JP2526766B2 - Gas barrier laminated plastics material - Google Patents
Gas barrier laminated plastics materialInfo
- Publication number
- JP2526766B2 JP2526766B2 JP4195784A JP19578492A JP2526766B2 JP 2526766 B2 JP2526766 B2 JP 2526766B2 JP 4195784 A JP4195784 A JP 4195784A JP 19578492 A JP19578492 A JP 19578492A JP 2526766 B2 JP2526766 B2 JP 2526766B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- gas barrier
- plastics material
- silicon
- oxygen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000004888 barrier function Effects 0.000 title claims description 27
- 239000000463 material Substances 0.000 title claims description 26
- 239000002650 laminated plastic Substances 0.000 title claims description 8
- 239000007789 gas Substances 0.000 claims description 29
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- 229920003023 plastic Polymers 0.000 claims description 22
- 239000004033 plastic Substances 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 19
- 229910052799 carbon Inorganic materials 0.000 claims description 19
- 239000001301 oxygen Substances 0.000 claims description 19
- 229910052760 oxygen Inorganic materials 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- -1 silicon oxide compound Chemical class 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 7
- 150000003377 silicon compounds Chemical class 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 59
- 239000010408 film Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 7
- 239000011247 coating layer Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000003961 organosilicon compounds Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- NEXSMEBSBIABKL-UHFFFAOYSA-N hexamethyldisilane Chemical compound C[Si](C)(C)[Si](C)(C)C NEXSMEBSBIABKL-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002736 metal compounds Chemical group 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- OVFCVRIJCCDFNQ-UHFFFAOYSA-N carbonic acid;copper Chemical compound [Cu].OC(O)=O OVFCVRIJCCDFNQ-UHFFFAOYSA-N 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910000009 copper(II) carbonate Inorganic materials 0.000 description 1
- 239000011646 cupric carbonate Substances 0.000 description 1
- 235000019854 cupric carbonate Nutrition 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は包装用等に使用されるガ
スの透過を遮断したプラスチックス材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plastic material used for packaging or the like, which has a gas permeation barrier.
【０００２】[0002]
【従来の技術】包装材は内容物の保護と保存のためガス
の透過を防ぐ必要があり、従来種々の試みがなされてい
る。例えば、ケイ素酸化物やアルミニウム酸化物等の無
機の被覆層を設けたり、ポリ塩化ビニリデン等のガス遮
断性樹脂層を積層したり、アルミ箔の金属フイルムを積
層することが試みられて来た。この他特開平３−１８３
７５９号公報にはプラスチックスフイルムにそのプラス
チックスと同じ合成樹脂を真空蒸着や、スパッタリング
によって薄膜状で被覆して有機物層を形成し、その上に
無機物を蒸着して有機物と無機物の混合層を形成し、そ
の上に無機物層を形成した積層フイルムが示されてい
る。このプラスチックスは、被覆層の無機物とは全く異
なる物質であって親和性が乏しいためプラスチックスに
は同じ合成樹脂を被覆し、無機被覆の定着性を良くする
ために中間に合成樹脂と無機物のブレンド層を形成した
ものであるが、ブレンド層の表面は無機物のみの面では
なく合成樹脂の面も存在するので無機物層の定着性は期
待した程には向上しない。また、合成樹脂と無機物を２
工程で蒸着することはシート状物以外例えば成形体には
適用出来ない。さらに合成樹脂は蒸着すると分子量が低
下するのでこのプラスチックス材は加工性が劣化する。
このような問題があるので充分満足出来るものではな
い。2. Description of the Related Art Packaging materials are required to prevent gas permeation in order to protect and preserve their contents, and various attempts have been made so far. For example, attempts have been made to provide an inorganic coating layer such as silicon oxide or aluminum oxide, laminate a gas barrier resin layer such as polyvinylidene chloride, or laminate a metal film of aluminum foil. In addition to this, JP-A-3-183
No. 759 discloses that a plastic film is coated with the same synthetic resin as the plastics in a thin film form by vacuum deposition or sputtering to form an organic material layer, and an inorganic material is deposited thereon to form a mixed layer of the organic material and the inorganic material. A laminated film formed and having an inorganic layer formed thereon is shown. Since this plastic is a substance that is completely different from the inorganic substance of the coating layer and has a poor affinity, the plastic is coated with the same synthetic resin, and in order to improve the fixing property of the inorganic coating, the synthetic resin and the inorganic substance are in the middle. Although the blend layer is formed, since the surface of the blend layer has not only the surface of the inorganic material but also the surface of the synthetic resin, the fixing property of the inorganic material layer is not improved as expected. In addition, 2 synthetic resin and inorganic
The vapor deposition in the process cannot be applied to, for example, a molded body other than the sheet-shaped material. Further, when the synthetic resin is vapor-deposited, the molecular weight is lowered, so that the workability of the plastics material is deteriorated.
Because of this problem, it is not completely satisfactory.
【０００３】[0003]
【発明が解決しようとする課題】従来試みられたガスの
透過を遮断したプラスチックス材は充分満足出来るもの
ではなかった。前述の例についてみても無機の被覆層を
設けたプラスチックス材は遮断性が小さく内容物の変質
を充分に防止出来ない。またポリ塩化ビニリデンを積層
するとガス遮断性は良いが、包装材の廃棄が時に塩素が
発生するので問題がある。アルミ箔等を積層すると不透
明となって内容物が見えなくなり、しかもマイクロ波を
遮断するので電子レンジによる加熱が出来ない欠点があ
る。本発明はこのような問題を全て解決した。SUMMARY OF THE INVENTION The plastics materials that have hitherto been tried to block the permeation of gas have not been sufficiently satisfactory. Even in the above example, the plastics material provided with the inorganic coating layer has a small barrier property and cannot sufficiently prevent the deterioration of the contents. Further, when polyvinylidene chloride is laminated, the gas barrier property is good, but when the packaging material is discarded, chlorine is sometimes generated, which is a problem. When aluminum foil is laminated, it becomes opaque and the contents become invisible, and since microwaves are blocked, it cannot be heated by a microwave oven. The present invention has solved all of these problems.
【０００４】 １． プラスチックス材と、その上に設
けた少なくともケイ素、酸素、炭素を含む有機ケイ素化
合物の重合体であって、ケイ素、炭素、酸素の組成にお
いてケイ素１５％以上、炭素２０％以上、残りが酸素を
含有する重合体で形成された第１層と、第１層の上に設
けたケイ素酸化物の第２層とからなるガス遮断性積層プ
ラスチックス材。２ ． 第２層の主成分が酸化ケイ素化合物であり、その
組成がＳｉＯｘ（ｘ＝１．５〜２．０）である、１項に
記載されたガス遮断性積層プラスチックス材。３ ． 第２層の酸化ケイ素化合物が６０％以上であり、
その組成がＳｉＯｘ（ｘ＝１．５〜２．０）である、１
項または２項に記載されたガス遮断性積層プラスチック
ス材。４ ． 第１層が０．０１μｍ〜０．１μｍの膜厚であり
第２層が０．０３μｍ〜０．２μｍである、１項ないし
３項のいずれか１項に記載されたガス遮断性積層プラス
チックス材。1. A polymer of a plastics material and an organosilicon compound containing at least silicon, oxygen, and carbon, which is provided on the plastics material, and has a composition of silicon, carbon, and oxygen.
15% or more of silicon, 20% or more of carbon, and the balance of oxygen
A gas barrier laminated plastics material comprising a first layer formed of a polymer contained therein and a second layer of silicon oxide provided on the first layer. 2 . The gas-barrier laminated plastics material according to item 1, wherein the main component of the second layer is a silicon oxide compound and the composition is SiOx (x = 1.5 to 2.0). 3 . The silicon oxide compound of the second layer is 60% or more,
Its composition is SiOx (x = 1.5 to 2.0), 1
2. A gas-insulating laminated plastics material according to item 2 or item 2 . 4 . The first layer has a thickness of 0.01 μm to 0.1 μm, and the second layer has a thickness of 0.03 μm to 0.2 μm.
Gas barrier property laminated plastics material as claimed in any one of three terms.
【０００５】[0005]
【作用】ケイ素酸化物層はガス遮断性は小さいが、それ
以外は良好な性能を示すので、ガス遮断性を向上させる
べく種々研究した。[Function] The silicon oxide layer has a small gas barrier property, but otherwise exhibits good performance, so various studies were conducted to improve the gas barrier property.
【０００６】本発明の第１の特徴は、プラスチックス材
の上に、ケイ素、炭素、酸素を含む有機ケイ素化合物の
重合体被覆層を設けたことである。この層はそれ自体は
ガス遮断性はない。本発明の第２の特徴は上記の第１層
の上にケイ素酸化物層を設けたことである。このケイ素
酸化物層は前述の通り直接プラスチックス材に設けても
充分なガスの透過を遮断する作用を奏さない。ところ
が、第１の層の上に第２の層が設けられると、両者の相
乗効果によってガス遮断性が著しく向上する。The first feature of the present invention is that a polymer coating layer of an organic silicon compound containing silicon, carbon and oxygen is provided on a plastic material. This layer is not itself gas barrier. The second feature of the present invention is that a silicon oxide layer is provided on the first layer. Even if the silicon oxide layer is directly provided on the plastics material as described above, it does not have a sufficient effect of blocking gas permeation. However, when the second layer is provided on the first layer, the synergistic effect of the two significantly improves the gas barrier property.
【０００７】何故この二種の層がこの順序で積層される
とこのような特別の効果が奏されるのかその学問的解明
は必ずしも充分ではないが、本発明は反復再現する作用
効果を奏する。本発明者は、ケイ素酸化物層のガス遮断
効果は、被覆基体上に供給されるケイ素酸化物微粒子の
安定定着性によるとことろが大きいと考える。即ち供給
された粒子はプラスチックス基体上を移動し最も安定な
場所で安定化し定着する。この場合プラスチックス基体
の上にケイ素、炭素、酸素を含むケイ素化合物の重合体
被膜が形成されているとケイ素酸化物微粒子は良好に安
定化し定着する。そしてその分布は均一となり、安定化
してケイ素酸化物粒子の上にさらに酸化物微粒子が積み
重なってケイ素酸化物被覆が形成されるので緊密な被覆
となるからであると考えている。The reason why such special effects are exhibited when these two layers are laminated in this order is not necessarily scientifically elucidated, but the present invention has the effect of repetitive reproduction. The inventor believes that the gas barrier effect of the silicon oxide layer is largely due to the stable fixing property of the silicon oxide fine particles supplied onto the coated substrate. That is, the supplied particles move on the plastic substrate and are stabilized and fixed at the most stable place. In this case, when a polymer film of a silicon compound containing silicon, carbon and oxygen is formed on the plastic substrate, the silicon oxide fine particles are well stabilized and fixed. It is considered that the distribution becomes uniform, and the particles are stabilized and the oxide fine particles are further stacked on the silicon oxide particles to form a silicon oxide coating, resulting in a tight coating.
【０００８】第１の有機ケイ素化合物重合体被覆層は第
１層中のケイ素、炭素、酸素の組成において、、ケイ素
１５％以上、炭素２０％以上そして残りが酸素を含有
し、０．０１μｍ〜０．１μｍの薄い層である。被覆層
の厚みがこれより厚くなるとガス遮断性が悪くなる。The first organic silicon compound polymer coating layer comprises, in the composition of silicon, carbon and oxygen in the first layer, 15% or more of silicon, 20% or more of carbon and the balance of oxygen, and 0.01 μm- It is a thin layer of 0.1 μm. If the thickness of the coating layer is thicker than this, the gas barrier property deteriorates.
【０００９】このような第１層の特殊な有機ケイ素化合
物重合体被覆は例えば、ヘキサメチルジシラン等の有機
ケイ素化合物モノマーをプラスチックス基体上で重合す
ることによって形成することが出来る。Such a special organosilicon compound polymer coating of the first layer can be formed, for example, by polymerizing an organosilicon compound monomer such as hexamethyldisilane on a plastic substrate.
【００１０】本発明で使用する有機シリコン化合物モノ
マーとしてはビニルトリエトキシシラン、ビニルトリメ
トキシシラン、テトラメトキシシラン、テトラエトキシ
シラン、フェニルトリメトキシシラン、オクタメチルシ
クロテトラシロキサン、メチルトリメトキシシラン、メ
チルトリエトキシシラン、１１３３−テトラメチルジシ
ロキサン、ヘキサンメチルジシロキサン等である。Examples of the organic silicon compound monomer used in the present invention include vinyltriethoxysilane, vinyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, phenyltrimethoxysilane, octamethylcyclotetrasiloxane, methyltrimethoxysilane, and methyltrimethoxysilane. Examples include ethoxysilane, 1133-tetramethyldisiloxane, and hexanemethyldisiloxane.
【００１１】第２層はケイ素酸化物からなる層である
が、この層はケイ素酸化物以外の金属化合物例えばＭｇ
ＯやＭｇＦ２やＣｕＣＯ３などを含むことも出来る。し
かしながら、この第２層はケイ素酸化物が主成分であ
り、ケイ素酸化物は好ましくは６０％以上より好適には
６５％以上存在しなければならない。第２層のケイ素酸
化物被覆は例えば二酸化ケイ素などのケイ素酸化物と他
の金属化合物を用いてＰＶＤ法で形成することが出来
る。本発明の第３の特徴はこのようなガス遮断層が設け
られたプラスチックス材は廃棄上全く問題はなく、リサ
イクルも出来る。本発明のガス遮断層を配設するプラス
チックス材としてはポリエチレンテレフタレート等のポ
リエステル樹脂、ポリエチレン、ポリプロピレン等のポ
リオレフィン樹脂、ナイロン、ポリビニルアルコール、
ポリ塩化ビニル樹脂、ポリカーボネート樹脂等である。
本発明のガス遮断層を設けたプラスチックス材は成形性
が良くないので、ガス遮断性は成形したボトル、袋、箱
等の包装容器に被覆するのが好ましい。ガス遮断層を配
設したプラスチックスフイルムはガス遮断層の上に保護
層をラミネートすることにより袋に加工することが出来
る。本発明のガス遮断性プラスチックスはガス遮断層の
定着性が良好であるので熱湯殺菌に耐えるのでレトルト
用に使用することが出来る。The second layer is a layer made of silicon oxide, and this layer is a metal compound other than silicon oxide, such as Mg.
It may also contain O, MgF2, CuCO3, or the like. However, this second layer is mainly composed of silicon oxide, which should preferably be present in an amount of 60% or more, more preferably 65% or more. The silicon oxide coating of the second layer can be formed by the PVD method using silicon oxide such as silicon dioxide and other metal compounds. The third feature of the present invention is that the plastics material provided with such a gas blocking layer has no problem in disposal and can be recycled. Examples of the plastics material for disposing the gas barrier layer of the present invention include polyester resins such as polyethylene terephthalate, polyolefin resins such as polyethylene and polypropylene, nylon, polyvinyl alcohol,
Examples thereof include polyvinyl chloride resin and polycarbonate resin.
Since the plastics material provided with the gas barrier layer of the present invention does not have good moldability, it is preferable to cover the molded container such as a bottle, bag or box with the gas barrier property. The plastic film provided with the gas barrier layer can be processed into a bag by laminating a protective layer on the gas barrier layer. Since the gas barrier plastics of the present invention have good fixability of the gas barrier layer, they withstand hot water sterilization and can be used for retorts.
【００１２】[0012]
【実施例】つぎに実施例を製造例を含めて示して本発明
を具体的に説明する。各実施例と比較例におけるガス透
過量の測定は基材がシートの場合は、水蒸気透過量はＬ
ｙｓｓｙ 社製 Ａｕｔｏｍａｔｉｃ Ｐｅｒｍｅａｂ
ｉｌｉｔｙ Ｔｅｓｔｅｒ Ｌ８０−４０００を使用し
て測定した。測定条件は４０℃相対温度９０％である。
透過単位はｇ／ｍ２ ｄａｙ で表わした。酸素ガス透
過量はモダンコントロール社製ＯＸ−ｔｒａｎ １００
を使用して測定した。測定条件は２７℃相対温度９０
％であり透過量単位ｃｃ／ｍ２ ｄａｙ ａｔｍ で表
わした。基材がボトルやカップ状の場合はボトルまたは
カップ内に水を２ｇ充填した。アルミ箔とポリプロピレ
ンまたはポリエチレンテレフタレート樹脂が積層されて
いる積層体を蓋材として使用し、アルミ箔を外面にむ
け、水が充填されているボトルまたはカップにヒートシ
ールした。５０℃４０％ＲＨ、４０℃１０％ＲＨの雰囲
気にそれらを保存し、重量変化を測定し、水蒸気透過量
を測定した。EXAMPLES Next, the present invention will be specifically described by showing Examples including Production Examples. When the substrate is a sheet, the water vapor transmission amount is L
yssy's Automatic Permeab
It was measured using an Ility Tester L80-4000. The measurement conditions are 40 ° C. and a relative temperature of 90%.
The transmission unit is expressed in g / m 2 day. Oxygen gas permeation rate is OX-tran 100 manufactured by Modern Control Co.
Was measured using. The measurement conditions are 27 ° C and a relative temperature of 90.
% And expressed in the unit of permeation amount cc / m 2 day atm. When the base material was a bottle or cup, 2 g of water was filled in the bottle or cup. A laminate in which aluminum foil and polypropylene or polyethylene terephthalate resin were laminated was used as a lid material, the aluminum foil was exposed to the outside, and heat sealed in a bottle or cup filled with water. They were stored in an atmosphere of 50 ° C. 40% RH and 40 ° C. 10% RH, weight change was measured, and water vapor transmission amount was measured.
【００１３】実施例１ 厚み１００μｍの二軸延伸ポリエチレンテレフタレート
シートの表面にヘキサメチルジシランとエチレン及び酸
素ガスを混合し低温プラズマＣＶＤ法によりＳｉ１６
％、Ｏ３６％、Ｃ４８％の組成比の第１層の重合体被膜
を形成した。この被覆の膜厚は０．０５３μｍであっ
た。この薄膜の上に高周波イオンプレーティング法によ
りケイ素と酸素の組成比が１：１．８で膜厚が０．０７
μｍの薄膜の第２層を被覆した。Example 1 Hexamethyldisilane, ethylene and oxygen gas were mixed on the surface of a biaxially stretched polyethylene terephthalate sheet having a thickness of 100 μm, and Si16 was formed by a low temperature plasma CVD method.
%, O36%, C48% composition ratio of the first layer polymer film was formed. The film thickness of this coating was 0.053 μm. On this thin film, the composition ratio of silicon and oxygen was 1: 1.8 and the film thickness was 0.07 by the high frequency ion plating method.
A second layer of μm thin film was coated.
【００１４】実施例２〜実施例３ 第１屑のケイ素、酸素、炭素の組成を表１に示すように
変えた他は実施例と同様にして第１層と第２層を形成し
た。Examples 2 to 3 The first layer and the second layer were formed in the same manner as in Example except that the composition of silicon, oxygen and carbon of the first scrap was changed as shown in Table 1.
【００１５】比較例１ないし３ 第１層のケイ素、酸素、炭素の組成を表１に示すように
変えた以外は実施例１と同様にして第１層と第２層を形
成した。実施例１〜３および比較例１〜３の第１層の組
成比と膜厚、第２層の組成比と膜厚を表１に示す。併せ
てこれ等の被膜を設けたシートの水蒸気透過量を表１に
示す。Comparative Examples 1 to 3 A first layer and a second layer were formed in the same manner as in Example 1 except that the composition of silicon, oxygen and carbon of the first layer was changed as shown in Table 1. Table 1 shows the composition ratio and film thickness of the first layer and the composition ratio and film thickness of the second layer in Examples 1 to 3 and Comparative Examples 1 to 3. In addition, Table 1 shows the amount of water vapor permeation of the sheet provided with these coatings.
【００１６】[0016]
【表１】 [Table 1]
【００１７】実施例４ 厚み２５μｍの二軸延伸ポリエチレンテレフタレートフ
イルムの表面にプラズマＣＶＤ法によりケイ素、酸素、
炭素の重量比が２：３：５で膜厚が０．０４μｍの第１
層を被覆しその上にプラズマＣＶＤ法によりケイ素、酸
素、炭素の組成比が３：６：１で膜厚が０．０５６μｍ
の第２層を被覆した。Example 4 Silicon, oxygen and the like were deposited on the surface of a biaxially stretched polyethylene terephthalate film having a thickness of 25 μm by a plasma CVD method.
First with carbon weight ratio of 2: 3: 5 and thickness of 0.04 μm
A layer is coated and a composition ratio of silicon, oxygen and carbon is 3: 6: 1 and a film thickness is 0.056 μm by plasma CVD method.
A second layer of.
【００１８】比較例４ 第１層を設けない以外は実施例４と同一とした。これ等
のフイルムの酸素ガス透過量を未処理の被覆のない比較
例５のフイルムとともに表２に示す。Comparative Example 4 The same as Example 4 except that the first layer was not provided. The oxygen gas permeation rates of these films are shown in Table 2 together with the uncoated film of Comparative Example 5 which is untreated.
【００１９】[0019]
【表２】 [Table 2]
【００２０】実施例５ 口径２０ｍｍ、胴径２５ｍｍ、高さ５０ｍｍのシリンダ
ー型ポリプロピレン製ボトルの外表面にプラズマＣＶＤ
法によりケイ素、酸素、炭素の組成比が２：３：５で膜
厚が０．０４４μｍの第１層を被覆し、その上にプラズ
マＣＶＤ法によりケイ素、酸素、炭素の組成比が３：
６：１で膜厚が０．０６９μｍの第２層を被覆した。Example 5 Plasma CVD was performed on the outer surface of a cylinder type polypropylene bottle having a diameter of 20 mm, a body diameter of 25 mm and a height of 50 mm.
Method is used to cover the first layer having a composition ratio of silicon, oxygen and carbon of 2: 3: 5 and a thickness of 0.044 μm, and the composition ratio of silicon, oxygen and carbon is 3: 3 on the first layer by plasma CVD.
A 2: 1 layer with a thickness of 0.069 μm was coated with 6: 1.
【００２１】比較例６ 第１層を設けない以外は実施例５と同一とした。これ等
のボトルの水蒸気透過量を未処埋の被覆のない比較例７
のボトルと共に表３に示す。Comparative Example 6 The same as Example 5 except that the first layer was not provided. The water vapor permeation amount of these bottles was compared with Comparative Example 7 without any untreated coating.
It is shown in Table 3 together with the bottle.
【００２２】[0022]
【表３】 [Table 3]
【００２３】実施例６ 口径６０ｍｍ、底径２０ｍｍ、高さ６０ｍｍの逆円錐台
形状のポリエチレンテレフタレート製カップの内表面に
プラズマＣＶＤ法によりケイ素、酸素、炭素の組成比が
２：３：５で膜厚が０．０４７μの第１層を被覆し、そ
の上にプラズマＣＶＤ法によりケイ素、酸素、炭素の組
成比が３：６：１で膜厚が０．０６９μの第２層を被覆
した。Example 6 A film having a composition ratio of silicon, oxygen and carbon of 2: 3: 5 was formed on the inner surface of a cup of polyethylene terephthalate having an inverted truncated cone shape having a diameter of 60 mm, a bottom diameter of 20 mm and a height of 60 mm by plasma CVD. A first layer having a thickness of 0.047 μ was coated, and a second layer having a composition ratio of silicon, oxygen and carbon of 3: 6: 1 and a thickness of 0.069 μ was coated on the first layer by plasma CVD.
【００２４】比較例８ 第１層を設けない以外は実施例６と同一とした。これ等
のカップの水蒸気透過量を未処理の被覆のない比較例９
のボトルと共に表４に示す。Comparative Example 8 The same as Example 6 except that the first layer was not provided. The water vapor permeation rates of these cups were compared to the untreated Comparative Example 9
It is shown in Table 4 together with the bottle.
【００２５】[0025]
【表４】 [Table 4]
【００２６】本発明のガス遮断性プラスチック材は非常
に薄い遮断層で非常に優れたガス遮断効果を奏してお
り、各層の組成が特定範囲からはずれると効果が大きく
劣化することがわかる。The gas barrier plastic material of the present invention exhibits a very excellent gas barrier effect in a very thin barrier layer, and it can be seen that the effect is greatly deteriorated when the composition of each layer deviates from the specific range.
【００２７】[0027]
【発明の効果】本発明は１／１００μｍオーダーの薄い
膜でガスの透過を有効に遮断し、使用後のリサイクルが
良好であり、廃棄にも問題がない優れた効果を奏する。INDUSTRIAL APPLICABILITY According to the present invention, a thin film of the order of 1/100 μm effectively blocks the permeation of gas, has good recycling after use, and has no problem in disposal.
Claims (4)
なくともケイ素、酸素、炭素を含む有機ケイ素化合物の
重合体であって、ケイ素、炭素、酸素の組成においてケ
イ素１５％以上、炭素２０％以上、残りが酸素を含有す
る重合体で形成された第１層と、第１層の上に設けたケ
イ素酸化物の第２層とからなるガス遮断性積層プラスチ
ックス材。1. A polymer of a plastics material and an organic silicon compound containing at least silicon, oxygen and carbon, which is provided on the plastics material, and has a composition of silicon, carbon and oxygen.
Contains 15% or more of carbon, 20% or more of carbon, and the rest contains oxygen
A gas barrier laminated plastics material comprising a first layer formed of a polymer according to claim 1, and a second layer of silicon oxide provided on the first layer.
り、その組成がＳｉＯｘ（ｘ＝１．５〜２．０）であ
る、請求項１に記載されたガス遮断性積層プラスチック
ス材。2. The gas barrier laminated plastics material according to claim 1, wherein the main component of the second layer is a silicon oxide compound and the composition thereof is SiOx (x = 1.5 to 2.0). .
であり、その組成がＳｉＯｘ（ｘ＝１．５〜２．０）で
ある、請求項１または２に記載されたガス遮断性積層プ
ラスチックス材。3. A silicon oxide compound of the second layer is 60% or more, the composition is SiOx (x = 1.5~2.0), gas barrier properties stacked according to claim 1 or 2 Plastics material.
厚であり第２層が０．０３μｍ〜０．２μｍである、請
求項１ないし３のいずれか１項に記載されたガス遮断性
積層プラスチックス材。Wherein the second layer is the first layer be a film thickness of 0.01μm~0.1μm is 0.03Myuemu～0.2Myuemu, according to any one of claims 1 to 3 Gas Barrier laminated plastics material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4195784A JP2526766B2 (en) | 1992-06-15 | 1992-06-15 | Gas barrier laminated plastics material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4195784A JP2526766B2 (en) | 1992-06-15 | 1992-06-15 | Gas barrier laminated plastics material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05345383A JPH05345383A (en) | 1993-12-27 |
| JP2526766B2 true JP2526766B2 (en) | 1996-08-21 |
Family
ID=16346915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4195784A Expired - Fee Related JP2526766B2 (en) | 1992-06-15 | 1992-06-15 | Gas barrier laminated plastics material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2526766B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002092875A1 (en) * | 2001-05-11 | 2002-11-21 | Toyo Seikan Kaisha,Ltd. | Silicon oxide membrane |
| JP2008100398A (en) * | 2006-10-18 | 2008-05-01 | Toppan Printing Co Ltd | Plastic container and method for producing plastic container |
| DE102004017241A9 (en) | 2004-04-05 | 2012-07-19 | Schott Ag | Composite material and method for its production |
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| JP3319164B2 (en) * | 1994-08-01 | 2002-08-26 | 凸版印刷株式会社 | Transparent gas barrier material |
| JP3314541B2 (en) * | 1994-08-22 | 2002-08-12 | 凸版印刷株式会社 | Laminate |
| DE4438359C2 (en) * | 1994-10-27 | 2001-10-04 | Schott Glas | Plastic container with a barrier coating |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54139979A (en) * | 1978-04-24 | 1979-10-30 | Seiko Epson Corp | Coated organic resin |
| JP2734548B2 (en) * | 1988-08-30 | 1998-03-30 | 橋本フォーミング工業株式会社 | Manufacturing method of surface hardened plastic molded products |
| EP0470777A3 (en) * | 1990-08-07 | 1993-06-02 | The Boc Group, Inc. | Thin gas barrier films and rapid deposition method therefor |
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1992
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| Publication number | Publication date |
|---|---|
| JPH05345383A (en) | 1993-12-27 |
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