TWI507941B - Surface panels with detection capability - Google Patents
Surface panels with detection capability Download PDFInfo
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- TWI507941B TWI507941B TW102129035A TW102129035A TWI507941B TW I507941 B TWI507941 B TW I507941B TW 102129035 A TW102129035 A TW 102129035A TW 102129035 A TW102129035 A TW 102129035A TW I507941 B TWI507941 B TW I507941B
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- panel
- molded body
- layer
- substrate
- decorative
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- 238000001514 detection method Methods 0.000 title description 9
- 239000010410 layer Substances 0.000 claims description 152
- 239000011241 protective layer Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 11
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 10
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 229920000178 Acrylic resin Polymers 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 229920002799 BoPET Polymers 0.000 claims description 3
- 230000035882 stress Effects 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 230000007613 environmental effect Effects 0.000 description 6
- -1 Polyethylene Terephthalate Polymers 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000009500 colour coating Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Human Computer Interaction (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
本發明係關於一種作為可攜式設備或其他電子設備之框體之一部分使用之表面面板,尤其是關於一種包含包圍透光區域之裝飾層及設置於上述透光區域之檢測電極層之具有檢測功能之表面面板。The present invention relates to a surface panel partially used as a casing of a portable device or other electronic device, and more particularly to a detection layer including a decorative layer surrounding the light-transmitting region and a detecting electrode layer disposed on the light-transmitting region Functional surface panel.
作為可攜式設備或其他電子設備之框體之一部分使用之表面面板係於中央部形成能夠透視液晶顯示裝置等之顯示畫面並且可藉由手指進行觸控操作之透光區域,且於該透光區域之周圍設置有被著色成框狀之裝飾區域。The surface panel used as part of the casing of the portable device or other electronic device is formed at a central portion to form a light-transmissive region capable of seeing a display screen of the liquid crystal display device or the like and capable of performing a touch operation by a finger, and A decorative area colored in a frame shape is provided around the light area.
於專利文獻1之圖6以下揭示有具備透明觸控面板之觸控面板模組。A touch panel module having a transparent touch panel is disclosed below in FIG. 6 of Patent Document 1.
該觸控面板模組係藉由射出成型而成型透明面板。於透明面板上形成凹陷,於該凹陷之內部插入並保持有透明觸控面板。並且,將保持有透明觸控面板之透明面板保持於二次成形模具之內部,並藉由IMD(in-mold decoration,模內裝飾)射出成型而成型保持透明觸控面板之殼體。The touch panel module is formed by injection molding to form a transparent panel. A recess is formed on the transparent panel, and a transparent touch panel is inserted and held inside the recess. Moreover, the transparent panel holding the transparent touch panel is held inside the overmolded mold, and the housing of the transparent touch panel is molded by injection molding by IMD (in-mold decoration).
於專利文獻2中揭示有具有感測器及蓋之器件。A device having a sensor and a cover is disclosed in Patent Document 2.
圖8所示之器件係經由接著劑將觸控感測器與蓋接著而構成。圖9所示之器件係將觸控感測器夾在頂蓋與底蓋之間。The device shown in FIG. 8 is constructed by attaching a touch sensor to a cover via an adhesive. The device shown in Figure 9 sandwiches the touch sensor between the top and bottom covers.
[專利文獻1]美國專利公開2008/0117186A1[Patent Document 1] US Patent Publication 2008/0117186A1
[專利文獻2]美國專利公開2009/0073130A1[Patent Document 2] US Patent Publication 2009/0073130A1
專利文獻1之圖6以下揭示之觸控面板模組成為如下構造,即,為了無法自外部觀察到保持於透明面板之透明觸控面板之配線層等,而藉由經著色之殼體之一部分來覆蓋透明觸控面板之前方。因此,觸控面板模組之構造複雜且厚度尺寸變大至所需以上。The touch panel module disclosed in FIG. 6 of Patent Document 1 has a structure in which a part of the colored housing is not in order to be able to observe the wiring layer or the like of the transparent touch panel held by the transparent panel from the outside. To cover the front of the transparent touch panel. Therefore, the structure of the touch panel module is complicated and the thickness is increased to be more than necessary.
專利文獻2之圖8所記載之器件為積層有觸控感測器及蓋該兩層之構造,因此易因該兩層之接著時之應力差或熱應力差等而產生變形或翹曲。The device described in FIG. 8 of Patent Document 2 has a structure in which a touch sensor is laminated and covers the two layers, and thus deformation or warpage is likely to occur due to a stress difference or a thermal stress difference between the two layers.
專利文獻2之圖9所記載之器件係將觸控感測器夾在頂蓋與底蓋之間,因此與圖8所記載者相比不易產生變形或翹曲。但是,於使用該器件時,必須於表面側積層具有用於隱藏觸控感測器之配線等之裝飾部之膜。由於積層並接著該膜,因而易因接著時之應力差或熱應力差等而產生變形或翹曲。The device described in FIG. 9 of Patent Document 2 sandwiches the touch sensor between the top cover and the bottom cover, and thus is less likely to be deformed or warped than the one shown in FIG. However, when the device is used, it is necessary to laminate a film having a decorative portion for hiding wiring of the touch sensor or the like on the surface side. Since the film is laminated and then adhered, deformation or warpage is liable to occur due to a stress difference or a thermal stress difference in the subsequent state.
又,專利文獻2中記載之器件係於其端面出現觸控感測器與蓋之接合部,因此水分或腐蝕氣體等變得容易滲透至觸控感測器之電極部,耐環境性較差,壽命容易降低。Further, the device described in Patent Document 2 has a joint portion between the touch sensor and the cover on the end surface thereof, so that moisture or corrosive gas or the like easily penetrates into the electrode portion of the touch sensor, and the environmental resistance is poor. Life expectancy is reduced.
本發明係解決上述先前之課題者,其目的在於提供一種能夠構成為薄型且不易產生變形、而且耐環境性優異之具有檢測功能之表面面板。The present invention has been made in view of the above-mentioned problems, and an object of the invention is to provide a surface panel having a detection function which can be formed into a thin shape and which is less likely to be deformed and which is excellent in environmental resistance.
本發明係一種具有檢測功能之表面面板,其係具有透光區域及包圍上述透光區域之裝飾區域者,其特徵在於包括:具有外表面及內表面之透光性之基材; 設置於上述基材之上述外表面而形成上述裝飾區域之裝飾層、及設置於上述內表面且位於上述透光區域內之透光性之檢測電極層;以及分別由透光性之合成樹脂材料形成且覆蓋上述基材之上述外表面之外側成形體及覆蓋上述基材之上述內表面之內側成形體;且上述外側成形體之表面及上述內側成形體之表面之兩者被表面保護層覆蓋。The invention relates to a surface panel having a detecting function, which has a light transmitting region and a decorative region surrounding the light transmitting region, and is characterized in that: a substrate having a light transmissive property of an outer surface and an inner surface; a decorative layer formed on the outer surface of the substrate to form the decorative region, and a transmissive detecting electrode layer disposed on the inner surface and located in the transparent region; and a translucent synthetic resin material Forming and covering the outer surface forming body of the outer surface of the substrate and the inner molded body covering the inner surface of the substrate; and both the surface of the outer molded body and the surface of the inner molded body are covered with a surface protective layer .
本發明之具有檢測功能之表面面板係由外側成形體與內側成形體夾持具有裝飾層及檢測電極層之基材之構造。進而,於外側成形體之表面設置作為硬塗層之表面保護層,以使外側成形體之表面不易損傷並且手指等直接接觸而便於操作,該表面保護層係設置於外側成形體之表面及內側成形體之表面之兩者。The surface panel having the detecting function of the present invention has a structure in which a substrate having a decorative layer and a detecting electrode layer is sandwiched between the outer molded body and the inner molded body. Further, a surface protective layer as a hard coat layer is provided on the surface of the outer molded body so that the surface of the outer molded body is less likely to be damaged and the fingers or the like are directly contacted for easy handling, and the surface protective layer is provided on the surface and the inner side of the outer molded body. Both of the surfaces of the shaped body.
其結果為,隔著基材之中心於外側與內側基本之積層構造成為對稱,各層之積層步驟中之應力差或因熱變化產生之應力差於外側與內側容易平衡,從而不易使面板產生變形或翹曲。As a result, the laminated structure is basically symmetrical on the outer side and the inner side via the center of the substrate, and the stress difference in the laminating step of each layer or the stress difference due to the thermal change is easily balanced on the outer side and the inner side, so that the panel is less likely to be deformed. Or warp.
外側成形體與內側成形體可由相同材料且相同厚度形成,但亦可使厚度互不相同,或者使材質不同,從而可使應力差於以基材為基準之外側與內側進一步減小。The outer molded body and the inner molded body may be formed of the same material and the same thickness, but the thicknesses may be different from each other or the materials may be different, so that the stress difference may be further reduced from the outer side and the inner side with respect to the substrate.
再者,基材與外側成形體、及基材與內側成形體可於模塑步驟中一體化,但亦可為將預先成型之外側成形體及內側成形體與基材經由透光性之接著劑接著而成者。Further, the base material and the outer molded body, and the base material and the inner molded body may be integrated in the molding step, but the preformed outer side molded body and the inner molded body and the base material may be passed through the light transmissive property. The agent continues to grow.
本發明較佳為如下構造,即,具有上述外側成形體之端部與上述內側成形體之端部及上述基材之端部之上述面板端面被上述表面保護層覆蓋。In the present invention, it is preferable that the end surface of the outer molded body and the end portion of the inner molded body and the end surface of the base material are covered by the surface protective layer.
於上述基材之一部分自上述面板端面向外部延伸出之情形時,成為除上述基材延伸出之部分以外,上述面板端面被上述表面保護層 覆蓋之構造。When a part of the substrate extends from the panel end to the outside, the end surface of the panel is covered by the surface protection layer except for the portion from which the substrate extends. Cover construction.
進而,本發明可設為,於上述面板端面,上述表面保護層之一部分滲透至上述基材與上述外側成形體之間隙及上述基材與上述內側成形體之間隙中之至少一者。Furthermore, in the above-described panel end surface, at least one of the surface protective layers may penetrate into at least one of a gap between the base material and the outer molded body and a gap between the base material and the inner molded body.
如上所述藉由以表面保護層覆蓋面板端面,水分或腐蝕氣體不易滲入至出現於面板端面之基材與外側成形體之間隙、或基材與內側成形體之間隙,從而耐環境性優異。As described above, by covering the end surface of the panel with the surface protective layer, moisture or corrosive gas does not easily penetrate into the gap between the substrate and the outer molded body which are present on the end surface of the panel, or the gap between the substrate and the inner molded body, and is excellent in environmental resistance.
本發明中,上述基材為合成樹脂膜。例如,上述基材為PET(Polyethylene Terephthalate,聚對苯二甲酸乙二酯)膜,上述外側成形體與上述內側成形體係由丙烯酸系樹脂形成。In the present invention, the substrate is a synthetic resin film. For example, the substrate is a PET (Polyethylene Terephthalate) film, and the outer molded body and the inner molding system are formed of an acrylic resin.
於該情形時,於上述基材與上述外側成形體之邊界部、及上述基材與上述內側成形體之邊界部之兩者設置有接合層。In this case, a bonding layer is provided on both the boundary portion between the base material and the outer molded body and the boundary portion between the base material and the inner molded body.
又,可設為上述裝飾層形成於上述接合層之表面之構造。Further, the decorative layer may be formed on the surface of the bonding layer.
本發明之表面面板中,由於以基材為中心而於外側與內側積層構造成為大致對稱,因此不易產生變形或翹曲。又,由於外側成形體之表面被表面保護層覆蓋,因此不易損傷,且容易藉由手指等進行操作。In the surface panel of the present invention, since the outer layer and the inner layered structure are substantially symmetrical around the base material, deformation or warpage is less likely to occur. Further, since the surface of the outer molded body is covered with the surface protective layer, it is less likely to be damaged and is easily handled by a finger or the like.
進而,藉由在面板端面上設置表面保護層,能夠保護基材之表面免受水分或腐蝕氣體等之影響,從而能夠提高耐環境性。Further, by providing the surface protective layer on the end surface of the panel, the surface of the substrate can be protected from moisture or corrosive gas, and the environmental resistance can be improved.
1‧‧‧表面面板1‧‧‧Surface panel
1a‧‧‧面板外表面1a‧‧‧Outer surface of the panel
1b‧‧‧面板內表面1b‧‧‧ panel inner surface
1c‧‧‧面板端面1c‧‧‧ faceplate end face
2‧‧‧框體2‧‧‧ frame
2a‧‧‧表面2a‧‧‧ surface
3‧‧‧透光區域3‧‧‧Lighting area
4‧‧‧裝飾區域4‧‧‧Decorative area
11‧‧‧基材膜11‧‧‧Base film
11a‧‧‧外表面11a‧‧‧Outer surface
11b‧‧‧內表面11b‧‧‧ inner surface
12‧‧‧外側成形體12‧‧‧Outer molded body
13‧‧‧內側成形體13‧‧‧Inside molded body
14‧‧‧外側接合層14‧‧‧Outer joint layer
15‧‧‧內側接合層15‧‧‧Inside joint layer
16‧‧‧配線帶16‧‧‧Wiring tape
16b‧‧‧內表面16b‧‧‧ inner surface
21‧‧‧檢測電極層21‧‧‧Detection electrode layer
21a‧‧‧右側電極21a‧‧‧Right electrode
21b‧‧‧左側電極21b‧‧‧Left electrode
22‧‧‧配線層22‧‧‧Wiring layer
22a‧‧‧右側配線層22a‧‧‧Right wiring layer
22b‧‧‧左側配線層22b‧‧‧Left wiring layer
23‧‧‧裝飾層23‧‧‧Decorative layer
24‧‧‧引出配線層24‧‧‧Leading wiring layer
25‧‧‧連接器電極25‧‧‧Connector electrodes
26‧‧‧有機絕緣層26‧‧‧Organic insulation
28‧‧‧表面保護層28‧‧‧Surface protection layer
30‧‧‧標誌顯示部30‧‧‧ sign display
31‧‧‧反射層31‧‧‧reflective layer
32‧‧‧有機絕緣層32‧‧‧Organic insulation
33‧‧‧透過部33‧‧‧Transmission Department
41a‧‧‧一次成形模具41a‧‧‧One forming mould
41b‧‧‧一次成形模具41b‧‧‧One forming mould
42‧‧‧空腔42‧‧‧ cavity
43a‧‧‧二次成形模具43a‧‧‧Secondary forming mould
43b‧‧‧二次成形模具43b‧‧‧Secondary forming mould
44‧‧‧空腔44‧‧‧ cavity
101‧‧‧表面面板101‧‧‧Surface panel
101a‧‧‧面板外表面101a‧‧‧ panel outer surface
101b‧‧‧面板內表面101b‧‧‧ panel inner surface
101c‧‧‧面板端面101c‧‧‧ faceplate end face
201‧‧‧表面面板201‧‧‧Surface panel
201a‧‧‧面板外表面201a‧‧‧ panel outer surface
201b‧‧‧面板內表面201b‧‧‧ panel inner surface
201c‧‧‧面板端面201c‧‧‧ panel end face
201d‧‧‧面板彎曲部201d‧‧‧Face bending
圖1係表示本發明之第1實施形態之表面面板之立體圖。Fig. 1 is a perspective view showing a surface panel according to a first embodiment of the present invention.
圖2係圖1所示之表面面板之II-II線之剖面圖。Figure 2 is a cross-sectional view taken along line II-II of the surface panel shown in Figure 1.
圖3係透視表示設置於表面面板之內表面之檢測電極層與配線層之圖案之俯視圖。Fig. 3 is a plan view showing, in perspective, a pattern of a detecting electrode layer and a wiring layer provided on an inner surface of a surface panel.
圖4(A)、(B)係表示表面面板之積層步驟之一例之說明圖。4(A) and 4(B) are explanatory views showing an example of a step of laminating a surface panel.
圖5係表示本發明之第2實施形態之表面面板之剖面圖。Fig. 5 is a cross-sectional view showing a surface panel according to a second embodiment of the present invention.
圖6為表示本發明之第3實施形態之表面面板之剖面圖。Fig. 6 is a cross-sectional view showing a surface panel according to a third embodiment of the present invention.
圖1及圖2所示之第1實施形態之表面面板1作為行動電話、個人數位助理等可攜式設備或者電子設備之框體之一部分使用。The surface panel 1 of the first embodiment shown in Figs. 1 and 2 is used as a part of a portable device or a casing of an electronic device such as a mobile phone or a personal digital assistant.
第1實施形態之表面面板1為平坦之構造且平面形狀為長方形狀。表面面板1設置於可攜式設備或者電子設備之框體2之表面2a。於框體2之內部,內置有安裝有各種電子電路之電路基板以及顯示裝置。該顯示裝置為彩色液晶顯示裝置或者有機電致發光顯示裝置等。The surface panel 1 of the first embodiment has a flat structure and a planar shape in a rectangular shape. The surface panel 1 is disposed on the surface 2a of the casing 2 of the portable device or electronic device. Inside the casing 2, a circuit board on which various electronic circuits are mounted and a display device are incorporated. The display device is a color liquid crystal display device or an organic electroluminescence display device.
表面面板1具有能夠使光透過之透光區域3、及包圍上述透光區域3之裝飾區域4。顯示裝置之畫面之顯示內容可透過透光區域3自外部目視。The front panel 1 has a light-transmitting region 3 through which light can pass, and a decorative region 4 surrounding the light-transmitting region 3. The display content of the screen of the display device can be visually viewed from the outside through the light transmitting region 3.
圖2中示出了表面面板1之積層構造。The laminated structure of the surface panel 1 is shown in FIG.
表面面板1具有基材膜11。基材膜11具有透光性。本說明書中之透光性係指具有能夠透視顯示裝置之顯示內容之程度之透光率,例如全光線透過率為80%以上,優選為90%以上。The surface panel 1 has a substrate film 11. The base film 11 has light transmissivity. The light transmittance in the present specification means a light transmittance which is capable of seeing the display content of the display device, for example, the total light transmittance is 80% or more, preferably 90% or more.
基材膜11由作為具有適於形成觸控感測器之強度及耐熱性之合成樹脂之PET(聚對苯二甲酸乙二脂)形成。或者亦可使用COP(Cyclo Olefin Polymers,環狀聚烯烴)等。The base film 11 is formed of PET (polyethylene terephthalate) which is a synthetic resin having a strength and heat resistance suitable for forming a touch sensor. Alternatively, COP (Cyclo Olefin Polymers) or the like can be used.
基材膜11具有朝向框體2之外側之外表面11a、及朝向框體2之內部之內表面11b。如圖2所示,於基材膜11之外表面11a接合有外側成形體12,於內表面11b接合有內側成形體13。The base film 11 has an outer surface 11a facing the outer side of the frame 2 and an inner surface 11b facing the inside of the frame 2. As shown in FIG. 2, the outer molded body 12 is joined to the outer surface 11a of the base film 11, and the inner molded body 13 is joined to the inner surface 11b.
外側成形體12及內側成形體13為透光性之丙烯酸系等之合成樹脂材料,例如由PMMA(Poly(methyl methacrylate),聚甲基丙烯酸甲酯)形成。The outer molded body 12 and the inner molded body 13 are made of a translucent acrylic resin or the like, and are formed of, for example, PMMA (poly(methyl methacrylate), polymethyl methacrylate).
若為基材膜11由PET或者COP形成、外側成形體12及內側成形體 13由PMMA形成之材料之組合,則基材膜11與外側成形體12以及內側成形體13之接合性欠佳。因此,於表面面板1中,基材膜11之外表面11a與外側成形體12係經由外側接合層14而接合,內表面11b與內側成形體13係經由內側接合層15而接合。外側接合層14及內側接合層15為透光性之丙烯酸系之樹脂層。該樹脂層係於外表面11a及內表面11b塗敷熔融樹脂並藉由熱硬化或紫外線硬化等使其硬化而形成。If the base film 11 is formed of PET or COP, the outer molded body 12 and the inner molded body In the combination of the materials formed of PMMA, the bonding property between the base film 11 and the outer molded body 12 and the inner molded body 13 is unsatisfactory. Therefore, in the surface panel 1, the outer surface 11a of the base film 11 and the outer molded body 12 are joined via the outer joint layer 14, and the inner surface 11b and the inner molded body 13 are joined via the inner joint layer 15. The outer bonding layer 14 and the inner bonding layer 15 are translucent acrylic resin layers. This resin layer is formed by applying a molten resin to the outer surface 11a and the inner surface 11b and hardening it by thermosetting or ultraviolet curing.
如圖2所示,於基材膜11之內表面11b上形成有檢測電極層21及複數層配線層22。As shown in FIG. 2, a detecting electrode layer 21 and a plurality of wiring layers 22 are formed on the inner surface 11b of the base film 11.
圖3中,自外表面11a側透視表示形成於基材膜11之內表面11b之檢測電極層21及配線層22。In FIG. 3, the detection electrode layer 21 and the wiring layer 22 formed on the inner surface 11b of the base film 11 are seen from the outer surface 11a side.
檢測電極層21配置於表面面板1之透光區域3。如圖3所示,檢測電極層21被劃分為右側電極21a及左側電極21b。右側電極21a及左側電極21b分別設有複數層,並於表面面板1之長度方向(圖3之圖示上下方向)交替排列地形成。檢測電極層21由ITO(Indium Tin Oxide,氧化銦錫)形成。檢測電極層21於成膜於PET等基材膜11之內表面11b後,藉由蝕刻而被分離為右側電極21a及左側電極21b。The detecting electrode layer 21 is disposed on the light transmitting region 3 of the surface panel 1. As shown in FIG. 3, the detecting electrode layer 21 is divided into a right electrode 21a and a left electrode 21b. Each of the right electrode 21a and the left electrode 21b is provided with a plurality of layers, and is formed alternately in the longitudinal direction of the surface panel 1 (the vertical direction in the drawing of FIG. 3). The detecting electrode layer 21 is formed of ITO (Indium Tin Oxide). After the detection electrode layer 21 is formed on the inner surface 11b of the base film 11 such as PET, it is separated into the right electrode 21a and the left electrode 21b by etching.
如圖3所示,配線層22具有分別與右側電極21a連續之右側配線層22a、及分別與左側電極21b連續之左側配線層22b。右側配線層22a與左側配線層22b通過裝飾區域4之內側並繞回。如圖3所示,右側配線層22a與左側配線層22b延伸至裝飾區域4之上方區域且分別平行地配置而形成引出配線層24。As shown in FIG. 3, the wiring layer 22 has a right wiring layer 22a continuous with the right electrode 21a and a left wiring layer 22b continuous with the left electrode 21b. The right wiring layer 22a and the left wiring layer 22b pass around the inside of the decorative region 4 and wrap around. As shown in FIG. 3, the right wiring layer 22a and the left wiring layer 22b extend to the upper region of the decorative region 4 and are arranged in parallel to form the lead wiring layer 24.
上述內側接合層15以覆蓋檢測電極層21及配線層22之方式形成。The inner bonding layer 15 is formed to cover the detecting electrode layer 21 and the wiring layer 22.
如圖1及圖2所示,於基材膜11上一體地形成有自其上端呈帶狀連續之配線帶16,上述引出配線層24沿著配線帶16而形成。As shown in FIGS. 1 and 2, a wiring tape 16 continuous in a strip shape from the upper end thereof is integrally formed on the base film 11, and the lead wiring layer 24 is formed along the wiring tape 16.
右側配線層22a與左側配線層22b以及引出配線層24為於黏合劑樹 脂中含有低電阻之導電體之有機導電層,例如銀漿、銅漿或碳漿等。形成有右側配線層22a與左側配線層22b以及引出配線層24之有機導電層較形成有檢測電極層21之ITO富有柔軟性。即,相對於相同荷重之延伸率或彎曲率高於ITO。The right wiring layer 22a and the left wiring layer 22b and the lead wiring layer 24 are adhesive trees The grease contains an organic conductive layer of a low-resistance conductor such as silver paste, copper paste or carbon paste. The organic conductive layer in which the right wiring layer 22a, the left wiring layer 22b, and the lead wiring layer 24 are formed is more flexible than the ITO in which the detecting electrode layer 21 is formed. That is, the elongation or bending rate with respect to the same load is higher than that of ITO.
於右側配線層22a與左側配線層22b以及引出配線層24之形成步驟中,於形成於基材膜11之內表面11b之ITO層上成膜有機導電層,藉由蝕刻步驟而形成檢測電極層21、右側配線層22a、左側配線層22b以及引出配線層24之圖案。之後,藉由蝕刻步驟去除檢測電極層21之表面之有機導電層。In the step of forming the right wiring layer 22a, the left wiring layer 22b, and the lead wiring layer 24, an organic conductive layer is formed on the ITO layer formed on the inner surface 11b of the base film 11, and a detecting electrode layer is formed by an etching step. 21. Pattern of the right wiring layer 22a, the left wiring layer 22b, and the lead wiring layer 24. Thereafter, the organic conductive layer on the surface of the detecting electrode layer 21 is removed by an etching step.
或者,亦可利用有機導電層於印刷步驟中形成右側配線層22a與左側配線層22b以及引出配線層24。Alternatively, the right wiring layer 22a, the left wiring layer 22b, and the lead wiring layer 24 may be formed in the printing step by using the organic conductive layer.
如圖2所示,於基材膜11之外表面11a,在上述外側接合層14之表面上形成有裝飾層23。裝飾層23係於印刷步驟中形成者,係將著色塗膜塗敷成多層而形成。如圖1及圖2所示,藉由裝飾層23形成包圍透光區域3之裝飾區域4。As shown in FIG. 2, on the outer surface 11a of the base film 11, a decorative layer 23 is formed on the surface of the outer joint layer 14. The decorative layer 23 is formed by forming a coloring coating film in a plurality of layers in the printing step. As shown in FIGS. 1 and 2, the decorative region 4 surrounding the light-transmitting region 3 is formed by the decorative layer 23.
如圖1所示,於裝飾區域4之一部分設置有標誌(logo)顯示部30。如圖2所示,於標誌顯示部30,在基材膜11之內表面11b上設置有反射層31。該反射層31係藉由印刷包含金屬粉之塗膜而形成於上述內表面11b,或者藉由濺鍍金屬層等而形成。形成有反射層31之部分被有機絕緣層32覆蓋,於該部分,上述引出配線層24形成於有機絕緣層32之表面。As shown in FIG. 1, a logo display portion 30 is provided in one of the decorative regions 4. As shown in FIG. 2, on the indicator display portion 30, a reflective layer 31 is provided on the inner surface 11b of the base film 11. The reflective layer 31 is formed on the inner surface 11b by printing a coating film containing metal powder, or by sputtering a metal layer or the like. The portion where the reflective layer 31 is formed is covered with the organic insulating layer 32, and the lead wiring layer 24 is formed on the surface of the organic insulating layer 32.
於標誌顯示部30中,在裝飾層23之一部分形成有透過部33。該透過部33係藉由去除裝飾層23之一部分而形成,或者藉由局部削減塗敷成多層之著色塗膜之層數而形成。透過部33係以成為表示製品名或製造者名或者型號等之字符或記號或其組合之標誌圖案之方式形成。於標誌顯示部30,在裝飾區域4之一部分能夠以立體之顯示而目視金 屬色之標誌圖案。In the mark display portion 30, a transmissive portion 33 is formed in one portion of the decorative layer 23. The transmissive portion 33 is formed by removing a portion of the decorative layer 23 or by partially reducing the number of layers of the color coating film applied to the plurality of layers. The transmissive portion 33 is formed to be a logo pattern indicating a character or symbol such as a product name or a manufacturer's name or model number, or a combination thereof. In the sign display portion 30, in one of the decorative regions 4, it is possible to visually view the gold in a three-dimensional display. The color of the logo pattern.
如圖2所示,具有複數個配線圖案之引出配線層24沿著配線帶16之內表面16b延伸,於配線帶16之前部形成有與引出配線層24之各個配線圖案個別導通之連接器電極25。又,形成於配線帶16之內表面16b之引出配線層24被有機絕緣層26覆蓋。As shown in FIG. 2, the lead wiring layer 24 having a plurality of wiring patterns extends along the inner surface 16b of the wiring tape 16, and a connector electrode which is individually electrically connected to each wiring pattern of the lead wiring layer 24 is formed in front of the wiring tape 16. 25. Further, the lead wiring layer 24 formed on the inner surface 16b of the wiring tape 16 is covered by the organic insulating layer 26.
如圖2所示,表面面板1係於面板外表面1a,外側成形體12之表面被表面保護層28覆蓋,於面板內表面1b,內側成形體13之表面被表面保護層28覆蓋。進而,表面面板1之4邊之面板端面1c全部被表面保護層28覆蓋。自4邊之面板端面1c中之1邊延伸出作為基材膜11之一部分之配線帶16,但該面板端面1c中除配線帶16延伸出之部分以外均被表面保護層28覆蓋。As shown in Fig. 2, the surface panel 1 is attached to the outer surface 1a of the panel, and the surface of the outer molded body 12 is covered with a surface protective layer 28, and the surface of the inner molded body 13 is covered by the surface protective layer 28 on the inner surface 1b of the panel. Further, all of the panel end faces 1c on the four sides of the front panel 1 are covered by the surface protective layer 28. The wiring tape 16 as a part of the base film 11 is extended from one of the four end faces 1c of the four sides, but the face end face 1c is covered with the surface protective layer 28 except for the portion from which the wiring tape 16 extends.
表面保護層28係被稱作硬塗層(hard coat)者,表面硬度較基材膜11以及外側成形體12與內側成形體13高,例如以鉛筆硬度計為3 H~5 H左右。表面保護層28係由以丙烯酸系、矽酮系、氟系等為主體之紫外線硬化型樹脂材料形成。The surface protective layer 28 is referred to as a hard coat, and has a surface hardness higher than that of the base film 11 and the outer molded body 12 and the inner molded body 13, and is, for example, about 3 H to 5 H in terms of pencil hardness. The surface protective layer 28 is formed of an ultraviolet curable resin material mainly composed of an acrylic, an anthrone or a fluorine.
作為硬塗層之表面保護層28原本僅形成於表面面板1之面板外表面1a即可,然而於本發明中,不僅面板外表面1a,面板內表面1b與面板端面1c之全部表面亦被表面保護層28覆蓋。The surface protective layer 28 as the hard coat layer may be formed only on the panel outer surface 1a of the surface panel 1, but in the present invention, not only the panel outer surface 1a, but also the entire surface of the panel inner surface 1b and the panel end surface 1c are surfaced. The protective layer 28 is covered.
圖4中示出了上述表面面板1之製造方法之一例。An example of a method of manufacturing the above-described surface panel 1 is shown in FIG.
於製造步驟中,在PET膜等基材膜11之內表面11b上形成檢測電極層21、反射層31、有機絕緣層32、配線層22以及引出配線層24,進而形成內側接合層15。又,於基材膜11之外表面11a上形成外側接合層14及裝飾層23。In the manufacturing step, the detecting electrode layer 21, the reflective layer 31, the organic insulating layer 32, the wiring layer 22, and the lead wiring layer 24 are formed on the inner surface 11b of the base film 11 such as a PET film, and the inner bonding layer 15 is further formed. Further, the outer bonding layer 14 and the decorative layer 23 are formed on the outer surface 11a of the base film 11.
如圖4(A)所示,將形成有上述各層之基材膜11設置於一次成形模具41a、41b之內部,於基材膜11之內表面11b側形成空腔42。將PMMA等光學特性良好之合成樹脂材料以熔融狀態射出至該空腔42 內,而形成內側成形體13。PET等基材膜11與PMMA等內側成形體13藉由利用內側接合層15而相互牢固地接著。As shown in FIG. 4(A), the base film 11 on which the above layers are formed is placed inside the primary molding dies 41a and 41b, and the cavity 42 is formed on the inner surface 11b side of the base film 11. A synthetic resin material having good optical properties such as PMMA is emitted to the cavity 42 in a molten state. Inside, the inner molded body 13 is formed. The base film 11 such as PET and the inner molded body 13 such as PMMA are firmly adhered to each other by the inner joint layer 15 .
如圖4(B)所示,將具有各層之基材膜11與內側成形體13成為一體而成者設置於二次成形模具43a、43b之內部,於基材膜11之外表面11a側形成空腔44。將PMMA等光學特性良好之合成樹脂材料以熔融狀態射出至該空腔44內,而形成外側成形體12。PET等基材膜11與PMMA等外側成形體12通過夾著外側接合層14而相互牢固地接著。As shown in Fig. 4(B), the base film 11 and the inner molded body 13 having the respective layers are integrally formed in the secondary molding dies 43a and 43b, and are formed on the outer surface 11a side of the base film 11. Cavity 44. A synthetic resin material having good optical properties such as PMMA is emitted into the cavity 44 in a molten state to form the outer molded body 12. The base film 11 such as PET and the outer molded body 12 such as PMMA are firmly adhered to each other by sandwiching the outer joint layer 14.
之後,於面板外表面1a與面板內表面1b以及面板端面1c上形成作為硬塗層之表面保護層28。表面保護層28之塗佈步驟係將具有各層之基材膜11與外側成形體12以及內側成形體13形成一體而成者浸漬於紫外線硬化性之熔融樹脂之內部,於配線帶16之突出部以外之表面塗佈溶融樹脂。之後照射紫外線使熔融樹脂硬化,而形成表面保護層28。Thereafter, a surface protective layer 28 as a hard coat layer is formed on the panel outer surface 1a, the panel inner surface 1b, and the panel end surface 1c. In the coating step of the surface protective layer 28, the base film 11 having the respective layers is integrally formed with the outer molded body 12 and the inner molded body 13, and is immersed in the ultraviolet curable molten resin inside the protruding portion of the wiring tape 16. The surface is coated with a molten resin. Thereafter, the ultraviolet resin is irradiated to harden the molten resin to form the surface protective layer 28.
再者,亦可與圖4之步驟相反地,相對於具有各層之基材膜11先成型外側成形體12,之後成型內側成形體13,使基材膜11與外側成形體12以及內側成形體13一體化。Further, contrary to the step of FIG. 4, the outer molded body 12 may be molded first with respect to the base film 11 having the respective layers, and then the inner molded body 13 may be molded to form the base film 11 and the outer molded body 12 and the inner molded body. 13 integration.
又,作為表面面板1之製造方法,亦可預先形成外側成形體12及內側成形體13,藉由接著劑等將具有各層之基材膜11與外側成形體12以及內側成形體13相互接著,之後,由表面保護層28覆蓋面板外表面1a與面板內表面1b以及面板端面1c。Further, as the method of manufacturing the surface panel 1, the outer molded body 12 and the inner molded body 13 may be formed in advance, and the base film 11 having the respective layers, the outer molded body 12, and the inner molded body 13 may be mutually adhered by an adhesive or the like. Thereafter, the panel outer surface 1a and the panel inner surface 1b and the panel end surface 1c are covered by the surface protective layer 28.
圖2所示之表面面板1係以基材膜11為中心,於外側積層有外側接合層14與外側成形體12以及表面保護層28,於內側積層有內側接合層15與內側成形體13以及表面保護層28,於外側與內側積層構造為對稱。因此,於外側與內側接合時作用之應力差或因溫度變化產生之應力差變得極小。因此,不易產生變形或翹曲。In the surface panel 1 shown in FIG. 2, the outer joint layer 14 and the outer molded body 12 and the surface protective layer 28 are laminated on the outer side, and the inner joint layer 15 and the inner molded body 13 are laminated on the inner side. The surface protective layer 28 has a symmetrical structure on the outer side and the inner side. Therefore, the stress difference acting on the outer side and the inner side or the stress difference due to the temperature change becomes extremely small. Therefore, deformation or warpage is less likely to occur.
再者,檢測電極層21及裝飾層23為比接合層14、15及成形體12、13薄之膜,對變形或翹曲之影響極小。Further, the detecting electrode layer 21 and the decorative layer 23 are thinner than the bonding layers 14 and 15 and the molded bodies 12 and 13, and have little influence on deformation or warpage.
於該表面面板1中,在基材膜11之外側與內側分別接合有成形體12、13,而且先前僅形成於面板外表面1a之作為硬塗層之表面保護層28形成於面板外表面1a及面板內表面1b之兩者,因此成為容易防止因接合應力或熱應力而產生之變形或翹曲之構造。In the surface panel 1, the molded bodies 12, 13 are respectively joined to the outer side and the inner side of the base film 11, and the surface protective layer 28 as a hard coat layer previously formed only on the outer surface 1a of the panel is formed on the outer surface 1a of the panel. Both of the inner surfaces 1b of the panel are structured to easily prevent deformation or warpage caused by joint stress or thermal stress.
再者,藉由使外側成形體12與內側成形體13具有厚度尺寸差並調整厚度尺寸差,能夠進一步抵消或減小在以基材膜11為中心之外側與內側之應力差。Further, by making the outer molded body 12 and the inner molded body 13 have thickness difference and adjusting the thickness difference, the stress difference between the outer side and the inner side centering on the base film 11 can be further offset or reduced.
如圖2所示,表面面板1之4邊之全部面板端面1c被作為硬塗層之表面保護層28覆蓋。於面板端面1c出現基材膜11與外側成形體12之接合部之端部、以及基材膜11與內側成形體13之接合部之端部,然而該等接合部之端部被表面保護層28覆蓋,因此能夠有效地防止沿著基材膜11之外表面11a或內表面11b滲入水分或者滲入腐蝕氣體。As shown in FIG. 2, all of the panel end faces 1c of the four sides of the surface panel 1 are covered by the surface protective layer 28 as a hard coat layer. An end portion of the joint portion between the base film 11 and the outer molded body 12 and an end portion of the joint portion of the base film 11 and the inner molded body 13 are present on the panel end surface 1c, but the ends of the joint portions are surface-protected The cover is 28, so that it is possible to effectively prevent penetration of moisture or penetration of corrosive gas along the outer surface 11a or the inner surface 11b of the base film 11.
又,於圖4所示之成型步驟中,即使在基材膜11與外側成形體12之接合部之端部、以及基材膜11與內側成形體13之接合部之端部形成因成型不良造成之微細之間隙,亦可藉由使表面保護層28滲透至該間隙內並使其硬化,而有效地防止水分等沿著基材膜11滲入。Further, in the molding step shown in Fig. 4, the end portion of the joint portion between the base film 11 and the outer molded body 12 and the end portion of the joint portion between the base film 11 and the inner molded body 13 are defective in molding. The fine gap caused by the penetration of the surface protective layer 28 into the gap and hardening thereof can effectively prevent moisture or the like from infiltrating along the base film 11.
因此,能夠始終保護檢測電極層21及配線層22,耐水性及耐環境性變良好,從而能夠構成長壽命之表面面板1。Therefore, the detection electrode layer 21 and the wiring layer 22 can be always protected, and water resistance and environmental resistance are improved, and the surface panel 1 having a long life can be formed.
如圖1所示,於使用該表面面板1之可攜式設備中,設置於框體2之內部之顯示裝置之顯示畫面與透光區域3之內側對向,可透過表面面板1之透光性之透光區域3目視顯示內容。As shown in FIG. 1 , in the portable device using the surface panel 1 , the display screen of the display device disposed inside the frame 2 faces the inner side of the transparent region 3 and is transparent to the transparent surface panel 1 . The light transmissive area 3 visually displays the content.
又,當手指接觸能夠目視顯示畫面之透光區域3內之外側成形體12之表面之表面保護層28時,檢測輸出會根據手指與任一檢測電極層21之間之靜電電容而變化,而能夠檢測出手指與透光區域3之哪個位置接觸。Further, when the finger contacts the surface protective layer 28 on the surface of the outer-side molded body 12 in the light-transmitting region 3 of the display screen, the detection output changes depending on the electrostatic capacitance between the finger and any of the detecting electrode layers 21, and It is possible to detect which position of the light-transmitting region 3 the finger is in contact with.
圖5中示出了本發明之第2實施形態之表面面板101。該表面面板 101為圖2所示之第1實施形態之變化例。Fig. 5 shows a surface panel 101 according to a second embodiment of the present invention. The surface panel 101 is a modification of the first embodiment shown in Fig. 2 .
圖5所示之表面面板101中,基材膜11例如為丙烯酸系之樹脂膜,與PMMA之外側成形體12以及內側成形體13之接合性良好。因此,未設置圖2所示之外側接合層14及內側接合層15。因此,裝飾層23係藉由印刷步驟等而直接形成於基材膜11之外表面11a。In the surface panel 101 shown in FIG. 5, the base film 11 is, for example, an acrylic resin film, and has good adhesion to the PMMA outer side molded body 12 and the inner molded body 13. Therefore, the outer side joining layer 14 and the inner side joining layer 15 shown in Fig. 2 are not provided. Therefore, the decorative layer 23 is directly formed on the outer surface 11a of the base film 11 by a printing step or the like.
圖5所示之表面面板101亦以基材膜11為中心而於外側與內側積層構造為對稱,為不易產生變形或翹曲之構造。又,面板外表面101a與面板內表面101b以及全部之面板端面101c被表面保護層28覆蓋,耐環境性優異。The surface panel 101 shown in FIG. 5 is also symmetrical about the base film 11 and has a structure in which the outer layer and the inner layer are laminated, and is not easily deformed or warped. Further, the panel outer surface 101a, the panel inner surface 101b, and the entire panel end surface 101c are covered with the surface protective layer 28, and are excellent in environmental resistance.
圖6中示出了本發明之第2實施形態之表面面板201。於該實施形態中,對發揮與第1實施形態之表面面板1之構成要素相同功能之構件標註相同符號而進行說明。Fig. 6 shows a surface panel 201 according to a second embodiment of the present invention. In the embodiment, members having the same functions as those of the surface panel 1 of the first embodiment will be described with the same reference numerals.
圖6所示之表面面板201中,於基材膜11之內表面11b形成檢測電極層21及配線層等,並於其上形成有內側接合層15。於基材膜11之外表面11a形成外側接合層14,且於其表面形成有裝飾層23。In the surface panel 201 shown in FIG. 6, the detecting electrode layer 21, the wiring layer, and the like are formed on the inner surface 11b of the base film 11, and the inner bonding layer 15 is formed thereon. The outer bonding layer 14 is formed on the outer surface 11a of the base film 11, and a decorative layer 23 is formed on the surface thereof.
並且,藉由與圖4所示者相同之步驟形成外側成形體12及內側成形體13。該成型步驟中,於表面面板201上形成面板外表面201a與面板內表面201b,進而於4個側邊或者2個側邊形成面板彎曲部201d,表面面板201成為立體形狀。其結果為,面板端面201c朝向圖示下方。上述裝飾層23自面板外表面201a之周圍遍及面板彎曲部201d而設置。Further, the outer molded body 12 and the inner molded body 13 are formed by the same steps as those shown in Fig. 4 . In the molding step, the panel outer surface 201a and the panel inner surface 201b are formed on the surface panel 201, and the panel curved portion 201d is formed on the four sides or the two sides, and the surface panel 201 has a three-dimensional shape. As a result, the panel end surface 201c faces downward in the drawing. The decorative layer 23 is provided from the periphery of the panel outer surface 201a to the panel curved portion 201d.
並且,面板外表面201a、面板內表面201b、面板彎曲部201d以及面板端面201c之前表面被表面保護層28覆蓋。該表面面板201作為可攜式電子設備等之框體之表側之一部分而使用。Further, the front surface of the panel outer surface 201a, the panel inner surface 201b, the panel curved portion 201d, and the panel end surface 201c are covered by the surface protective layer 28. The surface panel 201 is used as one of the front sides of a casing of a portable electronic device or the like.
再者,亦可如圖6所示般,於面板彎曲部201d之內側進而設置檢測電極層51,構成在側部檢測手指之接觸之側部感測器。Further, as shown in FIG. 6, the detecting electrode layer 51 may be further provided inside the panel curved portion 201d, and a side sensor that detects the contact of the finger at the side portion may be formed.
又,本發明之表面面板並不限定於使用於上述實施形態之可攜 式設備用之外殼者,亦可作為操作各種電氣製品之遙控器或其他電子設備之外殼之一部分使用。Moreover, the surface panel of the present invention is not limited to the portable one used in the above embodiment. The outer casing of the device can also be used as part of the outer casing of a remote control or other electronic device for operating various electrical products.
1‧‧‧表面面板1‧‧‧Surface panel
1a‧‧‧面板外表面1a‧‧‧Outer surface of the panel
1b‧‧‧面板內表面1b‧‧‧ panel inner surface
1c‧‧‧面板端面1c‧‧‧ faceplate end face
3‧‧‧透光區域3‧‧‧Lighting area
4‧‧‧裝飾區域4‧‧‧Decorative area
11‧‧‧基材膜11‧‧‧Base film
11a‧‧‧外表面11a‧‧‧Outer surface
11b‧‧‧內表面11b‧‧‧ inner surface
12‧‧‧外側成形體12‧‧‧Outer molded body
13‧‧‧內側成形體13‧‧‧Inside molded body
14‧‧‧外側接合層14‧‧‧Outer joint layer
15‧‧‧內側接合層15‧‧‧Inside joint layer
16‧‧‧配線帶16‧‧‧Wiring tape
16b‧‧‧內表面16b‧‧‧ inner surface
21‧‧‧檢測電極層21‧‧‧Detection electrode layer
22‧‧‧配線層22‧‧‧Wiring layer
23‧‧‧裝飾層23‧‧‧Decorative layer
24‧‧‧引出配線層24‧‧‧Leading wiring layer
25‧‧‧連接器電極25‧‧‧Connector electrodes
26‧‧‧有機絕緣層26‧‧‧Organic insulation
28‧‧‧表面保護層28‧‧‧Surface protection layer
30‧‧‧標誌顯示部30‧‧‧ sign display
31‧‧‧反射層31‧‧‧reflective layer
32‧‧‧有機絕緣層32‧‧‧Organic insulation
33‧‧‧透過部33‧‧‧Transmission Department
Claims (8)
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JP2012213981A JP5917354B2 (en) | 2012-09-27 | 2012-09-27 | Front panel with detection function |
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TWI507941B true TWI507941B (en) | 2015-11-11 |
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