JP2012028564A - Molding with integrated conductive circuit and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding with an integrated conductive circuit in which corrosion of the conductive circuit can be reduced without increasing the number of components and the manufacturing process.SOLUTION: A protective film of a functional sheet is stuck to a conductive circuit using adhesive so that the conductive circuit is not exposed to the outside excepting a part thereof. The functional sheet is then buried in a resin molding so that the external surface of the protective film is flush with the surface of the resin molding, and a lead wire is electrically connected with a part of the conductive circuit where the protective film is not stuck.

Description

  The present invention relates to a conductive circuit used for a display panel of an in-vehicle audio device or an air conditioner, a window panel of a mobile phone, a display or mouse of a personal computer, an operation panel or remote control of various household devices, a display of a game device, or the like. The present invention relates to an integrally molded product and a method for manufacturing the same.

  Conventionally, as this type of conductive circuit integrated molded product, for example, one having a structure as shown in FIG. 13 is known. FIG. 13 is a partial cross-sectional view schematically showing the structure of a conventional conductive circuit integrated molded product.

  In FIG. 13, a conventional conductive circuit integrated molded product has a design pattern layer 101 formed on the outer surface of a resin molded body 102, and a functional sheet 103 such as an antenna or an electrostatic sensor sheet on the inner surface of the resin molded body 102. It has a formed structure.

  The design pattern layer 101 is a layer on which an operation function display pattern or an appearance design pattern such as an on / off button or a slider switch is formed.

  The resin molded body 102 is generally formed of polycarbonate (PC) or acrylic resin having transparency and insulating properties. The resin molded body 102 is molded in advance before the design pattern layer 101 and the functional sheet 103 are formed.

  The functional sheet 103 includes a base film 131, a conductive circuit 132 such as an antenna pattern layer and an electrostatic sensor pattern layer formed on the base film 131, and a conductive circuit 132 using an adhesive adhesive 133 as a corrosion resistance measure for the conductive circuit 132. It is comprised with the protective film 134 stuck on the top. The functional sheet 103 is adhered to the inner surface of the resin molded body 102 by the base film 131 being adhered to the inner surface of the resin molded body 102 by the adhesive 104. In addition, instead of the adhesive adhesive 133 and the protective film 134, there is a functional sheet in which the surface of the conductive circuit 132 is plated with a corrosion-resistant metal.

  The base film 131 is partly cut away at the outer periphery, and part of the conductive circuit 132 is exposed at the cutout part. The exposed portion of the conductive circuit 132 is electrically connected to one end of a strip-like lead 106 such as an FPC (flexible substrate) by an anisotropic conductive adhesive 105 such as ACF or ACP. A connector 107 for connecting to an external device is connected to the other end of the lead 106.

  The conductive circuit 132 has a property of corroding when exposed to the outside air. In the conventional conductive circuit integrated molded product, the edge of the conductive circuit 132 is exposed to the outside.

  As a method of solving the above problem, there is a method of forming a sealing resin so as to seal a connection portion between the conductive circuit 132 and the lead 106. However, in this case, of course, the number of parts increases.

  Accordingly, an object of the present invention is to solve the above-described problems, and to provide a conductive circuit integrated molded product that can suppress corrosion of the conductive circuit without increasing the number of parts, and a method for manufacturing the same. is there.

In order to achieve the above object, the present invention is configured as follows.
According to the first aspect of the present invention, the functional sheet having a conductive circuit is a conductive circuit integrated molded article arranged on the surface of the resin molding,
The functional sheet includes a protective film adhered to the conductive circuit by an adhesive adhesive so that the conductive circuit is not exposed to the outside except a part of the conductive circuit, and the outer surface of the protective film is the resin molding Embedded in the resin molded body so as to be flush with the surface of the body, and leads are electrically connected to a part of the conductive circuit,
A conductive circuit integrated molded article is provided.

  According to a second aspect of the present invention, there is provided the conductive circuit integrated molded product according to the first aspect, wherein the conductive circuit is an electrostatic sensor pattern layer or an antenna pattern layer.

  According to a third aspect of the present invention, there is provided the conductive circuit integrated molded product according to the first or second aspect, wherein a part of the conductive circuit is located flush with a surface of the resin molded body. provide.

  According to the 4th aspect of this invention, the said protective film provides the electrically conductive circuit integrated molded article as described in any one of the 1st-3rd aspect currently formed larger in size than the said electrically conductive circuit. .

  According to the 5th aspect of this invention, the outer peripheral part of the said protective film provides the conductive circuit integrated molded product as described in a 4th aspect currently adhere | attached with the said resin molding by the said adhesive adhesive.

According to the sixth aspect of the present invention, the functional sheet includes a base film attached to the resin molded body,
The conductive circuit is formed on the base film smaller in size than the base film and the protective film, and is sealed by an outer peripheral portion of the base film and an outer peripheral portion of the protective film, A conductive circuit integrated molded article according to any one of three aspects is provided.

According to the seventh aspect of the present invention, a concave portion is formed in the outer peripheral portion of the functional sheet,
A part of the resin molded body has entered the recess,
A conductive circuit integrated molded article according to any one of the first to sixth aspects is provided.

According to the eighth aspect of the present invention, a through hole is formed in the outer peripheral portion of the functional sheet,
A part of the resin molded body is filled in the through hole,
A conductive circuit integrated molded article according to any one of the first to seventh aspects is provided.

  According to a ninth aspect of the present invention, in the conductive circuit according to any one of the first to eighth aspects, the lead is arranged to cover a part of the conductive circuit so as not to touch outside air. Provide integrated molded products.

According to the tenth aspect of the present invention, the functional sheet in which a part of the conductive circuit is exposed to the outside is disposed on the cavity surface such that a part of the conductive circuit faces the cavity surface of the injection mold. ,
Injecting the molten resin into the cavity space of the mold, and simultaneously injecting the resin molded body, the functional sheet is embedded in the resin molded body so as to be flush with the surface of the resin molded body,
Electrically connecting a lead to a portion of the conductive circuit;
The manufacturing method of the conductive circuit integrated molded article is also provided.

According to the eleventh aspect of the present invention, the functional sheet having the conductive circuit is disposed on the cavity surface of the injection mold,
Injecting the molten resin into the cavity space of the mold, and simultaneously injecting the resin molded body, the functional sheet is embedded in the resin molded body so as to be flush with the surface of the resin molded body,
Peeling a part of the outer surface of the functional sheet to expose a part of the conductive circuit to the outside;
Electrically connecting a lead to a portion of the conductive circuit;
The manufacturing method of the conductive circuit integrated molded article is also provided.

  According to a twelfth aspect of the present invention, the conductive circuit integrated molding according to the eleventh aspect, wherein a notch is formed around a part of the outer surface of the functional sheet before the functional sheet is disposed on the cavity surface. A method for manufacturing a product is provided.

According to a thirteenth aspect of the present invention, the functional sheet includes a base film on which the conductive circuit is formed, and a protective film that covers the conductive circuit so that the conductive circuit is not exposed to the outside except for a part of the conductive circuit. With
The said base film and the said protective film provide the manufacturing method of the electrically conductive circuit integrated molded article as described in any one of the 10th-12th aspects currently formed larger in size than the said electrically conductive circuit.

  According to a fourteenth aspect of the present invention, in the thirteenth aspect, the conductive circuit is sealed by the outer peripheral portion of the base film and the outer peripheral portion of the protective film before the functional sheet is disposed on the cavity surface. A method for producing the described conductive circuit integrated molded article is provided.

  According to the fifteenth aspect of the present invention, the outer peripheral portion of the base film is deformed by the molten resin injected into the cavity space of the mold, and the outer peripheral portion of the base film and the outer peripheral portion of the protective film are used. A method for producing a conductive circuit integrated molded article according to the thirteenth aspect, wherein the conductive circuit is sealed.

  According to the conductive circuit integrated molded product according to the present invention, the functional sheet is embedded in the resin molded body so that the outer surface of the protective film is flush with the surface of the resin molded body. The edge is located in the resin molded body. Therefore, corrosion of the conductive circuit can be suppressed. Further, since the corrosion of the conductive circuit can be suppressed without separately providing a sealing resin for sealing the connection portion between the conductive circuit and the lead, an increase in the number of parts can be suppressed.

  Moreover, according to the manufacturing method of the conductive circuit integrated molded product according to the tenth aspect of the present invention, the functional sheet in which a part of the conductive circuit is exposed to the outside is disposed on the cavity surface of the mold, and the resin molded body is injected. Simultaneously with the molding, the functional sheet is embedded in the resin molded body so as to be flush with the surface of the resin molded body. Thereby, since the edge of a conductive circuit will be located in a resin molding, corrosion of a conductive circuit can be suppressed. Further, since the corrosion of the conductive circuit can be suppressed without separately providing a sealing resin for sealing the connection portion between the conductive circuit and the lead, an increase in the number of parts can be suppressed.

  Moreover, in the conventional manufacturing method, a pressure sensitive adhesive (PSA) is normally used as an adhesive agent, and a functional sheet is stuck on a resin molding. For this reason, air easily enters between the resin molded body and the functional sheet, light scattering occurs, and the skin-like unevenness is likely to occur. When such unevenness occurs, the transparency is lowered and the design as a conductive circuit integrated molded product is adversely affected. On the other hand, according to the method for manufacturing a conductive circuit integrated molded product according to the tenth aspect of the present invention, air and resin are formed between the resin molded body and the functional sheet by heat and pressure during injection molding of the resin molded body. Can be prevented from entering. Therefore, generation | occurrence | production of the said nonuniformity can be suppressed, transparency can be improved, and the designability as a conductive circuit integrated molded product can be improved.

  Moreover, according to the manufacturing method of the conductive circuit integrated molded product according to the eleventh aspect of the present invention, the functional sheet having the conductive circuit is disposed on the cavity surface of the mold, and simultaneously with the injection molding of the resin molded body, the resin molding The functional sheet is embedded in the resin molded body so as to be flush with the surface of the body. Thereby, since the edge of a conductive circuit will be located in a resin molding, corrosion of a conductive circuit can be suppressed. Further, since the corrosion of the conductive circuit can be suppressed without separately providing a sealing resin for sealing the connection portion between the conductive circuit and the lead, an increase in the number of parts can be suppressed. In addition, the heat and pressure during the injection molding of the resin molded body can suppress the air from entering between the resin molded body and the functional sheet, thereby suppressing the occurrence of the unevenness and improving the transparency. The design as a conductive circuit integrated molded product can be improved.

It is a perspective view of the conductive circuit integrated molded product concerning 1st Embodiment of this invention. It is sectional drawing which shows typically the structure of the conductive circuit integrated molded product of FIG. It is sectional drawing which shows typically the preferable example of a connection of the lead | read | reed in the conductive circuit integrated molded product concerning 1st Embodiment of this invention. It is sectional drawing which shows typically an example of the manufacturing method of the electrically conductive circuit integrated molded product concerning 1st Embodiment of this invention. It is sectional drawing which shows the process of following FIG. 4A. FIG. 4B is a cross-sectional view showing a step that follows FIG. 4B. It is a perspective view which shows typically the 1st modification of the electrically conductive circuit integrated molded product concerning 1st Embodiment of this invention. It is a perspective view which shows typically the 2nd modification of the electrically conductive circuit integrated molded product concerning 1st Embodiment of this invention. It is sectional drawing which shows typically the 3rd modification of the electrically conductive circuit integrated molded product concerning 1st Embodiment of this invention. It is sectional drawing which shows typically the 4th modification of the electrically conductive circuit integrated molded product concerning 1st Embodiment of this invention. It is sectional drawing which shows typically the 5th modification of the electrically conductive circuit integrated molded product concerning 1st Embodiment of this invention. It is sectional drawing which shows typically the structure of the electrically conductive circuit integrated molded product concerning 2nd Embodiment of this invention. It is sectional drawing which shows typically the preferable connection example of the lead in the conductive circuit integrated molded product concerning 2nd Embodiment of this invention. It is sectional drawing which shows typically an example of the manufacturing method of the conductive circuit integrated molded product concerning 2nd Embodiment of this invention. It is sectional drawing which shows the process of following FIG. 12A. It is sectional drawing which shows the process of following FIG. 12B. FIG. 12C is a cross-sectional view showing a step that follows FIG. 12C. It is a fragmentary sectional view which shows typically the structure of the conventional conductive circuit integrated molded product.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< First Embodiment >>
The structure of the conductive circuit integrated molded product according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a conductive circuit integrated molded product according to the first embodiment. FIG. 2 is a cross-sectional view schematically showing the structure of the conductive circuit integrated molded product of FIG.

  The conductive circuit integrated molded product according to the first embodiment includes a resin molded body 2 formed of a resin material such as polycarbonate (PC) and acrylic resin having transparency and insulating properties.

  A design pattern layer 1 is formed on the outer surface of the resin molded body 2 as shown in FIG. The design pattern layer 1 is a layer on which an operation function display pattern and an appearance design pattern such as an on / off button and a slider switch are formed.

  A functional sheet 3 such as an antenna or an electrostatic sensor sheet is embedded in the inner surface of the resin molded body 2 so as to be flush with the inner surface. The functional sheet 3 includes a base film 31, a conductive circuit 32 such as an antenna pattern layer or an electrostatic sensor pattern layer, and a protective film 34.

  The base film 31 is attached to the resin molded body 2 with the adhesive 4. The base film 31 is made of, for example, polycarbonate, polyethylene terephthalate (PET), an acrylic film, or the like.

  The conductive circuit 32 is formed on the base film 31. The conductive circuit 32 is formed, for example, by etching a transparent metal thin film such as a copper mesh or ITO (indium tin oxide) with a predetermined pattern.

  The protective film 34 is adhered to the conductive circuit 32 with an adhesive 33 so that the conductive circuit 32 is not exposed to the outside except for a part of the conductive circuit 32. The protective film 34 is made of polycarbonate, polyethylene terephthalate (PET), acrylic film, or the like. The functional sheet 3 is embedded in the resin molded body 2 such that the outer surface of the protective film 34 is flush with the inner surface of the resin molded body 2.

  A part 32 a of the conductive circuit 32, which is a part where the protective film 34 is not attached, is positioned flush with the inner surface of the resin molded body 2. A part 32 a of the conductive circuit 32 is electrically connected to a terminal part 6 d provided on one end part 6 A of the strip-like lead 6 by an anisotropic conductive adhesive 5 such as ACF or ACP. The lead 6 is composed of an FPC (flexible substrate) or the like.

  The lead 6 has a structure in which a conductor portion 6b is formed on a base film 6a such as polyimide. An insulator 6c is formed on the conductor portion 6b except for the terminal portion 6d to protect the conductor portion 6b. A connector 7 for connecting to an external device is connected to the other end 6B of the lead 6.

  According to the conductive circuit integrated molded product according to the first embodiment, the functional sheet 3 is embedded in the resin molded body 2 so that the outer surface of the protective film 34 is flush with the inner surface of the resin molded body 2. Thus, the edge of the conductive circuit 32 is located in the resin molded body 2. Therefore, corrosion of the conductive circuit 32 can be suppressed. Even when the functional sheet 3 is embedded in the resin molded body 2, the protective film 34 is not attached to the part 32 a of the conductive circuit 32, so that the part 32 a of the conductive circuit 32 is not attached. By crimping the lead 6 through the anisotropic adhesive 5, both can be easily electrically connected. Furthermore, since the corrosion of the conductive circuit 32 can be suppressed without separately providing a sealing resin for sealing the connecting portion between the conductive circuit 32 and the lead 6, an increase in the number of components can be suppressed.

  As shown in FIG. 3, the lead 6 is preferably arranged so as to cover a part 32a of the conductive circuit 32 so as not to be exposed to the outside air. Thereby, corrosion of the conductive circuit 32 can be further suppressed. On the other hand, in the conventional conductive circuit integrated molded product shown in FIG. 13, since there is a step in the exposed portion of the conductive circuit 32, it is difficult to completely cover the exposed portion with the lead 106.

  Next, a method for manufacturing a conductive circuit integrated molded product according to the first embodiment will be described. 4A to 4C are cross-sectional views schematically showing an example of a method for producing a conductive circuit integrated molded product according to the first embodiment.

  Here, two molds of a first mold T1 and a second mold T2 are used as injection molds. The first mold T1 is provided with a suction hole T1b for attracting and holding the design pattern layer 1 to the flat cavity surface T1a of the first mold T1. The second mold T2 is provided with a plurality of suction holes T2b for attracting and holding the functional sheet 3 to the flat cavity surface T2a of the second mold T1. Each suction hole T1b is connected by a suction groove (not shown). Each suction hole T2b is connected by a suction groove (not shown). Note that either the first mold T1 or the second mold T2 may be a fixed mold (or a movable mold).

  Here, the function sheet 3 formed in advance so that a part 32a of the conductive circuit 32 is exposed to the outside is used. Such a functional sheet 3 is formed by, for example, attaching a protective film 34 provided with a through hole at a position corresponding to a part 32 a of the conductive circuit 32 to the conductive circuit 32 with an adhesive adhesive 33. Can do. Such a functional sheet 3 can also be formed by peeling a part of the protective film 34 after the protective film 34 is adhered to the entire conductive circuit 32 with the adhesive adhesive 33.

  Here, it is assumed that the adhesive 4 is formed on the base film 31 in advance.

  First, as shown in FIG. 4A, the design pattern layer 1 is disposed on the cavity surface T1a of the first mold T1, and a part 32a of the conductive circuit 32 is opposed to the cavity surface T2a of the second mold T2. The functional sheet 3 is disposed on the cavity surface T2a.

  Next, the design pattern layer 1 is sucked through the suction hole T1b and the suction groove of the first mold T1 by a suction device (not shown), and the design pattern layer 1 is firmly held on the cavity surface T1c of the first mold T1. Similarly, the functional sheet 3 is sucked through the suction hole T2b and the suction groove of the second mold T2 by a suction device (not shown), and the functional sheet 3 is firmly held on the cavity surface T2c of the second mold T2.

  Next, as shown in FIG. 4B, the first mold T1 and the second mold T2 are closed. As a result, a cavity space S1 is formed between the first mold T1 and the second mold T2.

  Next, a molten resin such as PC or acrylic resin is poured into the cavity space S1. Thereby, as shown in FIG. 4C, the functional sheet 3 is embedded in the resin molded body 2 so as to be flush with the inner surface of the resin molded body 2 at the same time as the resin molded body 2 is injection-molded. At this time, the vicinity of the part 32a of the conductive circuit 32 of the functional sheet 3 is deformed by the injection pressure of the molten resin, and the part 32a of the conductive circuit 32 is flush with the inner surface of the resin molded body 2. To do.

  Next, the first mold T1 and the second mold T2 are opened, and the terminal portion 6d of the lead 6 is electrically connected to the part 32a of the conductive circuit 32 by the anisotropic conductive adhesive 5 as shown in FIG. Connect. Thereby, the conductive circuit integrated molded product according to the first embodiment is manufactured.

  According to the manufacturing method, the functional sheet 32 in which the part 32a of the conductive circuit 32 is exposed to the outside is disposed on the cavity surface T2a of the second mold T2, and simultaneously with the injection molding of the resin molded body 2, the resin molded body 2 The functional sheet 3 is embedded in the resin molded body 2 so as to be flush with the surface. Thereby, since the edge of the conductive circuit 32 is located in the resin molding 2, the corrosion of the conductive circuit 32 can be suppressed. In addition, even when the functional sheet 3 is embedded in the resin molded body 2, the protective film 34 is not attached to the part 32 a of the conductive circuit 32. By crimping the terminal portion 6d of the lead 6 via the anisotropic adhesive 5, both can be easily electrically connected. Furthermore, since the corrosion of the conductive circuit 32 can be suppressed without separately providing a sealing resin for sealing the connecting portion between the conductive circuit 32 and the lead 6, an increase in the number of components can be suppressed.

  In the conventional manufacturing method, a pressure sensitive adhesive (PSA) is usually used as the adhesive 104 and the functional sheet 103 is adhered to the resin molded body 102. For this reason, air is likely to enter between the resin molded body 102 and the functional sheet 103, light scattering occurs, and a skin-like unevenness is likely to occur. In particular, since it is difficult to remove air near the corners of fine irregularities formed by the patterned conductive circuit 32, uneven skin-like unevenness is likely to occur. When such unevenness occurs, the transparency is lowered and the design as a conductive circuit integrated molded product is adversely affected. On the other hand, according to the said manufacturing method, it can suppress that air enters between the resin molding 2 and the functional sheet 3 with the heat and pressure at the time of the injection molding of the resin molding 2. FIG. Therefore, generation | occurrence | production of the said nonuniformity can be suppressed, transparency can be improved, and the designability as a conductive circuit integrated molded product can be improved.

  Moreover, in the conventional manufacturing method, when the resin molding 102 has a three-dimensional curved surface, it is difficult to affix the functional sheet 103 on the curved surface. On the other hand, according to the manufacturing method, each member itself such as the base film 31 and the conductive circuit 32 is also stretched by heat and pressure at the time of injection molding of the resin molded body 2, so that they are generated without generating wrinkles. It can be easily integrated into a three-dimensional curved surface.

  In addition, this invention is not limited to the said 1st Embodiment, It can implement in another various aspect. For example, as shown in FIG. 5, one or more recesses 3 </ b> Aa may be provided on the outer periphery of the functional sheet 3 </ b> A so that the resin molded body 2 enters the recesses 3 </ b> Aa. Thereby, the adhesive force of 3 A of functional sheets and the resin molding 2 can be raised. Further, as shown in FIG. 6, one or more through holes 3Ba may be provided on the outer peripheral portion of the functional sheet 3B, and the resin molded body 2 may be filled in the through holes 3Ba. In this case as well, the adhesive force between the functional sheet 3A and the resin molded body 2 can be increased.

  Moreover, although the adhesive agent 4 was provided between the resin molding 2 and the base film 31 in the above, this invention is not limited to this. For example, when polycarbonate is used for the resin molded body 2 and the base film 31, it is possible to eliminate the necessity of providing the adhesive 4 because the mutual adhesiveness is good.

  Moreover, in FIG. 2, although the size of each member of the functional sheet 3 was shown as being the same, the present invention is not limited to this. For example, as shown in FIG. 7, the size of the protective film 34 may be formed larger than other members including the conductive circuit 32. In this case, since the conductive circuit 32 can be completely covered with the protective film 34, the corrosion of the conductive circuit 32 can be further suppressed.

  In addition, depending on the combination of materials used for the resin molded body 2 and the protective film 34, the adhesive force (adhesiveness) between the resin molded body 2 and the protective film 34 may not be sufficiently secured. Therefore, as shown in FIG. 8, the size of the adhesive adhesive 33 is increased and the portion protrudes from the conductive circuit 32 in the plane direction (left and right direction in the figure) when viewed from the thickness direction (up and down direction in the figure). The adhesive adhesive 33a may also be formed on the outer peripheral portion 34a of the protective film 34. In this case, since the outer peripheral portion 34a of the protective film 34 and the resin molded body 2 can be adhered by the adhesive adhesive 33a, the resin molded body is not affected by the material used for the resin molded body 2 and the protective film 34. 2 and the protective film 34 can be sufficiently secured. Moreover, since it is only necessary to increase the size of the pressure-sensitive adhesive 33, it is possible to suppress an increase in the number of parts and the manufacturing process. A pressure-sensitive adhesive other than the pressure-sensitive adhesive 33 a may be formed on the outer peripheral portion 34 a of the protective film 34. In this case, it is possible to select an adhesive adhesive that is optimal for the adhesion between the resin molded body 2 and the protective film 34, and the adhesive force between the resin molded body 2 and the protective film 34 can be further increased.

  9, the conductive circuit 32 is formed smaller than the protective film 34 and the base film 31, and the conductive circuit 32 is sealed by the outer peripheral portion 34a of the protective film 34 and the outer peripheral portion 31a of the base film 31. You may make it do. In this case, since the conductive circuit 32 can be reliably prevented from touching the outside air, corrosion of the conductive circuit 32 can be reliably suppressed.

  9 shows an example in which the conductive circuit 32 is sealed by bonding the outer peripheral portion 34a of the protective film 34 and the outer peripheral portion 31a of the base film 31 with the adhesive adhesive 33. Is not limited to this. When the adhesiveness between the material used for the protective film 34 and the material used for the base film 31 is good, the outer peripheral portion 34a of the protective film 34 and the outer peripheral portion 31a of the base film 31 may be brought into direct contact and bonded. Good. Moreover, although the example which forms the adhesive agent 4 also on the outer peripheral part 31a of the base film 31 was shown in FIG. 9, this invention is not limited to this. When the adhesiveness between the material used for the protective film 34 and the material used for the resin molding 2 is good, for example, when polycarbonate is used for both, it is not necessary to provide the adhesive 4.

  The sealing of the conductive circuit 32 by the outer peripheral portion 34a of the protective film 34 and the outer peripheral portion 31a of the base film 31 may be performed before the functional sheet 3 is disposed on the cavity surface T2a of the second mold T2. . That is, the functional sheet 3 in which the conductive circuit 32 is sealed by the outer peripheral portion 34 a of the protective film 34 and the outer peripheral portion 31 a of the base film 31 is created in advance, and the conductive circuit according to the second embodiment is used using the functional sheet 3. An integrally molded product may be manufactured.

  The conductive circuit 32 may be sealed by the outer peripheral portion 34a of the protective film 34 and the outer peripheral portion 31a of the base film 31 by utilizing the injection pressure and heat of the molten resin when the resin molded body 2 is injection molded. it can. That is, the conductive circuit 32 may be sealed by deforming the outer peripheral portion 31a of the base film 31 with the molten resin injected into the cavity space S1.

  In the above description, the design pattern layer 1 is provided, but the design pattern layer 1 is not necessarily provided.

<< Second Embodiment >>
The structure of the conductive circuit integrated molded product according to the second embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view schematically showing the structure of a conductive circuit integrated molded product according to the second embodiment. The conductive circuit integrated molded product according to the second embodiment is different from the conductive circuit integrated molded product according to the first embodiment in that the vicinity of a part 32a of the conductive circuit 32 is not deformed and the conductive circuit 32 is not deformed. This is that a part 32 a of the resin is not flush with the inner surface of the resin molded body 2.

  Even in such a configuration, the functional sheet 3 is embedded in the resin molded body 2 so that the outer surface of the protective film 34 is flush with the inner surface of the resin molded body 2. Is located in the resin molded body 2. Therefore, corrosion of the conductive circuit 32 can be suppressed. Even when the functional sheet 3 is embedded in the resin molded body 2, the protective film 34 is not attached to the part 32 a of the conductive circuit 32, so that the part 32 a of the conductive circuit 32 is not attached. By crimping the lead 6 through the anisotropic adhesive 5, both can be easily electrically connected. Furthermore, since the corrosion of the conductive circuit 32 can be suppressed without separately providing a sealing resin for sealing the connecting portion between the conductive circuit 32 and the lead 6, an increase in the number of components can be suppressed.

  As shown in FIG. 11, the lead 6 is preferably arranged so as to cover a part 32a of the conductive circuit 32 so as not to be exposed to the outside air. Thereby, corrosion of the conductive circuit 32 can be further suppressed. In this case, there is a step between the part 32a of the conductive circuit 32 and the outer surface of the protective film 34. However, if a paste-like material such as ACP is used as the anisotropic conductive adhesive 5, for example, It is possible to completely cover the part 32 a of the circuit 32 with the lead 6.

  Next, a method for manufacturing a conductive circuit integrated molded product according to the second embodiment will be described. 14A and 14B are cross-sectional views schematically showing an example of a method for manufacturing a conductive circuit integrated molded product according to the second embodiment. 15 is a cross-sectional view taken along line C1-C1 of FIG. 14A.

  Here, it is assumed that the conductive circuit 4 is formed on the base film 3 and the adhesive 5 is formed on the conductive circuit 4 in advance. In addition, it is assumed that a terminal portion 7 d of the lead 7 is electrically connected to a part of the end portion of the conductive circuit 4 by an anisotropic conductive adhesive 6 in advance.

  Here, the same two molds as the first embodiment, the first mold T1 and the second mold T2, are used as injection molds. In addition, the functional sheet 3 in which cuts 34b are formed in advance around a part of the adhesive adhesive 33 and the protective film 34 facing the part 32a of the conductive circuit 32 is used. Further, it is assumed that the adhesive 4 is formed on the base film 31 in advance.

  First, as shown in FIG. 12A, the design pattern layer 1 is disposed on the cavity surface T1a of the first mold T1, and the functional sheet 3 is placed so that the protective film 34 faces the cavity surface T2a of the second mold T2. It arrange | positions to cavity surface T2a.

  Next, the design pattern layer 1 is sucked through the suction hole T1b and the suction groove of the first mold T1 by a suction device (not shown), and the design pattern layer 1 is firmly held on the cavity surface T1c of the first mold T1. Similarly, the functional sheet 3 is sucked through the suction hole T2b and the suction groove of the second mold T2 by a suction device (not shown), and the functional sheet 3 is firmly held on the cavity surface T2c of the second mold T2.

  Next, as shown in FIG. 12B, the first mold T1 and the second mold T2 are closed. As a result, a cavity space S1 is formed between the first mold T1 and the second mold T2.

  Next, a molten resin such as PC or acrylic resin is poured into the cavity space S1. Thereby, as shown in FIG. 12C, the functional sheet 3 is embedded in the resin molded body 2 so as to be flush with the inner surface of the resin molded body 2 at the same time as the resin molded body 2 is injection-molded.

  Next, the first mold T1 and the second mold T2 are opened, and as shown in FIG. 12D, a part of the pressure-sensitive adhesive 33 and the protective film 34 in which the cuts 34b are formed are peeled off.

  Next, the terminal portion 6 d of the lead 6 is electrically connected to the part 32 a of the conductive circuit 32 by the anisotropic conductive adhesive 5. Thereby, the conductive circuit integrated molded product according to the second embodiment shown in FIG. 10 or FIG. 11 is manufactured.

  According to the manufacturing method, the functional sheet 3 is disposed on the cavity surface T2a of the second mold T2, and functions so as to be flush with the surface of the resin molded body 2 simultaneously with the injection molding of the resin molded body 2. The sheet 3 is embedded in the resin molded body 2. Thereby, since the edge of the conductive circuit 32 is located in the resin molding 2, the corrosion of the conductive circuit 32 can be suppressed. In addition, even when the functional sheet 3 is embedded in the resin molded body 2, the protective film 34 is not attached to the part 32 a of the conductive circuit 32. By crimping the terminal portion 6d of the lead 6 via the anisotropic adhesive 5, both can be easily electrically connected. In addition, since the corrosion of the conductive circuit 32 can be suppressed without separately providing a sealing resin for sealing the connection portion between the conductive circuit 32 and the lead 6, an increase in the number of components can be suppressed. Furthermore, since it is possible to suppress air from entering between the resin molded body 2 and the functional sheet 3 due to heat and pressure during the injection molding of the resin molded body 2, the occurrence of the unevenness is suppressed and transparency is improved. It is possible to improve the design as a conductive circuit integrated molded product.

  In the above description, in order to improve the peelability of a part of the adhesive adhesive 33 and the protective film 34, the notches 34b are formed in advance around them, but the notches 34b are not necessarily formed.

  It is to be noted that, by appropriately combining any of the various embodiments, the effects possessed by them can be produced.

  Since the conductive circuit molding simultaneous integrated molded product according to the present invention can prevent the corrosion of the conductive circuit without increasing the number of parts and the manufacturing process, it is possible to prevent the corrosion of the conductive circuit. It is useful as a panel in which a design pattern and an electrostatic sensor film are integrated, used for a window panel of a telephone, a display and mouse of a personal computer, an operation panel and remote controller of various household devices, a display of a game machine, etc. .

DESCRIPTION OF SYMBOLS 1 Design pattern layer 2 Resin molding 3 Function sheet 4 Adhesive 5 Anisotropic conductive adhesive 6 Lead 6a Base film 6b Conductor part 6c Insulator 6d Terminal part 7 Connector 31 Base film 32 Conductive circuit 33 Adhesive adhesive 34 Protective film T1 1st mold T2 2nd mold S1 space

Claims (15)

The functional sheet having a conductive circuit is a conductive circuit integrated molded article arranged on the surface of the resin molded body,
The functional sheet includes a protective film adhered to the conductive circuit by an adhesive adhesive so that the conductive circuit is not exposed to the outside except a part of the conductive circuit, and the outer surface of the protective film is the resin molding Embedded in the resin molded body so as to be flush with the surface of the body, and leads are electrically connected to a part of the conductive circuit,
Conductive circuit integrated molded product.   The conductive circuit integrated molded product according to claim 1, wherein the conductive circuit is an electrostatic sensor pattern layer or an antenna pattern layer.   3. The conductive circuit integrated molded product according to claim 1, wherein a part of the conductive circuit is positioned flush with a surface of the resin molded body.   The conductive circuit integrated molded product according to any one of claims 1 to 3, wherein the protective film is formed larger in size than the conductive circuit.   The outer peripheral part of the said protective film is a conductive circuit integrated molded product of Claim 4 adhere | attached with the said resin molding by the said adhesive adhesive. The functional sheet includes a base film that is attached to the resin molded body,
The conductive circuit is formed smaller on the base film than the base film and the protective film, and is sealed by an outer peripheral portion of the base film and an outer peripheral portion of the protective film. The conductive circuit integrated molded article according to any one of? A concave portion is formed on the outer peripheral portion of the functional sheet,
A part of the resin molded body has entered the recess,
The conductive circuit integrated molded product according to any one of claims 1 to 6. A through hole is formed in the outer periphery of the functional sheet,
A part of the resin molded body is filled in the through hole,
The conductive circuit integrated molded article according to any one of claims 1 to 7.   The conductive circuit integrated molded product according to any one of claims 1 to 8, wherein the lead is disposed so as to cover a part of the conductive circuit so as not to touch outside air. A functional sheet in which a part of the conductive circuit is exposed to the outside is disposed on the cavity surface such that a part of the conductive circuit faces the cavity surface of the injection mold,
Injecting the molten resin into the cavity space of the mold, and simultaneously injecting the resin molded body, the functional sheet is embedded in the resin molded body so as to be flush with the surface of the resin molded body,
Electrically connecting a lead to a portion of the conductive circuit;
The manufacturing method of the conductive circuit integrated molded article including this. A functional sheet having a conductive circuit is placed on the cavity surface of the injection mold,
Injecting the molten resin into the cavity space of the mold, and simultaneously injecting the resin molded body, the functional sheet is embedded in the resin molded body so as to be flush with the surface of the resin molded body,
Peeling a part of the outer surface of the functional sheet to expose a part of the conductive circuit to the outside;
Electrically connecting a lead to a portion of the conductive circuit;
The manufacturing method of the conductive circuit integrated molded article including this.   The method for manufacturing a conductive circuit integrated molded product according to claim 11, wherein a notch is formed around a part of an outer surface of the functional sheet before the functional sheet is disposed on the cavity surface. The functional sheet includes a base film on which the conductive circuit is formed, and a protective film that covers the conductive circuit so that the conductive circuit is not exposed to the outside except a part of the conductive circuit.
The method for producing a conductive circuit integrated molded product according to any one of claims 10 to 12, wherein the base film and the protective film are formed larger in size than the conductive circuit.   The conductive circuit integrated molded product according to claim 13, wherein the conductive circuit is sealed by an outer peripheral portion of the base film and an outer peripheral portion of the protective film before the functional sheet is disposed on the cavity surface. Method.   The outer peripheral part of the base film is deformed by the molten resin injected into the cavity space of the mold, and the conductive circuit is sealed by the outer peripheral part of the base film and the outer peripheral part of the protective film. 14. A method for producing a conductive circuit integrated molded product according to 13.

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