JP2014170637A - Method for producing electrostatic capacitance sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing an electrostatic capacitance sensor capable of realizing so excellent a surface appearance for which the thickness of printing is not visually recognized, and capable of improving the accuracy of positioning.SOLUTION: The method for producing an electrostatic capacitance sensor comprises the steps of: forming a circuit pattern 16 on either surface on a film base material; forming, on the film base material having had the circuit pattern 16 formed thereon and using a male mold, a film base material so as emulate the outer surface of the male mold; and forming, on the film base material having had the circuit pattern 16 formed thereon and using a die in contact with a surface opposite the surface which the male mold touches, an opposite surface so as to emulate the die.

Description

  The present invention relates to a method for manufacturing a capacitance sensor.

  A method for manufacturing a capacitance sensor has been proposed in which a decorative layer is formed on the surface of a film and an electrode layer is formed on the back surface of the film (see, for example, Patent Document 1). In the method of manufacturing a capacitance sensor described in Patent Document 1, even when the capacitance sensor is installed in a mounting surface having a curved surface, the capacitance sensor is disposed close to the back surface of the operation surface. Can do. Here, if there is a gap between the back surface of the operation surface and the capacitance sensor, the capacitance assumed between the finger or the like of the input body and the electrode layer deviates from the design value. Thereby, in the manufacturing method of the capacitance sensor described in Patent Document 1, it is possible to prevent a decrease in detection sensitivity by preventing a gap from being formed between the operation surface and the capacitance sensor.

  On the other hand, a method for manufacturing a capacitance sensor in which a decorative film and an electrode film are separately prepared and bonded together has been proposed (for example, see Patent Document 2). In the manufacturing method of the electrostatic capacity sensor described in Patent Document 2, the decorative film and the electrode film are separate bodies, and therefore, there is no possibility that the conductive line is smeared or damaged by the solvent.

JP 2010-267607 A JP 2010-244776

  However, in the method for manufacturing a capacitance sensor described in Patent Document 1, the decoration layer is disposed on the surface of the capacitance sensor, which is insufficient in terms of chemical resistance and scratch resistance. Moreover, in the manufacturing method of the electrostatic capacitance sensor described in Patent Document 1, there is a concern about deterioration of design properties accompanying design deterioration due to the influence of chemicals or scratches. And in the manufacturing method of the electrostatic capacitance sensor of patent document 1, when a decoration layer is arrange | positioned on the back surface of a film and an electrode layer is laminated | stacked on it, a solvent or heat | fever is applied to a decoration layer at the time of printing of an electrode. It will cause damage.

  On the other hand, in the method of manufacturing a capacitance sensor described in Patent Document 2, forming and insert molding are performed after a decorative film and an electrode film prepared separately are bonded to each other. Therefore, it is difficult to select an adhesive layer that can withstand problems such as elongation during forming and heat resistance during insert molding. Moreover, in the manufacturing method of the electrostatic capacitance sensor described in Patent Document 2, when the electrode film and the decorative film are bonded together after being molded in three dimensions, the members each having a three-dimensional shape are bonded together. It is difficult.

  And in the manufacturing method of the electrostatic capacitance sensor of patent document 1 and patent document 2, in the forming process, the thickness of the printed wiring or electrode is visually recognized from the surface side, so-called “around” It happens. In the forming process, for example, “forming” is performed by using a film having a printing step on the mold surface, and the printing step is pressed against the mold surface by the pressure during forming. The thickness is transferred to the opposite surface (surface layer side) of the film, and unevenness occurs. The “hits” generated by the forming process remain like a pattern on the external appearance of the capacitance sensor even after the insert molding. Even when this printing step is on the film surface that is not in contact with the mold surface, the unevenness of the printing step remains on the surface layer side after the forming process, so that it remains like a pattern on the exterior after insert molding. Here, for example, even if an intermediate layer is disposed between the capacitance sensor and the decorative layer so as to cancel the printing thickness, it is difficult to completely eliminate the intermediate layer. In particular, when the wiring is formed of a silver paste, the wiring is thin and hard, so that the wiring shape is likely to remain in the capacitance sensor as “spot”. Therefore, it can be considered that the forming mold is a female mold. However, when a female forming mold is employed, the displacement between the capacitance sensor and the decorative layer is large, so that the displacement is likely to occur and the positioning accuracy cannot be increased. In addition, when forming is performed on a molded product obtained by laminating two films, since the two films are laminated, an adhesive layer that can achieve both elongation, heat resistance, and adhesiveness is provided. Selection is difficult. That is, in the manufacturing method of the electrostatic capacitance sensor described in Patent Document 1 and Patent Document 2, in the forming and insert molding processes, the printing thickness of the decorative layer and the electrode layer is transferred to the surface and the appearance is deteriorated. Have.

  The present invention has been made in view of the above problems, and provides a method for manufacturing a capacitance sensor that can realize a good surface appearance in which the thickness of printing is not visually recognized and can improve positioning accuracy. With the goal.

In order to solve the above problems, the present invention proposes the following means.
One aspect of the present invention is the step of forming a circuit pattern on at least one of the front surface and the back surface on a film substrate having a front surface and a back surface, and the film substrate on which the circuit pattern is formed. Forming the film base so as to follow the outer surface of the male mold using a male mold, and contacting the surface opposite to the surface on which the male mold contacts the film base on which the circuit pattern is formed. And a step of forming the opposite surface so as to follow the die by using a die.

  In the above-described method for manufacturing a capacitance sensor, the step of forming the mold by contacting the opposite surface may be insert injection.

  Moreover, the manufacturing method of said electrostatic capacitance sensor WHEREIN: You may further provide the process of providing a decorating film in the said opposite surface in the said film base material.

  Furthermore, in the method for manufacturing a capacitance sensor, a step of forming a protective layer on the film base material that covers the circuit pattern before forming the male pattern after forming the circuit pattern. You may prepare.

  In addition, in the above-described capacitance sensor manufacturing method, the protective layer may have an insulating property.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the electrostatic capacitance sensor which can implement | achieve the favorable surface external appearance in which the thickness of printing is not visually recognized, and can improve positioning accuracy can be provided.

It is the external appearance perspective view seen from the upper direction of the capacitance sensor manufactured by the manufacturing method of the capacitance sensor of one embodiment of the present invention. It is the external appearance perspective view seen from the downward direction of the same capacitance sensor. FIG. 2 is a cross-sectional view of the capacitance sensor of FIG. 1 taken along line AA. It is a flowchart explaining the procedure of the manufacturing method of the electrostatic capacitance sensor of one embodiment of this invention. It is a schematic diagram of the 1st process of the manufacturing method of the same electrostatic capacitance sensor. It is a schematic diagram of the 2nd process of the manufacturing method of the same electrostatic capacitance sensor. It is a principal part enlarged view of the 2nd process of the manufacturing method of the same electrostatic capacitance sensor. It is a schematic diagram of the front | former stage of the 3rd process of the manufacturing method of the same capacitance sensor. It is a schematic diagram of the back | latter stage of the 3rd process of the manufacturing method of the same electrostatic capacitance sensor. It is a principal part enlarged view of the 3rd process of the manufacturing method of the same electrostatic capacitance sensor. It is a schematic diagram of the front | former stage of the 4th process of the manufacturing method of the same capacitance sensor. It is a schematic diagram of the back | latter stage of the 4th process of the manufacturing method of the same capacitance sensor. It is a schematic diagram of the 1st process of the 1st modification of the manufacturing method of the same electrostatic capacitance sensor. It is a schematic diagram of the 2nd process of the 1st modification of the manufacturing method of the same electrostatic capacitance sensor. It is a schematic diagram of the 1st process of the 2nd modification of the manufacturing method of the same capacitance sensor. It is a schematic diagram of the 1st process of the 3rd modification of the manufacturing method of the same electrostatic capacitance sensor. It is a schematic diagram of the 1st process of the 4th modification of the manufacturing method of the same electrostatic capacitance sensor. It is a schematic diagram of the 1st process of the 5th modification of the manufacturing method of the same electrostatic capacitance sensor.

  Hereinafter, an embodiment of a method for producing a capacitance sensor according to the present invention will be described with reference to FIGS. FIG. 1 is an external perspective view of a capacitance sensor manufactured by a method for manufacturing a capacitance sensor according to an embodiment of the present invention as viewed from above. FIG. 2 is an external perspective view of the capacitance sensor viewed from below. FIG. 3 is a cross-sectional view of the capacitance sensor of FIG.

As shown in FIGS. 1, 2, and 3, the capacitance sensor 10 includes a sensor sheet 11 and a decorative film 12. In the present specification, the terms “up”, “upper”, “upper surface”, and “surface” refer to directions in which the decorative film 12 faces the sensor sheet 11 in FIG. Further, in this specification, “lower”, “lower”, “lower surface”, and “rear surface” mean directions in which the support 18 is viewed from the film substrate 17 in FIG.
The capacitance sensor 10 is applied to, for example, a touch switch.

  The sensor sheet 11 is formed by sequentially laminating a circuit pattern 16 having electrodes 13 and wirings 14, a film base material 17, and a support 18 from below.

As shown in FIG. 2, the electrodes 13 are light transmissive, and are arranged in a circumferential direction with triangles that spread radially in plan view. In the present embodiment, a plurality of electrodes 13 are formed on the sensor sheet 11. Here, the electrode 13 is a portion corresponding to an area to be illuminated, and is formed of a light transmissive material.
The wiring 14 is disposed so as to partially overlap the outer edge portions of the plurality of electrodes 13, and is independently connected to each of the electrodes 13. The wiring 14 is extended to the connection portion 19. The wiring 14 is formed by a member that does not have optical transparency, such as a metal thin film or a metal particle-containing resin layer (silver paste).

  The circuit pattern 16 (consisting of the electrode 13 and the wiring 14 in this embodiment) is formed of a conductive member such as silver ink, carbon ink, conductive polymer, or metal nanowire. Moreover, when forming the sensor sheet 11 which can be illuminated, it is preferable that the electrode 13 is formed with the light transmissive electrically conductive film containing metal oxides, such as ITO, a conductive polymer, or metal nanowire. The wiring 14 is preferably formed of a low-resistance metal material (for example, silver ink). The thickness of the electrode 13 is, for example, 1 μm or less when illumination is possible, and the wiring 14 is about 5 to 15 μm. In the circuit pattern 16, the electrode 13 indirectly faces the user's finger as an input body when any one is operated. When the wiring 14 is formed of silver ink, it is preferable to form the external connection portion 20 by overprinting with carbon ink to prevent oxidation / sulfurization.

  On the film base 17, the electrodes 13 and the wirings 14 are formed by screen printing. The film substrate 17 has a connecting portion 19 that protrudes outward from the central portion where the electrode 13 is located. An end portion of the wiring 14 is disposed in the connection portion 19.

  The support 18 is integrated with the film substrate 17 to reinforce the film substrate 17. Examples of the resin that forms the support 18 include polycarbonate, polyacetal, polybutylene terephthalate, ABS resin, polypropylene, and acrylic resin.

  As shown in FIG. 1, the decorative film 12 is a member which shows a pattern by illumination. The decorative film 12 is formed into a thin plate using a light-transmitting material such as polyethylene terephthalate, polycarbonate, acrylic resin, and is formed into a hollow hemispherical shape by three-dimensional molding. The decorative film 12 may form a pattern (not shown) at the center.

As shown in FIG. 3, the wiring 14 has an external connection portion 20 at the end of the connection portion 19. A connector 21 is attached to the external connection unit 20. The connector 21 is attached to the circuit board 22 to electrically connect the wiring 14 to a detection circuit (not shown).
On the lower surface of the decorative film 12, a decorative layer 23 is formed. An adhesive layer 24 is formed on the lower surface of the decorative layer 23. The adhesive layer 24 is a light-transmitting adhesive, for example, an acrylic pressure-sensitive adhesive or a hot melt type adhesive.

Next, a method for manufacturing a capacitance sensor will be described.
FIG. 4 is a flowchart for explaining the manufacturing procedure of the manufacturing method of the capacitance sensor. FIG. 5 is a schematic diagram of the first step of the method of manufacturing the capacitance sensor. FIG. 6 is a schematic diagram of a second step of the method for manufacturing the capacitance sensor. FIG. 7 is an enlarged view of a main part of the second step of the method for manufacturing the capacitance sensor. FIG. 8 is a schematic diagram of the former stage of the third step of the method of manufacturing the capacitance sensor. FIG. 9 is a schematic diagram of the latter stage of the third step of the method of manufacturing the capacitance sensor. FIG. 10 is an enlarged view of a main part of the third step of the method for manufacturing the capacitance sensor. FIG. 11 is a schematic diagram of the former stage of the fourth step of the method of manufacturing the capacitance sensor. FIG. 12 is a schematic diagram of the latter stage of the fourth step in the method of manufacturing the capacitance sensor.

As shown in FIG. 4, first, in step S <b> 101, a first step of forming the circuit pattern 16 on the front surface 25 on the film base material 17 having the front surface 25 and the back surface 26 is performed. Step S102 is performed after step S101.
As shown in FIG. 5, in the first step, the electrode 13 and the wiring 14 are formed on the surface 25 of the film base material 17 by screen printing.

As shown in FIG. 4, in step S <b> 102, the film base material 17 is formed so as to follow the outer surface of the male die 50 using the male die 50 with respect to the film base material 17 on which the circuit pattern 16 is formed. Perform the process. Step S103 is performed after step S102.
As shown in FIG. 6, in the second step, pressure molding is performed by the male mold 50 from the back surface 26 side of the film base material 17. The film substrate 17 is formed into a hollow hemispherical shape having a convex surface 27 and a concave surface 28 by pressure forming. By the second step, the electrode 13 and the wiring 14 are deformed following the curved shape of the convex surface 27 of the film substrate 17.
As shown in FIG. 7, the circuit pattern 16 having the electrodes 13 and the wirings 14 is formed on the surface 25 of the film substrate 17 with irregularities.

  As shown in FIG. 4, in step S103 after step S102, the sample is formed in the process of step S102 and then trimmed to a shape suitable for insert injection. Step S104 is performed after step S103. In step 104, a third step of forming the convex surface 27 to follow the cavity die 60 using the cavity die 60 in contact with the convex surface 27 opposite to the concave surface 28 with respect to the film substrate 17 on which the circuit pattern 16 is formed. Do. Step S105 is performed after step S104.

As shown in FIG. 8, in the preceding stage of the third step, insert injection molding is performed using a cavity mold 60 having a cavity and a core mold 61. Concavities and convexities that define the surface shape of the capacitance sensor 10 are engraved on the cavity inner surface of the cavity mold 60 having the cavity. The core mold 61 defines the shape of the support 18.
In the insert injection molding using the cavity mold 60 and the core mold 61, the concave cavity mold 60 is arranged on the convex surface 27 side of the film substrate 17, and the core mold 61 is arranged on the concave surface 28 side of the film substrate 17, and the film base The material 17 is fixed to the cavity mold 60. Then, an injection resin 29 serving as the support 18 is injected from the resin injection hole 62 of the core mold 61 and pressed at a high pressure and a high temperature. The circuit pattern 16 disposed on the convex surface 27 of the film base material 17 is embedded in the convex surface 27 of the film base material 17 by insert injection molding. The circuit pattern 16 embedded in the convex surface 27 of the film substrate 17 has no irregularities on the molding surface 30.

As shown in FIG. 9, the cavity mold 60 and the core mold 61 are opened after the third step.
As shown in FIG. 10, the sensor sheet 11 having the circuit pattern 16 without unevenness on the molding surface 30 is manufactured.

As shown in FIG. 4, in step S <b> 105, a fourth step is performed in which the decorative film 12 is provided on the convex surface 27 of the film base material 17. Step S106 is performed after step 105.
As shown in FIG. 11, in the fourth step, a molded product 31 in which the decorative film 12 is bonded to the convex surface 27 of the sensor sheet 11 by following the molding surface 30 of the sensor sheet 11 is manufactured by a three-dimensional decoration method. Is done. In addition, as a concrete method of making the decorative film 12 follow the molding surface 30, an overlay molding method such as vacuum forming, pressure forming, vacuum pressure forming, ultra high pressure forming, TOM method or the like can be mentioned.

As shown in FIG. 4, in step S <b> 106, trimming is performed on the molded product 31.
As shown in FIG. 12, the electrostatic capacitance sensor 10 is manufactured by trimming the molded product 31 to adjust the outer shape.

Next, the usage method and operation of the capacitance sensor 10 of the present embodiment will be described.
When such a capacitance sensor 10 is used, the wiring 14 is electrically connected to the detection circuit on the circuit board 22 via the connector 21. The detection circuit outputs a reference signal to the electrode 13. Then, charges are accumulated in the electrode 13 by the reference signal output to the electrode 13. Therefore, when an input body (not shown) approaches the decorative film 12, the electrode 13 and the input body are electrostatically coupled to form a capacitor between the electrode 13 and the input body. Then, the capacitance between the electrode 13 and the input body changes depending on the distance between the electrode 13 and the input body, and the detection circuit detects this change in capacitance.

  As described above, according to the method for manufacturing a capacitance sensor of the present embodiment, the sensor sheet 11 having the circuit pattern 16 without unevenness can be manufactured. Therefore, according to the capacitance sensor manufacturing method of the present embodiment, it is possible to realize a good surface appearance in which the printing thickness is not visually recognized.

  Further, according to the method for manufacturing a capacitance sensor of the present embodiment, the step of forming the cavity mold 60 by contacting the convex surface 27 is the insert injection, so that the positioning accuracy of the circuit pattern 16 can be improved. it can.

  And according to the manufacturing method of the electrostatic capacitance sensor of this Embodiment, the decoration film 12 is provided in the sensor sheet 11 which has the circuit pattern 16 without an unevenness | corrugation. Therefore, according to the capacitance sensor manufacturing method of the present embodiment, it is possible to realize a good surface appearance in which the printing thickness is not visually recognized.

  Furthermore, according to the manufacturing method of the electrostatic capacitance sensor of this Embodiment, the process of forming and insert injection molding can be advanced in the single-piece | unit state of the film base material 17. FIG. Therefore, according to the manufacturing method of the capacitance sensor of the present embodiment, it is possible to avoid problems such as misalignment and unintentional shape.

  Furthermore, according to the manufacturing method of the capacitance sensor of the present embodiment, the decorative film 12 can be bonded to the sensor sheet 11 after the insert injection molding is completed. Therefore, according to the manufacturing method of the capacitance sensor of the present embodiment, it is possible to avoid the adhesive layer 24 from being damaged by the high temperature injection resin.

  In addition, according to the method for manufacturing a capacitance sensor of the present embodiment, when forming a shape such as a through hole or a jumper that is likely to cause a step, the capacitance sensor 10 is manufactured to prevent appearance deterioration due to the influence of thickness. be able to.

  Furthermore, according to the manufacturing method of the capacitance sensor of the present embodiment, since the male mold 50 is used, the position due to the elongation of the film base material 17 during the pressure forming is compared with the case where the female mold is used. Misalignment can be reduced.

  Furthermore, according to the manufacturing method of the capacitive sensor of the present embodiment, the decorative film 12 is made to follow the molding surface 30 of the sensor sheet 11 on the convex surface 27 of the sensor sheet 11 by the three-dimensional surface decoration method. to paste together. Therefore, according to the manufacturing method of the capacitance sensor of the present embodiment, the decorative layer 23 can be provided on the film base material 17 without any positional deviation.

(Modification 1)
FIG. 13 is a schematic diagram of the first step of the first modification of the method for manufacturing the capacitance sensor. As shown in FIG. 13, in the first step, a circuit pattern 16 having electrodes 13 and wirings 14 is formed on the back surface 26 of the film substrate 17 by screen printing instead of the surface 25 of the film substrate 17. .

  FIG. 14 is a schematic diagram of the second step of the first modification of the method for manufacturing the capacitance sensor. As shown in FIG. 14, in the second step, pressure molding is performed by the male mold 50 from the back surface 26 side of the film base material 17. By pressure forming, the electrode 13 and the wiring 14 are deformed and embedded following the curved shape of the concave surface 28 of the film substrate 17. At this time, a transfer surface 71 corresponding to the volume of the electrode 13 and the wiring 14 is formed on the surface 25 of the film substrate 17. However, the transfer surface 71 is formed into a surface having no irregularities by insert injection molding using the concave cavity mold 60 in the subsequent steps.

  According to the manufacturing method of the capacitance sensor of the first modified example, pressure molding is performed by the male mold 50 from the back surface 26 side of the film substrate 17 on which the circuit pattern 16 is formed. Therefore, according to the manufacturing method of the capacitance sensor of the first modified example, the circuit pattern 16 is installed by reliably preventing the displacement by directly pressing the male mold 50 against the circuit pattern 16. Can do.

(Modification 2)
FIG. 15 is a schematic diagram of the first step of the second modification of the method for manufacturing the capacitance sensor. As shown in FIG. 15, in the first step, the circuit pattern 16 of the electrode 13 and the wiring 14 is formed on the surface 25 of the film substrate 17 by screen printing. In the first step, the protective layer 72 is formed so as to cover the electrode 13 and the wiring 14. The protective layer 72 has an insulating property.

  According to the method of manufacturing the capacitance sensor of the second modification, the protective layer 72 can reduce the impact on the circuit pattern 16 during insert molding. Therefore, according to the manufacturing method of the capacitance sensor of the second modified example, it is possible to reliably prevent the displacement of the circuit pattern 16.

(Modification 3)
FIG. 16 is a schematic diagram of a first step of a third modification of the method for manufacturing the capacitance sensor. As shown in FIG. 16, in the first step, the circuit pattern 16 of the electrode 13 and the wiring 14 is formed on the surface 25 of the film substrate 17 by screen printing, and a protective layer 73 is formed integrally thereon. Yes. The protective layer 73 has an insulating property and forms a single flat surface 74 on the circuit pattern 16. The protective layer 73 is suitable for UV curable ink because thick film printing is possible.

  According to the manufacturing method of the capacitance sensor of the third modification, the impact on the circuit pattern 16 can be reduced at the time of insert molding by including the protective layer 73 formed integrally with the film base material 17. Therefore, according to the manufacturing method of the capacitance sensor of the third modified example, the positional deviation of the circuit pattern 16 can be reliably prevented.

  Moreover, according to the manufacturing method of the capacitance sensor of the third modification, the flat surface 74 is formed on the circuit pattern 16 by the protective layer 73, so that the thickness of the sensor sheet 11 can be made uniform.

  And according to the manufacturing method of the capacitance sensor of the third modified example, it is possible to make the influence of the thickness of the wiring 14 less likely by forming the flat surface 74, and therefore, in step S104 shown in FIG. Flattening is easy in the process.

(Modification 4)
FIG. 17 is a schematic diagram of the first step of the fourth modified example of the method of manufacturing the capacitance sensor. As shown in FIG. 17, this modification is a case of duplex printing. On the surface 25 of the film substrate 17, the circuit pattern 16 of the electrode 13 and the wiring 14 is formed by screen printing, and a protective layer 75 is formed so as to cover the circuit pattern 16. The protective layer 75 has a uniform flat surface 76 on the surface.

  On the back surface 26 of the film substrate 17, a ground layer 79 is formed which is electrically connected to the wiring 14 through the connection line 78 accommodated in the through hole 77. A protective layer 80 is formed to cover the ground layer 79. The protective layer 80 has a flat surface 81 on the back surface. Instead of the connection line 78 accommodated in the through hole 77, the wiring 14 and the ground layer 79 may be connected by a jumper line.

  According to the capacitance sensor manufacturing method of the fourth modification, the thickness of the sensor sheet 11 can be made uniform by the protective layer 75 and the protective layer 80.

(Modification 5)
FIG. 18 is a schematic diagram of the first step of the fifth modified example of the method of manufacturing the capacitance sensor. As shown in FIG. 18, this modification is a case where dielectric connection is applied. The dielectric connection is a connection in which two conductors are arranged with a dielectric in between. An electrode 82 for dielectric connection is formed on the surface 25 of the film substrate 17, and a protective layer 83 that covers the electrode 82 independently is formed. The protective layer 83 forms a uniform flat surface 84 on the surface. Here, for example, a conductive material that forms a pair with the electrode 13 is formed on the film base material (support) 17, and can be used by attaching a substrate provided with a detection circuit. Detection is possible when the conductor receives the proximity or contact of the finger to the electrode 13 as an induced radio signal.

  According to the capacitance sensor manufacturing method of the fifth modification, it is possible to cope with the case where the dielectric connection electrode 82 is formed, and the trimming process can be simplified in order to eliminate the need to take out the terminal portion and the like. it can.

  Further, according to the method of manufacturing the capacitance sensor of the fifth modified example, since there is no wiring, it is possible to prevent the influence of the ink flow caused by the high temperature / high pressure resin when the injection molding is performed and the electrode being damaged. .

The embodiment and the modification of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiment and the modification, and the design does not depart from the gist of the present invention. Changes are also included.
For example, the present invention is not limited to the touch switch shown in the above-described embodiment and modifications, and can be similarly applied to a three-dimensional touch panel.
In addition, the technical matters described in the above-described embodiment and modifications can be appropriately combined.

DESCRIPTION OF SYMBOLS 10 Capacitance sensor 11 Sensor sheet 12 Decoration film 13, 82 Electrode 14 Wiring 16 Circuit pattern 17 Film base material 18 Support body 19 Connection part 20 External connection part 21 Connector 22 Circuit board 23 Decoration layer 24 Adhesive layer 25 Surface 26 Back surface 27 Convex surface 28 Concave surface 29 Injection resin 30 Molded surface 31 Molded product 50 Male mold 60 Cavity mold 61 Core mold 71 Transfer surface 72, 73, 75, 80, 83 Protective layer 74, 76, 81, 84 Flat surface 77 Through hole 78 Connection line 79 Ground layer

Claims (5)

Forming a circuit pattern on at least one of the front surface and the back surface on a film substrate having a front surface and a back surface;
Forming the film base so as to follow the outer surface of the male mold using a male mold for the film base on which the circuit pattern is formed;
Forming the opposite surface to follow the mold using a mold that contacts the opposite surface to the surface on which the male mold contacts the film substrate on which the circuit pattern is formed;
A method of manufacturing a capacitance sensor, comprising:   2. The method of manufacturing a capacitance sensor according to claim 1, wherein the step of forming the mold by bringing the mold into contact with the opposite surface is an insert injection.   The method for producing a capacitance sensor according to claim 1, further comprising a step of providing a decorative film on the opposite surface of the film base material.   4. The method according to claim 1, further comprising: forming a protective layer covering the circuit pattern on the film substrate before forming the male pattern after forming the circuit pattern. 5. A method for producing the capacitance sensor according to claim 1.   The method of manufacturing a capacitance sensor according to claim 4, wherein the protective layer has an insulating property.

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