JP2020070491A - Alignment device, film deposition, alignment method, film deposition method, and electronic device manufacturing method - Google Patents

Abstract

To adjust a relative position between an electrostatic chuck and a substrate and/or the electrostatic chuck and a mask, when relative displacement occurs in a direction parallel to an adsorption face of the electrostatic chuck between them.SOLUTION: An alignment device according to the present invention includes: a substrate support unit for supporting a substrate; a mask support unit for supporting a mask; and an electrostatic chuck for adsorbing the substrate and the mask via the substrate. The substrate support unit and the mask support unit can move to the electrostatic chuck in one of a first direction parallel to an adsorption face of the electrostatic chuck and a second direction orthogonal to the first direction and parallel to the adsorption face of the electrostatic chuck, and can rotate in a rotation direction around a third direction orthogonal to each of the first and second directions.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an alignment apparatus, a film forming apparatus, an alignment method, a film forming method, and an electronic device manufacturing method.

  In the production of an organic EL display device (organic EL display), when forming an organic light emitting element (organic EL element; OLED) that constitutes the organic EL display device, a vapor deposition material evaporated from an evaporation source of a film forming device is used. An organic material layer or a metal layer is formed by vapor deposition on a substrate through a mask on which a pixel pattern is formed.

  In an upward deposition type (deposition up) film forming apparatus, an evaporation source is provided below a vacuum container of the film forming apparatus. On the other hand, the substrate is placed on the upper portion of the vacuum container, and the vapor deposition material is deposited on the lower surface of the substrate. In such a vacuum container of an upward deposition type film forming apparatus, the substrate is held only by the peripheral portion of the lower surface of the substrate by the substrate holder, so that the substrate bends due to its own weight, which is one factor that reduces the deposition accuracy. Is becoming Even in a film forming apparatus of a method other than the upward evaporation method, the substrate may be bent due to its own weight.

  As a method for reducing the bending of the substrate due to its own weight, a technique using an electrostatic chuck has been studied. That is, by bending the entire upper surface of the substrate with the electrostatic chuck, the bending of the substrate can be reduced.

  Patent Document 1 discloses a technique for adsorbing a substrate and a mask on an electrostatic chuck, and discloses a configuration for moving the electrostatic chuck in the horizontal direction.

Korean Patent Publication No. 2017-0061230

  When the substrate is attracted to the electrostatic chuck when the relative position between the electrostatic chuck and the substrate is shifted in the direction parallel to the attraction surface of the electrostatic chuck due to the error of the substrate transfer by the transfer robot, etc. The chuck will not fit properly. If the alignment process of the substrate with respect to the mask is performed in such a state, the accuracy of the relative position adjustment of the substrate with respect to the mask deteriorates.

  Further, when a voltage for attracting the mask is applied to the electrostatic chuck in a state where the relative position between the electrostatic chuck and the mask is deviated due to an error in the transfer of the mask by the transfer robot, etc. The suction force cannot sufficiently act on the mask, and the adhesion accuracy between the substrate and the mask deteriorates.

  The present invention is also applicable to a case where relative displacement occurs between at least one of the electrostatic chuck and the substrate and between the electrostatic chuck and the mask in a direction parallel to the attraction surface of the electrostatic chuck. An alignment apparatus, a film forming apparatus, an alignment method, a film forming method, and an electronic device manufacturing method capable of adjusting a relative position between an electrostatic chuck and a substrate or between an electrostatic chuck and a mask are provided. The main purpose is to provide.

  An alignment apparatus according to a first aspect of the present invention includes a substrate support unit for supporting a substrate, a mask support unit for supporting a mask, the substrate and an electrostatic device for adsorbing the mask via the substrate. A chuck, wherein the substrate support unit and the mask support unit have a first direction parallel to the attraction surface of the electrostatic chuck and a direction orthogonal to the first direction with respect to the electrostatic chuck. A third direction that is movable in at least one of the second directions that are parallel to the attraction surface of the electrostatic chuck, and that is orthogonal to each of the first direction and the second direction. It is characterized in that it can rotate in a rotation direction around the direction.

  A film forming apparatus according to a second aspect of the present invention is a film forming apparatus for forming an evaporation material on a substrate through a mask, and is characterized by including the alignment apparatus according to the first aspect of the present invention.

  An alignment method according to a third aspect of the present invention includes a step of supporting a substrate by a substrate supporting unit, a step of supporting a mask by a mask supporting unit, and at least one of the substrate and the mask with respect to an electrostatic chuck. At least one of a first direction that is a direction parallel to the attraction surface of the electrostatic chuck and a second direction that is a direction orthogonal to the first direction and that is parallel to the attraction surface of the electrostatic chuck. A pre-alignment step of adjusting the position by moving in one direction or rotating in a rotation direction around a third direction orthogonal to the first direction and the second direction; and a relative position of the substrate and the mask. And an alignment step for adjusting.

  A film forming method according to a fourth aspect of the present invention is a film forming method for forming a film of an evaporation material on a substrate through a mask, comprising a step of supporting the mask by a mask supporting unit, and a step of supporting the substrate on the substrate. A step of supporting by a unit, a first direction which is a direction parallel to the attraction surface of the electrostatic chuck with respect to the electrostatic chuck, and a direction orthogonal to the first direction, with respect to the substrate supported by the substrate supporting unit. And moving in at least one of the second directions parallel to the attraction surface of the electrostatic chuck, or using a third direction orthogonal to each of the first direction and the second direction as an axis. A pre-alignment step of adjusting the position by rotating the substrate in the rotating direction, a step of adhering the position-adjusted substrate to the electrostatic chuck, and a step of supporting the mask supporting unit. An alignment step of adjusting the position of the mask to the substrate sucked by the electrostatic chuck; a step of adhering the position-adjusted mask to the electrostatic chuck through the substrate; And a step of forming a vapor deposition material on the substrate via the above.

  A method of manufacturing an electronic device according to a fifth aspect of the present invention is characterized in that the electronic device is manufactured using the film forming method according to the fourth aspect of the present invention.

  According to the present invention, when a relative position shift occurs in a direction parallel to the attraction surface of the electrostatic chuck with respect to at least one of the electrostatic chuck and the substrate and between the electrostatic chuck and the mask, a static displacement occurs. At least one of the relative position between the electric chuck and the substrate and the relative position between the electrostatic chuck and the mask can be adjusted. As a result, at least one of the suction accuracy between the electrostatic chuck and the substrate and the suction accuracy between the electrostatic chuck and the mask can be improved, and as a result, the film forming accuracy can be improved.

FIG. 1 is a schematic view of a part of a manufacturing line of an organic EL display device. FIG. 2 is a schematic diagram of a film forming apparatus. FIG. 3 is a schematic diagram showing the configuration of the alignment apparatus according to the embodiment of the present invention. FIG. 4 is a schematic diagram for explaining an alignment method according to an embodiment of the present invention. FIG. 5 is an overall view of the organic EL display device and a cross-sectional view of the organic EL element.

  Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples merely exemplify preferable configurations of the present invention, and the scope of the present invention is not limited to those configurations. Further, in the following description, the hardware configuration and software configuration of the apparatus, the processing flow, the manufacturing conditions, the dimensions, the material, the shape, etc., unless otherwise specified, limit the scope of the present invention to them. It isn't meant.

  The present invention can be applied to an apparatus that deposits various materials on the surface of a substrate to form a film, and can be preferably applied to an apparatus that forms a thin film (material layer) having a desired pattern by vacuum vapor deposition. As the material of the substrate, any material such as glass, a film of a polymer material, and metal can be selected, and the substrate may be, for example, a substrate in which a film such as polyimide is laminated on a glass substrate. .. Further, as the vapor deposition material, any material such as an organic material or a metallic material (metal, metal oxide, etc.) may be selected. The present invention can be applied to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus in addition to the vacuum vapor deposition apparatus described below. The technique of the present invention is specifically applicable to an apparatus for manufacturing an organic electronic device (for example, an organic EL element, a thin film solar cell), an optical member, or the like. Among them, an organic EL element manufacturing apparatus that forms an organic EL element by evaporating a vapor deposition material and depositing it on a substrate through a mask is one of preferable application examples of the present invention.

<Electronic device manufacturing equipment>
FIG. 1 is a plan view schematically showing a partial configuration of an electronic device manufacturing apparatus.

  The manufacturing apparatus of FIG. 1 is used for manufacturing a display panel of an organic EL display device for a smartphone, for example. In the case of a display panel for smartphones, for example, a 4.5th generation substrate (about 700 mm × about 900 mm), a 6th generation full size (about 1500 mm × about 1850 mm) or a half cut size (about 1500 mm × about 925 mm) substrate After forming a film for forming an organic EL element, the substrate is cut out to manufacture a plurality of small-sized panels.

  An electronic device manufacturing apparatus generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices.

  The cluster apparatus 1 includes a plurality of film forming apparatuses 11 that perform a process (for example, a film forming process) on a substrate S, a plurality of mask stocking devices 12 that store masks M before and after use, and a transfer chamber arranged in the center thereof. 13 are provided. As shown in FIG. 1, the transfer chamber 13 is connected to each of the plurality of film forming apparatuses 11 and the mask stock apparatus 12.

  A transfer robot 14 that transfers the substrate and the mask is arranged in the transfer chamber 13. The transfer robot 14 transfers the substrate S from the path chamber 15 of the relay device arranged on the upstream side to the film forming apparatus 11. Further, the transfer robot 14 transfers the mask M between the film forming apparatus 11 and the mask stock apparatus 12. The transfer robot 14 is, for example, a robot having a structure in which a robot hand holding the substrate S or the mask M is attached to an articulated arm.

In the film forming apparatus 11 (also referred to as a vapor deposition apparatus), a vapor deposition material stored in an evaporation source is heated by a heater to be vaporized and vapor-deposited on a substrate through a mask. A series of film forming processes such as transfer of the substrate S to and from the transfer robot 14, adjustment of the relative position of the substrate S and the mask M (alignment), fixing of the substrate S on the mask M, film formation (vapor deposition), etc. Performed by the device 11.

  In the mask stock device 12, a new mask used in the film forming process in the film forming device 11 and a used mask are separately stored in two cassettes. The transfer robot 14 transfers a used mask from the film forming apparatus 11 to a cassette of the mask stock apparatus 12, and transfers a new mask stored in another cassette of the mask stock apparatus 12 to the film forming apparatus 11.

  The cluster apparatus 1 includes a pass chamber 15 for transferring the substrate S from the upstream side in the flow direction of the substrate S to the cluster apparatus 1, and a substrate chamber S for which the film forming process is completed in the cluster apparatus 1 on the downstream side. A buffer chamber 16 for transferring to the cluster device is connected. The transfer robot 14 in the transfer chamber 13 receives the substrate S from the upstream pass chamber 15 and transfers it to one of the film forming apparatuses 11 (for example, the film forming apparatus 11 a) in the cluster apparatus 1. In addition, the transfer robot 14 receives the substrate S for which the film forming process is completed in the cluster apparatus 1 from one of the plurality of film forming apparatuses 11 (for example, the film forming apparatus 11b), and the buffer connected to the downstream side. It is transported to the chamber 16.

  A swirl chamber 17 for changing the orientation of the substrate is installed between the buffer chamber 16 and the pass chamber 15. The swirl chamber 17 is provided with a transfer robot 18 that receives the substrate S from the buffer chamber 16, rotates the substrate S by 180 °, and transfers the substrate S to the pass chamber 15. As a result, the orientation of the substrate S is the same in the upstream cluster device and the downstream cluster device, and substrate processing is facilitated.

  The pass chamber 15, the buffer chamber 16, and the swirl chamber 17 are so-called relay devices that connect the cluster devices, and the relay device installed on at least one of the upstream side and the downstream side of the cluster device is the pass chamber 15, the buffer chamber. At least one of the chamber 16 and the swirl chamber 17 is included.

  The film forming device 11, the mask stock device 12, the transfer chamber 13, the buffer chamber 16, the swirl chamber 17, and the like are maintained in a high vacuum state during the process of manufacturing the organic light emitting device. The pass chamber 15 is normally maintained in a low vacuum state, but may be maintained in a high vacuum state as needed.

  In the present embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. 1. However, the present invention is not limited to this, and other types of apparatuses and chambers may be included. The arrangement between the chambers may change.

  For example, according to the present invention, the substrate S and the mask M are bonded together not by the film forming apparatus 11 but by another apparatus or chamber, which is then placed on a carrier and conveyed through a plurality of film forming apparatuses arranged in a line. The present invention can also be applied to an in-line type manufacturing apparatus that performs a film forming process while performing the above.

<Film forming device>
FIG. 2 is a schematic diagram showing the configuration of the film forming apparatus 11. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction (third direction) will be used. When the substrate S is fixed so as to be parallel to the horizontal plane (XY plane) during film formation, the lateral direction (direction parallel to the short side) of the substrate S is the X direction (first direction) and the longitudinal direction (long side is the long side). The parallel direction) is defined as the Y direction (second direction). Further, the rotation angle around the Z axis is represented by θ (rotation direction).

The film forming apparatus 11 includes a vacuum container 21 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, a substrate support unit 22, a mask support unit 23, and an electrostatic chuck provided inside the vacuum container 21. 24 and an evaporation source 25. The film forming apparatus 11 of the present embodiment may further include a frame-shaped mask table 26 installed so as to be fixed to the vacuum container 21.

  The substrate support unit 22 is means for receiving and holding the substrate S transported by the transport robot 14 provided in the transport chamber 13, and is also called a substrate holder.

  A mask support unit 23 is provided below the substrate support unit 22. The mask support unit 23 is means for receiving and holding the mask M transported by the transport robot 14 provided in the transport chamber 13, and is also called a mask holder.

  The mask M has an opening pattern corresponding to the thin film pattern formed on the substrate S, and is supported by the mask support unit 23. In particular, a mask used to manufacture an organic EL element for a smartphone is a metal mask having a fine opening pattern formed thereon and is also called an FMM (Fine Metal Mask).

  In the embodiment in which the film forming apparatus 11 includes the mask table 26, the mask M is transported from the mask supporting unit 23 to the mask table 26 and placed on the mask table 26 during the film forming process.

  Above the substrate support unit 22, an electrostatic chuck 24 for attracting and fixing the substrate by electrostatic attraction is provided. The electrostatic chuck 24 has a structure in which an electric circuit such as a metal electrode is embedded in a dielectric (for example, ceramic material) matrix. The electrostatic chuck 24 may be a Coulomb force type electrostatic chuck or a Johnson-Rahbek force type electrostatic chuck. Further, it may be a gradient force type electrostatic chuck. However, the electrostatic chuck 24 is preferably a gradient force type electrostatic chuck. This is because the electrostatic chuck 24 is a gradient force type electrostatic chuck, so that even if the substrate S is an insulating substrate, the electrostatic chuck 24 can favorably attract the substrate S. In the case where the electrostatic chuck 24 is a Coulomb force type electrostatic chuck, when positive (+) and negative (-) voltages are applied to the metal electrode, the attracted object such as the substrate S is applied through the dielectric matrix. A polarized charge having the opposite polarity to that of the metal electrode is induced, and the substrate S is attracted and fixed to the electrostatic chuck 24 by the electrostatic attraction between them.

  The electrostatic chuck 24 may be formed of one plate or may be formed to have a plurality of sub plates. Further, even in the case of being formed by one plate, a plurality of electric circuits may be included therein and the electrostatic attraction may be controlled so as to be different depending on the position in one plate.

  As shown in FIG. 2, for example, a cooling plate 27 may be provided as a cooling mechanism for suppressing the temperature rise of the substrate S on the side opposite to the attraction surface of the electrostatic chuck 24. As a result, alteration or deterioration of the organic material deposited on the substrate S can be suppressed.

  The evaporation source 25 is a crucible (not shown) in which an evaporation material to be deposited on the substrate is stored, a heater (not shown) for heating the crucible, and the evaporation material from the evaporation source is a substrate until the evaporation rate becomes constant. It includes a shutter (not shown) and the like that prevent the particles from scattering. The evaporation source 25 may have various configurations such as a point evaporation source and a linear evaporation source according to the application.

  Although not shown in FIG. 2, the film deposition apparatus 11 includes a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate.

The outer (atmosphere side) upper surface of the vacuum container 21 of the film forming apparatus 11 will be described later in detail with reference to FIG. 3, but is used for raising and lowering the substrate support unit 22 in the vertical direction (Z direction, third direction). A substrate support unit lifting drive mechanism 31 (substrate support unit drive mechanism), a mask support unit lift drive mechanism 33 (mask support unit drive mechanism) for lifting and lowering the mask support unit 23 in the vertical direction (Z direction, third direction), An electrostatic chuck elevating drive mechanism 32 (electrostatic chuck drive mechanism) for elevating the electrostatic chuck 24 and the like in the vertical direction (Z direction, third direction) is installed. Further, between the electrostatic chuck 24 and the substrate S, or between the electrostatic chuck 24 and the mask M, a pre-alignment for adjusting the relative position between the electrostatic chuck 24 and the mask M, and between the substrate S and the mask M. A horizontal drive mechanism (alignment stage) or the like is installed for alignment for relative position adjustment. The horizontal drive mechanism (alignment stage) can move at least one of the substrate support unit 22 and the mask support unit 23 with respect to the electrostatic chuck 24 in at least one of the X direction and the Y direction, or Z. It is configured so that it can be rotated in a θ direction, which is a rotation direction around the Z-axis direction, where θ is a rotation angle about the direction.

  In the present invention, as will be described later with reference to FIG. 3, in the horizontal direction (at least one of the X direction, the Y direction, and the θ direction), relative position adjustment of the substrate S with respect to the electrostatic chuck 24 and electrostatic discharge are performed. An electrostatic chuck elevating drive mechanism 32 for elevating and lowering the electrostatic chuck 24 is fixedly provided on the vacuum container 21 for at least one of adjusting the relative position of the mask M with respect to the chuck 24. 31 and the mask support unit lifting drive mechanism 33 are installed so as to be mounted on the alignment stage 30.

  The substrate S and the mask M are formed on the outer upper surface of the vacuum container 21 through a transparent window (not shown) provided on the upper surface of the vacuum container 21 in addition to the lifting drive mechanism and the horizontal drive mechanism described above. An alignment camera (not shown) for photographing the alignment mark may be installed.

  The film forming apparatus 11 includes a control unit 28. The control unit 28 has functions of carrying the substrate S and the mask M, pre-alignment and alignment, controlling the evaporation source 25, controlling film formation, and the like. The control unit 28 can be configured by, for example, a computer having a processor, a memory, a storage, an I / O and the like. In this case, the function of the control unit 28 is realized by the processor executing the program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 28 may be configured by a circuit such as an ASIC or FPGA. Further, the control unit 28 may be installed for each film forming apparatus, and one control unit may be configured to control a plurality of film forming apparatuses.

<Alignment device>
Hereinafter, the configuration of the alignment apparatus according to the embodiment of the present invention will be described with reference to FIG. Although the embodiment shown in FIG. 3 is an example in which the alignment apparatus is configured as a part of the film forming apparatus 11, the present invention is not limited to this and may be configured as an apparatus in which the film forming process is not performed. .. For example, before the film forming process is performed, an alignment device provided separately from the film forming device 11 is used to perform pre-alignment between the electrostatic chuck 24 and the substrate S or the mask M, and the substrate S and the mask M. An alignment step between may be performed.

  The alignment apparatus according to this embodiment includes a vacuum container 21, a substrate support unit 22, a mask support unit 23, an electrostatic chuck 24, and an alignment stage 30.

Relative position adjustment (pre-alignment) of the substrate S and / or the mask M with respect to the electrostatic chuck 24 in the horizontal direction (at least one of the X direction, Y direction, and θ direction) is performed on the outer upper surface of the vacuum container 21. ), And the relative position adjustment (alignment) in the horizontal direction (at least one of the X direction, the Y direction, and the θ direction) between the substrate S and the mask M, the substrate supporting unit 22 and the mask. An alignment stage 30 that moves the support unit 23 in the X and Y directions of the above horizontal direction, or rotates in the θ direction of the above horizontal direction, and a substrate for raising and lowering the substrate support unit 22 in the Z axis direction. Support unit lift drive mechanism 31 (substrate support unit drive mechanism) and electrostatic chuck lift for lifting the electrostatic chuck 24 in the Z-axis direction. Kinematic mechanism 32 (the electrostatic chuck drive mechanism), a mask support unit elevation driving mechanism 33 for raising and lowering the mask supporting unit 23 in the Z-axis direction (the mask supporting unit drive mechanism) are installed.

  The alignment stage 30 receives a driving force in the horizontal direction (at least one of the X direction, the Y direction, and the θ direction) from the alignment stage driving motor 301 fixed to the outer upper surface of the vacuum container 21 through the linear guide. That is, a guide rail (not shown) is fixedly installed on the outer upper surface of the vacuum container 21, and the linear block is movably installed on the guide rail. Further, the alignment stage base plate 302 is mounted on the linear block. By moving the linear block in the X and Y directions of the horizontal direction or by rotating it in the θ direction of the horizontal direction by the driving force from the alignment stage drive motor 301 fixed to the outer upper surface of the vacuum container 21. , The alignment stage base plate 302 mounted on the linear block follows the alignment stage 30, and moves the entire alignment stage 30 in the X and Y directions of the horizontal direction, or in the θ direction of the horizontal direction. It can be rotated.

  The substrate support unit elevation drive mechanism 31 and the mask support unit elevation drive mechanism 33 are mounted on the alignment stage 30 as described later. Therefore, the substrate support unit 22 and the mask support unit 23 may move along the substrate support unit 22 and the mask support unit 23 as the alignment stage moves in the X and Y directions of the horizontal direction and rotates in the θ direction of the horizontal direction. With the substrate S and the mask M supported by each of them, they move in the X and Y directions of the horizontal direction, or rotate in the θ direction of the horizontal direction.

  The substrate support unit lift drive mechanism 31 is a mechanism for moving the substrate support unit 22 up and down in the Z-axis direction, and is installed on the alignment stage base plate 302. The substrate support unit 22 in the vacuum container 21 is connected to the substrate support unit lift drive mechanism 31 through the outer upper surface of the vacuum container 21. The substrate support unit lifting / lowering drive mechanism 31 is linear as a substrate support unit lifting / lowering drive motor 311 and a substrate support unit lifting / lowering drive force transmission mechanism for transmitting the driving force of the substrate support unit lifting / lowering drive motor 311 to the substrate support unit 22. Includes a guide 312. In this embodiment, the linear guide 312 is used as the substrate support unit lifting drive force transmission mechanism, but the present invention is not limited to this, and a ball screw or the like may be used.

  The electrostatic chuck lifting / lowering drive mechanism 32 includes an electrostatic chuck lifting / lowering drive motor 321 for driving the electrostatic chuck 24 in the Z direction and a ball screw 322 as an electrostatic chuck lifting / lowering drive force transmission mechanism. The electrostatic chuck lifting / lowering drive mechanism fixed to the outer upper surface is installed on the base plate 323. In the present embodiment, the ball screw 322 is used as the electrostatic chuck up-and-down driving force transmission mechanism, but the present invention is not limited to this, and a linear guide or the like may be used.

As described above, in this embodiment, the electrostatic chuck elevating and lowering drive mechanism 32 is not installed on the alignment stage base plate 302 as in the related art, but is separated from the alignment stage 30 and independently of the vacuum container 21. Since it is installed on the electrostatic chuck lifting / lowering drive mechanism base plate 323 fixed to the outer upper surface, even if the alignment stage 30 moves in the X and Y directions of the horizontal direction or rotates in the θ direction of the horizontal direction. The electrostatic chuck elevating / lowering drive mechanism 32 follows the movement of the alignment stage 30 and does not move in the X direction or Y direction of the horizontal direction or rotate in the θ direction, but moves in the horizontal direction (X direction, Y direction, The relative position with respect to the outer upper surface of the vacuum container 21 in at least one of the θ directions) is fixed.

  In this specification, the electrostatic chuck lifting / lowering drive mechanism 32 is installed independently of the alignment stage 30 in a broad sense, so that the electrostatic chuck lifting / lowering drive mechanism 32 is not mounted on the alignment stage 30. In the narrow sense, the electrostatic chuck up-and-down drive mechanism 32 does not receive the driving force for moving in the X and Y directions of the horizontal direction or rotating in the θ direction from the alignment stage 30. It is not mounted on the stage 30 and is installed so as to be fixed to the outer upper surface of the vacuum container 21 in the horizontal direction (at least one of the X direction, the Y direction, and the θ direction) (that is, X in the horizontal direction). Direction, the Y direction is not moved, and the relative position to the outer upper surface of the vacuum container 21 is fixed without rotating in the θ direction). It is meant to say.

  The mask support unit up-and-down drive mechanism 33 is a mechanism for moving up and down the mask support unit 23 in the Z-axis direction, and is mounted on the alignment stage 30. The mask support unit 23 in the vacuum container 21 is connected to the mask support unit lift drive mechanism 33 through the outer upper surface of the vacuum container 21. The mask support unit up-and-down drive mechanism 33 includes a mask support unit up-and-down drive motor 331 and a ball screw 332, and has a function of moving up and down the mask support unit 23.

  As described above, in this embodiment, the substrate support unit up-and-down drive mechanism 31 and the mask support unit up-and-down drive mechanism 33 are installed on the base plate 302 of the alignment stage 30, and the electrostatic chuck up-and-down drive mechanism 32 is separated from the alignment stage 30. Since the alignment stage 30 moves in the X and Y directions of the horizontal direction or rotates in the θ direction, the substrate support unit lift drive mechanism 31 and the mask support unit lift drive mechanism 32 are installed independently of each other. Moves in the X and Y directions of the horizontal direction with respect to the electrostatic chuck up-and-down drive mechanism 32, or rotates in the θ direction. That is, the substrate S supported by the substrate support unit 22 and the mask M supported by the mask support unit 23 move in the X direction or the Y direction of the horizontal direction with respect to the electrostatic chuck lifting drive mechanism 32, or Rotate in the θ direction.

  As a result, as will be described later, the substrate S supported by the substrate support unit 22 is displaced relative to the electrostatic chuck 24 in the horizontal direction (at least one of the X direction, the Y direction, and the θ direction). Also in the case, the relative position between the substrate S and the electrostatic chuck 24 in the horizontal direction (at least one of the X direction, the Y direction, and the θ direction) can be adjusted. Similarly, when the mask M supported by the mask support unit 23 is displaced relative to the electrostatic chuck 24, the mask M is moved in the X direction or the Y direction of the horizontal direction, or θ. The relative position with respect to the electrostatic chuck 24 can be adjusted by rotating in the direction.

<Alignment method and film forming method>
With reference to FIGS. 4A to 4H, a pre-alignment process of the substrate S and the mask M with respect to the electrostatic chuck 24, an alignment process of the mask M with respect to the substrate S, and a film forming method including the same will be described. In addition, in order to make it easy to understand the vertical movements of the substrate S, the mask M, and the electrostatic chuck 24 in these explanations, the alignment stage 30, the substrate support unit vertical drive mechanism 31, the electrostatic chuck vertical drive mechanism 32, and the mask support unit vertical movement The drive mechanism 33 is not shown.

  When it is time to replace the mask, as shown in FIG. 4A, a new mask M is carried into the vacuum container 21 of the film forming apparatus 11 and supported by the mask supporting unit 23.

  Subsequently, as shown in FIG. 4B, the substrate S on which the vapor deposition material is formed using the mask M is carried into the vacuum container 21 and supported by the substrate support unit 22.

  In this state, a pre-alignment process of the substrate S with respect to the electrostatic chuck 24 is performed. In the pre-alignment step of the substrate S, for example, a corner portion of the rectangular electrostatic chuck 24 and the alignment mark formed on the substrate S are photographed by an alignment camera (rough alignment camera), and the electrostatic chuck 24 is imaged. The relative position shift amount of the substrate S is measured.

  In another embodiment, instead of the corner portion of the electrostatic chuck 24, another electrostatic chuck alignment mark formed on the corner portion of the electrostatic chuck 24 is photographed together with the alignment mark of the substrate, and the relative positional deviation amount is detected. May be measured.

  Further, an opening is formed in the electrostatic chuck 24 so that the alignment mark of the substrate S placed under the electrostatic chuck 24 can be seen from above.

  When it is determined that the relative positions of the electrostatic chuck 24 and the substrate S are deviated, as shown in FIG. 4C, the alignment stage 30 is moved in the X direction or the Y direction of the horizontal direction, or θ. By rotating the electrostatic chuck 24 in the horizontal direction, the relative position of the electrostatic chuck 24 and the substrate S in the horizontal direction (at least one of the X direction, the Y direction, and the θ direction) is adjusted.

  In the present embodiment, as described with reference to FIG. 3, the substrate support unit 22 and the substrate support unit lift drive mechanism 31 are mounted on the alignment stage 30, and the electrostatic chuck lift drive mechanism 32 moves from the alignment stage 30. Since they are installed separately, the alignment stage 30 is moved relative to the electrostatic chuck 24 and the substrate S by moving the alignment stage 30 in the X and Y directions of the horizontal direction or by rotating it in the θ direction. The target position can be adjusted. As described above, according to the present invention, the relative position between the electrostatic chuck 24 and the substrate S in the horizontal direction (at least one of the X direction, the Y direction, and the θ direction) is determined by the substrate transfer error of the transfer robot 14. Even when they are deviated from each other, the relative position of the substrate S with respect to the electrostatic chuck 24 can be adjusted, so that the substrate S can be favorably attracted to the electrostatic chuck 24.

  When the adjustment of the relative position of the substrate S with respect to the electrostatic chuck 24 (substrate pre-alignment) is completed, the electrostatic chuck 24 is lowered by the electrostatic chuck lifting drive mechanism 32, as shown in FIG. 4D. A predetermined voltage (ΔV1) is applied to the electrostatic chuck 24 to attract the substrate S to the electrostatic chuck 24.

  Subsequently, as shown in FIG. 4E, the electrostatic chuck elevating and lowering drive mechanism 32 is driven to lower the substrate S attracted to the electrostatic chuck 24 onto the mask M. At this time, the substrate support unit elevating / lowering mechanism 31 can lower the substrate support unit 22 together with the lowering of the electrostatic chuck 24.

When the substrate S attracted to the electrostatic chuck 24 is lowered to the alignment measurement position (for example, the measurement position in the fine alignment process), the alignment camera (fine alignment camera) is used as shown in FIG. Then, the alignment marks of the substrate S and the mask are photographed, and the relative positional deviation amount is measured. When the relative positional displacement amount between the substrate S and the mask M exceeds a threshold value, the alignment stage 30 on which the mask support unit elevating and lowering drive mechanism 33 is mounted is moved in the X direction or the Y direction in the horizontal direction, or in the θ direction. To adjust the relative position between the substrate S and the mask M. When adjusting the relative position between the substrate S and the mask M, the substrate S has already been attracted to the electrostatic chuck 24, as shown in FIG. 4D. Therefore, even if the relative position between the substrate S and the mask M is adjusted by moving the alignment stage 30 in the horizontal direction as described above, the substrate S is not affected, and the above-mentioned substrate The relative position in the horizontal direction between S and the mask M is adjusted.

  As a result, when the relative positional deviation amount between the substrate S and the mask M falls within the threshold value, the electrostatic chuck elevating and lowering drive mechanism 32 is driven to move the electrostatic chuck 24, as shown in FIG. The mask M is lowered. A predetermined voltage (ΔV2) is applied to the electrostatic chuck 24 lowered onto the mask M to draw the mask M toward the substrate S, whereby the substrate S and the mask M are brought into close contact with each other.

  Then, the shutter of the evaporation source 25 is opened, and the evaporation material evaporated from the evaporation source 25 is evaporated on the lower surface of the substrate through the mask (FIG. 4 (h)).

  According to the present invention, pre-alignment of the substrate S with respect to the electrostatic chuck 24 is possible, so that the stacking accuracy of the stack of the electrostatic chuck / substrate / mask is improved, and as a result, the film forming accuracy is improved.

  Although FIG. 4 mainly describes the configuration in which the substrate S is pre-aligned with the electrostatic chuck 24, the mask M may be pre-aligned with the electrostatic chuck 24. That is, after the mask M is carried into the vacuum container 21 by the transfer robot 14 and supported by the mask supporting unit 23, the relative displacement between the mask M and the electrostatic chuck 24 is performed by the same method as the substrate pre-alignment. The amount may be measured and the relative position may be adjusted. Then, the relative position between the substrate S and the mask M in the horizontal direction is adjusted. In that case, first, pre-alignment of the mask M with respect to the electrostatic chuck 24 is performed. Next, pre-alignment of the substrate S with respect to the electrostatic chuck 24 is performed by the above method. Then, the position adjustment amount (difference) of the substrate S with respect to the electrostatic chuck 24 at that time is stored as coordinate data. Here, since the substrate S and the mask M are pre-aligned with respect to the electrostatic chuck 24, the relative positions of the substrate S and the mask M are deviated from each other. When the relative position of the mask S is adjusted during the rough alignment between the substrate S and the mask M, the mask M is not moved based on the coordinate data when the pre-alignment of the substrate S with respect to the electrostatic chuck 24 is performed. The electric chuck 24 is moved in a direction opposite to the direction in which the electric chuck 24 is moved. Thereby, the stacking accuracy of the stacked body of the electrostatic chuck / substrate / mask can be further improved, and as a result, the film forming accuracy can be improved.

  Further, in the present embodiment, it has been described with reference to FIG. 4 that the alignment between the substrate S and the mask M is performed while the substrate S is attracted to the electrostatic chuck 24, but the present invention is not limited to this. Instead, the mask M may be moved from the mask support unit 23 to the mask base 26, and then the substrate S supported by the substrate support unit 22 and the mask M on the mask base 26 may be aligned.

  Further, in the present embodiment, referring to FIG. 4, after the pre-alignment of the substrate S, the alignment between the substrate S and the mask M is performed in one step (that is, fine alignment for performing highly accurate alignment). However, the present invention is not limited to this, and the alignment step performed after the pre-alignment may be performed in two steps (a rough alignment for performing rough alignment and the above-described fine alignment).

In the above description, the film forming apparatus 11 has a so-called upward vapor deposition method (deposition up) in which film formation is performed with the film forming surface of the substrate S facing vertically downward. The present invention is not limited to this, and the substrate S may be arranged vertically on the side surface of the vacuum container 21, and the film formation may be performed in a state where the film formation surface of the substrate S is parallel to the gravity direction. .. In the above-described embodiment, the electrostatic chuck 24 is configured such that the attracting surface is a horizontal surface, the first direction (X direction), the second direction (Y direction) are horizontal, and the third direction (Z direction). ) Is configured to be vertical. On the other hand, when the substrate S is vertically set, the attraction surface of the electrostatic chuck 24 is a surface perpendicular to the horizontal plane, the third direction is the horizontal direction, and the first direction is the horizontal direction. The second direction is a direction orthogonal to each other in a plane perpendicular to the horizontal plane.

<Electronic device manufacturing method>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described. Hereinafter, a configuration and a manufacturing method of an organic EL display device will be illustrated as an example of an electronic device.

  First, the organic EL display device to be manufactured will be described. 5A shows an overall view of the organic EL display device 60, and FIG. 5B shows a sectional structure of one pixel.

  As shown in FIG. 5A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. It should be noted that the pixel here refers to a minimum unit that enables display of a desired color in the display area 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B which emit different lights. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

  FIG. 5B is a schematic partial sectional view taken along the line AB of FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. , And an organic EL element including. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements that emit red, green, and blue (sometimes described as organic EL elements). The first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed commonly to the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by water and oxygen, a protective layer 70 is provided to protect the organic EL element from water and oxygen.

  Although the hole transport layer 65 and the electron transport layer 67 are shown as one layer in FIG. 5B, they are formed as a plurality of layers including a hole block layer and an electron block layer depending on the structure of the organic EL display element. May be done. Further, between the first electrode 64 and the hole transport layer 65, there is an energy band structure capable of smoothly injecting holes from the first electrode 64 into the hole transport layer 65. A hole injection layer can also be formed. Similarly, an electron injection layer may be formed between the second electrode 68 and the electron transport layer 67.

  Next, an example of the method for manufacturing the organic EL display device will be specifically described.

  First, a circuit 63 (not shown) for driving the organic EL display device and the substrate 63 on which the first electrode 64 is formed are prepared.

  An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in a portion where the first electrode 64 is formed. 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

  The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, the substrate is held by at least one of the substrate supporting unit 22 and the electrostatic chuck 24, and the hole transport layer 65 is displayed in the display area. The first electrode 64 is formed as a common layer. The hole transport layer 65 is formed by vacuum vapor deposition. In reality, the hole transport layer 65 is formed to have a size larger than that of the display region 61, so that a high-definition mask is unnecessary.

  Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into the second organic material film forming apparatus and held by the substrate supporting unit 22 and the electrostatic chuck 24. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red light is formed on the portion of the substrate 63 where the element that emits red light is arranged.

  According to the present invention, the substrate support unit lift drive mechanism 31 and the mask support unit lift drive mechanism 33 are mounted on the alignment stage 30, and the electrostatic chuck lift drive mechanism 32 is separately installed from the alignment stage 30. Thus, the relative positions of the electrostatic chuck 24, the substrate support unit 22, and the mask support unit 23 can be effectively adjusted, and thus the film deposition failure can be effectively reduced.

  Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third organic material film forming apparatus, and the light emitting layer 66B emitting blue is formed by the fourth organic material film forming apparatus. .. After the film formation of the light emitting layers 66R, 66G, 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

  The substrate on which the electron transport layer 67 has been formed is moved by the metallic vapor deposition material film forming apparatus to form the second electrode 68.

  After that, the organic EL display device 60 is completed by moving to a plasma CVD device to form a protective layer 70.

  If the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, if the substrate 63 is exposed to an atmosphere containing water and oxygen, the light emitting layer made of an organic EL material will be formed. It may be deteriorated by water or oxygen. Therefore, in this embodiment, the loading and unloading of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

  The above-described embodiments are merely examples of the present invention, and the present invention is not limited to the configurations of the above-described embodiments, and may be appropriately modified within the scope of the technical idea thereof.

21: Vacuum container 22: Substrate support unit 23: Mask support unit 24: Electrostatic chuck 30: Alignment stage 31: Substrate support unit lift drive mechanism 32: Electrostatic chuck lift drive mechanism 33: Mask support unit lift drive mechanism

Claims (18)

A substrate support unit for supporting the substrate,
A mask support unit for supporting the mask,
An electrostatic chuck for attracting the mask through the substrate and the substrate;
The substrate support unit and the mask support unit are, with respect to the electrostatic chuck, a first direction parallel to an attraction surface of the electrostatic chuck and a direction orthogonal to the first direction, It is movable in at least one of the second directions that are parallel to the adsorption surface of the electric chuck, and has a third direction as an axis, which is orthogonal to the first direction and the second direction. An alignment device capable of rotating in a rotation direction. The apparatus further includes an alignment stage for moving the substrate supporting unit and the mask supporting unit in at least one of the first direction and the second direction with respect to the electrostatic chuck and rotating the electrostatic chuck in the rotating direction. ,
The alignment apparatus according to claim 1, wherein the electrostatic chuck is separately installed from the alignment stage.   The electrostatic chuck is maintained in a state in which the electrostatic chuck does not move in the first direction and the second direction and does not rotate in the rotation direction when the alignment device is installed. The alignment apparatus according to 2. Further including a vacuum vessel,
The electrostatic chuck is installed so that the relative position in the first direction, the second direction, and the rotation direction is fixed with respect to the vacuum container. The alignment apparatus according to any one of items. Further comprising a substrate support unit drive mechanism for moving the substrate support unit in the third direction,
The alignment apparatus according to claim 2, wherein the substrate support unit drive mechanism is mounted on the alignment stage. Further comprising a mask support unit driving mechanism for moving the mask support unit in the third direction,
The alignment apparatus according to claim 2, wherein the mask support unit driving mechanism is mounted on the alignment stage. Further comprising an electrostatic chuck drive mechanism for moving the electrostatic chuck in the third direction,
The alignment apparatus according to claim 2, wherein the electrostatic chuck drive mechanism is separated from the alignment stage and installed independently. Further comprising a base plate supporting an electrostatic chuck drive mechanism,
8. The electrostatic chuck driving mechanism is installed such that relative positions in the first direction, the second direction, and the rotation direction are fixed with respect to the base plate. The alignment device described in. Further including a vacuum vessel,
8. The electrostatic chuck drive mechanism is installed so that relative positions in the first direction, the second direction, and the rotation direction are fixed with respect to the vacuum container. Or the alignment device according to 8. A film forming apparatus for forming an evaporation material on a substrate through a mask,
A film forming apparatus comprising the alignment device according to claim 1. Supporting the substrate by a substrate support unit,
Supporting the mask with a mask support unit,
The electrostatic chuck includes at least one of the substrate and the mask, a first direction that is parallel to an adsorption surface of the electrostatic chuck with respect to the electrostatic chuck, and a direction that is orthogonal to the first direction. Of at least one of the second directions that are parallel to the suction surface, or rotated in a rotation direction around a third direction orthogonal to each of the first direction and the second direction. A pre-alignment step of adjusting the relative position of at least one of the electrostatic chuck and the substrate, and the electrostatic chuck and the mask by:
An alignment method comprising: an alignment step of adjusting relative positions of the substrate and the mask.   In the pre-alignment step, the substrate is moved in at least one of the first direction and the second direction with respect to the electrostatic chuck, or is rotated in the rotation direction, so that the electrostatic chuck is rotated. The alignment method according to claim 11, further comprising a step of adjusting a relative position between the substrate and the substrate. After the pre-alignment step, further comprising a step of adsorbing the substrate to the electrostatic chuck,
The alignment step includes a step of moving the mask in at least one of the first direction and the second direction or rotating the mask in the rotation direction with respect to the substrate attracted to the electrostatic chuck. The alignment method according to claim 11 or 12, characterized in that.   In the pre-alignment step, the mask is moved in at least one of the first direction and the second direction with respect to the electrostatic chuck, or is rotated in the rotation direction, so that the electrostatic chuck and the electrostatic chuck are rotated. The alignment method according to claim 11, further comprising the step of adjusting a relative position with respect to the mask.   12. The alignment step includes a step of moving the mask in at least one of the first direction and the second direction or rotating the mask in the rotation direction with respect to the substrate. 13. The alignment method according to item 13. A film forming method for forming a vapor deposition material on a substrate through a mask, comprising:
Supporting the mask with a mask support unit,
Supporting the substrate with a substrate support unit,
With respect to the electrostatic chuck, the substrate supported by the substrate support unit is provided with a first direction that is a direction parallel to an adsorption surface of the electrostatic chuck, and a direction that is orthogonal to the first direction. Moving in at least one of the second directions parallel to the chucking surface of the chuck, or rotating in a rotation direction around a third direction orthogonal to each of the first direction and the second direction. Pre-alignment process to adjust the position by
A step of adsorbing the position-adjusted substrate to the electrostatic chuck;
An alignment step of adjusting the position of the mask supported by the mask supporting unit with respect to the substrate attracted to the electrostatic chuck;
Adsorbing the position-adjusted mask to the electrostatic chuck via the substrate,
And a step of forming a vapor deposition material on the substrate through the mask.   In the alignment step, the mask supported by the mask supporting unit is moved or rotated in at least one of the first direction and the second direction with respect to the substrate attracted by the electrostatic chuck. The film forming method according to claim 16, wherein the film forming method is rotated in the direction.   An electronic device manufacturing method, comprising manufacturing an electronic device using the film forming method according to claim 16.