JP2006098299A - Probe card and prober - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To detect a contact state between contact terminals of a probe card and an inspected object with the probe card closely positioned to the inspection object, even when the contact terminal is made fine and even when an array thereof is formed with a narrow pitch. <P>SOLUTION: A displacement of a plate spring member 3 generated by contact of the contact terminals 2 with the inspection object 15 is detected when the probe card X1 has structure held with the plurality of contact terminals 2 onto the plate spring member 3 with one portion fixedly supported to an elastically displaceable support member. For example, the detection is attained by a continuity condition between an electrode member 4 provided close to the plate spring member 3 and the plate spring member 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a probe card used for energization inspection of an inspection object such as a semiconductor wafer and a prober that positions the probe card and the inspection object and performs an energization inspection.

In energization inspection using an electronic component such as a semiconductor wafer as an inspection object, a probe card is used as an electrical connection device.
The probe card is supported so that the contact terminals that come into contact with the IC terminals or wiring patterns on the surface of the object to be inspected are elastically displaced by being supported in a cantilevered manner with respect to the support member. It has a configuration in which it is electrically connected to a signal wiring formed on the printed circuit board or the like on the support member side. Then, various kinds of armature signals are inputted to and outputted from the signal wiring, thereby conducting an energization inspection of the inspection object.
In the energization inspection using this probe card, controlling the relative positions of the contact terminals provided on the probe card and the object to be inspected is to stabilize the electrical connection state. It is also important for avoiding wear and damage to the object to be inspected and the probe card.
In general, the positioning of the probe card and the object to be inspected and the input / output of electrical signals to the signal wiring on the support member side are performed by a device called a prober.
When positioning the probe card and the object to be inspected by the prober, make fine adjustments while checking the contact status between the probe card and the object to be inspected visually by the operator, The position of each of a plurality of contact terminals provided in the probe card (relative position with respect to the support part of the probe card) is detected by a capacitance sensor provided in the prober or an image recognition device. Based on the above, the probe card and the inspection object are automatically positioned by the prober.
However, the accuracy of visual confirmation by the operator is not sufficient, and in the method of detecting the position of the contact terminal in advance by a prober, the probe card and the object to be inspected are positioned close to each other. The actual contact state of the contact terminal with the object to be inspected cannot be grasped.

On the other hand, conventionally, various techniques for detecting the contact state between the contact terminal of the probe card and the inspection object while the probe card and the inspection object are positioned have been proposed.
For example, in Patent Document 1, a needle formed at the same height as a row of a plurality of contact terminals is provided, and when the needle touches a dummy electrode on the surface of the object to be slightly raised, the needle is electrically connected to the needle. A technique for detecting the presence / absence of contact between a contact terminal and an object to be inspected by disconnecting the contact with another short needle that has come into contact is shown. Further, Patent Document 1 discloses a technique for converting a displacement of a needle that contacts an object to be inspected into an optical signal and then converting it into an electrical signal.
Further, Patent Document 2, Patent Document 3 and Patent Document 4 also detect the contact state between the probe card and the inspection object by converting the displacement of the contact terminal (needle) contacting the inspection object into an electric signal. Things are shown.

On the other hand, with the recent high integration of electronic components, the density of electrodes arranged on the object to be inspected (electronic components) has been increased and the pitch has been made narrower. Narrow pitch is progressing.
Such contact terminals arranged at a very narrow pitch use, for example, a photolithography technique and a terminal formation technique based on plating as shown in Patent Document 5, Patent Document 6, Patent Document 7, and Patent Document 8, etc. Made. Using these technologies, in principle, miniaturization to the same level as semiconductor manufacturing becomes possible.
In the conventional general probe card, the contact terminal is formed in a needle shape and elastically deforms itself to absorb the dispersion and inclination of the relative position with the object to be inspected. In a probe card having a contact terminal, for example, as shown in Patent Document 7, a plurality of contact terminals (contact unit) are held by a leaf spring partially fixed to a support, and the leaf spring The structure which absorbs the dispersion | variation and inclination of a relative position with a to-be-inspected object by elastic deformation of is proposed.
Japanese Patent No. 3441835 Japanese Patent Laid-Open No. 11-214454 Japanese Patent Laid-Open No. 10-213597 Japanese Patent Laid-Open No. 10-239399 JP 2001-330628 A Japanese Patent Application Laid-Open No. 2002-228685 JP 2002-311049 A JP 2002-71719 A

However, when the pitch of the contact terminals is reduced (contact terminals are made finer), it is difficult to detect the displacement of the contact terminals as in the prior art.
This will be described below.
As the contact terminals of the probe card become finer and narrower, the amount of displacement required for displacement detection cannot be secured.
When the contact terminal has a cantilever shape, the displacement y at the tip of the contact terminal is expressed by the following equation (1).
y = WL ³ / (3EI) (1)
Where W is the load, L is the length of the beam, I is the moment of inertia of the cross section, and E is the Young's modulus. Further, the sectional secondary moment I is expressed by the following equation (2).
^{I = bh 3/12 ... (} 2)
Where b is the width of the beam and h is the height of the beam.
The maximum stress applied to the beam is expressed by the following equation (3).
σ = WLh / (2I) (3)
From these formulas (1) to (3), if the beam width b is reduced to reduce the contact terminal pitch, the beam displacement y for the same load W increases, but the stress σ applied to the beam. As a result, the plastic deformation of the contact terminal occurs.
In addition, even if the length L and height h of the beam are adjusted so that plastic deformation of the contact terminal does not occur, the displacement y and the stress σ are in a trade-off relationship, and the stress σ due to bending is kept small. In this case, it is necessary to reduce the displacement y.
For example, the contact terminal is made of a high strength material having a Young's modulus of about 200 GPa and a tensile strength of about 100 kg / mm ² , and has a high aspect ratio in which the beam width b is 15 μm and the height h is 30 μm. Even if it is formed, in order not to cause plastic deformation when a load of 2 g is applied, the length L of the beam must be suppressed to 100 μm or less, and the beam (contact terminal) at that time The maximum displacement (deformation amount) of the tip portion is about 1 μm. Also, considering the allowance for strength, it is normal to suppress the displacement to less than 1/2 of that, and in order to actually detect the presence or absence of contact, a displacement of about 1/10 is detected from there. Must. Therefore, it is necessary to detect a displacement of the order of several tens of nm, and it is impractical to provide such a high-resolution displacement sensor.
Accordingly, the present invention has been made in view of the above circumstances, and its object is to bring the probe card and the object to be inspected close to each other even if the contact terminals are miniaturized and the arrangement pitch is narrowed. Another object of the present invention is to provide a probe card and a prober capable of detecting the contact state between the contact terminal of the probe card and the object to be inspected.

In order to achieve the above object, the present invention provides a structure suitable for a probe card having a fine contact terminal in contact with an object to be inspected, that is, a part of the probe card is fixedly supported with respect to a support member and elastically displaced. In the case where a plurality of contact terminals are held by an elastic member such as a leaf spring, the total pressing equivalent of the pressing (load) to each of the plurality of contact terminals due to the contact between the contact terminals and the object to be inspected is It is focused on the elastic member, and the elastic member is displaced (deformed) relatively large. That is, by detecting the displacement, the contact state between the contact terminal and the inspection object is indirectly detected.
Here, the displacement amount of the contact terminal itself and the displacement amount of the elastic member do not necessarily coincide with each other. However, since the contact terminal is always displaced when contacting the object to be inspected, it is a conventional detection target. It can be handled in substantially the same manner as the displacement of the contact terminal itself.

More specifically, for example, when the elastic member has electrical conductivity, it is electrically connected to a signal wiring provided on the support member side, and otherwise, the surface of the elastic member is electrically conductive. And forming one or more electrode members and electrically connecting them to the signal wires, and one or more electrode members (first electrode members) electrically connected to the signal wires to the elastic members. , A configuration may be considered in which the contact terminals are provided close to the side opposite to the side holding the contact terminals or in contact with the side holding the contact terminals.
Thereby, on the signal wiring side, if the conduction state between the elastic member side (or the conductive portion side on the surface thereof) and the electrode member side is detected, the displacement state of the elastic member can be detected. In particular, it is possible to detect the contact state of the contact terminal with the inspection object.
That is, when the electrode member is disposed close to the elastic member as described above, the elastic member is displaced more than the distance from the electrode member by the contact terminal contacting (contacting) the inspection object. Then, when it contacts with the electrode member, it changes from a cut-off state to a conductive state. On the contrary, when the electrode member is arranged in contact with the elastic member as described above, when the elastic member is similarly displaced, the elastic member is separated from the electrode member to change from a conductive state to a cut-off state. .
If a plurality of such electrode members are arranged at different positions, the distribution of the displacement state of the elastic member can be detected.
For example, if the proximity portions or contact portions of the plurality of electrode members with respect to the elastic member are arranged at different positions in the arrangement direction of the plurality of contact terminals, the probe card and the test object in the arrangement direction of the contact terminals It is possible to detect the presence or absence of a relative inclination.
In addition, if both the electrode member in contact with the holding side of the contact terminal and the electrode member in proximity to the opposite side are combined, first, the contact terminal is moved by the electrode member in contact with the holding side of the contact terminal. It can be detected that the object is in contact with (in contact with) the object to be inspected, and further, it can be detected that the contact terminal is pressed against the object to be inspected with a predetermined pressing force by the electrode member adjacent to the opposite side.
Further, the elastic member is displaced more distant from the fixed support position with respect to the support member. For this reason, if the proximity | contact part or contact part with respect to the said elastic member of the said several electrode member (1st electrode member) is each arrange | positioned in a different distance from the fixed support position with respect to the said supporting member of the said elastic member, The displacement state can be detected in multiple stages, not only whether the distance between the probe card and the object to be inspected is appropriate, but also how much load is applied from the displacement-load characteristics of the elastic member. Is also possible.
In addition, even if it is difficult or impossible to adopt a configuration in which the elastic member or the conductive portion formed on the surface thereof is electrically connected to the signal wiring side for some reason, By providing a plurality of (second electrode members), the same displacement detection can be performed by detecting the conduction state between the electrode members.

On the other hand, if the elastic member is affixed with a strain gauge electrically connected to the signal wiring, the displacement of the elastic member can be detected in an analog manner. First, it is possible to detect in more detail how much load is applied from the displacement-load characteristics of the elastic member. However, in this case, it is necessary to provide a bridge circuit and a minute voltage change detection circuit (amplifier, etc.) in the signal input / output path to the strain gauge, for example, the signal input / output unit in the prober.
The configuration described above has a plurality of contact terminals (fine contact terminals arranged at a narrow pitch (for example, a pitch of 40 μm or less)) formed close to each other by photolithography technology, that is, with the object to be detected. It is preferable to apply to a probe card having contact terminals that are difficult to detect because displacement due to contact is very small.

  The means for detecting the displacement of the elastic member may be provided in a prober for positioning the probe card and the object to be inspected and inputting / outputting signals to / from the signal wiring. For example, if the displacement of the elastic member is detected in a non-contact manner by a capacitance sensor, a displacement sensor using a laser beam, or the like, a displacement detector is provided on the probe card manufactured for each type of the object to be inspected. If the basic structure of the probe card is the same as compared with the case of providing a card, it can be made more versatile regardless of its type.

  According to the present invention, when the probe card has a structure in which a plurality of contact terminals are held by an elastic member such as a leaf spring that is partly fixed and supported with respect to the support member and is elastically displaced, By detecting the displacement (deformation) of the elastic member caused by the contact with the inspection object, the probe card and the inspection object are brought close to each other even if the contact terminals are miniaturized and the arrangement pitch is narrowed. In this state, the contact state between the contact terminal and the object to be inspected can be indirectly detected.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings so that the present invention can be understood. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.
FIG. 1 is a schematic side view of the probe card X1 according to the first embodiment of the present invention, FIG. 2 is a schematic side sectional view showing a state in which the probe card X1 is in contact with a semiconductor wafer, and FIG. 4 is a schematic side view of the probe card X2 according to the second embodiment and a perspective view of the main part, FIG. 4 is a schematic side view of the probe card X3 according to the third embodiment of the present invention, a perspective view of the main part, and FIG. 6 is a schematic side view of a probe card X4 according to a fourth embodiment of the invention, FIG. 6 is a schematic side view of a probe card X5 according to a fifth embodiment of the present invention, and FIG. 7 is a probe card according to the sixth embodiment of the present invention. It is a schematic side view of X6.

(First embodiment)
First, the configuration of the probe card X1 according to the first embodiment of the present invention will be described using the side view shown in FIG.
The probe card X1 includes a leaf spring member 3 that is supported in a cantilever manner by being fixedly supported at one end by a fixing member 9 or a reinforcing member 8 with respect to a supporting member 1 such as a printed circuit board as a main body. ing. Thereby, the said leaf | plate spring member 3 is elastically displaced when a press is added.
Further, the probe card X1 includes a plurality of contact terminals 2 (conductive contacts) that come into contact with the semiconductor wafer 15 that is an object to be inspected, and the contact terminals 2 are interposed via the holding base 6 that is a rigid body. The structure is held by the leaf spring member 3.
Each of the contact terminals 2 is fixedly supported in a cantilevered manner with respect to the holding base 6 and is slightly displaced by being elastically pressed. As a result, slight irregularities on the surface of the semiconductor wafer 15 are absorbed by the individual displacements of the contact terminals 2. In FIG. 1, a plurality of the contact terminals 2 are arranged in the depth direction of the figure.
The contact terminals 2 are provided on a holding base 6 made of silicon or the like, and each contact terminal 2 is formed on the support member 1 side via a printed wiring 5a on the resin film 5. The signal wiring 1a is electrically connected.
With such a configuration, by inputting / outputting an inspection signal to / from the signal wiring 1a on the support member 1 side in a state where each of the contact terminals 2 is in contact with a printed wiring on the semiconductor wafer 15, An energization inspection of the semiconductor wafer 15 can be performed.

Further, the probe card X1 includes a configuration (displacement detection unit) for detecting the displacement of the leaf spring member 3 (elastic member) as described below.
First, the leaf spring member 3 is a metal (that is, conductive) elastic member, which is electrically connected to the signal wiring 1a on the support member 1 side through a conducting wire 3a.
Further, a protrusion 4b protruding in the direction of the leaf spring member 3 is provided at a position close to the side opposite to the side (lower side in the figure) that holds the contact terminal 2 with respect to the leaf spring member 3. An electrode member 4 (an example of a first electrode member) is provided. The electrode member 4 is fixed to the support member 1 through an insulator 7, the fixing member 9, and the reinforcing member 8, and further, the electrode on the support member 1 side is connected through a conductor 4a. It is electrically connected to the signal wiring 1a.
In the present embodiment, the metal (conductive) leaf spring member 3 is used. However, when a non-conductive elastic member is used, it corresponds to the protrusion 4b of the electrode member 4 on the surface. It is also conceivable to use an elastic member in which a conductive portion such as a metal film is formed in the portion to be connected, and to connect the conductive portion to the signal wiring 1a with a conducting wire or the like.

FIG. 2 is a schematic side sectional view showing a state in which the probe card X1 is in contact (contact) with the semiconductor wafer 15.
As shown in FIG. 2, when the contact terminal 2 contacts (contacts) the semiconductor wafer 15, the leaf spring member 3 is pressed and displaced via the holding base 6. When the displacement is greater than or equal to the distance between the projection 4a of the electrode member 4 and the leaf spring member 3 that were originally set, the electrode member 4 and the leaf spring member 3 come into contact with each other, The mutual state changes from an electrically disconnected state to a conductive state. FIG. 2 shows a conductive state, and FIG. 1 shows a cut-off state.
Here, in order to perform an appropriate energization inspection, it is necessary to secure to some extent the pressure (load) of each of the contact terminals 2 against the semiconductor wafer 15. In order to ensure the pressing, when conducting the energization inspection of the semiconductor wafer 15, as shown in FIG. 2, the probe card X1 and the semiconductor wafer 15 are in a state where the leaf spring member 3 is relatively displaced (deformed). Are positioned relative to each other. For example, the leaf spring member 3 is displaced by about 20 μm to 100 μm.
Therefore, the protrusion 4b of the electrode member 4 is arranged in advance at the displacement position of the leaf spring member 3 when a pressure (load) suitable for the current check is ensured, and the inspection is performed on the signal wiring 1a side. A position where the leaf spring member 3 is secured with a pressure (load) suitable for an electric current inspection if a conduction state between the leaf spring member 3 side and the electrode member 4 side is detected by signal input / output. It can be detected whether or not it has been displaced. That is, it is possible to detect whether or not the contact state of the contact terminal 2 with respect to the semiconductor wafer 15 is appropriate in a state where the probe card X1 and the semiconductor wafer 15 are positioned close to each other.

(Second Embodiment)
FIG. 3 is a schematic side view (a) and a perspective view (b) of a main part of a probe card X2 according to a second embodiment of the present invention, which is a modification of the probe card X1.
As shown in FIG. 3, the probe card X2 has the same configuration as the probe card X1 except that a plurality of the electrode members 4 are provided at different positions in the probe card X1 (FIG. 1).
Here, the plurality of electrode members 4 (first electrode members) in the probe card X2 are fixedly supported to the support member 1 of the leaf spring member 3 by the protrusion 4a which is a proximity portion to the leaf spring member 3. They are arranged at different distances from the position. Further, the interval (gap) between each protrusion 4a and the leaf spring member 3 is substantially the same.
Since the leaf spring member 3 is displaced more distant from the fixed support position with respect to the support member 1, the displacement state of the leaf spring member 3 can be changed in multiple stages (example of FIG. 3) by the configuration shown in FIG. In this case, it can be detected in two stages). As a result, it is possible to detect not only whether the distance between the probe card X2 and the semiconductor wafer 15 is appropriate, but also how much load is applied from the displacement-load characteristics of the leaf spring member 3. Become.
For example, in this case, the electrode member 4 on the side far from the support member 1 is disposed at a position corresponding to the displacement of the leaf spring member 3 when a pressure (load) suitable for an energization inspection is ensured. It is conceivable to arrange the electrode member 4 on the side close to the support member 1 at a position corresponding to the upper limit displacement within a range in which the contact terminal 2 and the semiconductor wafer 15 are not worn or damaged.
By using such a probe card X2, the positioning is basically performed by the conductive state of the electrode member 4 on the side far from the support member 1, and the electrode member on the side close to the support member 1 should be used. When the continuity 4 is detected, it is determined that the state is abnormal, and it is possible to take measures such as performing positioning again so that the continuity state is released. As a result, the contact terminals 2 and the semiconductor wafer 15 can be prevented from being worn or damaged.

(Third embodiment)
FIG. 4 is a schematic side view (a) and a perspective view (b) of the main part of a probe card X3 according to a third embodiment of the present invention, which is a modification of the probe card X1.
As shown in FIG. 4, in the probe card X3, in the probe card X1 (FIG. 1), the two electrode members 4 to be paired are provided close to each other, and the leaf spring member 3 is connected to the support member. The probe card X1 has the same configuration as that of the probe card X1 except that it is not electrically connected to the signal wiring 1a on the first side.
That is, the probe card X3 is provided with the electrode member 4 (an example of a second electrode member) in the vicinity of the side opposite to the side holding the contact terminal 2 with respect to the conductive leaf spring member 3, and the electrode The member 4 is electrically connected to the signal wiring 1a.
With such a configuration, even when it is difficult for some reason to electrically connect the leaf spring member 3 to the signal wiring 1a side, the conduction state between the electrode members 4 is detected. As a result, the displacement of the leaf spring member 3 can be detected as in the case of the probe card X1.

(Fourth embodiment)
FIG. 5 is a schematic side view of a probe card X4 according to a fourth embodiment of the present invention, which is a modification of the probe card X1.
As shown in FIG. 5, the probe card X4 has an electrode member 4 ′ (equivalent to the electrode member 4) in contact with the leaf spring member 3 on the opposite side in the probe card X1 (FIG. 1). Except for being provided, it has the same configuration as the probe card X1.
That is, the electrode member 4 ′ (an example of the first electrode member) in the probe card X4 holds the contact terminal 2 with respect to the conductive leaf spring member 3 electrically connected to the signal wiring 1a. It is provided in contact with the surface on the side, and is electrically connected to the signal wiring 1a via a conductor 4a '.
When the leaf spring member 3 is displaced by contact (contact) of the contact terminal 2 with the semiconductor wafer 15 by such a probe card X4, the contact terminal 2 is separated from the electrode member 4 ′ to be disconnected from the conductive state. To change. If such a change in the conduction state is detected by input / output of an inspection signal on the signal wiring 1a side, it is possible to detect at least whether or not the contact terminal 2 is in contact with the semiconductor wafer 15.
If this detection signal is used, for example, when the interruption of conduction in the electrode member 4 ′ is detected during the positioning operation by the prober (while the distance between the probe card X4 and the semiconductor wafer 15 is being reduced). Thus, it is possible to perform control such as stopping (ending the positioning operation) after the distance is further reduced by a certain minute length from the position at the time of detection. As a result, the leaf spring member 3 can be displaced to a position where a pressure (load) suitable for energization inspection is ensured, and the contact state of the contact terminal 2 with respect to the semiconductor wafer 15 can be made appropriate.

(Combination of the first to third embodiments and the fourth embodiment)
Further, the electrode member 4 that is brought close to the leaf spring member 3 of any of the probe cards X1 to X3 and the electrode member 4 ′ that is in contact with the leaf spring member 3 of the probe card X4 are combined. Is also possible.
Thereby, it can be detected that the contact terminal 2 is in contact (contact) with the semiconductor wafer 15 by the electrode member 4 ′ in contact with the holding side of the contact terminal 2, and further, the electrode member 4 adjacent to the opposite side thereof. Thus, it can be detected that the contact terminal 2 is pressed against the semiconductor wafer 15 with a predetermined pressing force.
When the probe card having such a configuration is used, for example, during the positioning operation by the prober (while the distance between the probe card X4 and the semiconductor wafer 15 is reduced), the conduction of the electrode member 4 ′ is interrupted. Until it is detected, an approaching operation is performed at a high speed without sacrificing some accuracy, and after the disconnection of the conduction with respect to the electrode member 4 ′ is detected, until the conduction with respect to the electrode member 4 is detected, Control can be performed such that the approaching operation (positioning operation) is performed with high accuracy even if the speed is sacrificed. This makes it possible to achieve both high speed and high precision positioning.

(Fifth embodiment)
FIG. 6 is a schematic side view of a probe card X5 according to a fifth embodiment of the present invention provided with a strain gauge 7 as a configuration (displacement detector) for detecting the displacement of the leaf spring member 3 (elastic member). .
As shown in FIG. 6, the probe card X5 is attached to the surface of the leaf spring member 3 (elastic member) instead of the electrode members 4 and 4 ′ in the probe cards X1 to X4, and the signal wiring 1a. Is provided with a strain gauge 7 electrically connected thereto.
With such a configuration, the displacement of the leaf spring member 3 can be detected in an analog manner, so that in addition to the presence or absence of contact of the contact terminal 2 with the semiconductor wafer 15 (whether or not the strain detection value has changed), From the displacement-load characteristic of the spring member 3, it is possible to detect in more detail how much load is applied between the contact terminal 2 and the semiconductor wafer 15.
However, in this case, it is necessary to provide a bridge circuit and a minute voltage change detection circuit (amplifier, etc.) in the signal input / output path to the strain gauge 7, for example, the signal input / output unit in the prober.

(Sixth embodiment)
FIG. 7 is a schematic side view of a probe card X6 according to the sixth embodiment of the present invention, which is a modification of the probe card X1 (FIG. 1).
The difference of the probe card X6 from the probe card X1 is as follows.
First, as shown in FIG. 7, the probe card X6 has a configuration in which the leaf spring member 3 is supported at both opposite ends by the two support members 1 (supported in a doubly supported beam shape). ing.
Further, the probe card X6 is provided with an array of a plurality of contact terminals 2 that come into contact with the semiconductor wafer 15 that is the object to be inspected, one row on each side of the two support members 1, and the contact terminals 2 are The structure is held by the leaf spring member 3 through a holding base 6 that is a rigid body.
Further, each of the contact terminals 2 is held on the holding base 6 via an elastic layer 10 made of rubber or the like, and is slightly displaced by being pressed. As a result, slight irregularities on the surface of the semiconductor wafer 15 are absorbed by the individual displacements of the contact terminals 2. In FIG. 7, a plurality of the contact terminals 2 are arranged in the depth direction of the figure.
The electrode member 4 is also provided on each side of the two support members 1, and is arranged so as to mainly detect the contact state of the row of the contact terminals 2 on each side of the two support members 1. Has been.
Such a configuration is also an embodiment of the present invention.
Further, in the probe card, when the contact terminals 2 are brought into contact with the electrodes formed around the IC on the semiconductor wafer as the inspection object, four rows of the contact terminals corresponding to each of the four sides of the square IC Many have two rows.
In this case, four (a plurality) of the plate spring members 3 are provided corresponding to each of the four sides of the object to be inspected, and a plurality of rows of the contact terminals 2 and the electrode members 4 (for each plate spring member 3 are provided. If the probe card is provided with a displacement detector, the inspection efficiency and positioning accuracy can be improved.
In the probe cards X1 to X6 described above, the leaf spring member 3 is configured to hold the contact terminal 2 via the holding base 6 (rigid body). The member 3 may be configured to directly hold the contact terminal 2.

(Seventh embodiment)
In general, since the probe card is manufactured for each type of semiconductor wafer 15 to be inspected, it is necessary to incorporate the configuration shown in the probe cards X1 to X6. On the other hand, the prober for positioning the probe card and the semiconductor wafer 15 is a general-purpose one corresponding to various probe cards.
Therefore, it is conceivable to apply the present invention to a prober as an embodiment that makes the present invention more versatile.
Generally, a prober is an XYZ stage as a positioning means for positioning a probe card and an inspection object such as a semiconductor wafer, a camera used for positioning, a microscope, a computer for controlling the XYZ stage, and the like. It comprises.
As a probe card positioned by such a prober, for example, one end of the probe card X1 (see FIG. 1) without the electrode member 4, that is, the support member 1 provided with the signal wiring 1a. Comprises a plate spring member 3 (elastic member) fixedly supported by the fixing member 9 and elastically displaced, and a plurality of the contact terminals 2 that contact the semiconductor wafer 15 (inspection object) with respect to the plate spring member 3. However, a probe card having a configuration of being held via the holding base 6 and each of the contact terminals 2 being electrically connected to the signal wiring 1a is used.
The prober according to the present embodiment includes, in addition to a general prober configuration, the leaf spring member 3 in the probe card (excluding the electrode member 4 from the probe card X1) held by the prober. A displacement sensor such as a laser displacement meter is provided as means for detecting the displacement.
A laser displacement meter is a well-known non-contact displacement sensor that measures the amount of axial displacement of a laser beam in the measurement object by irradiating the surface of the displacement measurement object with laser light and observing the reflected light. is there.
The laser displacement meter provided as the displacement sensor is fixed at a relative position to the support member 1 that fixes and supports the leaf spring member 3 (see FIG. 1), and is substantially perpendicular to the surface of the leaf spring member 3. The amount of displacement of the leaf spring member 3 in the direction substantially perpendicular to the surface of the semiconductor wafer 15 is detected by irradiating laser light from the direction and observing the reflected light.
Then, by a control means such as a computer connected to the laser displacement meter (displacement sensor), during the positioning operation of the distance between the probe card and the semiconductor wafer 15 (the distance between the probe card 20 and the semiconductor wafer 15 is reduced). In the meantime, the displacement detection value of the laser displacement meter is monitored, and when the displacement detection value reaches a predetermined displacement setting value, the probe card positioning operation by the prober is stopped.
As a result, if the displacement set value is set to a value corresponding to the displacement of the leaf spring member 3 when a pressure (load) suitable for energization inspection is secured, the probe card and the semiconductor wafer 15 are brought close to each other. In this state, it is possible to detect whether or not the contact state of the contact terminal 2 with respect to the semiconductor wafer 15 is appropriate, and it is possible to position in the appropriate state.

In addition, the displacement set value is set to a first displacement set value corresponding to the displacement of the leaf spring member 3 when a pressure (load) suitable for energization inspection is ensured, and to a second displacement corresponding to a smaller displacement. It is also conceivable to set in two steps with the displacement set value.
In this case, until the displacement detection value of the displacement sensor such as the laser displacement meter reaches the second displacement set value by the control means, the probe card is inserted at a high speed without sacrificing some accuracy. After approaching the second displacement set value or more, until the first displacement set value is reached, the approach operation (positioning operation) is performed with high accuracy at the expense of speed. By performing control, it is possible to achieve both high-speed positioning and high accuracy.
Further, an upper limit displacement set value corresponding to the upper limit displacement of the leaf spring member 3 within a range that does not cause wear or damage to the contact terminal 2 or the semiconductor wafer 15 is set in advance. When the displacement detection value exceeds the upper limit displacement set value, for example, when the sensor card is brought close to the semiconductor wafer 15, an alarm is output, or the proximity operation of the probe card to the semiconductor wafer 15 is urgently stopped, etc. Control can also be considered.
Thus, according to the prober provided with the displacement sensor, if the basic structure of the probe card is the same as that in the case where the displacement detector is provided in the probe card manufactured for each type of the semiconductor wafer 15, It can be made more general regardless of the type.
In the present embodiment, the laser displacement meter 40 is used as the displacement detecting means of the leaf spring member 3, but the present invention is not limited to this, and other non-contact type displacement meters such as a capacitance sensor. It is also possible to use.
In addition, as in the displacement detection in the probe cards X1 to X6, it is conceivable to employ contact-type displacement detection means using electrode members or the like.

  The present invention is applicable to a probe card for energization inspection and a prober used for positioning thereof.

The schematic side view of the probe card X1 which concerns on 1st Embodiment of this invention. The schematic sectional side view showing the state where probe card X1 contacted the semiconductor wafer. The schematic side view of the probe card X2 which concerns on 2nd Embodiment of this invention, and the perspective view of the principal part. The schematic side view and perspective view of the principal part of probe card X3 concerning a 3rd embodiment of the present invention. The schematic side view of probe card X4 concerning a 4th embodiment of the present invention. The schematic side view of probe card X5 concerning a 5th embodiment of the present invention. The schematic side view of probe card X6 concerning a 6th embodiment of the present invention.

Explanation of symbols

X1 to X6 ... probe card 1 ... support member 1a ... signal wiring 2 ... contact terminal 3 ... leaf spring member (elastic member)
4, 4 '... electrode member 5 ... resin film 6 ... holding substrate 7 ... insulator 10 ... elastic layer 15 ... semiconductor wafer

Claims (7)

A plurality of contact terminals that contact the object to be inspected are held for each of the one or more elastic members that are partly fixedly supported and elastically displaced with respect to the support member, and each of the contact terminals is disposed on the support member side. A probe card electrically connected to the provided signal wiring,
A probe card comprising a displacement detector for detecting displacement of the elastic member. The displacement detector is
The conductive elastic member electrically connected to the signal wiring or the elastic member formed on the surface of the conductive portion electrically connected to the signal wiring is opposite to the side holding the contact terminal. 2. The first electrode member according to claim 1, further comprising one or a plurality of first electrode members provided in proximity to a side surface or in contact with a surface on a side holding the contact terminal and electrically connected to the signal wiring. Probe card.   3. The probe card according to claim 2, wherein the proximity portions or contact portions of the plurality of first electrode members with respect to the elastic member are arranged at different distances from a fixed support position of the elastic member with respect to the support member. The displacement detector is
The conductive elastic member or the conductive member formed on the surface is provided adjacent to the side opposite to the side holding the contact terminal or in contact with the side holding the contact terminal. The probe card according to claim 1, further comprising a plurality of second electrode members electrically connected to the signal wiring.   The probe card according to claim 1, wherein the displacement detection unit includes a strain gauge provided on the elastic member and electrically connected to the signal wiring. A plurality of contact terminals that are in contact with an object to be inspected are held for each of one or a plurality of elastic members that are elastically displaced by being fixedly supported by a support member provided with a signal wiring, and each of the contact terminals Is a prober for positioning the probe card electrically connected to the signal wiring and the inspection object,
A prober comprising displacement detection means for detecting displacement of the elastic member.   The prober according to claim 6, wherein the displacement detection means detects the displacement of the elastic member in a non-contact manner.

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