JP2021136418A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

To provide a substrate processing apparatus capable of processing a back surface of a substrate without inverting the substrate.SOLUTION: A substrate processing apparatus 1 includes a cleaning brush 8, a first holding unit 3, a transport mechanism 80, second holding units 5a and 5b, moving mechanisms 6a and 6b, and a rotation drive unit 4. The cleaning brush 8 includes a brush body 810 and a holder 820. The first holding unit 3 attracts a lower surface 820b of the holder 820 to hold the cleaning brush 8. The transport mechanism 80 transports the cleaning brush 8 between a transfer position in which the cleaning brush 8 is delivered to the first holding unit 3 and a retracted position. The second holding units 5a and 5b hold a substrate W. The moving mechanisms 6a and 6b move the second holding units 5a and 5b to bring the brush body 810 of the cleaning brush 8 into contact with the back surface Wb of the substrate W. The rotation drive unit 4 rotates the first holding unit 3 to rotate the cleaning brush 8 integrally with the first holding unit 3. The cleaning brush 8 cleans the back surface Wb of the substrate W by rotating.SELECTED DRAWING: Figure 3

Description

The present invention relates to a substrate processing apparatus and a substrate processing method.

A substrate processing apparatus for processing both surfaces (front surface and back surface) of a substrate is known (see, for example, Patent Document 1). The substrate processing apparatus of Patent Document 1 includes a cleaning apparatus, a rough grinding apparatus, a conveying apparatus, and a reversing apparatus.

The transport device transports the substrate to the reversing device. The reversing device reverses the front and back of the substrate. As a result, the substrate is in a state in which, of both sides of the substrate, the surface opposite to the grinding surface to be ground by the rough grinding apparatus faces upward. The transport device transports the inverted substrate to the cleaning device.

The cleaning device cleans the cleaning surface of both sides of the substrate, which is the surface opposite to the grinding surface. The transport device transports the washed substrate to the reversing device. The reversing device reverses the front and back of the substrate. As a result, the substrate is in a state where the ground surface faces upward. In other words, the substrate is in a state where the cleaning surface faces downward. The transport device transports the inverted substrate to the rough grinding device.

The rough grinding apparatus includes a chuck table, a rotating mechanism, and a grinding head. The chuck table attracts the cleaning surface of the substrate and holds the substrate. As a result, the substrate is held on the chuck table with the ground surface facing up. The rotation mechanism rotates the chuck table that holds the substrate. The grinding head abuts on the grinding surface of the rotating substrate to grind the grinding surface.

Japanese Unexamined Patent Publication No. 2018-11146

However, in the substrate processing apparatus of Patent Document 1, it is necessary to invert the substrate twice in order to process both sides of the substrate. As a result, the number of steps for processing one substrate has increased, which has been a factor in reducing throughput.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of processing the back surface of a substrate without inverting the substrate.

The substrate processing apparatus of the present invention includes a cleaning brush, a first holding unit, a transport mechanism, a second holding unit, a moving mechanism, and a rotation driving unit. The cleaning brush has a brush body for cleaning the substrate and a holder to which the brush body is attached. The first holding portion attracts the lower surface of the holder on the side opposite to the brush body to hold the cleaning brush. In the transport mechanism, the cleaning brush is delivered to the first holding portion so that the first holding portion attracts the lower surface of the cleaning brush, and the cleaning brush is the first holding portion in a plan view. The cleaning brush is conveyed between the and the retracted position that does not overlap with the cleaning brush. The second holding portion holds the substrate. The moving mechanism moves at least one of the first holding portion and the second holding portion to bring the brush body of the cleaning brush into contact with the back surface of the substrate. The rotation drive unit rotates the first holding unit that holds the cleaning brush, and rotates the cleaning brush integrally with the first holding unit. The cleaning brush cleans the back surface of the substrate by rotating. The second holding portion holds a portion of the substrate that is different from the range cleaned by the cleaning brush.

In certain embodiments, the first holding portion has a contact surface, a suction port, and a first engaging portion. The contact surface comes into contact with the lower surface of the cleaning brush. The suction port is formed on the contact surface. The first engaging portion is provided in a region of the contact surface other than the suction port. The cleaning brush has a second engaging portion that engages with the first engaging portion. The second engaging portion is provided on the lower surface of the holder.

In certain embodiments, the first holding portion has a plurality of the first engaging portions located at different positions from each other.

In certain embodiments, the brush body of the cleaning brush has a convex or concave shape.

In certain embodiments, the first holding portion holds the substrate by attracting a central portion of the back surface of the substrate while the cleaning brush is located at the retracted position.

In certain embodiments, the transport mechanism transports the cleaning brush to a contact position where the brush body of the cleaning brush comes into contact with a portion of the back surface of the substrate held by the first holding portion. The brush body of the cleaning brush located at the contact position comes into contact with a portion of the back surface of the substrate that is detached from the first holding portion in a plan view. The rotation drive unit rotates the substrate by rotating the first holding unit that holds the substrate. The cleaning brush cleans a part of the back surface of the substrate by coming into contact with the rotating substrate.

In certain embodiments, the substrate processing apparatus further comprises a cleaning unit that cleans the surface of the substrate held by the first holding unit.

In certain embodiments, the second holding section holds the substrate held by the first holding section. The moving mechanism moves at least one of the first holding portion and the second holding portion to separate the substrate from the first holding portion. The transport mechanism transports the cleaning brush to the delivery position while the substrate is away from the first holding portion.

The substrate processing method of the present invention is a method of cleaning the back surface of a substrate using a cleaning brush. The cleaning brush has a brush body for cleaning the substrate and a holder to which the brush body is attached. In the method, the transport mechanism conveys the cleaning brush and delivers the cleaning brush to the first holding portion, and the first holding portion sucks the lower surface of the holder on the opposite side of the brush body. Then, the step of holding the cleaning brush and the moving mechanism move at least one of the first holding portion and the second holding portion that holds the substrate, and the back surface of the substrate is moved by the cleaning brush. In the step of bringing the brush into contact with the brush body, the rotation driving unit rotates the first holding portion that holds the cleaning brush, and the cleaning brush that rotates integrally with the first holding portion presses the back surface of the substrate. Includes a cleaning step.

According to the substrate processing apparatus and the substrate processing method according to the present invention, the back surface of the substrate can be processed without inverting the substrate.

It is a schematic diagram of the substrate processing system which concerns on Embodiment 1 of this invention. It is a schematic cross-sectional view of the substrate processing apparatus which concerns on Embodiment 1 of this invention. It is a schematic cross-sectional view of the substrate processing apparatus which concerns on Embodiment 1 of this invention. It is a perspective view which shows the brush transfer mechanism. (A) is a side view of a cleaning brush. (B) is a side view showing a first modification of the cleaning brush. (C) is a side view showing a second modification of the cleaning brush. (A) is a plan view of the spin chuck. (B) is a plan view showing a spin chuck holding a substrate. (C) is a plan view showing a spin chuck holding a cleaning brush. It is a flow chart of the substrate cleaning process by the substrate processing system which concerns on Embodiment 1 of this invention. (A) to (d) are schematic views which show the flow of the substrate cleaning process by the substrate processing apparatus which concerns on Embodiment 1 of this invention. (A) to (d) are schematic views which show the flow of the substrate cleaning process by the substrate processing apparatus which concerns on Embodiment 1 of this invention. (A) and (b) are schematic views which show the flow of the substrate cleaning process by the substrate processing apparatus which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows another example of the substrate cleaning process by the substrate processing apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows another example of the suction position of a cleaning brush. (A) is a plan view showing a spin chuck. (B) is a cross-sectional view of a spin chuck and a cleaning brush. (A) is a plan view which shows the 1st modification of a spin chuck. (B) is a plan view showing a second modification of the spin chuck. (A) and (b) are plan views which show the 3rd modification of the spin chuck.

Hereinafter, embodiments of the present invention will be described with reference to the drawings (FIGS. 1 to 15 (b)). However, the present invention is not limited to the following embodiments. It should be noted that the description may be omitted as appropriate for the parts where the explanations are duplicated. Further, in the drawings, the same or corresponding parts are designated by the same reference numerals and the description is not repeated.

"Substrate" in the present embodiment includes a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for a FED (Field Emission Display), a substrate for an optical disk, a substrate for a magnetic disk, and a substrate. Various substrates such as substrates for opto-magnetic disks can be applied. Hereinafter, the present embodiment will be described mainly by taking as an example a substrate processing apparatus used for processing a disk-shaped semiconductor wafer, but the present embodiment can also be similarly applied to the processing of various substrates exemplified above. Further, various shapes of the substrate can be applied.

[Embodiment 1]
Hereinafter, the first embodiment of the present invention will be described with reference to FIGS. 1 to 12. First, the substrate processing system 100 of the present embodiment will be described with reference to FIG. FIG. 1 is a schematic view of the substrate processing system 100 of the present embodiment. Specifically, FIG. 1 is a schematic plan view of the substrate processing system 100. The substrate processing system 100 processes the substrate W. More specifically, the substrate processing system 100 is a single-wafer type apparatus that processes substrates W one by one. In the present embodiment, the substrate W is a disk-shaped semiconductor wafer.

As shown in FIG. 1, the substrate processing system 100 includes a plurality of substrate processing devices 1, a fluid cabinet 100A, a plurality of fluid boxes 100B, a plurality of load port LPs, an indexer robot IR, and a center robot CR. , And a control device 101. The control device 101 controls the operation of each part of the substrate processing system 100. For example, the control device 101 controls the load port LP, the indexer robot IR, and the center robot CR. In the present embodiment, the control device 101 includes a control unit 102 and a storage unit 104.

Each of the load port LPs accommodates a plurality of substrates W in a laminated manner. The indexer robot IR conveys the substrate W between the load port LP and the center robot CR. The center robot CR conveys the substrate W between the indexer robot IR and the substrate processing device 1. A mounting table (path) for temporarily mounting the substrate W is provided between the indexer robot IR and the center robot CR, and the mounting table is provided between the indexer robot IR and the center robot CR. The device configuration may be such that the substrate W is indirectly delivered.

Each of the substrate processing devices 1 supplies the processing liquid to the surface Ws of the substrate W to process the surface Ws of the substrate W. Further, each of the substrate processing devices 1 processes the back surface Wb of the substrate W using the cleaning brush 8 (see FIGS. 2 and 3). The surface Ws of the substrate W is, for example, the surface on both sides of the substrate W on which the device is formed. The back surface Wb of the substrate W is the surface opposite to the front surface Ws.

The plurality of substrate processing devices 1 form a plurality of tower TWs (four tower TWs in FIG. 1) arranged so as to surround the center robot CR in a plan view. Each tower TW includes a plurality of substrate processing devices 1 (three substrate processing devices 1 in FIG. 1) stacked one above the other.

The fluid cabinet 100A houses the treatment liquid. Each of the fluid boxes 100B corresponds to one of a plurality of tower TWs. The processing liquid in the fluid cabinet 100A is supplied to all the substrate processing devices 1 included in the tower TW corresponding to the fluid box 100B via one of the fluid boxes 100B. The substrate processing apparatus 1 will be described later with reference to FIGS. 2 and 3.

The control unit 102 has a processor. The control unit 102 has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). Alternatively, the control unit 102 may have a general-purpose arithmetic unit.

The storage unit 104 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure of the substrate W.

The storage unit 104 has a main storage device. The main storage device is, for example, a semiconductor memory. The storage unit 104 may further have an auxiliary storage device. Auxiliary storage includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit 104 may include removable media. The control unit 102 controls the operation of each unit of the substrate processing system 100 based on the computer program and data stored in the storage unit 104.

Subsequently, the substrate processing system 100 of the present embodiment will be further described with reference to FIGS. 1 to 3. 2 and 3 are schematic cross-sectional views of the substrate processing apparatus 1. Specifically, FIG. 2 shows a state in which the substrate processing apparatus 1 is processing the surface Ws of the substrate W. FIG. 3 shows a state in which the substrate processing apparatus 1 is processing the back surface Wb of the substrate W.

As shown in FIG. 2, the substrate processing device 1 includes a chamber 2, a spin chuck 3, a spin motor unit 4, a first gripping pin 5a, a second gripping pin 5b, a first moving mechanism 6a, and a first. 2 The movement mechanism 6b, the first nozzle 7, the nozzle movement mechanism 70, the cleaning brush 8, the brush transfer mechanism 80, and the second nozzle 9 are provided. Further, as shown in FIG. 2, the substrate processing system 100 includes a first supply pipe P1, a first valve V1, a second supply pipe P2, and a second valve V2. The control device 101 controls the spin motor unit 4, the first moving mechanism 6a, the second moving mechanism 6b, the nozzle moving mechanism 70, the brush transfer mechanism 80, the first valve V1, and the second valve V2.

The chamber 2 is a box-shaped housing having an internal space, and the inside and the outside of the chamber 2 are partitioned. The chamber 2 is provided with a shutter (not shown) and an opening / closing mechanism thereof. Normally, the shutter is closed, and as a result, the atmosphere inside and outside the chamber 2 is blocked. The shutter is opened when the substrate W is carried into the chamber 2 by the center robot CR (FIG. 1) or when the substrate W is carried out from the inside of the chamber 2 by the center robot CR (FIG. 1).

One substrate W is housed in the chamber 2. The substrate processing device 1 holds the substrate W horizontally in the chamber 2 and processes the substrates W one by one. The chamber 2 includes a spin chuck 3, a spin motor unit 4, a first gripping pin 5a, a second gripping pin 5b, a first moving mechanism 6a, a second moving mechanism 6b, a first nozzle 7, a nozzle moving mechanism 70, and a cleaning brush. 8. The brush transfer mechanism 80 and the second nozzle 9 are housed. Further, the chamber 2 accommodates a part of each of the first supply pipe P1 and the second supply pipe P2.

The spin chuck 3 is a vacuum suction type chuck (so-called vacuum chuck), and is connected to a decompression device provided in a factory where the substrate processing system 100 is installed via a pipe. The spin chuck 3 attracts the central portion of the back surface Wb of the substrate W to hold the substrate W. Specifically, the spin chuck 3 detachably attracts the substrate W. The spin chuck 3 is an example of the first holding portion.

The spin chuck 3 has a suction base 3a and a spin shaft 3b. The suction base 3a has a circular shape in a plan view, and the upper surface of the suction base 3a is a horizontal plane. The spin chuck 3 sucks the back surface Wb of the substrate W placed on the upper surface of the suction base 3a. As a result, the substrate W is held horizontally by the spin chuck 3. The spin shaft 3b extends in the vertical direction. The upper end of the spin shaft 3b is coupled to the central portion of the suction base 3a.

The spin motor unit 4 rotates the spin chuck 3 around the first rotation axis AX1 extending in the vertical direction. Therefore, when the spin chuck 3 holds the substrate W, the spin motor unit 4 rotates the spin chuck 3, so that the substrate W rotates integrally with the spin chuck 3 about the first rotation axis AX1. .. Specifically, the spin motor unit 4 rotates the spin shaft 3b around the first rotation axis AX1. As a result, the suction base 3a rotates about the first rotation axis AX1. The spin motor unit 4 is an example of a rotation drive unit. The spin motor unit 4 rotates the spin chuck 3 when cleaning the front surface Ws of the substrate W and when cleaning the back surface Wb of the substrate W.

The first moving mechanism 6a moves the first gripping pin 5a in the horizontal direction and the vertical direction. Specifically, the first moving mechanism 6a moves the first gripping pin 5a along the circumferential direction centered on the second rotation axis AX2 extending in the vertical direction. Further, the first moving mechanism 6a raises and lowers the first gripping pin 5a in the vertical direction.

Specifically, the first moving mechanism 6a includes a first arm 61a, a first shaft portion 62a, and a first driving portion 63a. The first arm 61a extends along the horizontal direction. The first gripping pin 5a is arranged at the tip of the first arm 61a. Specifically, the first gripping pin 5a is coupled to the lower surface of the tip end portion of the first arm 61a and projects downward from the first arm 61a. The base end portion of the first arm 61a is connected to the first shaft portion 62a. The first shaft portion 62a extends along the vertical direction.

The first drive unit 63a has a rotation drive mechanism and an elevating drive mechanism. The rotation drive mechanism of the first drive unit 63a rotates the first shaft portion 62a around the second rotation axis AX2, and rotates the first arm 61a around the first shaft portion 62a along the horizontal plane. As a result, the first gripping pin 5a moves along the horizontal plane. Specifically, the first gripping pin 5a moves around the first shaft portion 62a along the circumferential direction. The rotation drive mechanism of the first drive unit 63a includes, for example, a motor capable of forward / reverse rotation.

The elevating drive mechanism of the first drive unit 63a raises and lowers the first shaft portion 62a in the vertical direction. The elevating drive mechanism of the first drive unit 63a raises and lowers the first shaft portion 62a, so that the first gripping pin 5a moves up and down in the vertical direction. The elevating drive mechanism of the first drive unit 63a has a drive source such as a motor and an elevating mechanism, and the elevating mechanism is driven by the drive source to raise or lower the first shaft portion 62a. The elevating mechanism includes, for example, a rack and pinion mechanism or a ball screw.

The second moving mechanism 6b moves the second gripping pin 5b in the horizontal direction and the vertical direction. Specifically, the second moving mechanism 6b moves the second gripping pin 5b along the circumferential direction centered on the third rotation axis AX3 extending in the vertical direction. Further, the second moving mechanism 6b raises and lowers the second gripping pin 5b in the vertical direction.

Specifically, the second moving mechanism 6b has a second arm 61b, a second shaft portion 62b, and a second driving portion 63b, similarly to the first moving mechanism 6a. The second gripping pin 5b is arranged at the tip of the second arm 61b in the same manner as the first gripping pin 5a. Since the configuration of the second moving mechanism 6b is the same as that of the first moving mechanism 6a, a detailed description thereof will be omitted.

The first gripping pin 5a and the second gripping pin 5b cooperate with each other when cleaning the back surface Wb of the substrate W to hold the substrate W. Specifically, the first moving mechanism 6a and the second moving mechanism 6b move the first gripping pin 5a and the second gripping pin 5b so that the first gripping pin 5a and the second gripping pin 5b grip the substrate W. .. The first gripping pin 5a and the second gripping pin 5b are examples of the second holding portion.

The first nozzle 7 supplies the first treatment liquid to the surface Ws of the substrate W held by the spin chuck 3 to clean the surface Ws of the substrate W. Specifically, the first nozzle 7 discharges the first treatment liquid toward the surface Ws of the rotating substrate W. The first nozzle 7 is an example of a cleaning unit.

The first supply pipe P1 supplies the first treatment liquid to the first nozzle 7. The first supply pipe P1 is a tubular member through which the first treatment liquid flows. The first valve V1 is arranged in the first supply pipe P1. The first valve V1 switches between supplying and stopping the supply of the first processing liquid to the first nozzle 7.

Specifically, when the first valve V1 is opened, the first treatment liquid is discharged from the first nozzle 7 toward the surface Ws of the substrate W. On the other hand, when the first valve V1 is closed, the discharge of the first processing liquid is stopped. Further, the first valve V1 controls the flow rate of the first treatment liquid flowing downstream of the first valve V1 in the first supply pipe P1. Specifically, the flow rate of the first treatment liquid flowing downstream from the first valve V1 is adjusted according to the opening degree of the first valve V1. The first valve V1 is, for example, a motor valve.

The nozzle moving mechanism 70 moves the first nozzle 7 in the horizontal direction and the vertical direction. Specifically, the nozzle moving mechanism 70 moves the first nozzle 7 along the circumferential direction centered on the fourth rotation axis AX4 extending in the vertical direction. Further, the nozzle moving mechanism 70 raises and lowers the first nozzle 7 in the vertical direction.

Specifically, the nozzle moving mechanism 70 has a nozzle arm 71, a nozzle shaft portion 72, and a nozzle driving portion 73, similarly to the first moving mechanism 6a. The first nozzle 7 is arranged at the tip of the nozzle arm 71 in a posture in which the first treatment liquid can be supplied toward the surface Ws of the substrate W held by the spin chuck 3. Since the configuration of the nozzle moving mechanism 70 is the same as that of the first moving mechanism 6a, detailed description thereof will be omitted.

The first nozzle 7 discharges the first treatment liquid toward the surface Ws of the substrate W while moving along the horizontal plane. The first nozzle 7 is sometimes referred to as a scan nozzle. The surface Ws of the substrate W is cleaned by discharging the first treatment liquid toward the surface Ws of the rotating substrate W while the first nozzle 7 is moving.

In the present embodiment, the first treatment liquid is pure water. However, the first treatment liquid is not limited to pure water. The first treatment liquid may be functional water such as carbonated water, ionized water, deionized water (DIW), ozone water, reduced water (hydrogen water), or magnetic water. Alternatively, the first treatment solution may be, for example, a chemical solution such as aqueous ammonia or a mixed solution having a diluted concentration of a mixture of aqueous ammonia and aqueous hydrogen peroxide (diluted concentration SC1). When the first treatment liquid is a chemical liquid, the substrate treatment apparatus 1 may include a nozzle for discharging the rinse liquid toward the surface Ws of the substrate W.

Subsequently, the cleaning brush 8 and the brush transfer mechanism 80 will be described with reference to FIGS. 2 and 3. The brush transport mechanism 80 transports the cleaning brush 8 between the retracted position and the delivery position. The retracted position is a position where the cleaning brush 8 does not overlap with the spin chuck 3 in a plan view. FIG. 2 shows the cleaning brush 8 located at the retracted position. The delivery position is a position where the cleaning brush 8 is delivered to the spin chuck 3. FIG. 3 shows a cleaning brush 8 delivered to the spin chuck 3. When cleaning the back surface Wb of the substrate W, the brush transfer mechanism 80 conveys the cleaning brush 8 from the retracted position to the delivery position, and delivers the cleaning brush 8 to the spin chuck 3. The brush transfer mechanism 80 is an example of a transfer mechanism.

Specifically, the brush transfer mechanism 80 includes a brush transfer arm 81 and a transfer drive unit 82. The brush transfer arm 81 holds the cleaning brush 8. The transfer drive unit 82 moves the brush transfer arm 81 in the horizontal direction and the vertical direction. The transfer drive unit 82 moves the brush transfer arm 81 along the first direction D1, so that the cleaning brush 8 is conveyed from the retracted position to the transfer position. Here, the first direction D1 is a horizontal direction approaching the spin chuck 3. When the spin chuck 3 receives the cleaning brush 8 from the brush transfer arm 81, it attracts the cleaning brush 8 and holds the cleaning brush 8.

Specifically, as shown in FIG. 3, the brush transfer arm 81 conveys the cleaning brush 8 to the delivery position so that the spin chuck 3 attracts the lower surface 8b of the cleaning brush 8. Therefore, when the spin chuck 3 receives the cleaning brush 8 from the brush transport arm 81, it attracts the lower surface 8b of the cleaning brush 8.

When the cleaning brush 8 is delivered from the brush transfer arm 81 to the spin chuck 3, the transfer drive unit 82 lowers the brush transfer arm 81 to a retracted position along the second direction D2 as shown in FIG. The brush transfer arm 81 is moved. Here, the second direction D2 is the direction opposite to the first direction D1. That is, the second direction D2 is a horizontal direction away from the spin chuck 3.

Subsequently, the first gripping pin 5a, the second gripping pin 5b, the first moving mechanism 6a, the second moving mechanism 6b, and the spin motor unit 4 will be further described with reference to FIG. As shown in FIG. 3, when cleaning the back surface Wb of the substrate W, the first gripping pin 5a and the second gripping pin 5b cooperate to hold the substrate W.

Specifically, the first gripping pin 5a and the second gripping pin 5b grip a portion of the substrate W that is different from the range to be cleaned by the cleaning brush 8. Specifically, the first moving mechanism 6a moves the first gripping pin 5a to a position where it comes into contact with a part of the side surface of the substrate W. Further, the second moving mechanism 6b moves the second gripping pin 5b to a position where it comes into contact with another part of the side surface of the substrate W. As a result, the substrate W is gripped by the first gripping pin 5a and the second gripping pin 5b. When the substrate W is gripped by the first gripping pin 5a and the second gripping pin 5b, the first gripping pin 5a faces the second gripping pin 5b in the radial direction of the substrate W.

The first moving mechanism 6a and the second moving mechanism 6b move the substrate W to a position where the substrate W does not interfere with the brush conveying arm 81 and the cleaning brush 8 when the brush conveying arm 81 delivers the cleaning brush 8 to the spin chuck 3. The first gripping pin 5a and the second gripping pin 5b that grip the above are raised.

The first moving mechanism 6a and the second moving mechanism 6b hold the first gripping pin 5a for holding the substrate W so that the cleaning brush 8 comes into contact with the back surface Wb of the substrate W after the spin chuck 3 holds the cleaning brush 8. And the second gripping pin 5b is moved. More specifically, the first moving mechanism 6a and the second moving mechanism 6b lower the first gripping pin 5a and the second gripping pin 5b. The first moving mechanism 6a and the second moving mechanism 6b are examples of the moving mechanism.

The spin motor unit 4 rotates the spin chuck 3 that holds the cleaning brush 8 when cleaning the back surface Wb of the substrate W. As a result, the cleaning brush 8 that comes into contact with the back surface Wb of the substrate W rotates integrally with the spin chuck 3 about the first rotation axis AX1, and the back surface Wb of the substrate W is cleaned.

Subsequently, the second nozzle 9, the second supply pipe P2, and the second valve V2 will be described with reference to FIG. When cleaning the back surface Wb of the substrate W, the second nozzle 9 supplies the second treatment liquid toward the back surface Wb of the substrate W held by the first gripping pin 5a and the second gripping pin 5b. Specifically, the second nozzle 9 discharges the second treatment liquid toward the portion of the back surface Wb of the substrate W that is not in contact with the cleaning brush 8.

The second supply pipe P2 supplies the second treatment liquid to the second nozzle 9. The second valve V2 is arranged in the second supply pipe P2. The second valve V2 switches between supplying and stopping the supply of the second processing liquid to the second nozzle 9. Since the configurations of the second supply pipe P2 and the second valve V2 are the same as those of the first supply pipe P1 and the first valve V1, detailed description thereof will be omitted.

In the present embodiment, the second treatment liquid is pure water. However, the second treatment liquid is not limited to pure water. The second treatment liquid may be functional water such as carbonated water, ionized water, DIW, ozone water, reduced water (hydrogen water), or magnetic water. Alternatively, the first treatment solution may be, for example, aqueous ammonia or a chemical solution such as SC1 having a diluted concentration. When the second treatment liquid is a chemical liquid, the substrate processing apparatus 1 may include a nozzle for discharging the rinse liquid toward the back surface Wb of the substrate W.

The substrate processing device 1 further includes a shatterproof cup arranged in the chamber 2 so as to be able to move up and down. The shatterproof cup is arranged around the substrate W held by the spin chuck 3 when cleaning the surface Ws of the substrate W, and receives the liquid scattered from the rotating substrate W.

Subsequently, the brush transfer mechanism 80 will be further described with reference to FIG. FIG. 4 is a perspective view showing the brush conveying mechanism 80. As shown in FIG. 4, the brush transfer arm 81 is a thin-walled member and has a U-shape in a plan view.

The transport drive unit 82 includes a first connecting member 83, a second connecting member 84, and a support member 85. The brush transfer arm 81 is connected to the tip of the first connecting member 83. The connection portion between the brush transfer arm 81 and the first connecting member 83 constitutes a joint portion. The tip of the second connecting member 84 is connected to the base end of the first connecting member 83. The connection portion between the second connecting member 84 and the first connecting member 83 constitutes a joint portion. The tip of the support member 85 is connected to the base end of the second connecting member 84. The connection portion between the support member 85 and the second connecting member 84 constitutes a joint portion. The support member 85 extends in the vertical direction.

The transport drive unit 82 bends and stretches the first connecting member 83 and the second connecting member 84. As a result, the brush transfer arm 81 moves along the first direction D1 and the second direction D2. The transport drive unit 82 includes, for example, a motor and a gear mechanism provided at each joint portion.

The transport drive unit 82 raises and lowers the support member 85. As a result, the brush transfer arm 81 moves up and down. The transport drive unit 82 has, for example, a drive source such as a motor and an elevating mechanism, and the elevating mechanism is driven by the drive source to elevate and lower the support member 85. The elevating mechanism includes, for example, a rack and pinion mechanism or a ball screw.

Subsequently, the cleaning brush 8 will be described with reference to FIG. 5A. FIG. 5A is a side view of the cleaning brush 8. As shown in FIG. 5A, the cleaning brush 8 has a brush body 810 and a holder 820.

The brush body 810 comes into contact with the back surface Wb of the substrate W to clean the back surface Wb of the substrate W. The brush body 810 is made of, for example, a porous material. The brush body 810 may be sponge-like. Further, the brush body 810 may be made of a resin such as polyvinyl alcohol (PVA). The brush body 810 may include a large number of hair-like members.

The brush body 810 is attached to the holder 820. The holder 820 has a lower surface 820b. The lower surface 820b of the holder 820 is a surface opposite to the brush body 810, and constitutes the lower surface 8b of the cleaning brush 8. The holder 820 has, for example, a bottomed tubular shape. Since the cleaning brush 8 has the holder 820, the cleaning brush 8 can be attracted to the spin chuck 3.

In the present embodiment, the upper surface of the brush body 810 is a flat surface. The shape of the upper surface of the brush body 810 is arbitrary. Here, two modified examples (first modified example and second modified example) of the cleaning brush 8 will be described with reference to FIGS. 5 (b) and 5 (c).

FIG. 5B is a side view showing a first modification of the cleaning brush 8. FIG. 5C is a side view showing a second modification of the cleaning brush 8. As shown in FIG. 5B, the upper surface of the brush body 810 may have a convex shape. Alternatively, as shown in FIG. 5C, the upper surface of the brush body 810 may have a concave shape. Since the upper surface of the brush body 810 has a convex shape, the cleaning power of the central portion of the brush body 810 is improved. Since the upper surface of the brush body 810 has a concave shape, the cleaning power of the outer peripheral portion of the brush body 810 is improved. Therefore, by adjusting the shape of the upper surface of the brush body 810, cleaning can be performed according to the desired target.

For example, when cleaning the back surface Wb of the substrate W by aligning the center of the cleaning brush 8 with the center of the substrate W, the portion of the back surface Wb of the substrate W that is closer to the center of the substrate W is the portion far from the center of the substrate W. Cleaning is more difficult than that. This is because, on the back surface Wb of the rotating substrate W, the closer to the center of the substrate W, the slower the speed. Therefore, by making the upper surface of the brush body 810 convex and increasing the cleaning force by the central portion of the brush body 810, the entire area of the substrate W in contact with the brush body 810 can be cleaned more evenly.

Subsequently, the spin chuck 3, the substrate W, and the cleaning brush 8 will be further described with reference to FIGS. 6 (a) to 6 (c). FIG. 6A is a plan view of the spin chuck 3. FIG. 6B is a plan view showing the spin chuck 3 holding the substrate W. FIG. 6C is a plan view showing the spin chuck 3 holding the cleaning brush 8.

As shown in FIGS. 6A to 6C, the suction base 3a of the spin chuck 3 has a contact surface 31 and a suction port 32. When the spin chuck 3 holds the substrate W, the contact surface 31 comes into contact with the back surface Wb of the substrate W. When the spin chuck 3 holds the cleaning brush 8, the contact surface 31 comes into contact with the lower surface 8b of the cleaning brush 8 (lower surface 820b of the holder 820). The contact surface 31 constitutes the upper surface of the spin chuck 3.

The suction port 32 is formed on the contact surface 31. Specifically, the suction port 32 is formed at the center of the contact surface 31 (suction base 3a). The suction port 32 communicates with a decompression device provided in a factory where the substrate processing system 100 is installed via a pipe.

As shown in FIG. 6B, when holding the substrate W, the spin chuck 3 attracts the central portion of the back surface Wb of the substrate W by the suction port 32. When the spin chuck 3 sucks the substrate W, suction marks are generated on the back surface Wb of the substrate W. The range of the suction marks is the range facing the contact surface 31 and the suction port 32.

As shown in FIG. 6C, in the present embodiment, the cleaning brush 8 has a circular shape having a larger diameter than the suction base 3a. When holding the cleaning brush 8, the spin chuck 3 attracts the central portion of the lower surface 8b (lower surface 820b of the holder 820) of the cleaning brush 8 by the suction port 32. Therefore, if adsorption marks are generated on the back surface Wb of the substrate W before cleaning the back surface Wb of the substrate W, the adsorption marks can be cleaned by the cleaning brush 8. The cleaning brush 8 is held by the spin chuck 3 with the brush body 810 facing upward.

Further, as shown in FIGS. 6 (b) and 6 (c), the cleaning brush 8 has a smaller diameter than the substrate W. Therefore, when cleaning the back surface Wb of the substrate W, it is possible to prevent the cleaning brush 8 from interfering with the first gripping pin 5a and the second gripping pin 5b described with reference to FIGS. 2 and 3. ..

Subsequently, the substrate processing method of the present embodiment will be described with reference to FIG. 7. FIG. 7 is a flow chart of a substrate cleaning process by the substrate processing system 100. The substrate processing method of this embodiment is executed by the substrate processing system 100. As shown in FIG. 7, the substrate processing method of the present embodiment includes steps S1 to S10.

In step S1, the substrate W is carried into the chamber 2. Specifically, the control device 101 controls the indexer robot IR, the center robot CR, and the shutter provided in the chamber 2 to carry the substrate W to be processed into the chamber 2. In the present embodiment, the center robot CR delivers the substrate W to the first gripping pin 5a and the second gripping pin 5b. Specifically, the control device 101 controls the first moving mechanism 6a and the second moving mechanism 6b to cause the first gripping pin 5a and the second gripping pin 5b to grip the substrate W carried into the chamber 2.

In step S2, the spin chuck 3 attracts the substrate W. Specifically, the control device 101 controls the first moving mechanism 6a and the second moving mechanism 6b, and the substrate W gripped by the first gripping pin 5a and the second gripping pin 5b is the contact surface of the spin chuck 3. The first gripping pin 5a and the second gripping pin 5b are moved so as to come into contact with 31. As a result, the substrate W is attracted by the spin chuck 3.

In step S3, the surface Ws of the substrate W is cleaned. Specifically, the spin motor unit 4 and the first valve V1 so that the control device 101 discharges the first processing liquid while the first nozzle 7 moves horizontally with respect to the surface Ws of the rotating substrate W. And the nozzle moving mechanism 70 is controlled. After cleaning the surface Ws of the substrate W, a spin dry treatment is executed. In the spin dry process, the control device 101 controls the spin motor unit 4 to rotate the substrate W at high speed. After the spin dry process, the control device 101 stops driving the spin motor unit 4.

In step S4, the substrate W rises and separates from the spin chuck 3. Specifically, the control device 101 controls the first moving mechanism 6a and the second moving mechanism 6b, and the substrate W gripped by the first gripping pin 5a and the second gripping pin 5b is the contact surface of the spin chuck 3. The first gripping pin 5a and the second gripping pin 5b are raised so as to move upward away from 31.

In step S5, the spin chuck 3 attracts the cleaning brush 8. Specifically, the control device 101 controls the brush transfer mechanism 80 to transfer the substrate W from the retracted position to the transfer position.

In step S6, the substrate W is lowered, and the back surface Wb of the substrate W comes into contact with the brush body 810 of the cleaning brush 8. Specifically, the control device 101 controls the first moving mechanism 6a and the second moving mechanism 6b, and the substrate W gripped by the first gripping pin 5a and the second gripping pin 5b is the brush body of the cleaning brush 8. The first gripping pin 5a and the second gripping pin 5b are lowered so as to move downward to the position where they come into contact with the 810.

In step S7, the back surface Wb of the substrate W is cleaned. Specifically, the control device 101 controls the spin motor unit 4 to rotate the spin chuck 3, thereby rotating the cleaning brush 8. The cleaning brush 8 cleans the back surface Wb of the substrate W by rotating. After cleaning the back surface Wb of the substrate W, a spin dry process is executed. After the spin dry process, the control device 101 stops driving the spin motor unit 4.

In step S8, the substrate W rises and separates from the cleaning brush 8. Specifically, the control device 101 controls the first moving mechanism 6a and the second moving mechanism 6b, and the substrate W gripped by the first gripping pin 5a and the second gripping pin 5b is the brush body of the cleaning brush 8. The first gripping pin 5a and the second gripping pin 5b are raised so as to move upward away from the 810.

In step S9, the cleaning brush 8 is conveyed to the retracted position. Specifically, the control device 101 controls the brush transfer mechanism 80 so that the brush transfer arm 81 receives the cleaning brush 8 from the spin chuck 3. After that, the control device 101 controls the brush transfer mechanism 80 to transfer the substrate W to the retracted position.

In step S10, the processed substrate W is carried out from the inside of the chamber 2 to the outside. Specifically, the control device 101 informs the center robot CR and the chamber 2 so that the center robot CR receives the substrate W gripped by the first gripping pin 5a and the second gripping pin 5b and conveys the substrate W to the outside of the chamber 2. It controls the provided shutter, the first moving mechanism 6a, and the second moving mechanism 6b.

Subsequently, the substrate cleaning process by the substrate processing apparatus 1 of the present embodiment will be described with reference to FIGS. 8 (a) to 10 (b). 8 (a) to 10 (b) are schematic views showing a flow of substrate cleaning processing by the substrate processing apparatus 1.

FIG. 8A shows a standby state before the substrate W is carried into the chamber 2. As shown in FIG. 8A, the cleaning brush 8 is located in the retracted position in the standby state.

As shown in FIG. 8B, when the substrate W is carried into the chamber 2, the first gripping pin 5a and the second gripping pin 5b grip the substrate W. Specifically, the first moving mechanism 6a rotates the first shaft portion 62a to move the first gripping pin 5a to a position where it comes into contact with the side surface of the substrate W. Similarly, the second moving mechanism 6b rotates the second shaft portion 62b to move the second gripping pin 5b to a position where it contacts the side surface of the substrate W. The first gripping pin 5a and the second gripping pin 5b receive the substrate W from the center robot CR at a position above the spin chuck 3.

As shown in FIG. 8C, after the first gripping pin 5a and the second gripping pin 5b grip the substrate W, the first gripping pin 5a and the position where the back surface Wb of the substrate W is attracted by the spin chuck 3 The second gripping pin 5b is lowered. As a result, the back surface Wb of the substrate W comes into contact with the upper surface of the spin chuck 3 (the contact surface 31 of the suction base 3a), and the central portion of the back surface Wb of the substrate W is attracted by the suction port 32 of the spin chuck 3. Specifically, the first moving mechanism 6a and the second moving mechanism 6b lower the first shaft portion 62a and the second shaft portion 62b to lower the substrate W.

As shown in FIG. 8D, after the spin chuck 3 attracts the substrate W, the first moving mechanism 6a and the second moving mechanism 6b raise the first shaft portion 62a and the second shaft portion 62b, and the second shaft portion 62a and the second shaft portion 62b are raised. 1 Raise the gripping pin 5a and the second gripping pin 5b. After that, the spin motor unit 4 rotates the spin chuck 3, and the first nozzle 7 moves in the horizontal direction to discharge the first treatment liquid onto the surface Ws of the substrate W. As a result, the surface Ws of the substrate W is cleaned. After cleaning the surface Ws of the substrate W, a spin dry treatment is performed.

As shown in FIG. 9A, after the spin dry treatment, the first gripping pin 5a and the second gripping pin 5b grip the substrate W attracted to the spin chuck 3. Specifically, the first moving mechanism 6a and the second moving mechanism 6b move the first shaft portion 62a to a position where the first gripping pin 5a and the second gripping pin 5b can grip the substrate W attracted to the spin chuck 3. And the second shaft portion 62b is lowered. Next, the first moving mechanism 6a rotates the first shaft portion 62a to move the first gripping pin 5a to a position where it comes into contact with the side surface of the substrate W. Similarly, the second moving mechanism 6b rotates the second shaft portion 62b to move the second gripping pin 5b to a position where it contacts the side surface of the substrate W.

After the first gripping pin 5a and the second gripping pin 5b grip the substrate W, the first moving mechanism 6a and the second moving mechanism 6b raise the first shaft portion 62a and the second shaft portion 62b. As a result, the substrate W moves upward from the spin chuck 3 and stands by at a position away from the spin chuck 3.

As shown in FIG. 9B, while the substrate W is waiting above the spin chuck 3, the brush transfer arm 81 moves in the first direction D1 and is between the spin chuck 3 and the substrate W. The cleaning brush 8 is conveyed.

As shown in FIG. 9C, the brush transfer arm 81 lowers after transporting the cleaning brush 8 between the spin chuck 3 and the substrate W. In the process of lowering the brush transfer arm 81, the cleaning brush 8 is placed on the upper surface (contact surface 31) of the spin chuck 3, and the spin chuck 3 attracts the central portion of the lower surface 8b of the cleaning brush 8.

As shown in FIG. 9D, when the brush transfer arm 81 finishes descending, it moves to the second direction D2 and stands by at the retracted position.

As shown in FIG. 10A, when the brush transfer arm 81 stands by at the retracted position, the first gripping pin 5a and the second gripping pin 5a and the second gripping pin reach a position where the back surface Wb of the substrate W comes into contact with the cleaning brush 8 (brush body 810). 5b descends. As a result, the back surface Wb of the substrate W comes into contact with the cleaning brush 8 (brush body 810). Specifically, the first moving mechanism 6a and the second moving mechanism 6b lower the first shaft portion 62a and the second shaft portion 62b to lower the substrate W.

After the back surface Wb of the substrate W comes into contact with the cleaning brush 8 (brush body 810), the spin motor unit 4 rotates the spin chuck 3. As a result, the cleaning brush 8 rotates about the first rotation axis AX1 to clean the back surface Wb of the substrate W. Further, during cleaning of the back surface Wb of the substrate W, the second treatment liquid is discharged from the second nozzle 9 toward the back surface Wb of the substrate W. Specifically, the second nozzle 9 discharges the second treatment liquid to the portion of the back surface Wb of the substrate W outside the spin chuck 3. When the cleaning of the back surface Wb of the substrate W is completed, the spin dry process is performed.

As shown in FIG. 10B, after the spin-drying process is completed, the first moving mechanism 6a and the second moving mechanism 6b raise the first shaft portion 62a and the second shaft portion 62b. As a result, the substrate W moves upward from the cleaning brush 8 and stands by at a position away from the cleaning brush 8.

While the substrate W is waiting above the cleaning brush 8, the brush transfer arm 81 receives the substrate W from the spin chuck 3 and transports the substrate W to the retracted position. Specifically, the brush transfer arm 81 moves to a position below the cleaning brush 8. After that, the brush transfer arm 81 rises. In the process of raising the brush transfer arm 81, the brush transfer arm 81 holds the cleaning brush 8 and moves the cleaning brush 8 above the spin chuck 3. When the brush transfer arm 81 finishes ascending, it moves to the second direction D2 and conveys the cleaning brush 8 to the retracted position.

Subsequently, another example of the substrate cleaning process by the substrate processing apparatus 1 of the present embodiment will be described with reference to FIG. The substrate processing apparatus 1 may execute the substrate cleaning process described with reference to FIG. 11 instead of the substrate cleaning process with reference to FIGS. 8 (a) to 10 (b). FIG. 11 is a schematic view showing another example of the substrate cleaning process by the substrate processing apparatus 1. In the substrate cleaning process shown in FIG. 11, the processing at the time of cleaning the surface Ws of the substrate W is different from the substrate cleaning process with reference to FIGS. 8A to 10B.

As shown in FIG. 11, when cleaning the front surface Ws of the substrate W, a part of the back surface Wb of the substrate W may be cleaned by the cleaning brush 8. Specifically, the brush transport mechanism 80 transports the cleaning brush 8 to the contact position when cleaning the surface Ws of the substrate W. The contact position is a position where the brush body 810 of the cleaning brush 8 comes into contact with a part of the back surface Wb of the substrate W held by the spin chuck 3.

More specifically, the brush body 810 of the cleaning brush 8 located at the contact position comes into contact with the portion of the back surface Wb of the substrate W that is out of the spin chuck 3 in a plan view. As a result, the brush body 810 of the cleaning brush 8 comes into contact with a part of the back surface Wb of the rotating substrate W to clean a part of the back surface Wb of the substrate W. Specifically, the outer peripheral portion of the back surface Wb of the substrate W is cleaned. According to the substrate cleaning process shown in FIG. 11, in addition to the central portion of the back surface Wb of the substrate W, the outer peripheral portion of the back surface Wb of the substrate W can be cleaned.

The first embodiment has been described above with reference to FIGS. 1 to 11. According to this embodiment, the back surface Wb of the substrate W can be processed without inverting the substrate W. More specifically, both sides of the substrate W can be processed without inverting the substrate W. Therefore, as compared with the configuration in which the substrate W is inverted to process both sides of the substrate W, the number of steps for processing one substrate W can be reduced and the throughput can be improved. Further, according to the present embodiment, the adsorption marks on the back surface Wb of the substrate W can be cleaned.

Further, according to the present embodiment, the cleaning brush 8 can be rotated by using the spin chuck 3. Therefore, it is not necessary to newly provide a rotation mechanism for rotating the cleaning brush 8.

Further, according to the present embodiment, the back surface Wb of the substrate W can be cleaned by the cleaning brush 8 by mounting a mechanism for raising and lowering the substrate W. Therefore, both sides of the substrate W can be cleaned with a simple configuration.

Further, according to the present embodiment, when cleaning the back surface Wb of the substrate W, the suction port 32 of the spin chuck 3 is covered with the cleaning brush 8. Therefore, it is possible to prevent the second treatment liquid from entering the inside of the spin chuck 3 through the suction port 32 when cleaning the back surface Wb of the substrate W.

In the substrate processing apparatus 1 described with reference to FIGS. 1 to 11, the spin chuck 3 attracted the central portion of the lower surface 8b of the cleaning brush 8, but as shown in FIG. 12, the spin chuck 3 is a cleaning brush. A portion other than the central portion of the lower surface 8b of 8 may be adsorbed. In other words, the center of the lower surface 8b of the cleaning brush 8 may be eccentric with respect to the center of the spin chuck 3. FIG. 12 is a diagram showing another example of the suction position of the cleaning brush 8.

As shown in FIG. 12, even if the center of the lower surface 8b of the cleaning brush 8 is eccentric with respect to the center of the spin chuck 3, the range facing the contact surface 31 and the suction port 32 with respect to the back surface Wb of the substrate W. Can be washed. That is, the adsorption marks can be cleaned.

Further, in the substrate processing apparatus 1 described with reference to FIGS. 1 to 11, the cleaning brush 8 has a larger diameter than the suction base 3a, but the cleaning brush 8 has a smaller diameter than the suction base 3a. It may be present, or it may have the same area as the area of the adsorption base 3a in a plan view. As shown in FIG. 12, when the center of the lower surface 8b of the cleaning brush 8 is eccentric with respect to the center of the spin chuck 3, the suction marks are cleaned even if the cleaning brush 8 has a smaller diameter than the suction base 3a. Can be done.

[Embodiment 2]
Subsequently, the second embodiment of the present invention will be described with reference to FIGS. 13 (a) to 15 (b). However, matters different from those of the first embodiment will be described, and explanations of the same matters as those of the first embodiment will be omitted. In the second embodiment, the configurations of the spin chuck 3 and the cleaning brush 8 are different from those in the first embodiment.

First, the spin chuck 3 and the cleaning brush 8 included in the substrate processing apparatus 1 of the second embodiment will be described with reference to FIGS. 13 (a) and 13 (b). FIG. 13A is a plan view showing the spin chuck 3. FIG. 13B is a cross-sectional view of the spin chuck 3 and the cleaning brush 8.

As shown in FIG. 13A, the spin chuck 3 has a first engaging portion 33. The first engaging portion 33 is provided in a region of the contact surface 31 other than the suction port 32. In the present embodiment, the first engaging portion 33 includes a first fitting recess 33a and a second fitting recess 33b. The first fitting recess 33a and the second fitting recess 33b face each other via the suction port 32. The first fitting recess 33a and the second fitting recess 33b have a circular shape in a plan view.

As shown in FIG. 13B, the cleaning brush 8 has a second engaging portion 830. The second engaging portion 830 is provided on the lower surface 820b of the holder 820. The second engaging portion 830 engages with the first engaging portion 33 when the spin chuck 3 attracts the cleaning brush 8.

In the present embodiment, the second engaging portion 830 includes a first convex portion 830a and a second convex portion 830b. The first convex portion 830a and the second convex portion 830b project from the lower surface 820b of the holder 820. The first convex portion 830a and the second convex portion 830b are arranged at positions facing the first fitting recess 33a and the second fitting recess 33b, respectively. The first convex portion 830a and the second convex portion 830b are columnar.

When the spin chuck 3 attracts the cleaning brush 8, the first convex portion 830a and the second convex portion 830b are fitted into the first fitting recess 33a and the second fitting recess 33b, respectively. As a result, the first engaging portion 33 and the second engaging portion 830 are engaged.

The second embodiment has been described above with reference to FIGS. 13 (a) and 13 (b). According to the present embodiment, by engaging the first engaging portion 33 and the second engaging portion 830, the cleaning brush 8 rotates in the rotational direction with respect to the suction base 3a when cleaning the back surface Wb of the substrate W. It is possible to avoid the occurrence of a problem of relative rotation. In other words, it is possible to avoid the occurrence of a problem that the cleaning brush 8 does not rotate when cleaning the back surface Wb of the substrate W.

The first engaging portion 33 has two fitting recesses, but the first engaging portion 33 may have three or more fitting recesses. Similarly, the second engaging portion 830 has two convex portions, but the second engaging portion 830 may have three or more convex portions.

Subsequently, a modified example of the spin chuck 3 (first modified example to third modified example) will be described with reference to FIGS. 14 (a) to 15 (b). First, a first modified example and a second modified example of the spin chuck 3 will be described with reference to FIGS. 14 (a) and 14 (b). FIG. 14A is a plan view showing a first modification of the spin chuck 3. More specifically, FIG. 14A shows a spin chuck 3 adhering to the cleaning brush 8.

The first engaging portion 33 described with reference to FIGS. 13 (a) and 13 (b) has a concave portion having a circular shape in a plan view, whereas the first engaging portion 33 has a concave portion having a circular shape in a plan view. Not limited to. The first engaging portion 33 may have a shape that can be engaged with the second engaging portion 830.

For example, as shown in FIG. 14A, the first engaging portion 33 may have a groove shape. Specifically, the first engaging portion 33 shown in FIG. 14A includes a first groove portion 34a and a second groove portion 34b. The first groove portion 34a and the second groove portion 34b face each other via the suction port 32. The first groove portion 34a and the second groove portion 34b each extend along the circumferential direction.

According to the first modification of the spin chuck 3, the first engaging portion 33 and the second engaging portion 830 can be more easily engaged with each other. Specifically, since the first groove portion 34a extends along the circumferential direction, the work of inserting the first convex portion 830a into the first groove portion 34a becomes easy. Similarly, since the second groove portion 34b extends along the circumferential direction, the work of inserting the second convex portion 830b into the second groove portion 34b becomes easy.

When cleaning the back surface Wb of the substrate W, even if the cleaning brush 8 rotates relative to the suction base 3a in the rotation direction, the first convex portion 830a is one end of the first groove portion 34a in the rotation direction. Locked with. Alternatively, even if the cleaning brush 8 rotates relative to the suction base 3a in the rotation direction, the second convex portion 830b is locked at one end of the second groove portion 34b in the rotation direction. Therefore, it is possible to avoid the occurrence of a problem that the cleaning brush 8 does not rotate.

FIG. 14B is a plan view showing a second modification of the spin chuck 3. More specifically, FIG. 14B shows a spin chuck 3 adhering to the cleaning brush 8. As shown in FIG. 14B, the first engaging portion 33 may be a plan view fan type. Specifically, the first engaging portion 33 shown in FIG. 14B includes a first fan-shaped recess 35a and a second fan-shaped recess 35b. The first fan-shaped recess 35a and the second fan-shaped recess 35b face each other via the suction port 32. Specifically, the main part of the first fan-shaped recess 35a and the main part of the second fan-shaped recess 35b face each other via the suction port 32. Therefore, the first fan-shaped recess 35a and the second fan-shaped recess 35b each expand radially outward from the suction port 32 in a divergent manner.

According to the second modification of the spin chuck 3, the first engagement portion 33 and the second engagement portion 830 can be more easily engaged with each other as in the first modification of the spin chuck 3.

When cleaning the back surface Wb of the substrate W, even if the cleaning brush 8 rotates relative to the suction base 3a in the rotation direction, the first convex portion 830a is one of the first fan-shaped recesses 35a in the rotation direction. Locked at the end. Alternatively, even if the cleaning brush 8 rotates relative to the suction base 3a in the rotation direction, the second convex portion 830b is locked at one end of the second fan-shaped recess 35b in the rotation direction. Therefore, it is possible to avoid the occurrence of a problem that the cleaning brush 8 does not rotate.

Subsequently, a third modification example of the spin chuck 3 will be described with reference to FIGS. 15 (a) and 15 (b). 15 (a) and 15 (b) are plan views showing a third modification of the spin chuck 3. Specifically, FIG. 15B shows a spin chuck 3 adhering to the cleaning brush 8.

As shown in FIG. 15A, the spin chuck 3 may have a plurality of first engaging portions 33 arranged at different positions from each other. The third modification of the spin chuck 3 has three first engaging portions 33. Specifically, the three first engaging portions 33 are a first engaging portion 33 composed of a pair of a first fitting recess 33a1 and a second fitting recess 33b1, a first fitting recess 33a2, and a second fitting recess 33a2. It includes a first engaging portion 33 formed of a set of a fitting recess 33b2 and a first engaging portion 33 formed of a set of a first fitting recess 33a3 and a second fitting recess 33b3.

Hereinafter, the first engaging portion 33 composed of a pair of the first fitting recess 33a1 and the second fitting recess 33b1 is described as "+ X side engaging portion 33", and the first fitting recess 33a2 and the second fitting recess 33a2 are secondly fitted. The first engaging portion 33 composed of a pair with the recess 33b2 is described as "center engaging portion 33", and the first engaging portion 33 composed of a pair of the first fitting recess 33a3 and the second fitting recess 33b3 is described as "center engaging portion 33". -X side engaging portion 33 ".

The + X side engaging portion 33, the central engaging portion 33, and the −X side engaging portion 33 are arranged in this order. Specifically, the first fitting recess 33a2 and the second fitting recess 33b2 of the central engaging portion 33 face each other via the suction port 32. The first fitting recess 33a1 of the + X side engaging portion 33 is located on one side (+ X side) with respect to the first fitting recess 33a2 of the central engaging portion 33, and is the first of the −X side engaging portion 33. The fitting recess 33a3 is located on the opposite side (−X side) of the first fitting recess 33a2 of the central engaging portion 33. Similarly, the second fitting recess 33b1 of the + X side engaging portion 33 is located on one side (+ X side) with respect to the second fitting recess 33b2 of the central engaging portion 33, and the −X side engaging portion 33. The second fitting recess 33b3 is located on the other side (−X side) of the central engaging portion 33 with respect to the second fitting recess 33b2.

According to the third modification of the spin chuck 3, as shown in FIG. 15B, the first engaging portion 33 to which the second engaging portion 830 of the cleaning brush 8 is engaged is engaged with the three first engaging portions 33. By changing between the portions 33, the position of the cleaning brush 8 with respect to the spin chuck 3 can be easily changed. Therefore, the cleaning range can be easily changed by the cleaning brush 8.

In FIG. 15B, the shaded portion is the first engaging portion with which the second engaging portion 830 (first convex portion 830a and second convex portion 830b) of the cleaning brush 8 is engaged. 33 is shown. Specifically, in FIG. 15B, the second engaging portion 830 (first convex portion 830a and second convex portion 830b) of the cleaning brush 8 has a + X side engaging portion 33 (first fitting recess 33a1). And the state of being engaged with the second fitting recess 33b1) are shown. In this case, the center of the lower surface 8b of the cleaning brush 8 is eccentric to one side (+ X side) with respect to the center of the spin chuck 3.

The spin chuck 3 described with reference to FIGS. 15A and 15B has three first engaging portions 33, but the number of first engaging portions 33 is not limited to three. .. The spin chuck 3 may have two first engaging portions 33, or may have four or more first engaging portions 33.

The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 15 (b)). However, the present invention is not limited to the above-described embodiment, and can be implemented in various aspects without departing from the gist thereof. In addition, the plurality of components disclosed in the above-described embodiment can be appropriately modified. For example, one component of all components shown in one embodiment may be added to another component of another embodiment, or some component of all components shown in one embodiment. The element may be removed from the embodiment.

The drawings are schematically shown mainly for each component in order to facilitate the understanding of the invention, and the thickness, length, number, spacing, etc. of each of the illustrated components are convenient for drawing creation. It may be different from the actual one from the top. Further, the configuration of each component shown in the above embodiment is an example and is not particularly limited, and it goes without saying that various changes can be made without substantially deviating from the effect of the present invention. ..

For example, in the embodiment described with reference to FIGS. 1 to 15 (b), the brush body 810 of the cleaning brush 8 has a circular shape in a plan view, but the shape of the brush body 810 is a back surface Wb of the substrate W. As long as it can be washed, it is not particularly limited. For example, the brush body 810 may have a rectangular shape in a plan view.

Further, in the embodiment described with reference to FIGS. 1 to 15 (b), the substrate processing apparatus 1 processed the front surface Ws of the substrate W and then processed the back surface Wb of the substrate W. , The front surface Ws of the substrate W may be processed after the back surface Wb of the substrate W is processed.

Further, in the embodiment described with reference to FIGS. 1 to 15 (b), the substrate processing apparatus 1 treats the surface Ws of the substrate W with the first processing liquid, but the substrate processing apparatus 1 uses a cleaning brush. The surface Ws of the substrate W may be treated. In this case, the substrate processing device 1 includes a moving mechanism for moving the cleaning brush to bring the cleaning brush into contact with the surface Ws of the substrate W.

Further, in the embodiment described with reference to FIGS. 1 to 15 (b), the center robot CR attaches the substrate to the first gripping pin 5a and the second gripping pin 5b when the substrate W is carried into the chamber 2. Although the W is delivered, the center robot CR may deliver the substrate W to the spin chuck 3 when the substrate W is carried into the chamber 2.

Further, in the embodiment described with reference to FIGS. 1 to 15 (b), the substrate processing device 1 raises and lowers the substrate W, but the substrate processing device 1 may raise and lower the spin chuck 3. Alternatively, both the substrate W and the spin chuck 3 may be raised and lowered. In this case, the substrate processing device 1 includes an elevating mechanism for elevating and lowering the spin chuck 3.

Further, in the embodiment described with reference to FIGS. 1 to 15 (b), the first gripping pin 5a and the second gripping pin 5b hold the substrate W, but the substrate processing apparatus 1 uses the gripping pin to hold the substrate W. Instead of the configuration for holding the substrate W, a configuration for holding the substrate W by vacuum suction may be provided. Specifically, the substrate processing apparatus 1 may have a configuration in which the surface Ws of the substrate W is vacuum-sucked.

Further, in the embodiment described with reference to FIGS. 1 to 15 (b), the first gripping pin 5a projects downward from the first arm 61a in the first moving mechanism 6a, and the second gripping pin 5a in the second moving mechanism 6b. The pin 5b protrudes downward from the second arm 61b, but the first gripping pin 5a protrudes upward from the first arm 61a in the first moving mechanism 6a, and the second gripping pin 5b protrudes upward from the first arm 61a. 5b may be configured to project upward from the second arm 61b.

Further, in the embodiment with reference to FIGS. 13 (a) to 15 (b), the first fitting recess 33a has a circular shape in a plan view, but the first fitting recess 33a is not limited to the circular shape in a plan view. .. For example, the first fitting recess 33a may have a rectangular shape in a plan view. Similarly, in the embodiment with reference to FIGS. 13 (a) to 15 (b), the second fitting recess 33b has a circular shape in a plan view, but the second fitting recess 33b is limited to a circular shape in a plan view. Not done. For example, the second fitting recess 33b may have a rectangular shape in a plan view.

Further, in the embodiment with reference to FIGS. 13 (a) to 15 (b), the first convex portion 830a is columnar, but the first convex portion 830a is not limited to the columnar shape. The shape of the first convex portion 830a may be any shape as long as it can engage with the first engaging portion 33, and may be, for example, a prismatic shape. Similarly, in the embodiment with reference to FIGS. 13 (a) to 15 (b), the second convex portion 830b is columnar, but the second convex portion 830b is not limited to the columnar shape. The shape of the second convex portion 830b may be any shape as long as it can engage with the first engaging portion 33, and may be, for example, a prismatic shape.

Further, in the embodiment with reference to FIGS. 13 (a) to 15 (b), the first engaging portion 33 has a concave portion and the second engaging portion 830 has a convex portion, but the first engaging portion has a convex portion. The portion 33 may have a convex portion and the second engaging portion 830 may have a concave portion.

The present invention is useful in the field of processing substrates.

1: Substrate processing device 3: Spin chuck 4: Spin motor unit 5a: First gripping pin 5b: Second gripping pin 6a: First moving mechanism 6b: Second moving mechanism 7: First nozzle 8: Cleaning brush 8b: Bottom surface 31: Contact surface 32: Suction port 33: First engaging portion 70: Nozzle moving mechanism 80: Brush transport mechanism 101: Control device 102: Control unit 104: Storage unit 810: Brush body 820: Holder 820b: Bottom surface 830: First 2 Engagement part W: Substrate Wb: Back surface Ws: Front surface

Claims (9)

A cleaning brush having a brush body for cleaning the substrate and a holder to which the brush body is attached.
A first holding portion that attracts the lower surface of the holder on the side opposite to the brush body to hold the cleaning brush, and a first holding portion.
A delivery position where the cleaning brush is delivered to the first holding portion so that the first holding portion attracts the lower surface of the cleaning brush, and a retracted position where the cleaning brush does not overlap with the first holding portion in a plan view. A transport mechanism that transports the cleaning brush between and
A second holding portion for holding the substrate and
A moving mechanism that moves at least one of the first holding portion and the second holding portion to bring the brush body of the cleaning brush into contact with the back surface of the substrate.
A rotation drive unit for rotating the first holding portion for holding the cleaning brush and integrally rotating the cleaning brush with the first holding portion is provided.
The cleaning brush cleans the back surface of the substrate by rotating.
The second holding portion is a substrate processing device that holds a portion of the substrate that is different from the range cleaned by the cleaning brush. The first holding portion is
A contact surface that contacts the lower surface of the cleaning brush,
With the suction port formed on the contact surface,
It has a first engaging portion provided in a region other than the suction port of the contact surface, and has a first engaging portion.
The cleaning brush has a second engaging portion that engages with the first engaging portion.
The substrate processing apparatus according to claim 1, wherein the second engaging portion is provided on the lower surface of the holder. The substrate processing apparatus according to claim 2, wherein the first holding portion has a plurality of the first engaging portions arranged at different positions from each other. The substrate processing apparatus according to any one of claims 1 to 3, wherein the brush body of the cleaning brush has a convex shape or a concave shape. The first holding portion according to any one of claims 1 to 4, wherein the first holding portion holds the substrate by sucking the central portion of the back surface of the substrate while the cleaning brush is located at the retracted position. The substrate processing apparatus described. The transport mechanism transports the cleaning brush to a contact position where the brush body of the cleaning brush comes into contact with a part of the back surface of the substrate held by the first holding portion.
The brush body of the cleaning brush located at the contact position comes into contact with a portion of the back surface of the substrate that is detached from the first holding portion in a plan view.
The rotation drive unit rotates the substrate by rotating the first holding unit that holds the substrate.
The substrate processing apparatus according to claim 5, wherein the cleaning brush cleans a part of the back surface of the substrate by coming into contact with the rotating substrate. The substrate processing apparatus according to claim 5 or 6, further comprising a cleaning portion for cleaning the surface of the substrate held by the first holding portion. The second holding portion holds the substrate held by the first holding portion, and holds the substrate.
The moving mechanism moves at least one of the first holding portion and the second holding portion to separate the substrate from the first holding portion.
The substrate processing apparatus according to any one of claims 5 to 7, wherein the transport mechanism transports the cleaning brush to the delivery position while the substrate is separated from the first holding portion. A substrate processing method for cleaning the back surface of a substrate using a cleaning brush having a brush body for cleaning the substrate and a holder to which the brush body is attached.
A process in which the transport mechanism conveys the cleaning brush and delivers the cleaning brush to the first holding portion.
A step in which the first holding portion attracts the lower surface of the holder on the side opposite to the brush body to hold the cleaning brush.
A step in which the moving mechanism moves at least one of the first holding portion and the second holding portion that holds the substrate to bring the back surface of the substrate into contact with the brush body of the cleaning brush.
Substrate processing including a step in which the rotation driving unit rotates the first holding portion that holds the cleaning brush and cleans the back surface of the substrate with the cleaning brush that rotates integrally with the first holding portion. Method.

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