JP2005348847A - Distal end portion of electronic endoscope - Google Patents

Distal end portion of electronic endoscope Download PDF

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JP2005348847A
JP2005348847A JP2004170682A JP2004170682A JP2005348847A JP 2005348847 A JP2005348847 A JP 2005348847A JP 2004170682 A JP2004170682 A JP 2004170682A JP 2004170682 A JP2004170682 A JP 2004170682A JP 2005348847 A JP2005348847 A JP 2005348847A
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circuit board
distal end
electronic endoscope
end portion
signal lines
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JP2004170682A
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JP4502717B2 (en
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Masahiro Takano
雅弘 高野
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Pentax Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a distal end portion of electronic endoscopes which connects signal lines of a signal cable to a plurality of connecting terminals disposed on a circuit board separately and easily without any errors if the circuit board is reduced in the size. <P>SOLUTION: In the distal end portion of electronic endoscopes, where a solid-state image sensor 7 and the circuit board 10 are incorporated in the distal end of an insertion portion 1, and a plurality of signal lines 16 pulled out of the end of the signal cable 15 inserted in the insertion portion 1 are separately connected to a plurality of connecting terminals 17 disposed on the circuit board 10, recesses 18, 18' for positioning by separately fitting the farthest end parts 16a of the plurality of signal lines 16 are formed adjacently respectively to the plurality of connecting terminals 17 on the circuit board 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は電子内視鏡の先端部に関する。   The present invention relates to a distal end portion of an electronic endoscope.

挿入部の先端に固体撮像素子を内蔵する電子内視鏡においては、固体撮像素子の駆動回路等を構成する電子部品が取り付けられた回路基板が固体撮像素子の後側に隣接して配置され、挿入部内に挿通配置された信号ケーブルの先端から引き出された複数の信号線が、回路基板に設けられた複数の接続端子に個別に接続されている（例えば、特許文献１、２）。
特開平６−２８５０１８ 特開平９−１９２０９２ In an electronic endoscope that incorporates a solid-state image sensor at the tip of the insertion portion, a circuit board on which electronic components constituting a drive circuit of the solid-state image sensor are attached is arranged adjacent to the rear side of the solid-state image sensor, A plurality of signal lines drawn from the tip of the signal cable inserted and arranged in the insertion portion are individually connected to a plurality of connection terminals provided on the circuit board (for example, Patent Documents 1 and 2).
JP-A-6-285018 JP-A-9-192092

上述のような従来の電子内視鏡においては、回路基板に多数の接続端子が並んで形成されていて、信号ケーブルの先端から引き出された複数の信号線が各接続端子に半田付け等により個別に接続固着されている。   In the conventional electronic endoscope as described above, a large number of connection terminals are formed side by side on the circuit board, and a plurality of signal lines drawn from the tip of the signal cable are individually soldered to each connection terminal. The connection is fixed.

しかし、技術の進歩等により固体撮像素子が小型化されるのに伴って、回路基板が小型化されて隣り合う接続端子間の間隔が接近し、その結果、各信号線と接続端子とを顕微鏡観察下に位置決めをして半田付けしなければならなくなり、作業が非常に難しくて、僅かな不注意等によって、半田付け不良や、隣の接続端子とのショート等が発生する場合がある。   However, as the solid-state imaging device is miniaturized due to technological advancement and the like, the circuit board is miniaturized and the interval between adjacent connection terminals approaches, and as a result, each signal line and connection terminal are connected to a microscope. It must be positioned and soldered under observation, and the work is very difficult. Due to slight carelessness, a soldering failure or a short circuit with an adjacent connection terminal may occur.

そこで本発明は、回路基板が小型化されても、回路基板に配置された複数の接続端子に対して信号ケーブルの信号線を個別に容易かつ誤りなく接続することができる電子内視鏡の先端部を提供することを目的とする。   Therefore, the present invention provides a distal end of an electronic endoscope that can easily and without error connect individual signal lines of a signal cable to a plurality of connection terminals arranged on the circuit board even if the circuit board is downsized. The purpose is to provide a department.

上記の目的を達成するため、本発明の電子内視鏡の先端部は、挿入部の先端に固体撮像素子と回路基板とが内蔵されて、挿入部内に挿通配置された信号ケーブルの先端から引き出された複数の信号線が、回路基板に配置された複数の接続端子に個別に接続された電子内視鏡の先端部において、回路基板に、複数の信号線の最先端部分を個別に嵌め込んでその位置決めをするための凹部を、複数の接続端子の各々に隣接して形成したものである。   In order to achieve the above object, the distal end portion of the electronic endoscope of the present invention is drawn out from the distal end of a signal cable that has a solid-state imaging device and a circuit board built into the distal end of the insertion portion and is inserted and disposed in the insertion portion. At the distal end of the electronic endoscope where the plurality of signal lines are individually connected to the plurality of connection terminals arranged on the circuit board, the most advanced portions of the plurality of signal lines are individually fitted into the circuit board. The concave portion for positioning is formed adjacent to each of the plurality of connection terminals.

なお、凹部が、回路基板に形成された溝又は孔であってもよい。   Note that the recess may be a groove or a hole formed in the circuit board.

本発明によれば、回路基板に、複数の信号線の最先端部分を個別に嵌め込んでその位置決めをするための凹部を、複数の接続端子の各々に隣接して形成したことにより、信号線を回路基板に接続する作業を行う際には、信号線の最先端部分を凹部に嵌め込むことで信号線が接続端子に対して位置決めされるので、回路基板が小型化されても、回路基板に配置された複数の接続端子に対して信号ケーブルの信号線を個別に容易かつ誤りなく接続することができる。   According to the present invention, the recesses for individually positioning and positioning the leading end portions of the plurality of signal lines on the circuit board are formed adjacent to each of the plurality of connection terminals. When the circuit board is connected to the circuit board, the signal line is positioned with respect to the connection terminal by fitting the leading edge of the signal line into the recess. The signal lines of the signal cable can be individually and easily connected without error to the plurality of connection terminals arranged in the.

挿入部の先端に固体撮像素子と回路基板とが内蔵されて、挿入部内に挿通配置された信号ケーブルの先端から引き出された複数の信号線が、回路基板に配置された複数の接続端子に個別に接続された電子内視鏡の先端部において、回路基板に、複数の信号線の最先端部分を個別に嵌め込んでその位置決めをするための凹部を、複数の接続端子の各々に隣接して形成する。   A solid-state image sensor and a circuit board are built into the tip of the insertion part, and multiple signal lines drawn from the tip of the signal cable inserted and placed in the insertion part are individually connected to multiple connection terminals placed on the circuit board. In the distal end portion of the electronic endoscope connected to the circuit board, a recess for individually fitting the leading end portions of the plurality of signal lines into the circuit board for positioning is provided adjacent to each of the plurality of connection terminals. Form.

図面を参照して本発明の実施例を説明する。
図２は電子内視鏡の挿入部の先端部分を示しており、細長い可撓管状に形成された挿入部１の最先端部分に先端部本体２が連結され、その先端部本体２の最先端面に観察窓３と照明窓４等が配置されている。５は、照明窓４の後方に配置されているライトガイドファイババンドルである。 Embodiments of the present invention will be described with reference to the drawings.
FIG. 2 shows a distal end portion of an insertion portion of an electronic endoscope. A distal end portion body 2 is connected to the distal end portion of the insertion portion 1 formed in an elongated flexible tube, and the distal end portion 2 of the distal end portion body 2 is connected. The observation window 3 and the illumination window 4 are arranged on the surface. A light guide fiber bundle 5 is arranged behind the illumination window 4.

観察窓３の奥の先端部本体２内には、対物光学系６が配置されていて、その対物光学系６による被写体の投影位置に、例えばＣＣＤ（電荷結合素子）等からなる固体撮像素子７の受光面７ａが配置されている。   An objective optical system 6 is disposed in the distal end main body 2 at the back of the observation window 3, and a solid-state imaging device 7 made of, for example, a CCD (Charge Coupled Device) or the like is projected onto the subject projection position by the objective optical system 6. The light receiving surface 7a is arranged.

この実施例においては、対物光学系６の光軸と先端部本体２の軸線とが平行になるようにレイアウトされていて、固体撮像素子７の受光面７ａは対物光学系６の光軸に対して垂直の向きに配置されている。   In this embodiment, the optical axis of the objective optical system 6 and the axis of the tip body 2 are laid out in parallel, and the light receiving surface 7a of the solid-state image sensor 7 is in relation to the optical axis of the objective optical system 6. Are arranged in a vertical orientation.

そのような対物光学系６と固体撮像素子７を保持する撮像部保持枠８は、先端部本体２に軸線と平行方向に形成された貫通孔内に嵌挿固定されていて、撮像部保持枠８内には、固体撮像素子７の駆動回路等を構成する電子部品が取り付けられた例えば積層セラミック製の回路基板１０が、固体撮像素子７の後側に隣接して収容されている。１１は、固体撮像素子７から後方に延出して回路基板１０側に接続されたリード。１２は、リード１１の中間部分の外面に沿って配置された絶縁板である。   The imaging unit holding frame 8 that holds the objective optical system 6 and the solid-state imaging element 7 is fitted and fixed in a through hole formed in the distal end portion main body 2 in a direction parallel to the axis, and the imaging unit holding frame. A circuit board 10 made of, for example, a multilayer ceramic, to which electronic components constituting a drive circuit of the solid-state image sensor 7 and the like are attached, is accommodated in the rear side of the solid-state image sensor 7. A lead 11 extends rearward from the solid-state imaging device 7 and is connected to the circuit board 10 side. Reference numeral 12 denotes an insulating plate disposed along the outer surface of the intermediate portion of the lead 11.

１５は、固体撮像素子７で撮像された内視鏡観察画像の撮像信号等を伝送するために挿入部１内に軸線と平行方向に全長にわたって挿通配置された信号ケーブルであり、その内部には多数の信号線１６が挿通されている。   Reference numeral 15 denotes a signal cable that is inserted and disposed in the insertion portion 1 over the entire length in the direction parallel to the axis in order to transmit an imaging signal of an endoscope observation image captured by the solid-state imaging device 7. A large number of signal lines 16 are inserted.

そして、信号ケーブル１５の先端から前方に延出する各信号線１６の先端部分の絶縁被覆が剥がされて、露出導線１６ａが、回路基板１０の後端付近に配列されている複数の接続端子１７に個別に半田付け等によって接続されている。   And the insulation coating of the tip part of each signal line 16 extending forward from the tip of the signal cable 15 is peeled off, and the plurality of connection terminals 17 in which the exposed conductors 16 a are arranged near the rear end of the circuit board 10. Are individually connected by soldering or the like.

そのような回路基板１０には、III−III断面を図示する図３及びその部分の拡大斜視図である図１にも示されるように、各信号線１６の露出導線１６ａの最先端部分を個別に嵌め込んで回路基板１０に対する位置決めをするための信号線嵌め込み溝１８（凹部）が、複数の接続端子１７の各々に隣接して形成されている。   In such a circuit board 10, as shown in FIG. 3 illustrating the III-III cross section and FIG. 1 which is an enlarged perspective view of the section, the most advanced portion of the exposed conductor 16 a of each signal line 16 is individually provided. A signal line fitting groove 18 (concave portion) is formed adjacent to each of the plurality of connection terminals 17 for fitting into the circuit board 10 and positioning with respect to the circuit board 10.

なおこの実施例においては、図３に示されるように、回路基板１０の断面形状が矩形に形成されていて、その四側面の各々に信号線嵌め込み溝１８（及び接続端子１７）が横並びに配列されている。ただし、その他の配列、形状であってもよい。   In this embodiment, as shown in FIG. 3, the cross-sectional shape of the circuit board 10 is formed in a rectangular shape, and the signal line fitting grooves 18 (and the connection terminals 17) are arranged side by side on each of the four side surfaces. Has been. However, other arrangements and shapes may be used.

回路基板１０は、接続端子１７が配置されている後端付近の部分が信号線嵌め込み溝１８の溝底とほぼ同面になるように低く形成されていて、各信号線嵌め込み溝１８は、その後端側が接続端子１７の前端縁の中心位置に開口する状態に、接続端子１７と向きを合わせて形成されている。   The circuit board 10 is formed low so that the portion near the rear end where the connection terminal 17 is disposed is substantially flush with the groove bottom of the signal line fitting groove 18. The end side is formed in the state of opening to the center position of the front end edge of the connection terminal 17 so as to face the connection terminal 17.

したがって、信号ケーブル１５の信号線１６を回路基板１０に接続する作業を行う際には、図１に示されるように、信号線１６の露出導線１６ａの最先端部分を信号線嵌め込み溝１８内に嵌め込むことにより、露出導線１６ａが接続端子１７の中心を通る状態に位置決めされるので、その状態で露出導線１６ａを接続端子１７に半田付けすれば、各信号線１６を接続端子１７に対して容易に接続することができ、隣の接続端子１７とのショートや半田付け不良等が発生し難い。   Therefore, when the operation of connecting the signal line 16 of the signal cable 15 to the circuit board 10 is performed, as shown in FIG. 1, the leading end portion of the exposed conductor 16 a of the signal line 16 is placed in the signal line fitting groove 18. By fitting, the exposed conductor 16a is positioned so as to pass through the center of the connection terminal 17. If the exposed conductor 16a is soldered to the connection terminal 17 in this state, each signal line 16 is connected to the connection terminal 17. It can be easily connected, and short-circuiting with the adjacent connection terminal 17 or poor soldering hardly occurs.

なお、本発明は上記実施例に限定されるものではなく、例えば図４に示されるように、接続端子１７に対する信号線１６の露出導線１６ａの位置決めを行うのに、信号線嵌め込み溝１８に代えて信号線嵌め込み孔１８′を形成してもよく、要は、信号線１６の露出導線１６ａの最先端部分を嵌め込んで接続端子１７に対して位置決めをすることができる凹部であればよい。   The present invention is not limited to the above-described embodiment. For example, as shown in FIG. 4, in order to position the exposed conductor 16 a of the signal line 16 with respect to the connection terminal 17, the signal line fitting groove 18 is used. The signal line fitting hole 18 ′ may be formed as long as it is a recess that can be positioned with respect to the connection terminal 17 by fitting the leading end portion of the exposed conductor 16 a of the signal line 16.

本発明の第１の実施例の電子内視鏡の先端部の信号線接続部の斜視図である。It is a perspective view of the signal line connection part of the front-end | tip part of the electronic endoscope of 1st Example of this invention. 本発明の第１の実施例の電子内視鏡の先端部の側面断面図である。It is side surface sectional drawing of the front-end | tip part of the electronic endoscope of 1st Example of this invention. 本発明の第１の実施例の電子内視鏡の先端部の図２におけるIII−III断面図である。FIG. 3 is a sectional view taken along the line III-III in FIG. 2 of the distal end portion of the electronic endoscope according to the first embodiment of the present invention. 本発明の第２の実施例の電子内視鏡の先端部の信号線接続部の斜視図である。It is a perspective view of the signal wire | line connection part of the front-end | tip part of the electronic endoscope of 2nd Example of this invention.

符号の説明Explanation of symbols

１ 挿入部
２ 先端部本体
７ 固体撮像素子
１０ 回路基板
１５ 信号ケーブル
１６ 信号線
１６ａ 露出導線
１７ 接続端子
１８ 信号線嵌め込み溝（凹部）
１８′ 信号線嵌め込み孔（凹部） DESCRIPTION OF SYMBOLS 1 Insertion part 2 Front-end | tip part body 7 Solid-state image sensor 10 Circuit board 15 Signal cable 16 Signal line 16a Exposed conductor 17 Connection terminal 18 Signal line insertion groove | channel (recessed part)
18 'signal line insertion hole (concave)

Claims (2)

挿入部の先端に固体撮像素子と回路基板とが内蔵されて、挿入部内に挿通配置された信号ケーブルの先端から引き出された複数の信号線が、上記回路基板に配置された複数の接続端子に個別に接続された電子内視鏡の先端部において、
上記回路基板に、上記複数の信号線の最先端部分を個別に嵌め込んでその位置決めをするための凹部を、上記複数の接続端子の各々に隣接して形成したことを特徴とする電子内視鏡の先端部。 A solid-state imaging device and a circuit board are built into the distal end of the insertion portion, and a plurality of signal lines drawn from the distal end of the signal cable inserted and arranged in the insertion portion are connected to the plurality of connection terminals arranged on the circuit board. At the tip of the individually connected electronic endoscope,
An electronic endoscope characterized in that a recess for fitting and positioning the leading edge portions of the plurality of signal lines individually is formed adjacent to each of the plurality of connection terminals on the circuit board. The tip of the mirror. 上記凹部が、上記回路基板に形成された溝又は孔である請求項１記載の電子内視鏡の先端部。 The distal end portion of the electronic endoscope according to claim 1, wherein the concave portion is a groove or a hole formed in the circuit board.
JP2004170682A 2004-06-09 2004-06-09 The tip of the electronic endoscope Expired - Fee Related JP4502717B2 (en)

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JP4502717B2 JP4502717B2 (en) 2010-07-14

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013165207A (en) * 2012-02-13 2013-08-22 Denso Corp Circuit board with conductor and manufacturing method therefor
JP2013197104A (en) * 2012-03-15 2013-09-30 Denso Corp Circuit board with external connection conductor and method of manufacturing the same
CN109068964A (en) * 2016-04-28 2018-12-21 奥林巴斯株式会社 Cable connection structure, photographic device and endoscope

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JPS54113054U (en) * 1978-01-27 1979-08-08
JPS6298318A (en) * 1985-10-25 1987-05-07 Olympus Optical Co Ltd Endoscope
JPH06343602A (en) * 1993-06-10 1994-12-20 Toshiba Corp Solid photographing device for endoscope
JPH10112577A (en) * 1996-09-30 1998-04-28 Heraeus Sensor Nite Gmbh Circuit board having contact field for connecting conductor, its production and use
JPH10248803A (en) * 1997-03-10 1998-09-22 Olympus Optical Co Ltd Image pick-up device
JPH1119035A (en) * 1997-07-03 1999-01-26 Olympus Optical Co Ltd Endoscope
JP2000232957A (en) * 1999-02-15 2000-08-29 Olympus Optical Co Ltd Endoscopic device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113054U (en) * 1978-01-27 1979-08-08
JPS6298318A (en) * 1985-10-25 1987-05-07 Olympus Optical Co Ltd Endoscope
JPH06343602A (en) * 1993-06-10 1994-12-20 Toshiba Corp Solid photographing device for endoscope
JPH10112577A (en) * 1996-09-30 1998-04-28 Heraeus Sensor Nite Gmbh Circuit board having contact field for connecting conductor, its production and use
JPH10248803A (en) * 1997-03-10 1998-09-22 Olympus Optical Co Ltd Image pick-up device
JPH1119035A (en) * 1997-07-03 1999-01-26 Olympus Optical Co Ltd Endoscope
JP2000232957A (en) * 1999-02-15 2000-08-29 Olympus Optical Co Ltd Endoscopic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013165207A (en) * 2012-02-13 2013-08-22 Denso Corp Circuit board with conductor and manufacturing method therefor
JP2013197104A (en) * 2012-03-15 2013-09-30 Denso Corp Circuit board with external connection conductor and method of manufacturing the same
CN109068964A (en) * 2016-04-28 2018-12-21 奥林巴斯株式会社 Cable connection structure, photographic device and endoscope
CN109068964B (en) * 2016-04-28 2020-12-25 奥林巴斯株式会社 Cable connection structure, image pickup apparatus, and endoscope

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