JP2009123801A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding unit cleaning system capable of maintaining a holding unit of a substrate transport means in a clean condition. <P>SOLUTION: A spin chuck 51 is rotatably driven by a chuck rotating mechanism 511 while a substrate Wa for cleaning is held in the spin chuck 51. In this way, the substrate Wa for cleaning is rotated. A hand CRH1 of a first center robot CR 1 moves so as to surround the rotating substrate Wa for cleaning. In that state, the hand CRH1 subtly reciprocates in vertical and horizontal directions. In this way, the hand CRH1 slightly abuts on the outer edge of the rotating substrate Wa for cleaning. Thus, contaminants adhering on the hand CRH1 can be abraded by the substrate Wa for cleaning. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for processing a substrate.

  2. Description of the Related Art Conventionally, a substrate processing apparatus has been used to perform various processes on a substrate such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a glass substrate for an optical disk.

  For example, the substrate processing apparatus is provided with a film formation processing unit that performs film formation processing on the substrate and a transfer robot that transfers the substrate. The transfer robot is provided with a hand for holding the outer peripheral edge of the substrate. The transfer robot holds the substrate with a hand and carries the substrate into and out of the film forming unit.

  By the way, during the film forming process, various films are formed on the substrate. The film may also be formed on the outer peripheral edge of the substrate. In that case, when the substrate after film formation is held by the hand of the transfer robot, the film formed on the outer peripheral edge of the substrate may be peeled off and adhere to the transfer robot hand as a contaminant. If contaminants adhere to the hand of the transfer robot, the contaminants may transfer to another substrate and cause a substrate processing failure. In addition, the contaminants may fall into the substrate processing apparatus, causing a malfunction of the substrate processing apparatus.

Therefore, it has been proposed to perform an edge rinse process on the substrate after the film formation process (see, for example, Patent Document 1). In the edge rinse process, a chemical solution is supplied to the peripheral part of the substrate after the film formation process, whereby the film formed on the peripheral part of the substrate is removed. Thereby, contamination of the hand of the transfer robot can be suppressed.
Japanese Patent Laid-Open No. 2-51219

  However, even when the edge rinsing process is performed, the film adhering to the peripheral edge of the substrate may not be sufficiently removed. Therefore, contamination of the hand of the transfer robot cannot be sufficiently prevented. Further, other contaminants (dust etc.) other than the film formed on the substrate may adhere to the hand of the transfer robot, and the contaminants may be transferred to the substrate, resulting in substrate processing failure.

  The objective of this invention is providing the holding | maintenance part washing | cleaning system which can maintain the holding | maintenance part of a board | substrate conveyance means cleanly.

  (1) A substrate processing apparatus according to a first aspect of the present invention includes a processing unit that processes a substrate, a holding unit that holds the substrate, and a moving mechanism that moves the holding unit, and the substrate between the predetermined position and the processing unit. A substrate transport unit for transporting the substrate, a control unit for controlling the processing unit and the substrate transport unit, and a holding unit for cleaning the holding unit of the substrate transport unit provided in at least one of the substrate transport path and the processing unit by the substrate transport unit The holding unit cleaning unit includes a substrate holding and rotating unit that rotates the substrate while holding the substrate in a horizontal posture, and the control unit holds the holding unit on the substrate that is rotated by the substrate holding and rotating unit when cleaning the holding unit. The substrate holding and rotating means and the moving mechanism are controlled so that they come into contact with each other.

  In the substrate processing apparatus, the substrate is transferred between a predetermined position and the processing unit by the substrate transfer means, and the substrate is processed by the processing unit. The holding unit of the substrate transfer unit is cleaned by the holding unit cleaning unit in at least one of the substrate transfer path by the substrate transfer unit and the processing unit.

  When cleaning the holding unit, the substrate is held and rotated in a horizontal posture by the substrate holding and rotating means. In this state, the holding unit moves by the moving mechanism so as to come into contact with the substrate. In this case, contaminants adhering to the holding part are removed by friction between the substrate and the holding part.

  Thereby, the holding | maintenance part of a board | substrate conveyance means can be maintained cleanly. Accordingly, it is possible to prevent the contaminants from being transferred to the substrate before or after the processing by the processing unit via the holding unit, and the contaminants from falling into the substrate processing apparatus from the holding unit. As a result, the processing failure of the substrate and the operation failure of the substrate processing apparatus are prevented.

  Moreover, since a holding | maintenance part can be maintained cleanly without requiring a manual labor, the increase in a user's work burden can be suppressed.

  (2) The processing unit includes a first substrate holding / rotating device provided in common with the substrate holding / rotating unit of the holding unit cleaning unit, and a processing unit that performs processing on the substrate rotated by the first substrate holding / rotating device. The control unit may control the first substrate holding and rotating device and the moving mechanism so that the holding unit comes into contact with the substrate rotated by the first substrate holding and rotating device when the holding unit is cleaned.

  In this case, when the substrate is processed, the substrate is held and rotated by the first substrate holding and rotating device, and the substrate is processed by the processing means. At the time of cleaning the holding unit, the substrate is held and rotated by the first substrate holding and rotating device, and the holding unit moves so as to come into contact with the substrate.

  As described above, the first substrate holding / rotating device of the processing unit is used both for processing the substrate and for cleaning the holding unit, thereby suppressing an increase in size and cost of the substrate processing device.

  (3) The substrate processing apparatus further includes a substrate platform that is provided in the transport path and on which the substrate is temporarily placed, and the substrate platform is provided in common with the substrate holding and rotating unit of the holding unit cleaning unit. The second substrate holding and rotating device and the moving mechanism are arranged so that the holding unit comes into contact with the substrate rotated by the second substrate holding and rotating device when the holding unit is cleaned. May be controlled.

  In this case, at the time of processing the substrate, the substrate transported by the substrate transport means is temporarily placed on the substrate platform. At the time of cleaning the holding unit, the substrate mounting unit rotates and holds the substrate by the second substrate holding and rotating device, and the holding unit moves so as to come into contact with the substrate.

  As described above, since the holding unit is cleaned in the substrate transfer path by the substrate transfer unit, it is not necessary to secure a space for cleaning the holding unit separately from a space for processing the substrate. Therefore, an increase in the size and cost of the substrate processing apparatus is suppressed.

  (4) The substrate holding and rotating means may hold the cleaning substrate when cleaning the holding portion, and the outer peripheral portion of the cleaning substrate may have a flexible cleaning member.

  In this case, by bringing the holding portion into contact with the cleaning substrate held and rotated by the substrate holding and rotating means, the contaminants attached to the holding portion can be reliably removed by the flexible cleaning member. Thereby, the holding | maintenance part of a board | substrate conveyance means can be maintained more cleanly.

  (5) The substrate processing apparatus may further include a cleaning liquid supply unit that supplies a cleaning liquid to the substrate rotated by the substrate holding and rotating unit after cleaning the holding unit.

  In this case, the contaminants transferred from the holding unit to the substrate can be washed away by supplying a cleaning liquid to the substrate after cleaning the holding unit. Thereby, it is possible to repeatedly use the same substrate for cleaning the holding unit.

  (6) The holding unit includes a support member that supports the outer peripheral end of the substrate, and the control unit rotates and holds the substrate so that the support member of the holding unit contacts the outer peripheral end of the substrate rotated by the substrate holding and rotating unit. The means and the moving mechanism may be controlled.

  In this case, the contact area between the holding portion and the substrate is reduced by supporting the outer peripheral end portion of the substrate by the support member. Therefore, transfer of contaminants between the holding unit and the substrate is suppressed. Further, when the support member of the holding unit comes into contact with the outer peripheral end of the substrate rotated by the substrate holding and rotating means, contaminants attached to the support member are removed. This sufficiently prevents the contaminants from being transferred to the substrate before or after the processing by the processing unit via the support member, and the contaminants from dropping from the support member into the substrate processing apparatus.

  (7) A holding unit cleaning system according to a second aspect of the invention is a holding unit cleaning system for cleaning a holding unit that holds a substrate in the substrate transfer unit, and the substrate holding and rotating unit that rotates while holding the substrate in a horizontal posture. And a control means for controlling the substrate holding and rotating means and the substrate transport means so that the holding portion contacts the substrate rotated by the substrate holding and rotating means.

  In the holding unit cleaning system, the substrate is held and rotated in a horizontal posture by the substrate holding and rotating means. In this state, the holding unit of the substrate transport unit comes into contact with the rotating substrate. In this case, contaminants adhering to the holding part are removed by friction between the substrate and the holding part.

  Thereby, the holding | maintenance part of a board | substrate conveyance means can be maintained cleanly. Therefore, it is possible to prevent contaminants from being transferred to the substrate to be subjected to various treatments via the holding unit. As a result, the occurrence of processing defects on the substrate is prevented.

  Moreover, since the holding | maintenance part of a board | substrate conveyance means can be maintained cleanly without requiring a manual labor, the increase in a user's work burden can be suppressed.

  According to the present invention, it is possible to keep the holding portion of the substrate transfer means clean. Accordingly, it is possible to prevent the contaminants from being transferred to the substrate before or after the processing by the processing unit via the holding unit, and the contaminants from falling into the substrate processing apparatus from the holding unit. As a result, the processing failure of the substrate and the operation failure of the substrate processing apparatus are prevented. Moreover, since a holding | maintenance part can be maintained cleanly without requiring a manual labor, the increase in a user's work burden can be suppressed.

  Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, a photomask glass substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, and the like. Say.

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. In addition, in FIG. 1 and FIGS. 2 to 4 to be described later, in order to clarify the positional relationship, arrows indicating the X direction, the Y direction, and the Z direction orthogonal to each other are attached. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction. In each direction, the direction in which the arrow points is the + direction, and the opposite direction is the-direction. Further, the rotation direction around the Z direction is defined as the θ direction.

  As shown in FIG. 1, the substrate processing apparatus 500 includes an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, a resist cover film processing block 13, and a resist cover film removal block. 14 and an interface block 15. An exposure device 16 is arranged adjacent to the interface block 15. In the exposure apparatus 16, the substrate W is subjected to an exposure process by a liquid immersion method.

  Hereinafter, each of the indexer block 9, the antireflection film processing block 10, the resist film processing block 11, the development processing block 12, the resist cover film processing block 13, the resist cover film removal block 14 and the interface block 15 is referred to as a processing block. Call.

  The indexer block 9 includes a main controller (control unit) 30 that controls the operation of each processing block, a plurality of carrier platforms 40, and an indexer robot IR. The indexer robot IR is provided with a hand IRH for delivering the substrate W.

  The antireflection film processing block 10 includes antireflection film heat treatment units 100 and 101, an antireflection film application processing unit 50, and a first central robot CR1. The antireflection film coating processing unit 50 is provided opposite to the antireflection film heat treatment units 100 and 101 with the first central robot CR1 interposed therebetween. The first center robot CR1 is provided with hands CRH1 and CRH2 for transferring the substrate W up and down.

  A partition wall 17 is provided between the indexer block 9 and the antireflection film processing block 10 for shielding the atmosphere. On the partition wall 17, the substrate platforms PASS 1, PASS 2 and the cleaning substrate storage unit ST 1 are stacked one above the other. The substrate platform PASS1 is used when the substrate W is transported from the indexer block 9 to the antireflection film processing block 10, and the substrate platform PASS2 is used to transfer the substrate W from the antireflection film processing block 10 to the indexer block 9. Used when transporting to. The cleaning substrate storage unit ST1 stores a cleaning substrate for cleaning the hands CRH1 and CRH2 of the first central robot CR1. For example, an unprocessed substrate W is used as the cleaning substrate.

  The substrate platforms PASS1, PASS2 are provided with optical sensors (not shown) that detect the presence or absence of the substrate W. Thereby, it is possible to determine whether or not the substrate W is placed on the substrate platforms PASS1 and PASS2. The substrate platforms PASS1, PASS2 are provided with a plurality of support pins fixedly installed. The optical sensor and the support pin are also provided in the same manner on the substrate platforms PASS3 to PASS13 described later.

  The cleaning substrate storage unit ST1 has the same configuration as the substrate platforms PASS1 and PASS2, and the cleaning substrate is mounted on a plurality of fixed support pins. Cleaning substrate storage units ST2 to ST7 described later have the same configuration as the cleaning substrate storage unit ST1.

  The resist film processing block 11 includes resist film heat treatment units 110 and 111, a resist film coating processing unit 60, and a second central robot CR2. The resist film application processing unit 60 is provided to face the resist film heat treatment units 110 and 111 with the second central robot CR2 interposed therebetween. The second center robot CR2 is provided with hands CRH3 and CRH4 for transferring the substrate W up and down.

  A partition wall 18 is provided between the antireflection film processing block 10 and the resist film processing block 11 for shielding the atmosphere. On the partition wall 18, the substrate platforms PASS 3 and PASS 4 and the cleaning substrate storage unit ST 2 are stacked one above the other. The substrate platform PASS3 is used when transporting the substrate W from the antireflection film processing block 10 to the resist film processing block 11, and the substrate platform PASS4 reflects the substrate W from the resist film processing block 11. It is used when transporting to the processing block 10 for the prevention film. The cleaning substrate storage unit ST2 stores a cleaning substrate for cleaning the hands CRH3 and CRH4 of the second central robot CR2.

  The development processing block 12 includes development heat treatment units 120 and 121, a development processing unit 70, and a third central robot CR3. The development processing unit 70 is provided to face the development heat treatment units 120 and 121 with the third central robot CR3 interposed therebetween. The third center robot CR3 is provided with hands CRH5 and CRH6 for transferring the substrate W up and down.

  A partition wall 19 is provided between the resist film processing block 11 and the development processing block 12 for shielding the atmosphere. In the partition wall 19, the substrate platforms PASS 5 and PASS 6 and the cleaning substrate storage unit ST 3 are stacked one above the other. The substrate platform PASS5 is used to transport the substrate W from the resist film processing block 11 to the development processing block 12, and the substrate platform PASS6 is used to transfer the substrate W from the development processing block 12 to the resist film processing block 11. Used when transporting to. The cleaning substrate storage unit ST3 stores a cleaning substrate for cleaning the hands CRH5 and CRH6 of the third central robot CR3.

  The resist cover film processing block 13 includes resist cover film heat treatment units 130 and 131, a resist cover film coating processing unit 80, and a fourth central robot CR4. The resist cover film coating processing unit 80 is provided to face the resist cover film heat treatment units 130 and 131 with the fourth central robot CR4 interposed therebetween. The fourth center robot CR4 is provided with hands CRH7 and CRH8 for delivering the substrate W up and down.

  A partition wall 20 is provided between the development processing block 12 and the resist cover film processing block 13 for shielding the atmosphere. In the partition wall 20, the substrate platforms PASS 7 and PASS 8 and the cleaning substrate storage unit ST 4 are stacked one above the other. The substrate platform PASS7 is used when the substrate W is transferred from the development processing block 12 to the resist cover film processing block 13, and the substrate platform PASS8 is developed from the resist cover film processing block 13. Used when transporting to block 12. The cleaning substrate storage unit ST4 stores a cleaning substrate for cleaning the hands CRH7 and CRH8 of the fourth central robot CR4.

  The resist cover film removal block 14 includes post-exposure baking heat treatment units 140 and 141, a resist cover film removal processing unit 90, and a fifth central robot CR5. The post-exposure bake heat treatment unit 141 is adjacent to the interface block 15 and includes substrate platforms PASS11 and PASS12 as described later. The resist cover film removal processing unit 90 is provided to face the post-exposure bake heat treatment units 140 and 141 with the fifth central robot CR5 interposed therebetween. The fifth center robot CR5 is provided with hands CRH9 and CRH10 for transferring the substrate W up and down.

  A partition wall 21 is provided between the resist cover film processing block 13 and the resist cover film removal block 14 for shielding the atmosphere. In the partition wall 21, the substrate platforms PASS9 and PASS10 and the cleaning substrate storage unit ST5 are stacked one above the other. The substrate platform PASS9 is used when the substrate W is transferred from the resist cover film processing block 13 to the resist cover film removal block 14, and the substrate platform PASS10 is used to transfer the substrate W from the resist cover film removal block 14 to the resist cover film removal block 14. Used when transported to the cover film processing block 13. The cleaning substrate storage unit ST5 stores a cleaning substrate for cleaning the hands CRH9 and CRH10 of the fifth central robot CR5.

  The interface block 15 includes a sending buffer unit SBF, a cleaning / drying processing unit SD1, a sixth central robot CR6, an edge exposure unit EEW, a return buffer unit RBF, a placement and cooling unit PASS-CP (hereinafter abbreviated as P-CP). ), A substrate platform PASS13, cleaning substrate storage units ST6 and ST7, an interface transport mechanism IFR, and a cleaning / drying processing unit SD2. The cleaning / drying processing unit SD1 performs cleaning and drying processing of the substrate W before the exposure processing, and the cleaning / drying processing unit SD2 performs cleaning and drying processing of the substrate W after the exposure processing.

  The sixth central robot CR6 is provided with hands CRH11 and CRH12 (see FIG. 4) for delivering the substrate W up and down, and a hand H1 for delivering the substrate W to the interface transport mechanism IFR. , H2 (see FIG. 4) are provided above and below. Details of the interface block 15 will be described later.

  In the substrate processing apparatus 500 according to the present embodiment, an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, a resist cover film processing block 13, along the Y direction, The resist cover film removal block 14 and the interface block 15 are arranged in order.

  2 is a schematic side view of the substrate processing apparatus 500 of FIG. 1 viewed from the + X direction, and FIG. 3 is a schematic side view of the substrate processing apparatus 500 of FIG. 1 viewed from the −X direction. 2 mainly shows what is provided on the + X side of the substrate processing apparatus 500, and FIG. 3 mainly shows what is provided on the −X side of the substrate processing apparatus 500.

  First, the configuration on the + X side of the substrate processing apparatus 500 will be described with reference to FIG. As shown in FIG. 2, in the antireflection film coating processing unit 50 (see FIG. 1) of the antireflection film processing block 10, three coating units BARC are vertically stacked. Each coating unit BARC includes a spin chuck 51 that rotates while adsorbing and holding the substrate W in a horizontal posture, and a supply nozzle 52 that supplies a coating liquid for an antireflection film to the substrate W held on the spin chuck 51. Each coating unit BARC includes a cleaning nozzle 55 (see FIG. 6 described later) for supplying a cleaning liquid to the cleaning substrate.

  In the resist film coating processing section 60 (see FIG. 1) of the resist film processing block 11, three coating units RES are stacked in a vertical direction. Each coating unit RES includes a spin chuck 61 that rotates while adsorbing and holding the substrate W in a horizontal posture, and a supply nozzle 62 that supplies a coating liquid for a resist film to the substrate W held on the spin chuck 61. Each coating unit RES includes a cleaning nozzle (not shown) that supplies a cleaning liquid to the cleaning substrate.

  In the development processing unit 70 of the development processing block 12, five development processing units DEV are stacked one above the other. Each development processing unit DEV includes a spin chuck 71 that rotates by sucking and holding the substrate W in a horizontal posture, and a supply nozzle 72 that supplies the developer to the substrate W held on the spin chuck 71. Each development processing unit DEV includes a cleaning nozzle (not shown) for supplying a cleaning liquid to the cleaning substrate.

  In the resist cover film coating processing unit 80 of the resist cover film processing block 13, three coating units COV are stacked one above the other. Each coating unit COV includes a spin chuck 81 that rotates while adsorbing and holding the substrate W in a horizontal posture, and a supply nozzle 82 that supplies a coating liquid for the resist cover film to the substrate W held on the spin chuck 81. As a coating solution for the resist cover film, a material having a low affinity with the resist and water (a material having low reactivity with the resist and water) can be used. For example, a fluororesin. The coating unit COV forms a resist cover film on the resist film formed on the substrate W by applying a coating liquid onto the substrate W while rotating the substrate W. Each coating unit COV includes a cleaning nozzle (not shown) for supplying a cleaning liquid to the cleaning substrate.

  In the resist cover film removal processing unit 90 of the resist cover film removal block 14, three removal units REM are vertically stacked. Each removal unit REM includes a spin chuck 91 that rotates while adsorbing and holding the substrate W in a horizontal posture, and a supply nozzle 92 that supplies a peeling liquid (for example, a fluororesin) to the substrate W held on the spin chuck 91. The removal unit REM removes the resist cover film formed on the substrate W by applying a stripping solution onto the substrate W while rotating the substrate W. Each removal unit REM includes a cleaning nozzle (not shown) for supplying a cleaning liquid to the cleaning substrate.

  The method for removing the resist cover film in the removal unit REM is not limited to the above example. For example, the resist cover film may be removed by supplying a stripping solution onto the substrate W while moving the slit nozzle above the substrate W.

  On the + X side in the interface block 15, an edge exposure unit EEW and three cleaning / drying processing units SD2 are stacked in a vertical direction. Each edge exposure unit EEW includes a spin chuck 98 that rotates by attracting and holding the substrate W in a horizontal posture, and a light irradiator 99 that exposes the periphery of the substrate W held on the spin chuck 98. Each cleaning / drying processing unit SD2 has a supply nozzle (not shown) for supplying a cleaning liquid or an inert gas to the spin chuck 105 that rotates by sucking and holding the substrate W in a horizontal posture and the substrate W held on the spin chuck 105. ). Each cleaning / drying processing unit SD2 includes a cleaning nozzle (not shown) for supplying a cleaning liquid to the cleaning substrate.

  Next, the configuration on the −X side of the substrate processing apparatus 500 will be described with reference to FIG. 3. As shown in FIG. 3, two heating units (hot plates) HP and two cooling units (cooling plates) CP are provided in the antireflection film heat treatment units 100 and 101 of the antireflection film processing block 10, respectively. Laminated. Further, in the antireflection film heat treatment units 100 and 101, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are respectively arranged at the top.

  Two heating units HP and two cooling units CP are stacked in the resist film heat treatment sections 110 and 111 of the resist film processing block 11, respectively. In addition, in the resist film heat treatment units 110 and 111, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are respectively arranged at the top.

  In the development heat treatment sections 120 and 121 of the development processing block 12, two heating units HP and two cooling units CP are respectively stacked. Further, in the development heat treatment sections 120 and 121, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are respectively arranged at the top.

  In the resist cover film heat treatment sections 130 and 131 of the resist cover film processing block 13, two heating units HP and two cooling units CP are respectively stacked. In addition, in the resist cover film heat treatment sections 130 and 131, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are respectively arranged at the top.

  In the post-exposure baking heat treatment section 140 of the resist cover film removal block 14, two heating units HP and two cooling units CP are stacked one above the other, and the two post-exposure baking heat treatment section 141 has two heating units. The unit HP, the two cooling units CP, and the substrate platforms PASS11 and PASS12 are stacked one above the other. In addition, in the post-exposure bake heat treatment sections 140 and 141, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are arranged at the top.

  On the −X side in the interface block 15, the feed buffer unit SBF and the three cleaning / drying processing units SD <b> 1 are stacked one above the other. Each cleaning / drying processing unit SD1 includes a spin chuck 106 that rotates by sucking and holding the substrate W in a horizontal posture and a supply nozzle (not shown) that supplies a cleaning liquid or an inert gas to the substrate W held on the spin chuck 106. ). Each cleaning / drying processing unit SD1 includes a cleaning nozzle (not shown) for supplying a cleaning liquid to the cleaning substrate.

  Next, the interface block 15 will be described in detail with reference to FIG.

  FIG. 4 is a schematic side view of the interface block 15 as viewed from the + Y side. As shown in FIG. 4, in the interface block 15, on the −X side, a feed buffer unit SBF and three cleaning / drying processing units SD1 are stacked. In the interface block 15, an edge exposure unit EEW is disposed at the upper part on the + X side.

  Below the edge exposure unit EEW, the return buffer unit RBF, the placement / cooling unit P-CP, the substrate platform PASS13, and the cleaning substrate storage units ST6 and ST7 are vertically arranged at a substantially central portion in the interface block 15. Laminated. The cleaning substrate storage unit ST6 stores cleaning substrates for cleaning the hands CRH11 and CRH12 of the sixth central robot CR6. The cleaning substrate storage unit ST7 stores the hands H1 and H1 of the interface transport mechanism IFR. A cleaning substrate for cleaning H2 is stored. Below the edge exposure unit EEW, on the + X side in the interface block 15, three cleaning / drying processing units SD2 are stacked one above the other.

  A sixth center robot CR6 and an interface transport mechanism IFR are provided in the lower part of the interface block 15. The sixth central robot CR6 includes a feed buffer unit SBF and a cleaning / drying processing unit SD1, an edge exposure unit EEW, a return buffer unit RBF, a mounting / cooling unit P-CP, a substrate mounting unit PASS13, and a cleaning substrate storage. It is provided so as to be movable up and down and rotatable with respect to the part ST6. The interface transport mechanism IFR is movable up and down between the return buffer unit RBF, the placement / cooling unit P-CP, the substrate platform PASS13, the cleaning substrate storage unit ST7, and the cleaning / drying processing unit SD2. It is provided to be movable.

(2) Operation of Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 500 during the processing of the substrate W will be described with reference to FIGS.

(2-1) Operation of Indexer Block to Resist Cover Film Removal Block First, the operation of the indexer block 9 to the resist cover film removal block 14 will be briefly described.

  On the carrier mounting table 40 of the indexer block 9, a carrier C that stores a plurality of substrates W in multiple stages is loaded. The indexer robot IR takes out the unprocessed substrate W stored in the carrier C using the hand IRH. Thereafter, the indexer robot IR rotates in the ± θ direction while moving in the ± X direction, and places the unprocessed substrate W on the substrate platform PASS1.

  In the present embodiment, a front opening unified pod (FOUP) is adopted as the carrier C. However, the present invention is not limited to this, and an OC (open cassette) that exposes the standard mechanical interface (SMIF) pod and the storage substrate W to the outside air. ) Etc. may be used.

  Further, the indexer robot IR, the first to sixth center robots CR1 to CR6, and the interface transport mechanism IFR are each provided with a direct-acting transport robot that slides linearly with respect to the substrate W and moves the hand back and forth. Although it is used, the present invention is not limited to this, and an articulated transfer robot that linearly moves the hand forward and backward by moving the joint may be used.

  The unprocessed substrate W placed on the substrate platform PASS1 is received by the first central robot CR1 of the antireflection film processing block 10. The first center robot CR1 carries the substrate W into the antireflection film heat treatment units 100 and 101.

  Thereafter, the first central robot CR1 takes out the heat-treated substrate W from the antireflection film heat treatment units 100 and 101, and carries the substrate W into the antireflection film application processing unit 50. In the antireflection film coating processing unit 50, an antireflection film is applied and formed on the substrate W by the coating unit BARC in order to reduce low standing waves and halation that occur during exposure.

  Next, the first central robot CR1 takes out the coated substrate W from the antireflection film coating processing unit 50 and carries the substrate W into the antireflection film heat treatment units 100 and 101. Thereafter, the first central robot CR1 takes out the heat-treated substrate W from the antireflection film heat treatment units 100 and 101, and places the substrate W on the substrate platform PASS3.

  The substrate W placed on the substrate platform PASS3 is received by the second central robot CR2 of the resist film processing block 11. The second central robot CR2 carries the substrate W into the resist film heat treatment units 110 and 111.

  Thereafter, the second central robot CR2 takes out the heat-treated substrate W from the resist film heat treatment units 110 and 111, and carries the substrate W into the resist film coating treatment unit 60. In the resist film application processing unit 60, a resist film is applied and formed on the substrate W on which the antireflection film is applied and formed by the application unit RES.

  Next, the second central robot CR2 takes out the coated substrate W from the resist film coating processing unit 60, and carries the substrate W into the resist film heat treatment units 110 and 111. Thereafter, the second central robot CR2 takes out the heat-treated substrate W from the resist film heat treatment units 110 and 111, and places the substrate W on the substrate platform PASS5.

  The substrate W placed on the substrate platform PASS5 is received by the third central robot CR3 of the development processing block 12. The third central robot CR3 places the substrate W on the substrate platform PASS7.

  The substrate W placed on the substrate platform PASS7 is received by the fourth central robot CR4 of the resist cover film processing block 13. The fourth central robot CR4 carries the substrate W into the resist cover film coating processing unit 80. In this resist cover film coating processing section 80, a resist cover film is applied and formed on the substrate W on which the resist film has been applied and formed by the coating unit COV. Since the resist cover film is formed, even if the substrate W comes into contact with the liquid in the exposure device 16, the resist film is prevented from coming into contact with the liquid, and the resist components are prevented from eluting into the liquid. .

  Next, the fourth central robot CR4 takes out the coated substrate W from the resist cover film coating processing unit 80 and carries the substrate W into the resist cover film heat treatment units 130 and 131. Thereafter, the fourth central robot CR4 takes out the heat-treated substrate W from the resist cover film heat treatment units 130 and 131, and places the substrate W on the substrate platform PASS9.

  The substrate W placed on the substrate platform PASS9 is received by the fifth central robot CR5 of the resist cover film removal block 14. The fifth central robot CR5 places the substrate W on the substrate platform PASS11.

  The substrate W placed on the substrate platform PASS11 is received by the sixth central robot CR6 of the interface block 15, and predetermined processing is performed in the interface block 15 and the exposure device 16, as will be described later. After predetermined processing is performed on the substrate W in the interface block 15 and the exposure apparatus 16, the substrate W is carried into the post-exposure bake heat treatment unit 141 of the resist cover film removal block 14 by the sixth central robot CR6. .

  In the post-exposure baking heat treatment unit 141, post-exposure baking (PEB) is performed on the substrate W. Thereafter, the sixth central robot CR6 takes out the substrate W from the post-exposure bake heat treatment unit 141 and places the substrate W on the substrate platform PASS12.

  In this embodiment, post-exposure bake heat treatment unit 141 performs post-exposure bake, but post-exposure bake heat treatment unit 140 may perform post-exposure bake.

  The substrate W placed on the substrate platform PASS12 is received by the fifth central robot CR5 of the resist cover film removal block 14. The fifth central robot CR5 carries the substrate W into the resist cover film removal processing unit 90. In the resist cover film removal processing unit 90, the resist cover film is removed.

  Next, the fifth central robot CR5 takes out the processed substrate W from the resist cover film removal processing unit 90 and places the substrate W on the substrate platform PASS10.

  The substrate W placed on the substrate platform PASS10 is placed on the substrate platform PASS8 by the fourth central robot CR4 of the resist cover film processing block 13.

  The substrate W placed on the substrate platform PASS8 is received by the third central robot CR3 of the development processing block 12. The third central robot CR3 carries the substrate W into the development processing unit 70. In the development processing unit 70, development processing is performed on the exposed substrate W.

  Next, the third central robot CR3 takes out the development-processed substrate W from the development processing unit 70, and carries the substrate W into the development heat treatment units 120 and 121. Thereafter, the third central robot CR3 takes out the substrate W after the heat treatment from the development heat treatment units 120 and 121, and places the substrate W on the substrate platform PASS6.

  The substrate W placed on the substrate platform PASS6 is placed on the substrate platform PASS4 by the second central robot CR2 of the resist film processing block 11. The substrate W placed on the substrate platform PASS4 is placed on the substrate platform PASS2 by the first central robot CR1 of the anti-reflection film processing block 10.

  The substrate W placed on the substrate platform PASS 2 is stored in the carrier C by the indexer robot IR of the indexer block 9. Thereby, each process of the board | substrate W in the substrate processing apparatus 500 is complete | finished.

(2-2) Operation of Interface Block Next, the operation of the interface block 15 will be described in detail.

  As described above, the substrate W carried into the indexer block 9 is subjected to a predetermined process and then placed on the substrate platform PASS11 of the resist cover film removal block 14 (FIG. 1).

  The substrate W placed on the substrate platform PASS11 is received by the sixth central robot CR6 of the interface block 15. The sixth central robot CR6 carries the substrate W into the edge exposure unit EEW (FIG. 4). In the edge exposure unit EEW, the peripheral portion of the substrate W is subjected to exposure processing.

  Next, the sixth central robot CR6 takes out the edge-exposed substrate W from the edge exposure unit EEW and carries the substrate W into one of the cleaning / drying processing units SD1. In the cleaning / drying processing unit SD1, cleaning and drying processing of the substrate W before the exposure processing is performed as described above.

  Here, the time of the exposure process by the exposure apparatus 16 is usually longer than the other process steps and the transport step. As a result, the exposure apparatus 16 often cannot accept a subsequent substrate W. In this case, the substrate W is temporarily stored in the sending buffer unit SBF (FIG. 4). In the present embodiment, the sixth central robot CR6 takes out the substrate W that has been cleaned and dried from the cleaning / drying processing unit SD1, and transports the substrate W to the sending buffer unit SBF.

  Next, the sixth central robot CR6 takes out the substrate W stored and stored in the sending buffer unit SBF and carries the substrate W into the placement / cooling unit P-CP. The substrate W carried into the placement / cooling unit P-CP is maintained at the same temperature (for example, 23 ° C.) as that in the exposure apparatus 16.

  If the exposure apparatus 16 has a sufficient processing speed, the substrate W is transported from the cleaning / drying processing unit SD1 to the placement / cooling unit P-CP without storing and storing the substrate W in the sending buffer unit SBF. May be.

  Subsequently, the substrate W maintained at the predetermined temperature by the placement / cooling unit P-CP is received by the upper hand H1 (FIG. 4) of the interface transport mechanism IFR, and the substrate carry-in section 16a in the exposure apparatus 16 is received. (Fig. 1).

  The substrate W that has been subjected to the exposure processing in the exposure device 16 is unloaded from the substrate unloading portion 16b (FIG. 1) by the lower hand H2 (FIG. 4) of the interface transport mechanism IFR. The interface transport mechanism IFR carries the substrate W into one of the cleaning / drying processing units SD2 by the hand H2. In the cleaning / drying processing unit SD2, the substrate W after the exposure processing is cleaned and dried as described above.

  The substrate W that has been subjected to the cleaning and drying processing in the cleaning / drying processing unit SD2 is taken out by the hand H1 (FIG. 4) of the interface transport mechanism IFR. The interface transport mechanism IFR places the substrate W on the substrate platform PASS13 with the hand H1.

  The substrate W placed on the substrate platform PASS13 is received by the sixth central robot CR6. The sixth central robot CR6 transports the substrate W to the post-exposure bake heat treatment unit 141 of the resist cover film removal block 14 (FIG. 1).

  When the resist cover film removal block 14 temporarily cannot accept the substrate W due to a failure of the removal unit REM (FIG. 2), the substrate W after the exposure processing is temporarily stored in the return buffer unit RBF. can do.

  Here, in the present embodiment, the sixth central robot CR6 includes the substrate platform PASS11 (FIG. 1), the edge exposure unit EEW, the cleaning / drying processing unit SD1, the feed buffer unit SBF, and the placement / cooling unit. Although the substrate W is transported between the P-CP, the substrate platform PASS13, and the post-exposure bake heat treatment unit 141, this series of operations can be performed in a short time (for example, 24 seconds).

  The interface transport mechanism IFR transports the substrate W between the placement / cooling unit P-CP, the exposure apparatus 16, the cleaning / drying processing unit SD2, and the substrate platform PASS13. This can be done in time (eg, 24 seconds).

  As a result, the throughput can be improved reliably.

(3) Hand Cleaning Processing In the substrate processing apparatus 500, hand cleaning processing for cleaning the hands CRH1 to CRH12 of the first to sixth center robots CR1 to CR6 and the hands H1 and H2 of the interface transport mechanism IFR is performed. The details will be described below. The operation of each component shown below is controlled by the main controller 30 in FIG.

(3-1) Outline of Operation of Substrate Processing Apparatus First, an outline of the operation of the substrate processing apparatus 500 during the hand cleaning process will be described with reference to FIGS. The hand cleaning process may be automatically performed between lots, or may be performed at an arbitrary timing by a user operating a control panel (not shown). During the hand cleaning process, the above-described processing of the substrate W is not performed.

  In the anti-reflection film processing block 10, the first central robot CR1 takes out the cleaning substrate from the cleaning substrate storage unit ST1, and carries the cleaning substrate into one of the coating units BARC. The substrate W carried into the coating unit BARC is held in a horizontal posture by the spin chuck 51. Then, in the coating unit BARC, the hands CRH1 and CRH2 of the first center robot CR1 are sequentially cleaned by the cleaning substrate. Details of the operation in the coating unit BARC will be described later. Thereafter, the first central robot CR1 carries out the cleaning substrate from the coating unit BARC, and returns the cleaning substrate to the cleaning substrate housing portion ST1.

  In the resist film processing block 11, the second central robot CR2 takes out the cleaning substrate from the cleaning substrate housing portion ST2, and carries the cleaning substrate into one of the coating units RES. The substrate W carried into the coating unit RES is held in a horizontal posture by the spin chuck 61. Then, in the coating unit RES, the hands CRH3 and CRH4 of the second center robot CR2 are sequentially cleaned by the cleaning substrate. Details of the operation in the coating unit RES will be described later. Thereafter, the second center robot CR2 carries out the cleaning substrate from the coating unit RES, and returns the cleaning substrate to the cleaning substrate housing portion ST2.

  In the development processing block 12, the third central robot CR3 takes out the cleaning substrate from the cleaning substrate storage unit ST3 and carries the cleaning substrate into any of the development processing units DEV. The substrate W carried into the development processing unit DEV is held in a horizontal posture by the spin chuck 71. In the development processing unit DEV, the hands CRH5 and CRH6 of the third central robot CR3 are sequentially cleaned by the cleaning substrate. Details of the operation in the development processing unit DEV will be described later. Thereafter, the third central robot CR3 carries out the cleaning substrate from the development processing unit DEV, and returns the cleaning substrate to the cleaning substrate housing portion ST3.

  In the resist cover film processing block 13, the fourth center robot CR4 takes out the cleaning substrate from the cleaning substrate housing portion ST4 and carries the cleaning substrate into one of the coating units COV. The substrate W carried into the coating unit COV is held in a horizontal posture by the spin chuck 81. Then, in the coating unit COV, the hands CRH7 and CRH8 of the fourth center robot CR4 are sequentially cleaned by the cleaning substrate. Details of the operation in the coating unit COV will be described later. Thereafter, the fourth central robot CR4 carries out the cleaning substrate from the coating unit COV, and returns the cleaning substrate to the cleaning substrate housing portion ST4.

  In the resist cover film removal block 14, the fifth central robot CR5 takes out the cleaning substrate from the cleaning substrate housing portion ST5 and carries the cleaning substrate into one of the removal units REM. The substrate W carried into the removal unit REM is held in a horizontal posture by the spin chuck 91. Then, in the removal unit REM, the hands CRH9 and CRH10 of the fifth central robot CR5 are sequentially cleaned by the cleaning substrate. Details of the operation in the removal unit REM will be described later. Thereafter, the fifth central robot CR5 carries out the cleaning substrate from the removal unit REM, and returns the cleaning substrate to the cleaning substrate housing portion ST5.

  In the interface block 15, the sixth central robot CR6 takes out the cleaning substrate from the cleaning substrate storage unit ST6 and carries the cleaning substrate into the cleaning / drying processing unit SD1. The substrate W carried into the cleaning / drying processing unit SD1 is held in a horizontal posture by the spin chuck 106 (FIG. 3). Then, in the cleaning / drying processing unit SD1, the hands CRH11 and CRH12 of the sixth center robot CR6 are sequentially cleaned. Details of the operation in the cleaning / drying processing unit SD1 will be described later. Thereafter, the sixth central robot CR6 carries out the cleaning substrate from the cleaning / drying processing unit SD1, and returns the cleaning substrate to the cleaning substrate housing portion ST6.

  Further, in the interface block 15, the interface transport mechanism IFR takes out the cleaning substrate from the cleaning substrate storage unit ST7 and carries the cleaning substrate into the cleaning / drying processing unit SD2. The substrate W carried into the cleaning / drying processing unit SD2 is held by the spin chuck 105 (FIG. 2). In the cleaning / drying processing unit SD2, the hands H1 and H2 of the interface transport mechanism IFR are sequentially cleaned. Details of the operation in the cleaning / drying processing unit SD2 will be described later. Thereafter, the interface transport mechanism IFR carries the cleaning substrate out of the cleaning / drying processing unit SD2, and returns the cleaning substrate to the cleaning substrate housing portion ST7.

(3-2) Regarding the Hand of Each Robot Next, a specific configuration of the hand CRH1 will be described. The hands CRH2 to CRH12, H1, and H2 have the same configuration as the hand CRH1. FIG. 5A is a plan view showing a specific example of the hand CRH1. FIG. 5B is a cross-sectional view taken along line P-P of the substrate support portion 704 shown in FIG.

  As shown in FIG. 5A, the hand CRH <b> 1 has a substantially U shape and is curved along the outer periphery of the substrate W. In the hand CRH1, three substrate support portions 704 are provided at substantially equal angular intervals. As shown in FIG. 5B, each substrate support portion 704 has an inclined surface 704a inclined inward and downward, and a substrate support surface 704b extending inward from the lower end of the inclined surface 704a. The peripheral edge of the lower surface of the substrate W is supported by the substrate support surface 704b, and the substrate W is positioned in the horizontal direction by the inclined surface 704a.

  The shapes of the hands CRH1 to CRH12, H1, and H2 are not limited to the example of FIG. For example, the hands CRH <b> 1 to CRH <b> 12, H <b> 1, H <b> 2 may have a shape that extends to the lower surface side of the substrate W. Further, instead of the substrate W supported by the substrate support surface 704b of the substrate support portion 704, the substrate W may be supported by the inclined surface 704a of the substrate support portion 704. Further, the shapes of the hands CRH1 to CRH12, H1 and H2 may be the same or different.

(3-3) About each unit During the hand cleaning process, the coating units BARC, RES, COV, the development processing unit DEV, the removal unit REM, and the cleaning / drying processing units SD1 and SD2, the first to sixth central robots CR1 to CR1 The CR6 hands CRH1 to CRH12 and the interface transport mechanism IFR hands H1 and H2 are cleaned. Hereinafter, the details of the operations of the coating units BARC, RES, COV, the development processing unit DEV, the removal unit REM, and the cleaning / drying processing units SD1, SD2 during the hand cleaning process will be described using the coating unit BARC as an example.

  FIG. 6 is a side view and a plan view for explaining the operation of the coating unit BARC during the hand cleaning process. FIG. 6 shows a case where the hand CRH1 of the first center robot CR1 is cleaned in the coating unit BARC.

  As shown in FIG. 6A, the coating unit BARC includes a spin chuck 51 and a cleaning nozzle 55. The spin chuck 51 is fixed to the upper end of the rotating shaft 512. The rotating shaft 512 is rotationally driven by a chuck rotating mechanism 511. An intake passage (not shown) is formed in the spin chuck 51, and the cleaning substrate Wa placed on the spin chuck 51 is vacuum-sucked and held in a horizontal posture by exhausting the inside of the intake passage. be able to.

  The cleaning nozzle 55 is provided obliquely above the spin chuck 51. A liquid supply pipe 56 for supplying a cleaning liquid (for example, pure water) is connected to the cleaning nozzle 55.

  During the hand cleaning process, the spin chuck 51 is rotated by the chuck rotating mechanism 511 while the cleaning substrate Wa is held by the spin chuck 51. As a result, the cleaning substrate Wa rotates. In this case, the rotation speed of the cleaning substrate Wa is adjusted to 10 rpm, for example.

  The hand CRH1 of the first center robot CR1 moves so as to surround the rotating cleaning substrate Wa. In this state, the hand CRH1 slightly reciprocates up and down and horizontally. Thereby, the inclined surface 704a (see FIG. 5B) and the substrate support surface 704b of the substrate support portion 704 of the hand CRH1 are lightly pressed against the outer peripheral end portion of the rotating cleaning substrate Wa. Thereby, the contaminant adhering to the inclined surface 704a and the substrate support surface 704b of the substrate support portion 704 of the hand CRH1 is scraped off by the cleaning substrate Wa.

  After a predetermined time elapses, the hand CRH1 leaves the coating unit BARC and the hand CRH2 enters the coating unit BARC. Then, similarly to the hand CRH1, the inclined surface 704a and the substrate support surface 704b of the substrate support portion 704 of the hand CRH2 are pressed against the rotating cleaning substrate Wa. Accordingly, contaminants attached to the inclined surface 704a and the substrate support surface 704b of the substrate support portion 704 of the hand CRH2 are scraped off by the cleaning substrate Wa. Thereafter, the hand CRH2 leaves the coating unit BARC.

  Subsequently, the cleaning liquid is supplied from the end cleaning nozzle 55 to the outer peripheral end of the cleaning substrate Wa while the rotation of the cleaning substrate Wa is maintained. As a result, the contaminants transferred from the hands CRH1 and CRH2 of the first central robot CR1 to the outer peripheral edge of the cleaning substrate Wa are washed away.

  Subsequently, when the spin chuck 51 is rotationally driven at a high speed, the cleaning substrate Wa is rotated at a high speed, and the cleaning liquid adhering to the cleaning substrate Wa is shaken off. Thereafter, the cleaning substrate Wa is unloaded from the coating unit BARC by the first central robot CR1.

  In this manner, the hands CRH1 and CRH2 of the first center robot CR1 are cleaned in the coating unit BARC. In this example, the hand CRH1 is washed first, but the hand CRH2 may be washed first.

  As described above, the coating units RES and COV, the development processing unit DEV, the removal unit REM, and the cleaning / drying processing units SD1 and SD2 include spin chucks 61 and 71 similar to the spin chuck 51 and the cleaning nozzle 55 of the coating unit BARC. 81, 91, 105, 106 and a cleaning nozzle.

  Using the spin chucks 61, 71, 81, 91, 105, 106 and the cleaning nozzle, the coating units RES, COV, the development processing unit DEV, the removal unit REM, and the cleaning / drying processing units SD1, SD2 Similar processing is performed. Thereby, the hands CRH3 to CRH12 of the second to sixth central robots CR2 to CR6 and the hands H1 and H2 of the interface transport mechanism IFR are washed.

(4) Effects of the embodiment In the present embodiment, contaminants attached to the hands CRH1 to CRH12, H1, and H2 are removed by the hand cleaning process. Thereby, the hands CRH1 to CRH12, H1, and H2 can be kept clean. Therefore, contaminants are prevented from transferring from the hands CRH1 to CRH12, H1, and H2 to the substrate W and from falling into the substrate processing apparatus 500 from the hands CRH1 to CRH12, H1, and H2. As a result, it is possible to prevent the processing failure of the substrate W and the operation failure of the substrate processing apparatus 500 from occurring.

  In addition, since the hands CRH1 to CRH12, H1, and H2 can be kept clean without the need for manpower, an increase in the work burden on the user can be suppressed.

  In the present embodiment, the hands CRH1 to CRH12, H1, and H2 are cleaned in the coating units BARC, RES, and COV, the development processing unit DEV, the removal unit REM, and the cleaning / drying processing units SD1 and SD2. That is, the hands CRH1 to CRH12, H1, and H2 are cleaned using a unit that processes the substrate W. Thereby, an increase in size and cost of the substrate processing apparatus 500 can be suppressed.

(5) Other Examples of Cleaning Substrate In the above embodiment, the unprocessed substrate W is used as the cleaning substrate Wa. However, the cleaning substrate shown in FIG. 7 may be used.

  FIG. 7 is a plan view showing another example of the cleaning substrate. A cleaning member Wo is attached to the outer peripheral end of the cleaning substrate Wb in FIG. The cleaning member Wo is made of a soft material such as sponge or rubber, for example.

  Regarding the example of the hand cleaning process in the case of using the cleaning substrate Wb, the difference from the above embodiment will be described by taking the process in the coating unit BARC as an example.

  In the coating unit BARC, the cleaning substrate Wb is held by the spin chuck 51 and rotates as the spin chuck 51 rotates. Subsequently, the cleaning liquid is supplied from the cleaning nozzle 55 to the cleaning member Wo of the cleaning substrate Wb that rotates. In this case, a solvent such as acetone or thinner is used as the cleaning liquid. As a result, the cleaning member Wo of the cleaning substrate Wb contains the solvent.

  In this state, the inclined surface 704a and the substrate support surface 704b of the substrate support portion 704 of the hands CRH1 and CRH2 of the first central robot CR1 are pressed against the outer peripheral end portion of the cleaning substrate Wb in the same manner as in the above embodiment.

  FIG. 8 is a diagram showing a contact state between the cleaning substrate Wb and the substrate support portions 704 of the hands CRH1 and CRH2. As shown in FIG. 8, when the cleaning substrate Wb is used, the inclined surface 704a and the substrate support surface 704b of the substrate support portion 704 come into contact with the cleaning member Wo of the rotating cleaning substrate Wb. As a result, contaminants adhering to the inclined surface 704a and the substrate support surface 704b of the substrate support portion 704 are polished by the cleaning member Wo.

  As described above, when the cleaning substrate Wb is used, since the hands CRH1 and CRH2 can be cleaned using a solvent such as acetone or thinner, the contaminants attached to the hands CRH1 and CRH2 can be more reliably detected. Can be removed.

(6) Indexer cleaning mechanism A cleaning mechanism (hereinafter referred to as an indexer cleaning mechanism) for cleaning the hand IRH of the indexer robot IR may be provided. FIG. 9 is a diagram illustrating an example of the indexer cleaning mechanism. In the example of FIG. 9, the indexer cleaning mechanism is provided in the substrate platform PASS1.

  As shown in FIG. 9A, the substrate platform PASS1 has a shelf plate 601 arranged horizontally. A plurality of support pins 603 for supporting the substrate W are provided on the shelf board 601.

  The indexer cleaning mechanism 600 includes a rotating shaft 605 provided so as to penetrate the shelf plate 602, a chuck portion 606 fixed to the upper end of the rotating shaft 605, and a lifting / lowering driving unit that drives the rotating shaft 605 to move up and down. 607 is included. During a period when the hand cleaning process is not performed, the chuck portion 606 is disposed at a lower position than the support pin 603.

  During the hand cleaning process, the indexer robot IR takes out the cleaning substrate Wa from the cleaning substrate storage unit ST1, and places the cleaning substrate Wa on the support pins 603 of the substrate platform PASS1.

  In this state, as shown in FIG. 9B, the rotary shaft 605 is raised by the lifting / lowering drive unit 607. Accordingly, the cleaning substrate Wa placed on the support pins 603 is received by the chuck portion 606. The chuck portion 606 holds the cleaning substrate Wa in a vacuum posture by vacuum suction. When the rotary shaft 605 is rotationally driven by the up-and-down rotation driving unit 607, the cleaning substrate Wa rotates.

  As shown in FIG. 9C, the hand IRH of the indexer robot IR moves so as to surround the rotating cleaning substrate Wa. The hand IRH of the indexer robot IR has the same configuration as the hand CRH1 shown in FIG.

  In this state, the hand IRH slightly reciprocates up and down and horizontally. Accordingly, the inclined surface 704a and the substrate support surface 704b of the substrate support portion 704 (see FIG. 5) of the hand IRH are lightly pressed against the outer peripheral end portion of the rotating cleaning substrate Wa, and the inclined surface 704a of the substrate support portion 704 is obtained. In addition, contaminants attached to the substrate support surface 704b are scraped off.

  Thus, by providing the substrate platform PASS1 with the indexer cleaning mechanism 600 that holds and rotates the cleaning substrate Wa, the hand IRH of the indexer robot IR can be cleaned.

  The indexer cleaning mechanism 600 may be provided in the substrate platform PASS2. A unit including the indexer cleaning mechanism 600 may be provided in the partition wall 17 or the indexer block 9. Further, the cleaning substrate Wb of FIG. 7 may be used instead of the cleaning substrate Wa.

(7) Other Embodiments In the above embodiment, the cleaning substrate storage units ST1 to ST7 have the same configuration as the substrate platform PASS1 to PASS13, but the configuration of the cleaning substrate storage units ST1 to ST7 is this. Not limited to. For example, the cleaning substrate storage units ST1 to ST7 may have a chamber structure that stores the cleaning substrates Wa and Wb in a sealed space. In this case, dust or the like is prevented from adhering to the cleaning substrates Wa and Wb stored in the cleaning substrate storage units ST1 to ST7.

  FIG. 9 shows an example in which the indexer cleaning mechanism 600 for cleaning the hand IRH of the indexer robot IR is provided in the substrate platform PASS1, but the cleaning mechanism having the same configuration as the indexer cleaning mechanism 600 is configured as follows. You may provide in mounting part PASS3-PASS13. In this case, the first to sixth central robots CR1 to CR6 and the hands IRH, CRH1 to CRH12, H1, and H2 of the interface transport mechanism IFR can be cleaned in the substrate platforms PASS3 to PASS13.

  In the interface block 15, the cleaning substrates Wa and Wb may be stored in at least one of the sending buffer unit SBF and the return buffer unit RBF instead of the cleaning substrate storage units ST6 and ST7.

  In the above embodiment, the coating units BARC, RES, COV, the development processing unit DEV, the removal unit REM, and the cleaning / drying processing units SD1, SD2 are provided with cleaning nozzles that supply a cleaning liquid to the cleaning substrate. The means for supplying the cleaning liquid to the cleaning substrate is not limited to this. For example, in the coating units BARC, RES, COV, the development processing unit DEV, and the removal unit REM, the cleaning liquid may be supplied to the cleaning substrate using the supply nozzles 52, 62, 72, 82, and 92.

  Further, in the coating units BARC, RES, and COV, an edge rinse process may be performed on the substrate W after the film formation process using a cleaning nozzle. In that case, after an antireflection film, a resist film or a resist cover film is formed on the substrate W, a cleaning liquid (for example, acetone or thinner) is supplied to the peripheral portion of the substrate W from the cleaning nozzle, whereby the peripheral edge of the substrate W is obtained. Each film formed on the part is removed.

  Further, a hand cleaning unit dedicated to the hand cleaning process may be provided. In this case, the hand cleaning unit is provided with a substrate holding and rotating means similar to the spin chucks 51, 61, 71, 81, 91, 105, and 106. By bringing the hands IRH, CRH1 to CRH12, H1, and H2 into contact with the cleaning substrate held and rotated by the substrate holding and rotating means, contaminants attached to the hands IRH, CRH1 to CRH12, H1, and H2 can be removed. it can.

(8) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the coating units BARC, RES, COV, the development processing unit DEV, the removal unit REM, and the cleaning / drying processing units SD1, SD2 are examples of processing units, and the hands IRH, CRH1 to CRH12, H1, H2 It is an example of a holding unit, the indexer robot IR, the first to sixth center robots CR1 to CR6, and the interface transport mechanism IFR are examples of moving mechanisms and substrate transport means, and the main controller 30 is an example of control means. .

  Also, the spin chucks 51, 61, 71, 81, 91, 105, 106 and the indexer cleaning mechanism 600 are examples of holding unit cleaning means and substrate holding rotation means, and the spin chucks 51, 61, 71, 81, 91, 105 are examples. 106 are examples of the first substrate holding and rotating device, the supply nozzles 52, 62, 72, 82, and 92 are examples of the processing means, and the indexer cleaning mechanism 600 is an example of the second substrate holding and rotating device. The cleaning substrate Wb is an example of a cleaning substrate, the cleaning member Wo is an example of a cleaning member, the cleaning nozzle 55 is an example of a cleaning liquid supply means, and the substrate support portion 704 is an example of a support member. .

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

  The present invention can be effectively used in various apparatuses having a substrate transfer means.

It is a top view of the substrate processing apparatus concerning an embodiment of the invention. It is the schematic side view which looked at the substrate processing apparatus of Drawing 1 from the + X direction. It is the schematic side view which looked at the substrate processing apparatus of Drawing 1 from the -X direction. It is the schematic side view which looked at the interface block from the + Y side. It is a figure which shows the specific structure of a hand. It is the side view and top view for demonstrating operation | movement of the application | coating unit at the time of a hand washing process. It is the top view and sectional drawing which show the other example of the board | substrate for washing | cleaning. It is a figure which shows a contact state with the board | substrate support part with the board | substrate for washing | cleaning of FIG. It is a figure which shows an example of an indexer washing | cleaning mechanism.

Explanation of symbols

30 Main controller 51, 61, 71, 81, 91, 105, 106 Spin chuck 52, 62, 72, 82, 92 Supply nozzle 55 Cleaning nozzle 500 Substrate processing apparatus 600 Indexer cleaning mechanism 704 Substrate support part BARC, RES, COV coating Unit DEV Development processing unit IR Indexer robot IRH, CRH1 to CRH12, H1, H2 Hand REM removal unit SD1, SD2 Cleaning / drying processing units CR1 to CR6 First to sixth center robots IFR Interface transport mechanism W Substrate Wo For cleaning Member Wa, Wb Cleaning substrate

Claims (7)

A processing unit for processing the substrate;
A substrate transport unit that transports the substrate between a predetermined position and the processing unit, including a holding unit that holds the substrate and a moving mechanism that moves the holding unit;
Control means for controlling the processing unit and the substrate transport means;
A holding unit cleaning unit that is provided in at least one of the substrate transfer path by the substrate transfer unit and the processing unit, and that cleans the holding unit of the substrate transfer unit;
The holding unit cleaning means includes a substrate holding rotating means for rotating while holding the substrate in a horizontal posture,
The control unit controls the substrate holding and rotating unit and the moving mechanism so that the holding unit comes into contact with a substrate rotated by the substrate holding and rotating unit when cleaning the holding unit. . The processing unit is
A first substrate holding and rotating device provided in common with the substrate holding and rotating means of the holding unit cleaning means;
Processing means for processing the substrate rotated by the first substrate holding and rotating device,
The control unit controls the first substrate holding and rotating device and the moving mechanism so that the holding unit comes into contact with a substrate rotated by the first substrate holding and rotating device during cleaning of the holding unit. The substrate processing apparatus according to claim 1, wherein: Further comprising a substrate mounting portion provided in the transfer path, on which the substrate is temporarily mounted;
The substrate mounting unit includes a second substrate holding and rotating device provided in common with the substrate holding and rotating unit of the holding unit cleaning unit,
The control unit controls the second substrate holding and rotating device and the moving mechanism so that the holding unit comes into contact with the substrate rotated by the second substrate holding and rotating device when the holding unit is cleaned. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is characterized. The said substrate holding | maintenance rotation means hold | maintains the board | substrate for washing | cleaning at the time of washing | cleaning of the said holding | maintenance part, The outer peripheral part of the said board | substrate for washing | cleaning has a cleaning member which has a softness | flexibility. The substrate processing apparatus according to any one of the above. The substrate processing apparatus according to claim 1, further comprising a cleaning liquid supply unit that supplies a cleaning liquid to the substrate rotated by the substrate holding and rotating unit after cleaning the holding unit. The holding unit includes a support member that supports an outer peripheral end of the substrate,
The said control means controls the said board | substrate holding | maintenance rotation means and the said moving mechanism so that the said supporting member of the said holding | maintenance part may contact the outer peripheral edge part of the board | substrate rotated by the said board | substrate holding | maintenance rotation means. The substrate processing apparatus in any one of 1-5. A holding unit cleaning system for cleaning a holding unit that holds a substrate in a substrate transfer means,
A substrate holding and rotating means for rotating while holding the substrate in a horizontal position;
A holding unit cleaning system comprising: a substrate holding and rotating unit and a control unit that controls the substrate transport unit so that the holding unit comes into contact with a substrate rotated by the substrate holding and rotating unit.

Images