JP2011017072A - Copper alloy material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a copper alloy material which is superior in bend formability, has superior strength, and is suitable for a lead frame for electrical and electronic equipment, a connector, a terminal material and the like, a connector and a terminal material for in-car products, a relay, a switch and the like.SOLUTION: The copper alloy material is characterized in that the area rate in a Brass orientation {110}<112> is 20% or less, the area rate in a Copper orientation {121}<111> is 20% or less, and the area rate in a Cube orientation {001}<100> is 5 to 60%, in a crystal orientation analysis by EBSD (Electron Back-Scatter Diffraction) measurement; a 0.2% yield strength is 500 MPa or more; and the electroconductivity is 30% IACS or more.

Description

  The present invention relates to a copper alloy material, and more particularly to a copper alloy material applied to lead frames, connectors, terminal materials, relays, switches, sockets and the like for in-vehicle components and electrical / electronic devices.

Characteristic items required for copper alloy materials used in applications such as lead frames, connectors, terminal materials, relays, switches, and sockets for automotive parts and electrical / electronic equipment are conductivity, yield strength (yield stress), Has tensile strength, bending workability, and stress relaxation resistance. In recent years, the level of these required characteristics has increased as electric and electronic devices have become smaller, lighter, more functional, denser, and used in higher temperatures.
The following changes are mentioned in the situation where copper alloy materials in recent years are used.
First, as the functionality of automobiles, electrical equipment, and electronic devices has increased, the number of connectors has been increasing, and so miniaturization of terminals and contact parts has been progressing. For example, a movement to downsize a terminal having a tab width of about 1.0 mm to 0.64 mm is progressing.
Secondly, the base material is becoming thinner due to the reduction of mineral resources and weight reduction of parts, and in order to maintain the spring contact pressure, a base material with higher strength than before is used. ing.
Third, the use environment is becoming hot. For example, to reduce the amount of carbon dioxide generated in automobile parts, electronic devices such as ECUs for engine control, which were conventionally installed on doors, are installed in the engine room and in the vicinity of the engine to reduce the weight of the vehicle body. However, the movement to shorten the wire harness between the electronic device and the engine is progressing.

With the above changes, the following problems have arisen in the copper alloy material.
With the miniaturization of the terminals, the bending radius of the bending process applied to the contact part and the spring part becomes smaller, and the material is subjected to a more severe bending process than before. Therefore, there is a problem that the material is cracked.
Along with the increase in strength of materials, the bending workability of materials is generally in a trade-off with strength, so that there is a problem that cracks occur in the materials.
If a crack occurs in the bent part applied to the contact part or the spring part, the contact pressure of the contact part decreases, the contact resistance of the contact part increases, the electrical connection is insulated, and the function as a connector is achieved. It becomes a serious problem because it is lost.

  Several proposals have been made to solve this demand for improvement in bending workability by controlling the crystal orientation. In Patent Document 1, in a Cu—Ni—Si based copper alloy, the crystal grain size and the X-ray diffraction intensity from the {311}, {220}, {200} planes satisfy a certain condition. It has been found that bending workability is excellent. Further, in Patent Document 2, in a Cu—Ni—Si based copper alloy, bending workability is excellent when the crystal orientation satisfies the condition that the X-ray diffraction intensity from the {200} plane and the {220} plane is satisfied. Has been found. Further, in Patent Document 3, it has been found that in a Cu—Ni—Si based copper alloy, bending workability is excellent by controlling the ratio of the Cube orientation {100} <001>.

JP 2006-009137 A JP 2008-013836 A JP 2006-283059 A

  By the way, in the invention described in Patent Document 1 or Patent Document 2, the measurement of crystal orientation by X-ray diffraction from a specific surface is performed by measuring only a specific surface in a distribution of crystal orientation having a certain spread. It is only related to Moreover, only the crystal plane in the plate surface direction is measured, and it cannot be controlled which crystal plane is oriented in the rolling direction or the plate width direction. Therefore, it was an insufficient method for completely controlling the bending workability. In the invention described in Patent Document 3, the effectiveness of the Cube orientation is pointed out, but other crystal orientation components are not controlled, and there are cases where the improvement of bending workability is insufficient. It was.

  In view of the problems as described above, the object of the present invention is to provide excellent bending workability, excellent strength, and lead frames, connectors, terminal materials, etc. for electrical and electronic equipment, such as connectors for automobiles and terminals. It is to provide a copper alloy material suitable for materials, relays, switches and the like.

  The inventors have made various studies and studied copper alloys suitable for electric / electronic component applications, reduced the Brass orientation and Copper orientation, and controlled the accumulation ratio of the Cube orientation to bend the workpiece. It has been found that cracks at the time are suppressed, and based on this, the present invention has been achieved. In addition, it has been found that there is a feature in the size of crystal grains for each crystal orientation in the case of the best bending workability. In addition, it has been found that by using a specific additive element in the present alloy system, the strength and stress relaxation characteristics can be improved without impairing electrical conductivity and bending workability. The present invention has been made based on these findings.

That is, the present invention
(1) In crystal orientation analysis in EBSD (Electron Back Scatter Diffraction) measurement, the area ratio of the Brass orientation {1 1 0} <1 1 2> is 20% or less, and the Copper orientation {1 2 1} < The area ratio of 1 1 1> is 20% or less, the area ratio of the Cube orientation {0 0 1} <1 0 0> is 5 to 60%, the 0.2% proof stress is 500 MPa or more, and the conductivity is 30% IACS. A copper alloy material characterized by the above,
(2) The composition contains 0.5 to 5.0 mass% of any one or two of Ni and Co, 0.1 to 1.5 mass% of Si, and the balance is composed of copper and inevitable impurities. In the crystal orientation analysis in the EBSD (Electron Back Scatter Diffraction) measurement, the area ratio of the Brass orientation {1 1 0} <1 1 2> is 20% or less, and the Copper orientation {1 2 1} <1 A copper alloy material, wherein the area ratio of 1 1> is 20% or less, and the area ratio of Cube orientation {0 0 1} <1 0 0> is 5 to 60%;
(3) The copper alloy material according to (1) or (2), wherein the average crystal grain area of the crystal grains in the Brass orientation and the Copper orientation is smaller than the average crystal grain area in the Cube orientation,
(4) The copper alloy is a total of at least one selected from the group consisting of Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr, and Hf. The copper alloy material according to item (2) or (3),
(5) A copper alloy material according to any one of (1) to (4), and (6) a connector material (1) to (5), which is a plate material The copper alloy material according to any one of items 1) is provided.

  The copper alloy material of the present invention is excellent in bending workability and has excellent strength, such as lead frames, connectors and terminal materials for electrical and electronic equipment, connectors and terminal materials for automobiles, relays, switches, etc. It is suitable for.

It is explanatory drawing of the test method of a stress relaxation characteristic, (a) is before heat processing, (b) shows the state after heat processing, respectively.

  A preferred embodiment of the copper alloy material of the present invention will be described in detail. Here, the “copper alloy material” means a material obtained by processing a copper alloy material into a predetermined shape (for example, a plate, a strip, a foil, a bar, a wire, or the like). In addition, a board | plate material and a strip are demonstrated below as embodiment.

In order to clarify the cause of the occurrence of cracks during bending of the material, the present inventors investigated in detail the metal structure of the material after bending deformation. As a result, it was observed that the base material was not uniformly deformed, but non-uniform deformation progressed, in which the deformation was concentrated only in a region having a specific crystal orientation. And, it was found that due to the non-uniform deformation, wrinkles with a depth of several microns and fine cracks occur on the surface of the base material after bending.
Then, it is understood that when the base material has less Brass orientation and Copper orientation, and the Cube orientation area ratio is high, uneven deformation is suppressed, wrinkles generated on the surface of the base material are reduced, and cracks are suppressed. It was.

  The above effects can be obtained when the area ratio of the Brass orientation and the Copper orientation is 20% or less and the area ratio of the Cube orientation is 5 to 60%. Preferably, the area ratio of the Brass orientation and the Copper orientation is 15% or less, the Cube area ratio is 10 to 55%, more preferably, the area ratio of the Brass orientation and the Copper orientation is 0.5 to 10%, respectively. Is 15 to 50%.

The crystal orientation display method in the present specification takes a rectangular coordinate system in which the rolling direction (RD) of the material is the X axis, the sheet width direction (TD) is the Y axis, and the rolling normal direction (ND) is the Z axis. Using the index (h k l) of the crystal plane each region in which is perpendicular to the Z axis (parallel to the rolling surface) and the index [u v w] of the crystal direction parallel to the X axis, (h k l) Shown in the form [u v w]. For the equivalent orientations under the cubic symmetry of the copper alloy, such as (1 3 2) [6 -4 3] and (2 3 1) [3 -4 6], It uses {h k l} <u v w> using the parenthesis symbol.
The Cube orientation is a state in which the (100) plane faces the rolling surface normal direction (ND) and the (100) plane faces the rolling direction (RD), and an index of {0 0 1} <1 0 0> Indicated by
The Brass orientation is a state in which the (110) plane faces the rolling surface normal direction (ND) and the (112) plane faces the rolling direction (RD), and an index of {1 1 0} <1 1 2> Indicated by
The Copper orientation is a state in which the (112) plane faces the rolling surface normal direction (ND) and the (111) plane faces the rolling direction (RD), and an index of {1 2 1} <1 1 1> Respectively.

The EBSD method was used for the analysis of the crystal orientation in the present invention. EBSD is an abbreviation for Electron Back Scatter Diffraction (Electron Backscatter Diffraction). Reflected Electron Kikuchi Line Diffraction (Kikuchi pattern) generated when a sample is irradiated with an electron beam in a Scanning Electron Microscope (SEM). This is the crystal orientation analysis technology used. In the present invention, a 500 μm square sample area containing 200 or more crystal grains was scanned in 0.5 μm steps, and the orientation was analyzed.
Regarding the deviation angle from the ideal orientation indicated by the above index, the rotation angle was calculated around a common rotation axis, and was taken as the deviation angle. For example, with respect to the S orientation (2 3 1) [6 -4 3], (1 2 1) [1 -1 1] is rotated by 19.4 ° with the (20 10 17) direction as the rotation axis. This angle was taken as the deviation angle. A common rotation axis that can be expressed at the smallest angle is adopted. This deviation angle is calculated for all measurement points, and the first decimal place is an effective number, and the area of crystal grains having an orientation within 10 ° from each of the Brass orientation, Copper orientation, and Cube orientation is the total measurement area. To obtain the area ratio.
The information obtained in the azimuth analysis by EBSD includes azimuth information up to a depth of several tens of nanometers at which the electron beam penetrates into the sample. It was described as an area ratio. The orientation distribution was measured from the plate surface.

  In the EBSD measurement, in order to obtain a clear Kikuchi diffraction image, it is preferable to perform the measurement after mirror polishing the surface of the substrate using colloidal silica abrasive grains after mechanical polishing.

  It shows about the average grain area for each crystal orientation. First, region information whose deviation angle from the ideal orientation of Brass, Copper, and Cube was within 10 ° was extracted by the above-described method. Then, how many measurement pixels each crystal grain is composed of was analyzed, and each crystal grain area was obtained. And the average value was computed from 20 or more crystal grains. The definition of the crystal grain is made up of two or more measurement points, and is surrounded by measurement points having a deviation angle of 10 ° or more.

When the average crystal grain area of the crystal grains of the Brass orientation and the Copper orientation is smaller than the average crystal grain area of the Cube orientation, there is an effect of suppressing the occurrence of cracks. This is considered to be an effect due to the dispersion of the crystal grains of the Brass orientation and the Copper orientation that adversely affect the bending workability.
Preferably, the average crystal grain area of the Brass orientation and the Copper orientation is 90% or less of the average crystal grain area of the Cube orientation, and more preferably the same value is 20 to 80%.

  Copper or copper alloy is used as the connector material of the present invention. Copper alloys such as copper, phosphor bronze, brass, western white, beryllium copper, and Corson alloy (Cu—Ni—Si) having electrical conductivity, mechanical strength and heat resistance required for the connector are preferable. In particular, when it is desired to reduce the Brass orientation and Copper orientation and increase the area ratio of the Cube orientation, a pure copper-based material, a beryllium copper, and a precipitation alloy including a Corson alloy are preferable. Furthermore, in order to achieve both high strength and high conductivity as required for the most advanced small terminal materials, Cu—Ni—Si, Cu—Ni—Co—Si, and Cu—Co—Si are used. preferable.

  In the present invention, nickel (Ni), cobalt (Co), and silicon (Si), which are the first additive element group to be added to copper (Cu), are controlled by controlling the addition amount of Ni—Si, Co. It is possible to improve the strength of the copper alloy by precipitating a compound of -Si and Ni-Co-Si. The amount of addition is one or two of Ni and Co in total, preferably 0.5 to 5.0 mass%, more preferably 0.6 to 4.5 mass%, more preferably 0.8 to The content of 4.0 mass% and Si is preferably 0.1 to 1.5 mass%, and more preferably 0.2 to 1.2 mass%. If the total amount of these elements is more than 5.1 mass%, the electrical conductivity tends to decrease, and if the total amount is less than 0.6 mass%, the strength tends to be insufficient.

  Next, the effect of an additive element that improves characteristics (secondary characteristics) such as stress relaxation resistance will be described. Preferred additive elements include Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr and Hf. In order to fully utilize the additive effect and not lower the electrical conductivity, the total amount is preferably 0.005 to 2.0 mass%, more preferably 0.01 to 1.5 mass%, more preferably It is 0.03-0.8 mass%. If the total amount of these additive elements is too large, it is not preferable because it causes a detrimental effect on the conductivity. If these additive elements are too small in total, the effect of adding these elements is hardly exhibited.

  The effect of adding each element is shown below. When Mg, Sn, and Zn are added to Cu—Ni—Si, Cu—Ni—Co—Si, and Cu—Co—Si copper alloys, the stress relaxation resistance is improved. The stress relaxation resistance is further improved by a synergistic effect when added together than when they are added. In addition, there is an effect of remarkably improving solder embrittlement.

  When Mn, Ag, B, and P are added, the hot workability is improved and the strength is improved.

  Cr, Fe, Ti, Zr, and Hf are finely precipitated as a single additive or a compound with Ni, Co, or Si as main additive elements, and contribute to precipitation hardening. Moreover, it precipitates with the magnitude | size of 50-500 nm as a compound, and there exists an effect which makes a crystal grain size fine by suppressing grain growth, and makes bending workability favorable.

Next, a method for controlling the area ratio of the Brass orientation, Copper orientation, and Cube orientation of the base material will be described. Here, a plate material (strip material) of a precipitation-type copper alloy will be described as an example, but the present invention can be applied to a solid solution alloy, a dilute alloy, and a pure copper alloy.
In general, a precipitation-type copper alloy is obtained by thinning a homogenized heat-treated ingot at each step of hot and cold, and performing a final solution heat treatment in a temperature range of 700 to 1020 ° C. to re-solidify solute atoms. Later, it is manufactured to satisfy the required strength by aging precipitation heat treatment and finish cold rolling. The conditions for the aging precipitation heat treatment and the finish cold rolling are adjusted according to characteristics such as desired strength and conductivity. The texture of the copper alloy is roughly determined by recrystallization that occurs during the final solution heat treatment in this series of steps, and finally determined by the rotation of the orientation that occurs during finish rolling.

In order to decrease the area ratio of the Brass orientation and the Copper orientation in the final solution heat treatment and increase the area ratio of the Cube orientation, in the recrystallization and crystal grain growth at this time, the crystal grains of the Cube orientation are changed to the Brass orientation, Copper. Prior to the orientational crystal grains, it is important to recrystallize preferentially and to grow the crystal grains. The crystal grains of Brass and Copper orientation contain more lattice defects such as dislocations than the crystal grains of Cube orientation.
The production method for promoting the preferential growth of Cube-oriented grains by such a mechanism has several points as follows.
First, the temperature increase rate in the range of 400 ° C. to 750 ° C. in the final solution heat treatment may be optimized in the range of 2 ° C./second to 50 ° C./second. In this range, preferential recrystallization in the Cube orientation is caused. If it is faster than this, the growth of the Cube orientation and other orientations occurs at the same time, and if it is slower, precipitation of the solute atoms and coarsening of the precipitates become remarkable, and the solute atoms are introduced during the solution heat treatment. This is not preferable because it cannot be dissolved.
Secondly, there is an annealing process and a method of introducing a rolling process after the annealing before the final solution heat treatment. The annealing step is preferably performed at 300 to 700 ° C. for 5 minutes to 20 hours, and the rolling step is preferably performed at a relatively low processing rate of 3 to 35%.
Third, it is preferable to perform cold rolling at a relatively high processing rate of 80 to 99% before the annealing step before the final solution heat treatment.

  By satisfy | filling the said content, the characteristic requested | required of the copper alloy board | plate material for connectors, for example can be satisfied. In one preferred embodiment of the copper alloy material of the present invention, the 0.2% proof stress is 500 MPa or more, and the conductivity is 30% IACS or more. Particularly preferably, the 0.2% proof stress is 600 MPa or more, the bending workability is a value obtained by dividing the minimum bending radius that can be bent without cracks in the 90 ° W bending test by the plate thickness, and the conductivity is about 1 or less. It is a copper alloy material having a good characteristic of 30% or less and a stress relaxation resistance characteristic of 30% or less by a measurement method held at 150 ° C. for 1000 hours, which will be described later, and that such a characteristic can be realized. Is one of the advantages. In the present invention, the 0.2% proof stress is a value based on JIS Z2241.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

Example 1
As shown in the composition in the column of alloy components in Tables 1-1 to 1-2, at least one or two of Ni and Co are added in a total amount of 0.5 to 5.0 mass%, and Si is set to 0.3 to An alloy containing 1.5 mass% and the balance being Cu and inevitable impurities was melted in a high frequency melting furnace, and this was cast to obtain an ingot. This was subjected to a homogenization heat treatment at 900 to 1020 ° C. for 3 minutes to 10 hours, followed by hot working, followed by water quenching (corresponding to water cooling) and chamfering to remove oxide scale. With this state as the providing material, the test materials of the copper alloy materials of Invention Examples 1-1 to 1-19 and Comparative Examples 1-1 to 1-9 were manufactured in any of the following steps A to E. . Tables 1-1 to 1-2 show which process of A to E was used.

(Process A)
Cold rolling at a processing rate of 75 to 85% is performed, and a final solution heat treatment is performed at a temperature increase rate of 50 to 200 ° C./second and held at 750 to 1000 ° C. for 5 seconds to 1 hour. Thereafter, an aging precipitation heat treatment at 350 to 600 ° C. for 5 minutes to 20 hours, finish rolling at a processing rate of 2 to 30%, and temper annealing for 10 seconds to 2 hours at 300 to 700 ° C. are performed.

(Process B)
Cold rolling at a working rate of 85-99% and holding at 300-700 ° C. for 5 minutes to 20 hours, cold working at a working rate of 35-55%, temperature increase rate of 2-50 ° C./second Final solution heat treatment is performed at 750 to 1000 ° C. for 5 seconds to 1 hour. Thereafter, an aging precipitation heat treatment at 350 to 600 ° C. for 5 minutes to 20 hours, finish rolling at a processing rate of 2 to 30%, and temper annealing for 10 seconds to 2 hours at 300 to 700 ° C. are performed.

(Process C)
Cold rolling at a working rate of 85 to 99%, heat treatment held at 300 to 700 ° C. for 5 minutes to 20 hours, cold working at a working rate of 5 to 35%, heating rate of 2 to 50 ° C./second Final solution heat treatment is performed at 750 to 1000 ° C. for 5 seconds to 1 hour. Thereafter, an aging precipitation heat treatment at 350 to 600 ° C. for 5 minutes to 20 hours, finish rolling at a processing rate of 2 to 30%, and temper annealing for 10 seconds to 2 hours at 300 to 700 ° C. are performed.

(Process D)
Cold rolling at a working rate of 85 to 99%, heat treatment held at 600 to 900 ° C. for 10 seconds to 5 minutes, cold working at a working rate of 35 to 55%, heating rate of 2 to 50 ° C./second Final solution heat treatment is performed at 750 to 1000 ° C. for 5 seconds to 1 hour. Thereafter, an aging precipitation heat treatment at 350 to 600 ° C. for 5 minutes to 20 hours, finish rolling at a processing rate of 2 to 30%, and temper annealing for 10 seconds to 2 hours at 300 to 700 ° C. are performed.

(Process E)
Cold rolling is performed at a processing rate of 85 to 99%, and a final solution heat treatment is performed at a temperature increase rate of 50 to 200 ° C./second and held at 750 to 1000 ° C. for 5 seconds to 1 hour. Thereafter, an aging precipitation heat treatment at 350 to 600 ° C. for 5 minutes to 20 hours, finish rolling at a processing rate of 2 to 30%, and temper annealing for 10 seconds to 2 hours at 300 to 700 ° C. are performed.

  After each heat treatment and rolling, acid cleaning and surface polishing were performed according to the state of oxidation and roughness of the material surface, and correction with a tension leveler was performed according to the shape.

  The following property investigation was conducted on this specimen. Here, the thickness of the test material was 0.15 mm. The results are shown in Tables 1-1 to 1-2.

a. Area ratio of Brass orientation, Copper orientation, and Cube orientation:
By the EBSD method, measurement was performed in a measurement region of about 500 μm square under the condition that the scan step was 0.5 μm. The measurement area was adjusted based on the inclusion of 200 or more crystal grains. As described above, the area ratio was calculated within 10 ° from each ideal orientation.

b. Bendability:
Cut into a width of 10 mm and a length of 25 mm perpendicular to the rolling direction, and W-bended so that the axis of bending is perpendicular to the rolling direction is GW (Good Way) and W-bent so as to be parallel to the rolling direction. The thing was made into BW (Bad Way), the bending part was observed with the optical microscope of 50 time, and the presence or absence of the crack was investigated.
Bending parts were evaluated as “A” when there were no cracks and slight wrinkles, “B” when there were no cracks but large wrinkles, and “C” when there were cracks. The bending angle of each bent portion was 90 °, and the inner radius of the bent portion was 0.15 mm.

c. 0.2% yield strength [YS]:
Three test pieces of JIS Z2201-13B cut out from the rolling parallel direction were measured according to JIS Z2241, and the average value was shown.

d: Conductivity [EC]:
The specific resistance was measured by a four-terminal method in a constant temperature bath maintained at 20 ° C. (± 0.5 ° C.) to calculate the conductivity. In addition, the distance between terminals was 100 mm.

e. Stress relaxation rate [SR]:
In accordance with JCBA T309: 2001 (corresponding to the former Japan Electronic Materials Industry Association Standard EMAS-3003), which is a provisional standard of the Japan Copper and Brass Association, as shown below, measurement was performed under conditions after holding at 150 ° C. for 1000 hours. . An initial stress of 80% of the proof stress was applied by the cantilever method.

FIG. 1 is an explanatory diagram of a stress relaxation characteristic test method, in which (a) shows a state before heat treatment and (b) shows a state after heat treatment. As shown in FIG. 1A, the position of the test piece 1 when an initial stress of 80% of the proof stress is applied to the test piece 1 held in a cantilever manner on the test stand 4 is a distance of δ ₀ from the reference. is there. This is held in a thermostatic bath at 150 ° C. for 1000 hours (heat treatment in the state of the test piece 1), and the position of the test piece 2 after removing the load is determined from the reference H _t as shown in FIG. Is the distance. 3 is a test piece when no stress is applied, and its position is a distance H ₁ from the reference. From this relationship, the stress relaxation rate (%) was calculated as (Ht−H1) / δ ₀ × 100. In the equation, δ ₀ is the distance from the reference to the test piece 1, H ₁ is the distance from the reference to the test piece 3, and H _t is the distance from the reference to the test piece 2.

f. Average grain area [GS] of crystal grains in each orientation:
In the orientation analysis by EBSD, data of regions within ± 10 ° from each ideal orientation of Brass, Copper, and Cube is extracted, and how many pixels each individual crystal grain is composed of is analyzed. Two grain areas were determined. And the average value was computed from 20 or more crystal grains. The definition of the crystal grain is made up of two or more measurement points, and is surrounded by measurement points having a deviation angle of 10 ° or more.

As shown in Table 1-1, Invention Examples 1-1 to 1-19 were excellent in bending workability, yield strength, electrical conductivity, and stress relaxation characteristics. In particular, Invention Examples 1-3, 1-4, 1-5, 1-9, 1-11, in which the average crystal grain area of the crystal grains of the Brass orientation and the Copper orientation is smaller than the average crystal grain area of the Cube orientation, Nos. 1-12, 1-17, and 1-18 exhibited extremely excellent bending workability such that at least one of GW and BW had no cracks and wrinkles were slight.
On the other hand, as shown in Table 1-2, when the provisions of the present invention were not satisfied, the characteristics were inferior.
That is, in Comparative Example 1-1, since the total amount of Ni and Co was small, the density of precipitates contributing to precipitation hardening was reduced and the strength was not excellent. Further, Si that does not form a compound with Ni or Co was excessively dissolved in the metal structure, and the conductivity was not excellent. Since Comparative Example 1-2 had a large total amount of Ni and Co, the conductivity was inferior. Comparative Example 1-3 was inferior in strength due to a small amount of Si. Comparative Example 1-4 was inferior in electrical conductivity because of a large amount of Si.
In Comparative Example 1-5, the area ratio of the Brass orientation was high, and the bending workability was inferior. Comparative Example 1-6 had a high Copper area ratio and was inferior in bending workability. In Comparative Example 1-7, the area ratios of both the Brass orientation and the Copper orientation were high, and the bending workability was inferior. In Comparative Example 1-8, the area ratio of the Cube orientation was low, and the bending workability was inferior. In Comparative Example 1-9, the area ratio of the Cube orientation was high, and the bending workability was inferior.

Example 2
With respect to the copper alloy having the composition shown in the column of alloy components in Table 2 and the balance consisting of Cu and inevitable impurities, Example 2-1 to 2-17 and Invention Examples 2-1 to 2 and Comparative Examples 2-1 to 2 -3 copper alloy material specimens were manufactured and the characteristics were examined in the same manner as in Example 1. The results are shown in Table 2.

As shown in Table 2, Invention Example 2-1 to Invention Example 2-17 were excellent in bending workability, yield strength, electrical conductivity, and stress relaxation characteristics.
On the other hand, when the requirements of the present invention were not satisfied, the characteristics were not excellent. That is, Comparative Examples 2-1, 2-2, and 2-3 (both of the comparative examples of the invention according to claim 4) were inferior in conductivity because the amount of other elements added was large.
As described above, according to the present invention, optimum characteristics as a connector material can be realized.

DESCRIPTION OF SYMBOLS 1 Test piece when initial stress was applied 2 Test piece after removing load 3 Test piece when stress was not applied 4 Test stand

Claims (6)

  In crystal orientation analysis in EBSD (Electron Back-Scatter Diffraction) measurement, the area ratio of the Brass orientation {1 1 0} <1 1 2> is 20% or less, and the Copper orientation {1 2 1} <1 1 The area ratio of 1> is 20% or less, the area ratio of Cube orientation {0 0 1} <1 0 0> is 5 to 60%, the 0.2% proof stress is 500 MPa or more, and the conductivity is 30% IACS or more. A copper alloy material characterized by being.   It contains 0.5 to 5.0 mass% of any one or two of Ni and Co in total, 0.1 to 1.5 mass% of Si, and the balance is composed of copper and inevitable impurities, and EBSD In crystal orientation analysis in (Electron Back-Scatter Diffraction) measurement, the area ratio of the Brass orientation {1 1 0} <1 1 2> is 20% or less, and the Copper orientation {1 2 1} <1 1 1 The area ratio of> is 20% or less, and the area ratio of Cube orientation {0 0 1} <1 0 0> is 5 to 60%.   The copper alloy material according to claim 1 or 2, wherein the average crystal grain area of the crystal grains of the Brass orientation and the Copper orientation is smaller than the average crystal grain area of the Cube orientation.   The copper alloy contains 0.005 to 2.0 mass% in total of at least one selected from the group consisting of Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr and Hf. The copper alloy material according to claim 2 or 3.   It is a board | plate material, The copper alloy material of any one of Claims 1-4 characterized by the above-mentioned.   The copper alloy material according to claim 1, wherein the copper alloy material is a connector material.

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