capacity of the semiconductor element is increased. , Is effective in the field of memory modules and the like in which it is necessary to mount a large number of memory type semiconductor devices of a single specification.

Next explained is the fifth embodiment of the invention.

FIG. 7 is a manufacturing process drawing of a semiconductor device showing a fifth embodiment of the present invention.

In this embodiment, as shown in FIG. 7, the pads 73 on the semiconductor element 72 are arranged in the central portion of the element L. O. A case where a semiconductor element compatible with C (Lead-On-Chip) is mounted will be described.

(1) First, as shown in FIG. 7A, the semiconductor element 7 obtained by the same method as that of the other embodiments described above.
A module 71 containing 2 is prepared, pads 73 are centrally arranged corresponding to LOC in the central portion of the element surface, and an anisotropic conductive sheet 74 is attached. Then, like the other embodiments described above, the leads 75 are patterned so as to correspond to the pads 73.

(2) Next, as shown in FIG. 7B, the lead 75 is positioned on the pad 73 and bonded and fixed by a technique such as thermocompression bonding.

(3) Next, as shown in FIGS. 7 (c), 7 (d) and 7 (e), bumps 76 such as solder balls are formed to complete the mounting of the module.

As a sixth embodiment, as shown in FIG. 8, a module 81 having leads 82 in which a semiconductor element is incorporated.
It may be formed so as to project to the outside of, and a gull wing shape may be formed by bending.

Further, as a seventh embodiment, as shown in FIG. 9, an adhesive tape 91 is set in a roll shape, a semiconductor element 92 is attached on the adhesive tape 91, and an upper die 93 and a lower die are attached. If a process for forming a module 96 having the semiconductor element 92 therein and sending it to the transfer line 97 and directly mounting it on a lead or a printed board is performed, the productivity can be improved by consistently performing the molding by the molding die 95 including 94. Can be dramatically increased.

As described in detail above, according to the present invention, even if the connection pad is set at any position on the surface of the semiconductor element, it can be connected and conducted, and the conventional type using a wire for connection. It is possible to obtain an extremely thin semiconductor device as compared with the above.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the present invention, and these modifications are not excluded from the scope of the present invention.

[0067]

As described in detail above, according to the present invention, the following effects can be obtained.

(A) Regardless of the position of the connection pad set on the surface of the semiconductor element, connection and conduction are possible, and an extremely thin semiconductor device is obtained as compared with the conventional type using a wire for connection. It is possible.

(B) The element surface is covered with an adhesive tape or the like, and then sealing molding is performed with a resin, and after the tape is peeled off, it is connected to a lead terminal via an anisotropic conductive sheet. Therefore, there is no problem such as thin resin flash on the surface of the lead terminal, and the sheet-like material far thinner than the wire loop is used to obtain the connection with the lead terminal, which is also advantageous for thinning. Since the lead terminal does not need to be plated for wire bonding, it is advantageous in terms of cost.

(C) A semiconductor device having almost the same size as the semiconductor element (so-called CSP: Chip / Scale / Package).
Since e) can be easily obtained, it is extremely advantageous when applied to a field requiring high-density mounting.

Further, even when compared with the case of so-called bare chip mounting in which a semiconductor element is directly mounted on a printed board, a bump on the surface of the element for connection or the like is not required, and the back surface of the element is covered and reinforced with a resin. Therefore, it is advantageous in testing for checking electrical characteristics and confirming operation guarantee, and a high-density packaged semiconductor device can be obtained.

(D) It is possible to easily obtain a semiconductor device in which the mounting area on the printed board is extremely small.

(E) It is possible to easily obtain a semiconductor device in which the mounting area on the printed board is extremely reduced and the functional capacity of the semiconductor element is increased. This is effective in the field of memory modules and the like, which require mounting a large number of devices.

(F) It is possible to obtain a semiconductor device in which leads are extended to the outside of a module containing a semiconductor element.

(G) Since the module containing the semiconductor element is molded consistently, it is possible to dramatically improve the productivity.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram (1) of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a manufacturing process diagram (2) of the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is a manufacturing process diagram (3) of the semiconductor device according to the first embodiment of the present invention.

FIG. 4 is a manufacturing process diagram of a semiconductor device showing a second embodiment of the present invention.

FIG. 5 is a manufacturing process diagram of a semiconductor device showing a third embodiment of the present invention.

FIG. 6 is a manufacturing process diagram of a semiconductor device showing a fourth embodiment of the present invention.

FIG. 7 is a manufacturing process diagram of a semiconductor device showing a fifth embodiment of the invention.

FIG. 8 is a sectional view of a semiconductor device showing a sixth embodiment of the present invention.

FIG. 9 is a view showing a manufacturing process of the semiconductor device showing the seventh embodiment of the invention.

FIG. 10 is a perspective view of a conventional semiconductor device.

11 is a cross-sectional view taken along the line AA of FIG.

FIG. 12 is a configuration diagram of a conventional semiconductor device.

[Explanation of symbols]

21, 91 Adhesive tapes 22, 41, 52 , 62 , 72, 92 Semiconductor elements 23 , 42 , 53 , 63, 73 Pads 24, 43 Sealing resin 25, 45, 51 , 61 , 66 , 71 , 81 , 96
Modules 26, 44 , 54, 64, 74 with built-in semiconductor elements Anisotropic conductive sheet 27 Frame 28 Lead terminals 29 Punches 30, 95 Mold dies 31, 93 Upper dies 32, 94 Lower dies 46 , 56, 67 Printed boards 55, 65, 75, 82 Leads 76 Bumps 97 Transport line

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 23/50

Claims (10)

(57) [Claims] 1. A step of (a) attaching a semiconductor element to an adhesive tape, (b) a step of covering the back surface side of the semiconductor element with a sealing resin and sealing-molding, and (c) the adhesive tape. After peeling, the step of attaching an anisotropic conductive sheet to the exposed surface side of the semiconductor element, and the step of (d) thermocompression-bonding the anisotropic conductive sheet to a lead terminal are performed. Device manufacturing method. 2. A step of (a) attaching a semiconductor element to an adhesive tape, (b) a step of covering the back surface side of the semiconductor element with a sealing resin and sealing-molding, and (c) the adhesive tape. After being peeled off, a step of attaching an anisotropic conductive sheet to the exposed surface side of the semiconductor element and (d) a step of thermocompression-bonding the anisotropic conductive sheet to a printed board are performed. Device manufacturing method. 3. A step of (a) attaching a semiconductor element to an adhesive tape, (b) a step of covering the back surface side of the semiconductor element with a sealing resin and sealing-molding, and (c) the adhesive tape. After peeling, a step of attaching an anisotropic conductive sheet to the exposed surface of the semiconductor element, (d) a step of thermocompression-bonding the anisotropic conductive sheet to a lead, and (e) a tip of the lead And a step of mounting on a printed board. 4. A step of (a) attaching a semiconductor element to an adhesive tape, (b) a step of coating the back surface side of the semiconductor element with a sealing resin and sealing-molding, and (c) the adhesive tape. After peeling, a step of attaching an anisotropic conductive sheet to the exposed surface of the semiconductor element, (d) a step of thermocompression-bonding the anisotropic conductive sheet to a lead, and (e) a bump on the lead And a step of forming the semiconductor device. 5. (a) exposing the pad of the semiconductor element,
A module formed of a sealing resin; (b) an anisotropic conductive sheet attached to the pad; and (c) a connecting member thermocompression-bonded to the anisotropic conductive sheet. Semiconductor device. 6. The semiconductor device according to claim 5, wherein the connecting member is a lead terminal. 7. The semiconductor device according to claim 5, wherein the connecting member is a printed board. 8. The semiconductor device according to claim 5, wherein the connecting member is a printed board having a lead interposed therebetween. 9. The semiconductor device according to claim 5, wherein the connecting member is a bump via a lead. 10. The semiconductor device according to claim 8,
A semiconductor device comprising: the module, which is opposed by sandwiching the lead and is thermocompression-bonded and fixed.