JP3441176B2 - Curable resin composition - Google Patents

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a curable resin composition. More specifically, the present invention relates to a photosensitive resin composition useful as a liquid photosolder resist which is excellent in ultraviolet curability, compatibility and developability and which is capable of forming an image by exposure to ultraviolet rays and development with a dilute aqueous alkali solution after forming a film.

[0002]

2. Description of the Related Art In a printed wiring board, a solder resist resin is widely used as a permanent protective film for a circuit board. The solder resist is formed on the entire surface of the base circuit conductor except the portion to be soldered. Its main role is to prevent solder from adhering to unnecessary portions when soldering electronic components to a printed wiring board, and to prevent oxidation and corrosion of circuit conductors.

Conventionally, when a solder resist is formed on a printed wiring board, a thermosetting type resist ink is printed by a screen printing method, and the transfer portion is thermoset or UV-cured. However, the screen printing method has a problem that bleeding, bleeding, and sagging occur at the time of printing, and it cannot cope with the recent increase in the density of circuit boards.

Photographic methods have been developed to solve this problem. The photographic method is a method of forming a desired pattern by exposing through a film on which a pattern is formed and then developing.

Photographic solder resists, that is, photo solder resists, are morphologically classified into a dry film type and a liquid type. In the case of the dry film type, bubbles are likely to be generated during thermocompression bonding, and there is concern about heat resistance and adhesion, which is expensive. Therefore, the liquid type is the mainstream.

Organic solvents have conventionally been used in the development of liquid photosolder resist inks. However, in recent years, due to the problem of environmental pollution, there is a tendency to shift to a type capable of developing with a dilute alkaline aqueous solution.

Such resist ink is disclosed in Japanese Patent Laid-Open No.
A compound obtained by adding a polybasic acid anhydride to a reaction product of a novolac type epoxy compound and an unsaturated monocarboxylic acid as described in JP-A 1-243869 is used as a main component. The solder resist ink obtained by using this compound as a main component has excellent heat resistance and is still widely used today.

However, the ink using the above compound is
There is a problem that it becomes sticky at the end of predrying for removing the solvent. If the preliminary drying condition is strengthened to solve this problem, the ink is cured by heat and the developability deteriorates after exposure. In addition, the novolac skeleton is difficult to modify, and cannot meet the demands for ink characteristics corresponding to various substrate circuits.

Japanese Unexamined Patent Publication (Kokai) No. 1-139619 discloses a resist ink containing a compound obtained by the addition reaction of glycidyl (meth) acrylate to a high acid value acrylic resin as a main component. Since this compound has an acrylic skeleton, the main chain can be freely modified and the preliminary drying property is also excellent. However, basic physical properties such as curability and developability of the ink have not been satisfactory.
Another problem is that it is difficult to control the reaction between the carboxyl group and the epoxy group, and thickening or gelation during the reaction easily occurs.

In order to solve these problems, Japanese Patent Laid-Open No.
JP-A-289820 discloses a curable resin composition prepared by adding a compound obtained by adding an alicyclic epoxy group-containing (meth) acrylate to a high acid value acrylic resin instead of glycidyl (meth) acrylate. Has been done.

[0011]

However, when the above composition is used in an alkali developable solder resist ink, the alkali developability of the ink is extremely poor because the alkali solubility of the above compound is insufficient. Become. Further, since it has an alicyclic structure, it has a poor compatibility with other additives such as a diluting monomer / oligomer, an epoxy compound, and an inorganic filler, and there is a problem that an ink component is separated during storage. .

[0012]

Means for Solving the Problems In the present invention, as a result of intensive studies to solve the above problems, a vinyl copolymer containing (meth) acrylic acid and a lactone-modified hydroxyalkyl (meth) acrylate as essential components. The curable resin composition obtained by blending an unsaturated group-containing resin obtained by adding a compound having an alicyclic epoxy group and a (meth) acrylic group simultaneously in the molecule to a part of the carboxyl group of The present invention has been completed and the present invention has been completed.

That is, the present invention provides "the following general formula (I) [Wherein R ¹ represents a hydrogen atom or a methyl group], and a compound represented by the following general formula (II) <Wherein R ¹ is a hydrogen atom or a methyl group, R ^{2 is the same as above.}
Is an alkylene group having 2 to 6 carbon atoms, R ³ is ³ to 1 carbon atoms
0 alkylene group, n represents an integer of 1 to 10> is a part of the carboxyl group of the vinyl copolymer, and the following general formula (III)

[Chemical 2] (III) <wherein R ¹ is a hydrogen atom or a methyl group, R ^{4 is the same as above.}
Represents an alkylene group having 1 to 20 carbon atoms>, and an unsaturated group-containing resin obtained by adding a compound having an alicyclic epoxy group and a (meth) acryl group at the same time in the molecule is an essential component. As a curable resin composition ”.

First, the unsaturated group-containing resin used in the present invention will be described.

The unsaturated group-containing resin of the present invention is obtained by adding a compound having an alicyclic epoxy group and a (meth) acryl group at the same time in a molecule to a vinyl copolymer having a carboxyl group.

The vinyl copolymer of the present invention comprises a (meth) acrylic acid represented by the general formula (I) and a lactone-modified hydroxyalkyl (meth) acrylate represented by the general formula (II),
Further, it can be obtained by copolymerizing other ethylenically unsaturated monomers, if necessary.

Examples of the lactone-modified hydroxyalkyl (meth) acrylate represented by the general formula (II) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and (meth) acrylic acid 2 -Hydroxybutyl, hydroxyalkyl (meth) acrylate such as 2-hydroxypentyl (meth) acrylate is converted into δ-valerolactone, β-methyl-δ-valerolactone, ε-caprolactone, 3,3,5-trimethylcaprolactone, Examples thereof include compounds modified with 3,5,5-trimethylcaprolactone. Of these, 2-hydroxyethyl caprolactone-modified (meth) acrylate is most preferably used from the viewpoints of physical properties such as developability and compatibility, and availability.

Other ethylenically unsaturated monomers include, for example, alkyl acrylates such as methyl acrylate, ethyl acrylate, isopropyl acrylate, n-butyl acrylate and 2-ethylhexyl acrylate, methyl methacrylate, Ethyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, methacrylic acid alkyl esters such as lauryl methacrylate, glycidyl acrylate, glycidyl methacrylate, allyllo Nitrile, methacrylonitrile, acrylamide, methacrylamide,
Aminoalkyl methacrylates such as aminomethyl methacrylate, N-methylaminomethyl methacrylate and N, N-dimethylaminomethyl methacrylate, acrylic acid such as N-methylaminomethyl acrylate and N, N-dimethylaminoethyl acrylate Examples thereof include styrene-based monomers such as aminoalkyl, styrene, vinyltoluene and α-methylstyrene, and vinyl acetate.

In some cases, a monoethylenically unsaturated monomer having a hydroxyl group can be used. Examples of these monomers include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate,
Examples thereof include hydroxyalkyl (meth) acrylates such as 2-hydroxypentyl (meth) acrylate.

The mixing ratio of (meth) acrylic acid in the vinyl copolymer can be freely determined depending on the amount of double bonds introduced into the unsaturated group-containing resin and the desired acid value.
The acid value of the vinyl copolymer is preferably 50 to 650, particularly preferably 200 to 530. When the acid value of the vinyl copolymer is less than 50, the amount of the above chemical formula 3 that can be added to the vinyl copolymer is small, and satisfactory properties as a curable resin cannot be obtained. If it is higher than 650, usable solvents are limited.

The acid value of the unsaturated group-containing resin is 10 to 3
00, preferably 20 to 200. When the acid value is 10 or less, the developability with a dilute alkali is insufficient. Conversely, the acid value is 3
If it exceeds 00, the water resistance, electric properties and humidifying properties of the coating film after curing deteriorate.

In the present invention, by using the compound represented by the above general formula (II), the developability and the compatibility with additives can be improved. The above general formula
The compounding ratio of the compound represented by (II) is such that the unsaturated group-containing resin obtained by adding the compound represented by the general formula (III) to the vinyl copolymer has a hydroxyl value of 1 to 200, preferably 3
Determine to be ~ 100. If the hydroxyl value of the unsaturated group-containing resin is less than 1, that is, if the compounding ratio of the compound represented by the general formula (II) is too small, the developability and compatibility are not sufficiently improved. On the other hand, when the hydroxyl value is more than 200, that is, when the compounding ratio of the compound represented by the general formula (II) is too large, the cured coating film has poor moisture resistance and water resistance. Examples of the compound having the alicyclic epoxy group and the (meth) acrylic group represented by the general formula (III) used in the present invention include, for example, 3,4-epoxycyclohexylmethyl (meth) acrylate and , 4-epoxycyclohexylethyl (meth) acrylate, 3,4-epoxycyclohexylbutyl (meth) acrylate and the like. These may be used alone or in combination.
Among these, 3,4-epoxycyclohexylmethyl (meth) acrylate is most preferable from the viewpoint of curability.

In addition to the above-mentioned compounds having an alicyclic epoxy group and a (meth) acrylic group at the same time, aliphatic epoxies such as glycidyl (meth) acrylate, β-methylglycidyl (meth) acrylate, allyl glycidyl ether, etc. The group-containing unsaturated compound can be used in the range of 80% by weight or less based on the alicyclic epoxy compound. If the proportion of the unsaturated compound containing an aliphatic epoxy group exceeds 80% by weight, the resulting unsaturated group-containing resin has poor hydrolysis resistance.

The amount of double bond in the obtained unsaturated group-containing resin is 1.0 mol to 3.5 mol per 1 kg of the resin.
It is determined so as to be mol, preferably 1.5 mol to 3.0 mol. If the amount of double bonds is less than 1.0 mol, sufficient curability cannot be obtained. On the contrary, when the amount of double bonds is more than 3.5 mol, storage stability may be deteriorated.

The number average molecular weight of the unsaturated group-containing resin is 10
00-50000, especially 3000-30000 are preferable. When the number average molecular weight is 1000 or less, heat resistance and coating film strength deteriorate. On the other hand, when it exceeds 50,000, workability and solubility in a solvent are deteriorated.

Next, the reaction for obtaining such an unsaturated group-containing resin will be described.

The unsaturated group-containing resin of the present invention is obtained by ring-opening addition of an alicyclic epoxy compound having a (meth) acrylic group to a vinyl copolymer containing (meth) acrylic acid.

The method for synthesizing the vinyl copolymer is not particularly limited as long as the resin as described above can be obtained, but polymerization in a suitable reaction solvent (solution polymerization) from the viewpoint of ease of reaction.
Is preferred. In solution polymerization, for example, a solvent and a polymerization initiator are mixed in a reactor, heated to 50 to 150 ° C., and then a monomer,
The polymerization initiator mixture is added dropwise over 2 to 5 hours and aged for 2 to 10 hours.

The solvent is not particularly limited as long as it dissolves the monomer and the vinyl copolymer, and for example, benzene,
Toluene, aromatic hydrocarbons such as xylene, alcohols such as methanol, ethanol and 2-propanol, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, ethers such as diethyl ether, dibutyl ether and dioxane, ethyl acetate, Isobutyl acetate, ethylene glycol monoacetate, propylene glycol monoacetate, dipropylene glycol monoacetate and other esters, ethylene glycol monoalkyl ethers, diethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, etc. Diethylene glycol dialkyl ethers, ethylene glycol monoalkyl ether Ether acetates, diethylene glycol monoalkyl ether acetates, dimethyl formamide, amides such as dimethylacetamide, carbon tetrachloride, halogenated hydrocarbons such as chloroform can be used. These solvents may be used alone or as a mixture. As the polymerization initiator, an ordinary radical polymerization initiator can be used, and examples thereof include 2,2′-azobisisobutyronitrile and 2,2′-azobis-
Azo series such as (2,4-dimethylvaleronitrile), lauroyl peroxide, di-t-butyl peroxide, bis (4-t-butylcyclohexyl) peroxydicarbonate, t-butylperoxy (2-ethylhexa) Noate), methyl ethyl ketone peroxide,
Peroxides such as benzoyl peroxide and cumene hydroperoxide are used alone or in combination.

The molecular weight of the vinyl copolymer is determined by the synthesis temperature, the amount and kind of the initiator used, the dropping rate of the monomer and the polymerization initiator, the kind and the amount of the solvent, and the like. Regarding the molecular weight of the vinyl copolymer, it is synthesized so that the number average molecular weight of the desired unsaturated group-containing resin is 1,000 to 50,000.

The desired unsaturated group-containing resin is obtained by ring-opening addition of an alicyclic epoxy compound having a (meth) acryl group to the carboxyl group of such a vinyl copolymer. The ring-opening addition of epoxy is performed at 50 to 150 ° C. by mixing a base polymer, an epoxy compound, a solvent, a ring-opening addition catalyst, and a polymerization inhibitor in some cases. If the temperature is 50 ° C. or lower, the reaction takes time and the productivity is deteriorated. At 150 ° C or higher, gelation is likely to occur during the reaction.

The ring-opening addition reaction of such an alicyclic epoxy compound having a (meth) acrylic group is preferably carried out in the presence of a molecular oxygen-containing gas in order to prevent gelation. Air is usually used as the molecular oxygen-containing gas,
It is blown into the reactor.

As a catalyst for promoting the ring-opening addition of an epoxy group to a carboxyl group, dimethylbenzylamine,
Tertiary amines such as triethylamine, tetramethylethylenediamine, tri-n-octylamine, quaternary ammonium salts such as tetramethylammonium chloride, tetramethylammonium bromide, tetrabutylammonium bromide, alkylureas such as tetramethylurea, tetramethylguanidine Such as alkyl guanidine can be mentioned. The above catalysts may be used alone or in combination. These catalysts are contained in an amount of 0.01 to 10% by weight based on the epoxy compound,
It is preferable to use 0.5 to 3.0% by weight. If it is less than 0.01% by weight, the catalytic effect is low and it is not necessary to add more than 10% by weight.

In the curable resin composition used in the present invention, in addition to the unsaturated group-containing resin, a conventionally known epoxy compound, polymerizable vinyl monomer and / or polymerizable compound may be appropriately used depending on the application and required performance. A prepolymer or the like can be added.

Examples of the epoxy compound include bisphenol A type epoxy resin, bisphenol S type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, N-glycidyl type epoxy resin, and alicyclic epoxy. Resin is chosen. These epoxy resins may be used alone or in combination. These epoxy compounds are added in a necessary amount, for example, 0 to 100 parts based on the unsaturated group-containing resin. The amount of epoxy compound is 100
When the amount is larger than the amount, the characteristics of the unsaturated group-containing resin are reduced.

The polymerizable vinyl monomer is a compound having a radical-polymerizable double bond represented by an acrylic acid ester or methacrylic acid ester compound, a vinyl aromatic compound such as styrene, an amide unsaturated compound, and the like.

Typical acrylic acid ester or methacrylic acid ester is as follows. Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth)
A hydroxyl group such as (meth) acrylic acid alkyl ester such as acrylate, 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, or caprocactone-modified 2-hydroxyethyl (meth) acrylate is used. Having (meth) acrylic acid esters, methoxydiethylene glycol (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, isooctyloxydiethylene glycol (meth) acrylate, phenoxytriethylene glycol (meth) acrylate,
(Meth) acrylates such as methoxytriethylene glycol (meth) acrylate and methoxypolyethylene glycol # 400- (meth) acrylate;
Bifunctional (meth) acrylic acid esters such as 6-hexanediol di (meth) acrylate and neopentyl glycol di (meth) acrylate, trifunctional (meth) acrylic acid esters such as trimethylolpropane tri (meth) acrylate Etc. are used.

Examples of the polymerizable prepolymer include (meth) acrylic acid esters of polyester polyol,
Examples thereof include (meth) acrylic acid esters of polyether polyols, adducts of polyepoxy with (meth) acrylic acid, and resins obtained by introducing hydroxy (meth) acrylate into polyol through polyisocyanate.

The above-mentioned polymerizable monomer and prepolymer are contained in an amount necessary for the unsaturated group-containing resin, for example, 0 to 1
It can be blended in an amount of 00 parts by weight, preferably 0 to 50 parts by weight. When the amount of the polymerizable monomer and the prepolymer is more than 100 parts, the characteristics of the unsaturated group-containing resin are reduced.

The curable resin composition of the present invention also becomes a photocurable resin composition when combined with a suitable photoinitiator.

Examples of the photoinitiator include benzophenone, acetophenone benzyl, benzyl dimethyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether,
Examples thereof include dimethoxyacetophenone, dimethoxyphenylacetophenone, diethoxyacetophenone and diphenyldisulfite. These photoinitiators are synergists for enhancing the conversion of light absorbed energy into polymerization initiating free radicals,
For example, tertiary amines can also be included.

When the curable resin composition of the present invention is cured by electron beam irradiation, it is not always necessary to add an initiator.

The resin composition of the present invention may further contain a thermal polymerization inhibitor, a surfactant, an ultraviolet absorber, a thixotropic agent, a dye and a pigment as other additives as required. Further, a thermoplastic resin, a thermosetting resin or the like can be blended.

The composition of the present invention can be cured by applying it as a thin film on a substrate. As a method for forming a thin film, spraying, brushing, roll coating, curtain coating, electrodeposition coating, electrostatic coating, etc. are used. The curing is preferably carried out in an inert gas atmosphere, but it can also be carried out in an air atmosphere.
The curable resin composition according to the present invention is used in various coating fields such as ink, plastic paint, paper printing, film coating, and furniture coating, FRP, lining, and also in the field of electronics such as insulating varnish, insulating sheet, laminated plate, print substrate, It can be applied to many industrial fields such as resist ink and semiconductor encapsulant.

[0045]

The present invention will be described in more detail with reference to the following examples. However, the present invention is not limited to this embodiment.

<Synthesis Example 1 of Resin Containing Unsaturated Group> Stirrer,
In a 2 liter separable flask equipped with a thermometer, a reflux condenser, a dropping funnel and a nitrogen inlet tube, 900 g of diethylene glycol dimethyl ether and t-butylperoxy 2-ethylhexanoate [Perbutyl O produced by NOF CORPORATION] After charging 21.4 g and heating to 90 ° C., 309.9 g of methacrylic acid, 116.4 g of methyl methacrylate, lactone-modified 2-hydroxyethyl methacrylate [compound represented by the general formula (II) / Placcel manufactured by Daicel Chemical Industries, Ltd.] FM1] 109.8 g was added dropwise to diethylene glycol dimethyl ether over 3 hours together with 21.4 g of bis (4-t-butylcyclohexyl) peroxydicarbonate [Perloyl TCP manufactured by NOF CORPORATION],
By further aging for 6 hours, a vinyl copolymer solution having a carboxyl group was obtained. The reaction was carried out under N ₂ flow.

Next, an acrylic acid ester of epoxycyclohexanemethanol [general formula (II
Compound represented by I) / Cyclomer A200 manufactured by Daicel Chemical Industries, Ltd.] 363.9 g, dimethylbenzylamine 3.6
g and 1.80 g of hydroquinone monomethyl ether were added, the temperature was raised to 100 ° C., and the ring-opening addition reaction of the epoxy was carried out by stirring.

The reaction was carried out under a stream of air. 16 hours later,
Acid value 57.9, viscosity at 25 ℃ 9200 cp, solid content concentration 53.8
%, Unsaturated group 2.22 mol per 1 kg of resin, and an unsaturated group-containing resin solution having a number average molecular weight of 7300 (converted to styrene) was obtained (referred to as resin A).

<Synthesis Example 2 of Resin Containing Unsaturated Group> Synthesis Example 1
1050 g of dipropylene glycol monomethyl ether and t-butyl peroxy 2-ethylhexanoate [Perbutyl O manufactured by NOF CORPORATION] 16.7
After charging g, heating to 90 ° C, methacrylic acid 273.2 g,
58.4 g of methyl methacrylate and 85.4 g of lactone-modified 2-hydroxyethylmethacrylate [Placcel FM1 manufactured by Daicel Chemical Industries, Ltd.] are used as azobiz dimethyl valeronitrile [ABN-V manufactured by Nippon Hydrazine Industry Co., Ltd.] 16.
The solution was added dropwise to dipropylene glycol monomethyl ether together with 7 g over 3 hours, and aged for 6 hours to obtain a vinyl copolymer solution having a carboxyl group. The reaction was carried out under N ₂ flow.

Next, 283.8 g of an acrylic acid ester of epoxycyclohexanemethanol [Cyclomer A200 manufactured by Daicel Chemical Industries, Ltd.], 2.8 g of triphenylphosphine, and 1.75 g of hydroquinone monomethyl ether were added to the vinyl copolymer solution, and the temperature was raised to 100 ° C. The ring-opening addition reaction of the epoxy was carried out by warming and stirring. The reaction was carried out under a stream of air. After 13 hours, an unsaturated group-containing resin solution having an acid value of 62.1, a viscosity at 25 ° C of 5300 cp, a solid content concentration of 42.1%, an unsaturated group of 2.25 mol per 1 kg of a resin, and a number average molecular weight of 7600 (converted to styrene) was obtained. (Referred to as Resin B).

<Synthesis Example 3 of Resin Containing Unsaturated Group> Synthesis example 2
Was synthesized in the same manner except that methyl methacrylate was changed to butyl methacrylate (referred to as resin C).

<Synthesis Example 4 of Resin Containing Unsaturated Group> Synthesis Example 2
Epoxy cyclohexane methanol acrylic acid ester of epoxy cyclohexane methanol methacrylic acid ester [manufactured by Daicel Chemical Industries, Ltd. Cyclomer M10
0] was synthesized in the same manner except that the amount was changed to 305.6 g (referred to as resin D).

<Synthesis Example 5 of Resin Containing Unsaturated Group] Synthesis Example 1
Was synthesized in the same manner except that the lactone-modified 2-hydroxyethyl methacrylate of was changed to 2-ethylhexyl methacrylate (referred to as resin E). <Synthesis Example 6 of Resin Containing Unsaturated Group> Synthesis was carried out in the same manner as in Synthesis Example 2 except that the acrylic ester of epoxycyclohexanemethanol was changed to 221.4 g of glycidyl methacrylate (referred to as Resin F).

Example 1 Resin A 100 parts by weight (solid content), trimethylolpropane triacrylate 20 parts by weight Epoxy equivalent 220 cresol novolac type epoxy resin [Epicoat 180S7 manufactured by Yuka Shell Epoxy Co., Ltd.]
0] 20 parts by weight, benzyl methyl ketal 7 parts by weight, diethylthioxanthone 2 parts by weight, phthalocyanine green 1.5 parts by weight, silica 5 parts by weight, barium sulfate 20 parts by weight, dicyandiamide 5 parts by weight, and then kneading with a three-roll mill. Then, a viscous ink composition was obtained.

<Examples 2 to 4> For resins B to D, viscous inks were obtained in the same manner as in Example 1.

<Comparative Examples 1 and 2> With respect to the resins E and F, viscous inks were obtained in the same manner as in Example 1.

The above Examples 1-4 and Comparative Examples 1-2
The ink obtained in step 1) is applied onto a patterned substrate using a bar coater to a thickness of 20 to 30 μm,
It was dried for 20 minutes by a blast dryer at ℃. Then, a negative film was brought into close contact with the film and irradiated with a light amount of 800 mJ / cm ² . Further, the coating film obtained by developing with a 1% sodium carbonate aqueous solution is
A solder resist film was obtained by curing in a 50 ° C. blower oven for 30 minutes.

With respect to the inks of Examples 1 to 4 and Comparative Examples 1 and 2, the state of the ink after standing at room temperature for 1 month, the tackiness after drying, the developability, the sensitivity, the adhesion, and the solder heat resistance were evaluated. The results are shown in Table 1.

Table 1 Examples Comparative Example 1 2 3 4 1 2 Ink condition after 1 month ○ ○ ○ ○ × ○ Tack property ○ ○ ○ ○ ○ △ Developability ○ ◎ ◎ ○ × ○ Sensitivity 9 9 9 7 6 4 [Step tablet step number] Adhesion ○ ○ ○ ○ ○ ○ Solder heat resistance ○ ○ ○ ○ ○ ○ [260 ° C × 20 seconds] Hydrolysis resistance ○ ○ ○ ○ ○ × The above characteristic evaluation was performed under the following conditions.

Ink condition after 1 month The obtained ink was left at room temperature for 1 month and evaluated according to the following criteria.

O: Almost no ink separation was observed. X: Ink separated Tackiness After completion of drying, tackiness by touch with a finger was examined and evaluated according to the following criteria.

◯: No tack. Δ: Some tack. X: Tack developability. The developability with 1% sodium carbonate was evaluated according to the following criteria.

⊚: Developable within 15 seconds ◯: Developable within 15 to 20 seconds Δ: Developable within 20 to 30 seconds ×: Required for 30 seconds or more Required sensitivity Evaluation was carried out using a Kodak 14-step tablet.

Adhesion The obtained resist coating film was subjected to a peeling test using cellophane tape according to JIS D 0202.

○: 100/100 Δ: 50/100 to 99/100 ×: 0/100 to 49/100 Soldering heat resistance The state of the coating film after being immersed in a solder bath at 260 ° C for 20 seconds was visually judged.

◯: No abnormality in the coating film Δ: Swelling and slight peeling observed in the coating film X: Swelling and peeling observed in the coating film Hydrolysis resistance Immersion in hot water at 40 ° C. for 240 hours Then, the state of the coating film was visually determined.

◯: No change at all Δ: Slight loss of coating gloss X: Loss of gloss As can be seen from the results, the inks of Examples have ink compatibility, developability and hydrolysis resistance. It can be seen that it has excellent properties. (Below margin)

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields investigated (Int.Cl. ⁷ , DB name) C08F 290/00-290/14 C08F 299/00-299/08 C08F 8/14

Claims (5)

(57) [Claims] 1. The following general formula (I) [Wherein R ¹ represents a hydrogen atom or a methyl group], and a compound represented by the following general formula (II) <Wherein R ¹ is a hydrogen atom or a methyl group, R ^{2 is the same as above.}
Is an alkylene group having 2 to 6 carbon atoms, R ³ is ³ to 1 carbon atoms
The number of alkylene groups is 0, and n is an integer of 1 to 10> and a part of the carboxyl group of the vinyl copolymer is a general formula (III) (III) <wherein R ¹ is a hydrogen atom or a methyl group, R ^{4 is the same as above.}
Represents an alkylene group having 1 to 20 carbon atoms>, and an unsaturated group-containing resin obtained by adding a compound having an alicyclic epoxy group and a (meth) acryl group at the same time in the molecule is an essential component. A curable resin composition comprising: 2. The number average molecular weight of the unsaturated group-containing resin is 1,
The curable resin composition according to claim 1, which is 000 to 50,000. 3. The acid value of the unsaturated group-containing resin is 10 to 200.
(The same applies to the following KOH mg / g) The curable resin composition according to claim 1. 4. The hydroxyl value of the unsaturated group-containing resin is 1 to 200.
(The same applies to the following KOH mg / g) The curable resin composition according to claim 1. 5. The curable resin composition according to claim 1, wherein the unsaturated group-containing resin has 1.0 to 3.5 mol of double bonds per 1 kg of resin.