JP2602612Y2 - Power supply - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply device such as an AC-DC converter or a DC-DC converter, and more specifically, a substrate on which electronic components are mounted is housed in a resin case. And a structure in which an electronic component is fixed by a sealing resin.

[0002]

2. Description of the Related Art A power supply device in which electronic components such as a semiconductor, a transformer, a capacitor, and a resistor are mounted on a substrate and the substrate is housed in a resin case,
Conventionally, in order to efficiently radiate the heat generated from each electronic component, a resin such as soft epoxy, silicon, or urethane, which has a higher thermal conductivity than air, is injected into the case, and the heat generated from the electronic component is reduced. Is radiated from the outer peripheral surface of the case using the resin as a medium.

However, in the conventional power supply device, the resin is injected almost entirely inside the case.
There has been a problem that the amount of injected resin is increased, which leads to an increase in cost and weight. When using electronic components which must not be sealed, such as an electrolytic capacitor with an explosion-proof valve (since the valve will not work properly if sealed with resin), for example, the electrolytic capacitor may be stored in a separate case. A structure for preventing sealing, such as a double structure, is required, and the number of parts is increased, and the structure is complicated, so that the cost is increased. Showa 60-1242
In No. 89, the inside of the case opened vertically
Separate a separate room with only the bottom open in the case
Board that is formed integrally with
A control device consisting of
An adjustment device for control was installed in the part except the shop
Things are disclosed. But with this structure, the whole room
The resin is filled, so the amount of resin increases and the substrate
The board is removed after the resin is cured.
Without it, parts cannot be replaced. Also, when filling resin
From the hole for passing the lead wire between the partition and the bottom of the case
Resin may leak. In addition, actual opening 60-166
No. 290 divides the case into two areas by partitions,
A board with electronic components mounted on a slit provided in the partition
Fits and attaches to one area defined by a partition
Fills the resin with the substrate and fills the other area with the resin
A structure having no structure is disclosed. And this structure
When realizing the structure, the spacer of soft material is used for the slit.
To prevent the resin from leaking. But with this structure
As in the case described above, the amount of resin increases, and
Exchange of goods is not possible. Also, parts to prevent leakage
Is also required, and the number of parts increases.

[0004] In view of the above circumstances, the present invention can reduce the amount of resin to be injected and filled to reduce cost and weight.
It can also be associated with a simple structure when using electronic components that must not be sealed, Hakare the cost, further tree
It is an object of the present invention to provide a power supply device capable of exchanging electronic components without fear of oil leakage .

[0005]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention divides a single-sided power supply case into a plurality of regions by a partition lower than the opening, and is divided by the partition. the resin was injected into one area, tower electronic components
Place the mounted substrate on the opening side of the case and the partition
Mounted on Ri, the electronic parts requiring mounted on heat dissipation to the substrate, partitioned and the resin by the partition is a partition
So that it is filled to a depth of less than the height of the
The semiconductor device is characterized by being embedded in a resin, and the other region is a non-injection region of the resin, and an electronic component which does not require relatively heat radiation is arranged in the non-injection region.

[0006]

In the power supply device of the present invention, the heat of the electronic components requiring heat radiation is radiated from the injected resin to the case. Since the injected resin is injected into the case only for electronic components requiring heat radiation, the amount of injected resin is reduced.

[0007]

FIG. 1 is an exploded perspective view of an embodiment of a power supply device according to the present invention, FIG. 2A is a side sectional view of the embodiment, and FIG. 2B is a sectional view taken along line EE of FIG. 2A. FIG. In FIG. 1, reference numeral 1 denotes a resin case having an opening on one side .
The inside of the case is divided into two by a partition 1a lower than the opening.
Is divided into two areas . Reference numeral 2 denotes a resin lid, and reference numeral 3 denotes a board on which electronic components 5a to 5c are mounted. A resin 4 such as soft epoxy, silicon, or urethane is injected into one of the divided areas 1b of the case 1. The other area 1
c is a region where the resin is not injected.

As shown in FIGS. 1 and 2A, semiconductor components such as transistors and diodes or electronic components 5a and 5b requiring heat radiation such as transformers are made of the resin 4a.
Is mounted on the substrate 3 so as to enter the region 1b into which
Electronic components 5d and 5e that do not require relatively heat radiation, such as capacitors, fuses, and inductors, and electronic components that must not be sealed, such as an electrolytic capacitor 5c with an explosion-proof valve, enter the region 1c where the resin 4 is not injected. Mounted on the substrate 3 as described above. The board 3 on which the electronic components 5a to 5e are mounted is placed on the convex portion 1i formed on the inner wall of the case 1, and the board 3 is fitted to the case 1 above the partition 1a and assembled. As shown in FIGS. 2A and 2B, the electronic component 5
When a and 5b are embedded in the resin 4, the level of the resin 4 is
It rises only by the volume in which the electronic components 5a and 5b are embedded.
Even if the resin level rises, the level of the resin 4 remains at the partition 1a.
The filling amount of the resin is set in advance so as not to exceed the value.
That is, the electronic components 5a and 5b are separated by the partition 1a.
Is filled and the resin 4 is filled to a depth less than the height of the partition 1a.
Is buried in the resin 4 thus formed. The lid 2 is attached to the case 1 by passing the external connection terminals 3a of the substrate 3 through the holes 2a formed in the lid 2 and the holes 2 formed in the four corners of the lid 2.
This is carried out by fitting b to the convex portions 1d at the four corners of the case 1 and elastically fitting the claw portions 2c of the lid 2 into the holes 1e formed on the side surfaces of the case 1. A convex portion 2d formed on the outer peripheral portion of the lid 2 so as to protrude outward is fitted into a concave portion 1f formed in the opening of the case 1 to reduce the play between the lid 2 and the case 1. In addition, by making the positions where the concave portions 1f and the convex portions 2d are formed asymmetrical positions, it is possible to prevent a mistake in the mounting direction of the lid 2.

Further, as shown in FIG. 2B, in the electronic component 5a (or 5b) requiring heat radiation, at least a heat-generating portion such as the electrode plate 6 is completely formed on the resin 4 in order to increase heat radiation efficiency. It is desirable that the case 1 be disposed as close to the outer peripheral side surface of the case 1 as possible. Further, in the above embodiment, the partition 1a is constituted by a rib integral with the case 1, but a structure in which a separate partition plate is fitted to the case 1 or assembled by bonding or the like may be adopted.

As described above, since the inside of the case 1 is partitioned by the partition 1a and the resin 4 is injected only into the area where the electronic components 5a and 5b requiring heat radiation are arranged, the amount of injected resin can be reduced. And cost reduction and weight reduction can be achieved. Also, an electrolytic capacitor 5c with an explosion-proof valve 7
In the region 1c where the resin 4 is not injected,
This can be achieved without complicating the structure and without increasing the number of parts, and cost can be reduced. Further, by forming the partition 1a, the rigidity of the case 1 is improved, and the case 1 can be prevented from being deformed. Also, if a part fails or if a part
Even when the product is changed, the substrate 3 is not embedded in the resin 4.
Therefore, the substrate 3 can be easily removed from the case 1.
This makes it easy to replace components on the board 3.

FIGS. 3A to 3C are plan views showing a case of another embodiment of the power supply device according to the present invention, and FIG. 3D is a sectional view taken along line FF of FIG. 3B. In the example of FIG. 3A, the partition 1a is formed in a curved shape.
In the examples of (B) and (C), the partition 1a is formed in a square or circular cylindrical shape, respectively. These partitions 1a are selected according to the type and quantity of electronic components mounted on the substrate 3 and their layout. For example, FIG.
As shown in (D), when a round rectifying bridge 8 is used, a case in which the partition 1a is formed in a circular cylindrical shape according to the shape of the rectifying bridge 8 is used. 8 with the resin plate 4 facing the bottom 1h of the case.
To be buried.

As described above, by forming the shape of the partition 1a so as to correspond to the electronic component to be used, the region 1b into which the resin 4 is injected can be made optimal to minimize the injection amount of the resin 4. As a result, the cost and weight can be further reduced.

[0013]

According to the present invention, a resin is injected into one region of a case divided into a plurality of sections by a partition, an electronic component requiring heat radiation is buried in the injected resin, and the other resin is injected. Since electronic components that do not require heat radiation are placed relatively in the areas where no heat is injected, the resin injected into the case only needs to be placed in the areas where the electronic components that require heat radiation are located .
Since the resin is filled below the height, the amount of injected resin can be reduced, and cost and weight can be reduced. Also, there is no risk of resin leakage when filling the resin.
No components are required to prevent leakage, and the board is made of resin.
Because it is not buried in the
In the case of changing parts, the parts can be replaced.

In the case of using a component which must not be sealed, such as an electrolytic capacitor with an explosion-proof valve, by disposing the electrolytic capacitor in a region where resin is not injected, the structure is not complicated, and Since it is possible to cope without increasing the number of points, cost can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an embodiment of a power supply device according to the present invention.

2A is a side sectional view of the embodiment, and FIG. 2B is a sectional view taken along line EE of FIG. 2A.

3 (A) to 3 (C) are plan views showing another example of the case according to the present invention, and FIG. 3 (D) is a sectional view taken along line FF of FIG. 3 (B).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Case 1a Partition 1b Resin injection area 1c Resin non-injection area 2 Lid 3 Substrate 4 Resin 5a-5e Electronic component 6 Electrode plate 7 Explosion-proof valve 8 Rectifying bridge

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H02M 1/00 H02M 3/00 H02M 7/04 H05K 7/20

Claims (1)

(57) [Scope of request for utility model registration] 1. A power supply of a single-sided opening Ke - substrate partition into a plurality of regions by a low partition than the opening through the scan, the resin is injected into one of the regions partitioned by the partition, and mounting an electronic component At the opening side of the case and
Attached above the partition, the electronic parts requiring mounted on heat dissipation to the substrate, before
Partitioned by the partition and the resin is below the height of the partition
It is embedded in the resin so as to be filled to a depth , and the other region is a non-injection region of the resin, and an electronic component which does not require relatively heat radiation is arranged in the non-injection region. Power supply.