JP2000232957A - Endoscopic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an endoscopic aperture having a cable of a structure capable of surely decreasing radiation noises even at the time of transmission of a signal having a high transmission frequency. SOLUTION: The signal line 39 for transmitting the high frequency signal among the plurality of signal lines constituting the CCD cable is composed of a coaxial signal line. The external conductor of the coaxial signal line is formed of double shielding bodies consisting of a first external conductor 39c and a second external conductor 39d. At this time, the first external conductor 39c is composed of a cross wound copper alloy wire and the second external conductor 39d is formed by vapor deposition of metal having high electrical conductivity on a polyester base material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an endoscope apparatus for reducing emission of unnecessary radiation noise from an endoscope and mixing of unnecessary noise into the endoscope.

[0002]

2. Description of the Related Art In recent years, measures against EMC (collectively, the problem of causing electromagnetic interference (EMI) and the problem of receiving electromagnetic interference (EMS)) have been sufficiently taken for electrical equipment used in hospitals and the like. This situation is increasingly desired, and EMC measures have become one of the important technical matters for endoscope devices.

To cope with this, for example, Japanese Patent Application Laid-Open No. Hei 7-184852 filed by the present applicant discloses a cable for driving a solid-state image pickup device (hereinafter referred to as a CCD) and extracting electric signals by using a plurality of signal lines. A technique is disclosed in which a shield body for shielding noise is provided on the outer periphery of the bundle. In the CCD cable, among the input / output signals of the CCD, a coaxial signal line is used as a signal line for transmitting a drive signal and a CCD output signal, and the coaxial signal line is made of, for example, a copper alloy wire. And a laminated structure of an inner conductor layer, a dielectric (insulator) layer made of Teflon resin, an outer conductor layer made of copper alloy, and an insulator layer made of Teflon resin. Has become.

According to such a technique, noise radiated from a signal line or the like for transmitting a drive signal is shielded by an outer conductor layer of the signal line (coaxial signal line) or a shield disposed at the outermost periphery of the cable. Is done.

[0005]

However, when the frequency of the transmitted signal is high, the noise generated during signal transmission may not be sufficiently shielded only by the external conductor and the shield. Particularly, the driving frequency of the horizontal transfer pulse for driving the CCD is as high as several megahertz to several tens of megahertz, and there is a possibility that the noise generated when transmitting this horizontal transfer pulse can no longer be completely shielded.

The present invention has been made in view of the above circumstances, and provides an endoscope apparatus having a cable having a structure capable of reliably reducing radiation noise even when transmitting a signal having a high transmission frequency. With the goal.

[0007]

In order to solve the above problems, an endoscope apparatus according to the present invention has a solid-state imaging device,
In the endoscope apparatus provided with a cable for transmitting input / output signals to / from the solid-state imaging device, at least a signal line for transmitting a high-frequency signal among signal lines constituting the cable is formed of a coaxial signal line, The external conductor of the signal line is a double shield body comprising a first external conductor and a second external conductor.

That is, radiation noise can be effectively suppressed by providing a double shield body for directly shielding noise on a signal line for transmitting a high-frequency signal.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 relate to an embodiment of the present invention. FIG. 1 is an overall configuration diagram showing an endoscope apparatus.
FIG. 3 is a cross-sectional view illustrating a main part of a CCD cable, and FIG. 4 is a cross-sectional view illustrating a main part of a coaxial signal line.

First, an outline of an endoscope apparatus to which the present invention is applied will be described with reference to FIG. An endoscope apparatus 1 shown in FIG. 1 is an electronic endoscope 2 provided with a means for preventing electromagnetic interference.
The electronic endoscope 2 is connected to the light source device 3 for supplying illumination light, and the electronic endoscope 2 is connected to the electronic endoscope 2 via a scope cable 4 and includes a solid-state device built in the electronic endoscope 2. A video processor 5 that performs signal processing on an image pickup device (hereinafter abbreviated as CCD) 25 (see FIG. 2), a color monitor 6 that is input via a monitor cable connected to the video processor 5 and displays a video signal, , Is configured.

The electronic endoscope 2 has an elongated insertion portion 7 that can be inserted into a body cavity or the like, an operation portion 8 connected to a rear end of the insertion portion 7, and extends from the operation portion 8. It has a universal cord section 9 and a scope connector section 10 provided at an end of the universal cord section 9 and detachably connected to the light source device 3.

Here, a contact connector 10a is provided on the side of the scope connector 10, and a scope cable 4 is detachably connected to the contact connector 10a via an electric connector 4a. Further, a video processor 5 is detachably connected to the other end of the scope cable 4 via an electric connector 4b.

The insertion section 7 has a solid-state imaging device 22 therein.
, A bendable bending portion 13 formed at the rear end of the front end portion 12, and a long flexible tube portion extending from the rear end of the bending portion 13 to the front end of the operation portion 8. 21.

The operating section 8 includes a bending operation knob 1.
The bending portion 13 is bent by gripping the grip portion 18 and operating the bending operation knob 14. An air supply / water supply control unit 15 for performing air supply / water supply control and a suction control unit 16 for controlling suction are provided on a side surface of the operation unit 8. Further, a switch section 17 having a plurality of switches 17a is provided on the top of the operation section 8.

A light guide (not shown) for transmitting illuminating light is inserted through the inside of the insertion section 7, the operation section 8, and the universal cord section 9. The rear end of the light guide reaches the scope connector 10, transmits the illumination light supplied from the lamp inside the light source device 3, and emits the light forward from the distal end surface fixed to the illumination window 20 of the distal end portion 12. It is designed to illuminate a subject such as an affected part.

The subject image illuminated by the illumination light is passed through an objective optical system unit 23 mounted in an observation window 19 adjacent to the illumination window 20 and a solid-state image pickup device ( An image is formed on the CCD 25 and photoelectrically converted by the CCD 25 (see FIG. 2).

A CCD cable 30 is connected to the CCD 25, and the CCD cable 30 is connected to the scope cable 4 via a noise reducer (not shown) housed in the scope connector section 10. Connected to video processor 5.

An air supply / water supply conduit (not shown) is inserted into the insertion section 7. The air supply / water supply line is connected to the air supply / water supply control unit 15 by the operation unit 8, and the end thereof is connected to the scope connector unit 10 through the air supply / water supply line inserted through the universal cord unit 9. And is connected to the air / water supply mechanism in the light source device 3.

A suction conduit (not shown) inserted into the insertion portion 7 is branched into two near the front end of the operation portion 8, one of which communicates with the forceps port 11 b, and the other of which passes through the suction control portion 16. It communicates with the suction conduit in the universal cord section 9 and reaches a suction base (not shown) of the scope connector section 10.

In addition, the suction conduit has a tip opening 1 at the tip 12.
The tip opening 11a functions as a suction port for performing suction during a suction operation, and functions as a forceps outlet from which the forceps are projected when the forceps are inserted through the forceps port 11b.

Next, based on FIG. 2, the electronic endoscope 2 will be described.
The configuration of the solid-state imaging device mainly at the distal end portion 12 will be described. The tip 12 is connected to the objective optical system unit 2
3 and a solid-state imaging device 22 disposed behind the objective optical system unit 23.

The objective optical system unit 23 includes an objective lens group 24 composed of a plurality of lenses,
The objective lens frame 28 is held by the distal end portion 12 by fitting the objective lens frame 28 to the distal end frame 35.

A CCD holder 27 is externally fitted on the base end side of the objective lens frame 28, and the solid-state imaging device 22 is connected to the objective optical system unit 23 via the CCD holder 27.
Is held in.

Specifically, a cover glass 26 facing the objective lens group 24 is held on the inner periphery of the CCD holder 27.

A CCD 25 is attached to the base end surface of the cover glass 26. This CCD 25
Is provided with a CCD chip 25a, and the CCD chip 25a is attached to the cover glass 26 via a cover glass 25b attached to the front surface.

A bump 25e as a contact is provided on a part of the front surface of the CCD chip 25a, and the CCD chip 25a is connected to the circuit board 25c via the bump 25e.

The circuit board 25c has a so-called TAB structure and includes a polyimide base 25f and a conductor pattern 25d made of copper foil provided on the polyimide base 25f. A part of the conductor pattern 25d extends from the end of the polyimide base material 25f near the bump 25e, and the extended conductor pattern 25d is joined to the bump 25e to form the CCD chip 25d.
The transmission and reception of a signal with a are performed. Also,
The periphery of the joint between the conductor pattern 25d and the bump 25e is sealed with a sealing resin 25g.

A land (not shown) is provided on the circuit board 25c, and an IC for amplifying an output signal from the CCD chip 25a, a capacitor for canceling noise, a resistor for securing impedance matching, and the like are provided. Electronic component 29 is mounted. The IC, the capacitor and the resistor may be built in the CCD chip 25a in advance.

The CCU is provided on the circuit board 25c.
(Camera control unit) and the like are connected with a CCD cable 30 for transmitting and receiving signals. The CCD cable 30 includes, for example, a coaxial signal line 39 for transmitting a drive signal to 25a, a coaxial signal line 40 for transmitting an output signal from the CCD chip 25a to a processor (not shown), and a drive for driving the CCD chip 25a. These signal lines extend from the end of the CCD cable 30 and are connected to the circuit board 25c. Here, the outer conductor group 42 of the plurality of coaxial signal lines is connected to the GND potential wired from the CCD chip 25a. As shown in the figure, when the size of the solid-state imaging device 22 is reduced and it is difficult to provide a plurality of signal line connection lands on the circuit board 25c, the signal lines are placed on the electrodes of the electronic component 29. Is arranged. The CCD cable 30
A more detailed configuration will be described later.

A shield member 32 is externally fitted to the CCD holder 27. This shield member 32
Is extended near the end of the CCD cable 30 to suppress unnecessary radiation and covers the outer periphery of the CCD 25.
It is electrically connected to a GND line (not shown) of the CD 25.

The inner periphery of the shield member 32 and the outer periphery from the base of the CCD holder 27 to the CCD 25 are provided to prevent the CCD 25 from contacting the shield member 32 and being short-circuited to the GND potential. , The insulating member 31 is covered.

Further, on the outer periphery of the shield member 32,
A covering member 34 is provided. This covering member 34
From the tip of the CCD holder 27 to the CCD cable 30
The entire solid-state imaging device 22 is covered and sealed over the tip of the CCD.
5. The filler 33 is filled around the circuit board 25c, each signal line, and the like. The filler 33 may be, for example, an epoxy or silicone adhesive.

Here, in the solid-state imaging device 22 configured as described above, the CCD holder 27 is fitted and fixed to the objective lens frame 28 in a state where the focus is performed between the objective lens group 24 and the CCD chip 25a. Then, it is fixed to the objective optical system unit 23. When the objective lens frame 28 and the CCD holder 27 are fixed, for example, an epoxy-based adhesive is used.

A bending first frame 37 constituting a bending tube (not shown) is connected to the base end side of the distal end frame 35.

On the front side of the front end frame 35, a front end cover 36 made of resin is provided.
A rubber covering member 38 is provided on the outer periphery of the curved first frame 37 and the distal end portion 12 is sealed.

In such an electronic endoscope 2, CC
Various signals are exchanged between the CCD 25 and the processor via the CCD cable 30 in order to drive the D25. In particular, as signals for driving the CCD 25, there are a horizontal transfer pulse, a vertical transfer pulse, and a drive power supply. In particular, the drive frequency of the horizontal transfer pulse is as high as several MHz to several tens of MHz. Therefore, it is known that the cause of the radiation noise of the electronic endoscope 2 is mainly the horizontal transfer pulse signal, which is emitted from the signal line transmitting the horizontal transfer pulse signal.

Next, the configuration of the CCD cable 30 applied to the electronic endoscope 2 and suitable for transmitting a horizontal transfer pulse signal will be described in detail with reference to FIGS. As shown in FIG. 3, the CCD cable 30 includes a coaxial signal line 39 transmitting a horizontal transfer pulse, a vertical transfer pulse having a relatively low driving frequency, and a coaxial signal line 40 transmitting an output signal from the CCD. It mainly comprises a group of twisted signal lines consisting of a simple signal line 41 for transmitting a driving power source for a CCD and a hybrid IC and a coaxial signal line 43 for transmitting another signal such as a vertical transfer pulse having a relatively low driving frequency. I have.

At the twist center of these signal lines, an intervening member 30d made of, for example, a cotton thread or an elastic body is provided.

A protective tape 30c made of, for example, a Teflon-based tape is wound around the outer periphery of the stranded wire group.

On the outer periphery of the protective tape 30c,
A shield 30b is provided to cover the entire stranded wire group and to suppress unnecessary radiation or prevent intrusion of radiated noise from other sources.

Further, a sheath 30a made of Teflon is provided on the outer circumference of the protective tape 30c which is the outermost circumference of the CCD cable 30.

As shown in FIG.
Has an inner conductor 39a at the center thereof,
An insulator 39 made of, for example, Teflon is provided on the outer periphery of 9a.
b is coated.

A first outer conductor 39c is provided on the outer periphery of the insulator 39b.
A second outer conductor 39d is provided on the outer periphery of 9c.

Here, the first outer conductor 39c is composed of a stranded wire obtained by twisting about 20 copper alloy wires having a wire diameter of 0.03 mm, and is wound horizontally around the outer periphery of the insulator 39b. ing. The copper alloy wire is subjected to, for example, tin plating. When the conductor resistance of the first external conductor 39c is to be kept low, silver plating may be performed instead of tin plating.

The second outer conductor 39d is formed by depositing a metal having a low conductor resistance on a polyester tape as a base material so that the outer periphery of the first outer conductor 39c is completely or overlapped. It is wound.
Copper or aluminum is applied as the metal to be deposited. Such metal deposition may be performed on both sides of the polyester substrate, or may be performed on one side depending on the level of radiation noise. When the second outer conductor 39d is formed by depositing metal on only one side of the polyester tape, the second outer conductor 39d is wound with the metal deposition surface in close contact with the first outer conductor. Is done.

Further, an insulator 39e made of, for example, Teflon is provided on the outer periphery of the second outer conductor 39d.

The coaxial signal line 40 for transmitting the vertical transfer pulse and the output signal from the CCD is connected to the second external conductor 39.
d, except that the coaxial signal line 3 is not provided.
The configuration is substantially the same as that of FIG. In addition, the simple signal line 41
Has a configuration in which the outer periphery of the internal conductor is covered with an insulator.

According to such an embodiment, the coaxial signal line 39 transmitting the horizontal transfer pulse having a high driving frequency is
By providing the heavy shield, it is possible to suppress radiation noise radiated from the internal conductor 39a when transmitting a horizontal transfer pulse.

Further, since the shield 30b is provided on the outer periphery of the twisted wire group in which a plurality of signal lines including the coaxial signal line 39 are twisted and bundled to constitute the CCD cable 30, noise radiated from the coaxial signal line 39 is provided. Can be suppressed more reliably.

The first outer conductor 39c is wound around the outer periphery of the insulator 39b in a horizontal winding.
The outer conductor 39c is superimposed at the time of winding so that the coaxial signal line 39
Can be prevented from increasing in diameter.

The second outer conductor 39d is formed by depositing a metal on a polyester tape.
Of the outer conductor 39d can be formed to be thin.
The increase in the diameter of the coaxial signal line 39 due to the provision of the heavy shield can be minimized.

Next, FIG. 5 shows a modification of the above-described embodiment according to the present invention, and FIG. 5 is a sectional view showing a main part of a CCD cable. The endoscope device of this modification differs from the above-described embodiment in the structure of the CCD cable. Note that the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted.

At the center of the CCD cable 44 in this modification, a first coaxial signal line 39 for transmitting a horizontal transfer pulse, which is a high-frequency drive signal, is twisted and bundled.
The stranded wire group 44e is disposed.

An intervening member 44h is provided on the outer periphery of the first strand group 44e, and a first shield body 44d is provided on the outer periphery of the intervening member 44h.

A coaxial signal line 40 for transmitting an output signal from the CCD is provided on the outer periphery of the first shield body 44d.
A simple signal line 41 for transmitting a CCD and hybrid IC driving power supply, a coaxial signal line 43 for transmitting other signals such as a vertical transfer pulse having a relatively low driving frequency, and a linearly formed intervening member 44g. A second stranded wire group 44f configured by being stranded is provided. The intervening member 44g may be omitted when the inner diameter of the second stranded wire group 44f has a predetermined inner diameter.

A protective tape 44c made of Teflon is spirally wound around the outer periphery of the second stranded wire group 44f.

A second shield 44b is provided on the outer periphery of the protective tape 44c, and a sheath 44a made of Teflon is provided on the outer periphery of the second shield 44b.

According to such a modification, the coaxial signal line 3 transmitting the horizontal transfer pulse, which is a source of large noise,
9 and the outer periphery of the coaxial signal line 39 is connected to the first shield body 44d, the second stranded wire group 44f, and the second
Of the coaxial signal line 39
Therefore, the effect of shielding radiation noise generated from the radiation can be improved, and the level of unnecessary radiation can be more effectively reduced.

[Supplementary Note] (Additional 1-1) In an endoscope apparatus having a solid-state imaging device and a cable for transmitting input / output signals to and from the solid-state imaging device, a plurality of signal lines constituting the cable are provided. Of these, the signal line for transmitting a high-frequency signal is constituted by a coaxial signal line, and the outer conductor of the present coaxial signal line is a double shield body comprising a first outer conductor and a second outer conductor. Endoscope device.

(Supplementary Note 1-2) In the double shield body, the first outer conductor forming the first shield is formed of a horizontally wound copper alloy wire, and the second outer conductor forming the second outer conductor is formed. The endoscope device according to attachment 1-1, wherein the outer conductor is formed by depositing a metal having high conductivity on a polyester base material.

(Supplementary Note 1-3) The endoscope apparatus according to Supplementary Note 1-1, wherein the signal line having the double shield body is a signal line for transmitting at least a horizontal transfer pulse signal.

(Supplementary Note 1-4) The cable for transmitting input / output signals to / from the solid-state image pickup device covers at least the outer periphery of a plurality of signal lines including the signal line for transmitting a high-frequency signal, and blocks noise. The endoscope device according to any one of supplementary notes 1-1 to 1-3, further comprising a shield body.

(Supplementary Note 1-5) The cable for transmitting input / output signals to / from the solid-state image sensor includes a plurality of signal lines including the signal line for transmitting at least a high-frequency signal disposed at the center of the cable. A first stranded wire group formed by twisting and bundling a first stranded wire group, a first shield body that covers the outer periphery of the first stranded wire group and blocks noise, A second stranded wire group formed by twisting and bundling signal wires other than the stranded wire group described above, and a second shield body that covers the outer periphery of the second stranded wire group and blocks noise. The endoscope apparatus according to any one of supplementary notes 1-1 to 1-3, characterized in that:

Incidentally, in an electronic endoscope having a solid-state image pickup device disposed at the distal end, the solid-state image pickup device comprises a solid-state image pickup device and a circuit board on which electronic components are mounted. The image sensor is connected to a CCD cable via a circuit board, and signals are exchanged with the control device via the CCD cable. In such a case, the solid-state imaging device, the circuit board, and the CCD cable are serially arranged along the longitudinal direction of the insertion section and connected to each other.

However, when the above members are serially connected along the longitudinal direction of the insertion portion, the length of the distal end portion is lengthened. Further, when the above members are serially connected, it is difficult to partially replace the constituent members when a part of the members constituting the solid-state imaging device fails.

In view of the above problems, an endoscope device in which the length of the distal end portion is shortened and the component members of the solid-state imaging device can be easily exchanged will be described.

FIG. 6 relates to an embodiment of an endoscope apparatus in which the length of the distal end portion can be shortened and the components of the solid-state imaging device can be easily exchanged. FIG. It is principal part sectional drawing of the front-end | tip part of a mirror.

Reference numeral 12A in the figure denotes a distal end of an electronic endoscope constituting the endoscope apparatus. The distal end portion 12A includes an objective optical system unit 46 and a solid-state imaging device 45 disposed behind the objective optical system unit 46.

The objective optical system unit 46 includes an objective lens group 57 composed of a plurality of lenses,
And an objective lens frame 58 that holds the lens 7 inside. The objective lens frame 58 is held by the distal end portion 12A by being fitted to the distal end frame 56.

Further, a CCD holder 49 is externally fitted to the base end of the objective lens frame 58 facing the inside of the distal end frame 56, and the solid-state imaging device 45 is connected to the objective optical system unit via the CCD holder 49. 46.

Specifically, a cover glass 48 facing the objective lens group 57 is held on the inner periphery of the CCD holder 49.

A solid-state image pickup device (hereinafter, referred to as a CCD) 47 is attached to the base end surface of the cover glass 48. Here, the CCD 47 is disposed so as to be substantially stored in the distal end frame 56, and only the leads 47 a provided on the base end surface of the CCD 47 are exposed outside the distal end frame 56.

A first circuit board 50 is provided on the lead 47a. This first circuit board 50
Is composed of, for example, a flexible substrate in which a copper foil pattern 50a is laminated on a polyimide base material. The first circuit board 50 is provided with a lead connection hole 50b into which the lead 47 can be inserted.
7 is inserted and fixed with solder or the like, so that the first
The circuit board 50 of FIG.
Signals are exchanged between the CD 47 and the first circuit board 50. A land (not shown) is provided on the first circuit board 50, and a CCD 47 is provided.
An electronic component 51 including an IC for amplifying an output signal from the IC, a capacitor for canceling noise, a resistor for ensuring impedance matching, and the like is mounted.
The IC, the capacitor, and the resistor may be built in the CCD 47 in advance. Here, the first circuit board 50 has its board surface disposed in parallel with the base end face of the CCD 47, and only one end of the first circuit board 50 faces the front end side of the front end portion 12A. And is bent in an L-shape. The pattern 50a extends from the polyimide base material from the tip of the bent one end of the first circuit board 50.

A second circuit board 52 made of the same material as the first circuit board 50 is provided on the base end side of the front end frame 56. This second circuit board 5
2 is substantially L-shaped, one end of the second circuit board 52 is disposed along the periphery of the end frame 56, and the end of the pattern 50 a extends from the first circuit board 50. It is facing. That is, one end of the second circuit board 52 is formed in an arc shape along the periphery of the end frame 56. A land (not shown) is provided at one end of the second circuit board 52, and the pattern 50a is soldered to the land, for example.
And the second circuit board 52 are connected. On the other hand, the other end of the second land is disposed so as to protrude from the base end of the end frame 56, and a land 52a is provided near the end. A CCD cable 53 is connected to the land 52a.
Are connected by soldering or the like.

Reference numeral 55 in the figure denotes a light guide for transmitting illumination light from a light source device (not shown).

According to such an embodiment, the following operations and effects are obtained. A circuit board interposed between the CCD 47 and the CCD cable 53 is composed of a first circuit board 50 and a second circuit board 52, and the first circuit board 50 is parallel to the base end face of the CCD 47. And the second circuit board 52 is arranged along the edge of the end frame 56, so that the space in the longitudinal direction for providing the circuit board can be shortened, and the tip 12A of the electronic endoscope can be shortened. Can be shortened.

Also, for the rigid length of the electronic endoscope, a CCD
Since the fixed portion of the cable 53 can be arranged on the front side, the strength of the fixed portion of the CCD cable 53 can be secured.

While the first circuit board 50 is connected to the CCD 47, the second circuit board 5 is connected to the CCD cable 53.
2 and the CCD 47 and the CCD cable 53 are connected via the first and second circuit boards 50 and 53, so that the CCD 47 and the CCD cable 53 can be separately repaired, and the repairability and the like are improved. Serviceability is improved.

In this embodiment, an example is shown in which the shape of one end of the second circuit board 52 is formed in an arc shape.
However, the present invention is not limited to this.

By the way, in an electronic endoscope having a solid-state imaging device disposed at the tip, the solid-state imaging device is configured to include a solid-state imaging device and a circuit board on which electronic components are mounted. The imaging element is connected to a CCD cable via a circuit board, and signals are exchanged with a control device via the CCD cable. In such a solid-state imaging device, the connection between the circuit board and the signal line of the CCD cable is generally performed by soldering or the like.

However, in the above-mentioned endoscope apparatus,
The bending and pulling of the CCD cable due to the bending operation of the bending portion and the like occur, so that the connection between the CCD cable and the circuit board may be disconnected. To cope with this, if the strength of the connecting portion between the CCD cable and the circuit board is improved, it is difficult to reduce the size of the connecting portion. In view of the above problems, an endoscope apparatus capable of improving the connection strength of the CCD cable connection will be described.

FIGS. 7 to 9 show a first embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connection portion. FIG. 7 is a sectional view of a main part of a solid-state imaging device.
FIG. 8 is a bottom view near the circuit board in FIG. 7, and FIG. 9 is a developed view of the cable holding member.

In FIG. 7, reference numeral 60 denotes a solid-state image pickup device.
It is externally fitted to the objective optical system unit 69 via the CD holder 61d. Here, the CCD holder 61d is fitted to the objective optical system unit 69 in a state where a solid-state image pickup device (hereinafter referred to as CCD) 61, which will be described later, is focused on the objective optical system unit 69. It is fixed via an adhesive.

A cover glass 61c is fitted and fixed to the inner periphery of the CCD holder 61d.
The above-mentioned CCD 61 is adhered to the base end face of.

The CCD 61 has leads 61a and 61a.
b, which extend to the proximal end of the endoscope.

The lead 61a is connected to the CCD cable 6
5 are connected by solder or the like, and a signal for driving the CCD 61 is transmitted.

On the other hand, a circuit board 62 is connected and fixed to the leads 61b with solder or the like.

On the circuit board 62, an IC 63 for amplifying an output signal from the CCD 61 and other electronic components 64 are mounted. Further, a land (not shown) is provided on the circuit board 62, and another signal line 65a constituting the CCD cable 65 is connected via the land. For example, the signal line 65a transmits an output signal from the CCD 61 to the video processor 5.

Here, the CCD cable 65 is provided with a cable holding member 66 for improving the connection strength of each signal line.
And is fixed to the circuit board 62 via the.

More specifically, as shown in FIG. 9, the cable holding member 66 includes a board holding portion 66a that can be narrowly attached to the left and right sides of the circuit board 62, and a cable holding portion that can be wound around the CCD cable 65. 66b.

As shown in FIGS. 7 and 8, the cable holding member 66 is interposed between the circuit board 62 and the CCD cable 65, and the board holding portion 66a is bent toward the circuit board 62 to form the circuit board 62. And the cable holding portion 66b is bent toward the CCD cable 65 and the CCD cable 65 is wound thereon, thereby fixing the CCD cable 65 to the circuit board 62.

Further, a shield member 67 is provided on the outer periphery of the electrical component around the CCD 61 and the circuit board 62, and a covering member 68 is provided on the outer periphery of the shield member 67.

According to such an embodiment, the CCD cable 65 is connected to the circuit board 6 via the cable holding member 66.
2, the fixing strength of the CCD cable 65 can be improved. Therefore, the movement of each signal line at the time of bending the endoscope can be restricted, and disconnection of the CCD cable 65 can be reduced.

Next, FIG. 10 shows a second embodiment of the endoscope apparatus capable of improving the connection strength of the CCD cable connecting portion, and FIG. 10 is a sectional view of a main part of the solid-state imaging device. is there.

In FIG. 10, reference numeral 70 denotes a solid-state image pickup device. The solid-state image pickup device 70 is externally fitted to the objective optical system unit 71 via a CCD holder 79 provided at the tip. Here, the CCD holder 79 is fitted to the objective optical system unit 71 in a state where a solid-state imaging device (hereinafter referred to as a CCD) 72 described later is focused on the objective optical system unit 71, and for example, an epoxy-based It is fixed via an adhesive.

A cover glass 78 is fitted and fixed to the inner periphery of the CCD holder 79, and the CCD 72 is attached to a base end surface of the cover glass 78.

The CCD 72 has leads 72a and 72a.
b, which extend to the proximal end of the endoscope.

A CCD cable 7 is connected to the lead 72a.
4 are connected by solder or the like, and a signal for driving, for example, the CCD 72 is transmitted by the signal line 74a.

On the other hand, the lead 72b is, for example, a CCD 7
2 is transmitted, and the lead 72
b, an IC for amplifying the output signal from the CCD 72
Are mounted and fixed by soldering or the like.

A land (not shown) is provided on the circuit board 73, and another signal line 74b constituting the CCD cable 74 is connected to the land.

At the base end of the CCD holder 79, a shield member 75 is fitted. More specifically, the shield member 75 mainly covers the outer periphery of the CCD 72 and the circuit board 73 in order to suppress unnecessary radiation of noise, and is formed as a substantially cylindrical member having a cable insertion hole 75a at the bottom. . Then, the shield member 75
Is held by fitting the open end side to the base end side of the CCD holder 79.

The cable insertion hole 75a has a CC
The D cable 74 is inserted, and the CCD cable 74
Inside the CD holder, it is strongly caulked by a ring-shaped fixing member 76 to prevent the CD holder from falling off.

Further, the CCD cable 74 is fixed to a shield member 75 via a fixing member 77. The fixing member 77 is made of, for example, an epoxy-based adhesive.

According to such an embodiment, since the CCD cable 74 is strongly caulked by the fixing member 76 in the shield member 75 and is fixed by the fixing member 77, the CCD cable 74 is Even if a force such as pulling is applied, the force is absorbed by the fixing member 76 and no stress is applied to the signal lines 74a and 74b in the shield member 75, so that disconnection of the signal line can be reduced.

Next, FIG. 11 shows a third embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connecting portion, and FIG. 11 is a sectional view of a main part of a solid-state imaging device. is there.

[0106] Reference numeral 12B in the figure indicates the distal end of the electronic endoscope constituting the endoscope apparatus. The distal end portion 12B includes an objective optical system unit 81 and a solid-state imaging device 80 disposed behind the objective optical system unit 81.

The objective optical system unit 81 includes the tip 1
It is fitted and held in a tip frame 89 provided on the tip side of 2B.

Further, a CCD holder 84 is externally fitted to the base end side of the objective optical system unit 81, and the solid-state imaging device 80 is held via the CCD holder 84.
Here, the solid-state imaging device 80 is held in a state where a solid-state imaging device (hereinafter, referred to as a CCD) 82, which will be described later, is in focus with the objective optical system unit 81.

Specifically, a cover glass 83 is fitted and held on the inner periphery of the CCD holder 84, and the CCD 82 is attached to a base end surface of the cover glass 83.

The CCD 82 has a lead 8 at its proximal end.
2a and a lead 82b.
A part of a signal line 87a constituting the D cable 87 is connected, while another signal line 87a is connected to the lead 82b via a circuit board 85.

Further, a shield member 86 is externally fitted on the base end side of the CCD holder 84 in order to suppress radiation of unnecessary noise.
And the circuit board 85.

A cable fixing member 90 is attached to the distal end frame 89 and extends toward the base end of the endoscope. Here, the cable fixing member 90 is formed of a plate having a predetermined curvature or a plate having no curvature. Note that the cable fixing member 90 may be fixed in the distal end frame 89 with an adhesive, or may be fixed with a screw (not shown) or the like.

Further, the CCD cable 87 is provided with a fixing member 88 formed in a ring shape, and the fixing member 88 is fixed to the cable fixing member 90.

Further, a curved first piece 92 constituting a curved tube (not shown) is externally fixed to the base end side of the distal end frame 89. Here, the connecting portion 91 between the fixing member 88 and the cable fixing member 90 is configured to fit within the distal end of the curved first top 92.

According to such an embodiment, the CCD cable 87 can be securely fixed, and disconnection and the like can be prevented.

Note that, in such an embodiment, C
An intermediate board may be provided between the CD cable 87 and the circuit board 85. As this substrate, for example, a flexible substrate using polyimide as a base material is used.

That is, in general, an image pickup unit including the CCD 82 and the circuit board 85 is connected to each signal line of a cable to the CCD 82 and the circuit board 85 and the like. Since is hardened with an adhesive, when the cable is disconnected or the like and the solid-state imaging device is repaired (for example, the cable is replaced), an operation of removing the adhesive occurs. This work requires a considerable amount of time, but by connecting the CCD cable 87 and the circuit board 85 via the flexible board, the repair work can be performed only on the flexible board without removing the adhesive. And the number of work steps can be minimized. In other words, the circuit board 85 provided in the solid-state imaging device 80 and C
By interposing the CD cable 87 with a flexible substrate or the like, even if a failure occurs in the solid-state imaging device 80 or the CCD cable 87, the flexible substrate and the C
By disconnecting the CD cable 87, the repair can be minimized, and the repairability of the endoscope is improved.

Next, FIG. 12 shows a fourth embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connection portion. FIG. It is. In this embodiment, the above C
Members similar to those of the third embodiment of the endoscope device capable of improving the connection strength of the CD cable connection portion are denoted by the same reference numerals, and description thereof will be omitted.

A lead 96a extends from the base end side of the CCD 96, and a circuit board 97 is connected and fixed to the lead 96a.

A land (not shown) is provided on the circuit board 97, and a CCD cable 98 is connected to the land. That is, the signal lines 98a constituting the CCD cable 98 extend from the distal end of the CCD cable 98, and the extended plurality of signal lines 98a are connected to lands provided on the circuit board 97.

Further, a plurality of signal lines 98a extending from the CCD cable 98 are provided with a covering member 100 for bundling and covering these signal lines 98a.
Is caulked by a fixing member 101 on the outer periphery. The distal end of the CCD cable 98 is fixed to the fixing member 1.
01 is fixed to the curved first frame 92 by, for example, a solder 102.

Here, the fixing member 101 is a curved first member.
It is fixed inside the frame 92. Although not shown, the outermost sheath of the cable may be peeled off in the entire range of the bending tube, and the signal line group may be arranged in the bending tube.

According to such an embodiment, signal line 9
Since 8a is fixed by the fixing member 101, even when the bending operation is performed, no stress is applied to the distal end more than the fixing member 1O1. Therefore, no stress is applied to the signal line 98a, and disconnection can be prevented.

FIGS. 13 to 16 show a fifth embodiment of the endoscope apparatus capable of improving the connection strength of the CCD cable connection section. FIG. 14 is a cross-sectional view taken along line AA of FIG. 13, FIG. 15 is a perspective view of the circuit board viewed from obliquely above, and FIG. 16 is a perspective view of the circuit board viewed from obliquely below.

In FIG. 13, reference numeral 110 denotes a solid-state image pickup device for an electronic endoscope.
A cover glass 112 affixed to the front surface of 111 and a pair of circuit boards 116 and 117 are provided.

Further, on the upper and lower side surfaces of the CCD 111,
The pattern 113a made of copper foil is a polyimide substrate 113
Circuit board (TAB board) 1 arranged and arranged in b
13 are provided so as to sandwich the CCD 111. The pattern 113a is connected to the CCD 111 via, for example, a bump (not shown), and its end is connected to the CCD 111.
1 is extended to the rear.

As shown in FIGS. 15 and 16, the circuit board 116 is formed in a substantially rectangular shape, and lands 122 corresponding to the patterns 113a are provided on the upper surface of the circuit board 116. Also, on the lower surface of the circuit board 116,
An IC 118 for amplifying an output signal from the CCD 111 and an electronic component 119 are mounted.

A land 121 for cable connection is provided on the front end surface of the circuit board 116. Here, the land 121 has a configuration in which a copper foil is provided in a side through hole provided in the front end surface of the circuit board 116 and solder plating is applied thereon.

The circuit board 117 has substantially the same configuration as the circuit board 116, and has an electronic component 119 on its upper surface.
And a land 122 corresponding to the pattern 113a is provided on the lower surface, and a land 121 for cable connection is provided on the front end surface.

These circuit boards 116 and 117 are the same as those shown in FIG.
As shown in FIG. 7, the lands 122 are arranged in parallel with each other in a state where they are exposed to the outside.
The distal end of the CCD cable 115 is held in the gap. At this time, the CCD cable 115 is placed between the electronic components 119 and the circuit boards 116 and 11
7.

At the tip of the CCD cable 115, a signal line 115 constituting the CCD cable 115 is provided.
a, 115b are extended, and these extended signal lines 115a, 115b are connected to the circuit boards 116, 117, respectively.
(See FIG. 13) by soldering or the like.

The circuit boards 116 and 117 are C
The unit sandwiching the CD cable 115 is inserted into the gap between the patterns 113a while the pattern 113a and the lands 122 are slid, so that connection with the CCD 111 is realized and the unit is held behind the CCD 111.

Further, the CCD 111 is connected to the circuit board 11.
The gap between 6,117 is filled with a filler 120 made of, for example, an epoxy-based adhesive.

According to such an embodiment, since the CCD cable 115 is sandwiched between the circuit boards 116 and 117, the strength of the connection portion of the CCD cable 115 is improved. Also, the CCD cable 115 is connected to the circuit boards 116, 1
17, the CCD cable 115 and the circuit board 11
6 and 117 are connected at the front ends of the circuit boards 116 and 117, the length of the connection portion can be reduced, and the rigid length of the solid-state imaging device 110 can be reduced.

The electronic component 119 uses the CCD cable 1
By arranging them between the positions 15, the CCD cable 115 can be securely fixed.

In an endoscope apparatus provided with an electronic endoscope, the connection between the solid-state image pickup device and a circuit board on which an IC for amplifying a signal from the solid-state image pickup device is mounted.
Generally, it was performed by soldering.

However, connecting the solid-state imaging device and the circuit board by soldering as described above increases the number of man-hours for performing an assembling operation and a repair operation. In view of the above problems, an embodiment of an endoscope apparatus capable of improving the assemblability of a solid-state imaging device and a circuit board will be described.

FIGS. 17 and 18 relate to an embodiment of an endoscope apparatus which can improve the assemblability of the solid-state image sensor and the circuit board. FIG. 17 is an exploded view of the solid-state image sensor and the circuit board. FIG. 18 is a side view showing a state where the solid-state imaging device and the circuit board are connected.

In FIGS. 17 and 18, reference numeral 105 denotes a solid-state image pickup device (hereinafter referred to as CCD), and reference numeral 106 denotes a circuit board.

The CCD 105 is provided with a plurality of leads 105a made of a member having a predetermined elasticity. These leads 105 a are arranged in two rows on the base end face of the CCD 105, whereby the CCD 10
5 are formed on the base end face with lead rows 103 facing each other.

The circuit board 106 has a conductor pattern (not shown) on both sides.
6, an IC 10 for amplifying a signal from the CCD 105
8 and other electronic components 109 are mounted.

A land (not shown) for connecting a cable is provided on the circuit board 106. A plurality of signal lines 107a extending from the CCD cable 107 are provided on the land by soldering or the like. It is connected.

The land 1 corresponding to the lead 105a of the CCD 105 is provided on both sides of the front end of the circuit board 106.
06a is provided.

Here, the gap between the lead rows 103 in which the leads 105 a are arranged is set to be smaller than the substrate pressure of the circuit board 106.

Such a CCD 105 and a circuit board 106
First, the leading end of the circuit board 106 is inserted into the gap between the lead rows 103 in which the lead rows 103 are spread outward (see FIG. 17), and the respective positions of the leads 105a and the lands 106a are set. After the alignment is performed, the alignment is performed by closing the lead row 103 using the elasticity of the lead 105a.

According to such an embodiment, the lead 105a and the land 106a are connected without soldering, so that assembly is easy.

Even if the CCD cable 107 is broken, the circuit board 106 can be pulled out of the CCD 105 and repaired or replaced.
5 can be repaired without affecting the cable 5.

Further, even if bending stress is applied to the solid-state imaging device, the stress can be absorbed by utilizing the elasticity of the lead 105a, so that no stress is applied to the connection portion of the CCD cable 107 and disconnection is prevented. You can do it.

By the way, in an electronic endoscope having a solid-state imaging device provided at the tip, a solid-state imaging device is configured to include a solid-state imaging device and a circuit board on which electronic components are mounted. The image sensor is connected to a CCD cable via a circuit board, and signals are exchanged with the control device via the CCD cable. In such a case, the solid-state imaging device, the circuit board, and the CCD cable are serially arranged and connected along the longitudinal direction of the insertion section.

However, when each of the above members is serially connected along the longitudinal direction of the insertion portion, the length of the distal end portion is lengthened. In view of the above problems, an endoscope apparatus capable of reducing the length of the distal end will be described.

FIGS. 19 to 22 relate to an embodiment of an endoscope apparatus in which the length of the distal end portion can be shortened. FIG. 2
0 is a sectional view of a main part of the solid-state imaging device, FIG. 21 is an explanatory diagram showing another contact configuration, and FIG. 22 is an explanatory diagram showing still another contact configuration.

In FIG. 20, reference numeral 125 denotes a solid-state imaging device of an electronic endoscope. The solid-state imaging device 125 includes a solid-state imaging device (hereinafter, referred to as a CCD) 126 and a CCD.
And a CCD holding substrate 127 disposed behind the CCD 126. The CCD holding substrate 127
Cable 132 is connected.

Specifically, the CCD 126
Is provided with a lead 126a on the base end surface, and the lead 126a extends rearward.

The CCD holding substrate 127 is formed of a short cylindrical member having an open rear, and the inner periphery thereof has
A pattern 128 made of copper foil is provided. A lead 1 is provided on the tip end surface of the CCD holding substrate 127.
A lead insertion hole 129 into which 26a can be inserted is provided. On the other hand, the inside of the short cylinder of the CCD holding substrate 127 is C
The distal end of the CD cable 132 is formed as a cable fixing portion 130 that can be inserted.

The CCD 126 is connected to the lead 12
6a is held in the CCD holding substrate 127 by being inserted into the lead insertion hole 129 of the CCD holding substrate 127 and soldered to the pattern 128.

The CCD cable 132 is connected to a plurality of simple signal lines 1 arranged along the inner periphery of the outer sheath 132a.
33 (see FIG. 19A). Also,
At the end of the simple signal line 133, a signal line core 133a
A conductive pin 134 is provided, which is connected to the outer surface 132 a of the CCD cable 132.
It is arranged to protrude from.

Here, the conductive pins 134 protruding from the outer cover 132a and the patterns 128 provided on the inner periphery of the CCD holding substrate 127 are provided at corresponding positions 136, respectively.

The CCD cable 132 is connected to the conductive pin 1
With the position of the CCD cable 132 aligned with the pattern 128, the tip of the CCD cable 132 is
By being inserted into the CCD 30, it is electrically connected to the CCD 126. At this time, the CCD holding substrate 127 and C
An insulating member 131 for preventing a short circuit between the conductive pin 134 and the lead 126a is provided between the insulating member 131 and the CD cable 132.
Is interposed.

Here, as shown in FIG.
6 is connected to the CCD cable 132 by a pattern 139 provided on the outer peripheral surface of the CCD fixed substrate 127 instead of the pattern 128 provided on the CCD fixed substrate 127 and bent forward from the base end of the CCD fixed substrate 127. Conductive pin 13
4 may be connected and fixed to the pattern 128 by the solder fixing portion 141.

Further, as shown in FIG. 22, when the CCD cable 132 connected to the solid-state imaging device 125 has a coaxial signal line 144,
An insulating portion 143 for preventing a short circuit between the shield member 144b of the coaxial signal line 144 and the conductive pin 142 is provided in the middle of the conductive pin 142 connected to the 44 core wires 144a.

According to such an embodiment, the connection between the CCD and the CCD cable is performed by connecting the conductive pins protruding from the outer periphery of the CCD cable and the pattern provided on the CCD holding substrate to the side of the end of the CCD cable. Since the connection is performed by the connection, the rigid length can be reduced.

The CCD 126 and the CCD cable 13
Since the respective units may be assembled before the connection with the device 2, the assemblability of the entire solid-state imaging device 125 can be improved.

By the way, generally, as shown in FIG. 23 (b), the distal end portion 150 of the electronic endoscope through which a treatment tool such as a cannula can be inserted is inserted as shown in FIG. 23 (b). A flexible treatment instrument channel 154 is provided adjacent to a solid-state imaging device (hereinafter, referred to as a CCD) 151. Here, reference numeral 152 in the figure denotes a light-receiving unit capable of capturing an image in the CCD 151, and reference numeral 153 denotes a light-shielding unit (OB unit: optical black unit) of the CCD 151.

However, in such an electronic endoscope, when a metal-made treatment tool such as a cannula or the like having a high reflectance is inserted into the treatment tool channel 154, the illumination emitted from an illumination window (not shown) is provided at the distal end portion 150. Some of the light
In some cases, a defect such as flare occurs on an image captured by being reflected by the treatment tool and incident on the CCD 151.
In response to this, the CCD 151 and the treatment instrument channel 154
If the distance from the endoscope is increased, the above-mentioned problem is solved, but it causes the end of the endoscope to have a large diameter. In view of the above circumstances, an endoscope apparatus that can reduce problems such as flare without increasing the diameter of the distal end will be described.

FIG. 24 shows an embodiment of an endoscope apparatus capable of reducing problems such as flare without increasing the diameter of the end portion of the endoscope, and FIG. 24B is a layout diagram illustrating a main part of a distal end portion of the electronic endoscope, FIG. 24B is an explanatory diagram illustrating an example of an image captured by the electronic endoscope illustrated in FIG. 24A, and FIG. FIG. 24D is a layout diagram illustrating a main part of the distal end of the electronic endoscope for the lower gastrointestinal tract, and FIG. 24D is an explanatory diagram illustrating an example of an image captured by the electronic endoscope illustrated in FIG. is there.

In FIG. 24A, reference numeral 150 denotes a distal end portion of the electronic endoscope. The distal end portion 150 is a CC having a light-shielding portion 153 provided on one side of a light-receiving portion 152 capable of capturing an image.
D151 and a treatment tool channel 154 adjacent to the CCD 151 and through which a treatment tool (not shown) can be inserted.

The CCD 151 is connected to the treatment instrument channel 1
A light-shielding portion 153 disposed closer to the light-emitting portion 54;
3 and a light receiving unit 152 adjacent to the light receiving unit 152.

In the endoscope apparatus provided with such an electronic endoscope, when used, a metal treatment tool 155 having a high reflectance is inserted into the treatment tool channel 154 and protrudes from the endoscope tip 150. I do. At that time, the treatment tool is irradiated with illumination light from an illumination window (not shown), and a part of the illumination light is reflected toward the distal end 150.

At this time, since the light shielding portion 153 is interposed between the light receiving portion 152 and the treatment instrument channel 154, the light receiving portion 152 can be positioned farther from the treatment instrument channel 154 by the width of the light shielding portion 153. Accordingly, a large amount of unnecessary light can be prevented from entering the light receiving section 152, so that problems such as flare can be reduced (FIG. 24).
(B)). Therefore, problems such as flare can be reduced without increasing the diameter of the tip.

As shown in FIGS. 24C and 24D,
The same function and effect can be obtained also in the distal end portion of the lower gastrointestinal tract electronic endoscope by adopting the same layout as that of the above-mentioned upper gastrointestinal tract electronic endoscope distal end portion.

[0171] Generally, the conventional endoscope is inconvenient to carry because it is necessary to connect a universal cord to the light source. To cope with this, for example, there is a technique disclosed in Japanese Patent Application No. 8-280612.

However, in the above prior art,
Since the lamp (illumination light supply unit) is configured to be detachable from the endoscope operation unit, the unit may be carelessly handled when the unit is removed, and the lamp may be damaged. That is,
When attaching / detaching the illumination light supply unit, the operation of pulling out the operation unit or the like is performed and a large stress is applied. At this time, there is a risk that an operator or the like may carelessly touch the lamp and damage the lamp. Was. Therefore, an endoscope apparatus capable of preventing damage to the lamp will be described.

FIG. 25 relates to an embodiment of the endoscope apparatus capable of preventing the lamp from being damaged, and is an explanatory view of the vicinity of the operation section of the endoscope.

An illumination lamp 156 is provided inside the operation unit 161 of the endoscope 160. This lighting lamp 15
6 is provided with a lead 163, which extends to the side of the operation unit 161.

A power supply unit 158 derived from a power source (not shown) is provided on the side of the operation unit 161.
The operation unit 161 is provided detachably. Specifically, a socket 162 is provided at the tip of the power supply unit 158, and the socket 162 and the lead 163 are detachably connected.

In the operation section 161, there is provided a reflecting mirror 157 for reflecting the illumination light emitted from the illumination lamp 156 toward the distal end of the endoscope 160. The light emitted from the illumination lamp 156 is reflected by the reflecting mirror 157, enters the light guide fiber 159, and emits light from the end of the endoscope 160.

According to such an embodiment, since the power supply unit is detachable from the operation unit, the endoscope can be easily carried.

In addition, since the lamp is provided in the operation section, it is possible to prevent the lamp from being accidentally damaged when the power supply unit is attached or detached.

Incidentally, conventionally, in an electronic endoscope,
Some endoscopes have a plurality of objective optical systems in order to obtain a plurality of different captured images simultaneously with the same endoscope. In such a case, the electronic endoscope generally has a plurality of different solid-state imaging devices, and these solid-state imaging devices are configured to form images on different objective optical systems.

However, when a plurality of solid-state imaging devices are provided in the same electronic endoscope, the outer diameter of the insertion portion tends to increase. In view of the above circumstances, an endoscope apparatus that can simultaneously configure a plurality of observation units using a single solid-state imaging device will be described.

FIGS. 26 and 27 relate to a first embodiment of an endoscope apparatus in which a plurality of observation means 2 can be simultaneously formed by using a single solid-state imaging device. FIG. FIG. 27 is a sectional view of a main part of the distal end portion of the mirror, and FIG. 27 is an explanatory diagram of an image on a monitor.

In FIG. 26, reference numeral 165 indicates a distal end of an electronic endoscope constituting the endoscope apparatus. This tip 16
5 includes a single solid-state imaging device (hereinafter referred to as CCD) 16
The CCD 166 is provided with an objective lens group 167 at the front end thereof.

Further, two end surfaces inclined in different directions with respect to the longitudinal direction of the endoscope are provided on the end surface of the end portion 165 of the electronic endoscope. One observation window 171 is arranged, and a second observation window 172 is arranged on the other inclined surface.

Further, a first liquid crystal shutter 169 is provided behind the first observation window 171, while a second liquid crystal shutter 169 is provided.
A second liquid crystal shutter 170 is provided in the observation window 172 of the first embodiment.

Here, the first and second liquid crystal shutters 1
Reference numerals 69 and 170 are connected to a processor processing system (not shown) via signal lines (not shown), respectively, so that incident light from the first and second observation windows is controlled to be transmitted and cut off by the processor processing system. Has become.

The first and second liquid crystal shutters 169, 1
Behind 70, a prism 168 is provided. The prism 168 has one incident surface connected to the first liquid crystal shutter 169, the second incident surface connected to the second liquid crystal shutter 170, and the light incident from these incident surfaces. The exit surface is disposed at a position facing the distal end side of the objective lens group 167.

That is, the light incident from the first observation window 171 is transmitted to the first liquid crystal shutter 169 and the prism 1
68, the light enters the objective lens group 167, and the CCD 16
6 is formed. The light incident from the second observation window 172 is transmitted to the second liquid crystal shutter 1.
70, the light enters the objective lens group 167 via the prism 168, and is imaged on the CCD 166. In other words, the first observation window 171 and the first liquid crystal shutter 1
69, prism 168, objective lens group 167, CCD1
66 constitutes an observation means, a second observation window 172, a second liquid crystal shutter 170, a prism 16
8, other objective means are constituted by the objective lens group 167 and the CCD 166.

An illumination window 174 is provided near the first observation window 171 for irradiating an object to be observed through the first observation window 171 with illumination light, and further behind the illumination window 174. Is provided with a first light guide 175 which is continuous with a lens constituting the illumination window 174. Similarly, a second illumination window 176 is provided near the second observation window 172, and a second light guide 177 is provided continuously to the second illumination window 176.

At the base end of the CCD 166, CCD leads 166a and 166b are provided. These CC
CCD cables 173 are connected to the D leads 166a and 166b.
Are connected to the signal lines 173a and 173b. Here, the signal lines 173a and 173b are CCD1
66 is a signal line for transmitting an output signal from the
73a transmits an even line signal among the field signals output from the CCD 166, and the signal line 173b transmits the CC signal.
An odd-numbered line signal among the field signals output from D166 is transmitted.

These signal lines 173a and 173b are connected to a monitor 178 via a processor processing system (not shown). The monitor 178 is configured as a monitor that can simultaneously display two different images.
The image based on the image signal transmitted from the signal line 173a is displayed on a, and the image based on the image signal transmitted from the signal line 173b is displayed on the other screen 178b.

That is, the first liquid crystal lens 169 transmits the light to the objective lens system 167 in synchronization with the transmission of the output signal of the signal line 173a, and synchronizes with the output signal of the signal line 173b. A state of blocking light to the lens system 167 has been created. On the other hand, the second liquid crystal shutter 1
Reference numeral 70 denotes a state in which light to the objective lens system 167 is blocked in synchronization with the transmission of the output signal of the signal line 173a;
A state in which light is transmitted to the objective lens system 167 in synchronization with the transmission of the output signal of 3b is created.

More specifically, the first and second liquid crystal shutters 169 and 170 shield light beams incident from the first and second observation windows 171 and 172 in synchronization with an output signal from the CCD 166. Has the function of transmitting light, usually CCD
When the output signal from the 166 is output to the monitor 178 through the processor processing system, the odd scanning lines on the monitor are scanned at 1/30 SEC (first field signal), and the next 1/30 SEC (second field signal) is scanned. An even line is scanned by a field signal), and one image is constituted by a total of 1/60 SEC.

With this configuration, a single objective lens system 167 is used to configure two observation optical systems, and a single CCD 166 is used to display images from the two observation optical systems on the monitor 178. Can be displayed.

According to such an embodiment, two different
Two visual fields can be observed simultaneously using a single objective lens system and a CCD, and the diameter of the tip can be reduced.

Further, since the transmission and blocking control of the incident light entering from the first and second observation windows is performed by the liquid crystal shutter, a mechanical shutter mechanism is not required, and the tip portion can be reduced in size. I can do things.

Next, FIGS. 28 and 29 relate to a second embodiment of an endoscope apparatus which can simultaneously constitute a plurality of observation means using a single solid-state imaging device. FIG. 29 is a cross-sectional view of a main part of a distal end portion of the electronic endoscope. FIG. 29 is an explanatory diagram of an image on a monitor.

In FIG. 28, reference numeral 180 indicates a distal end portion of an electronic endoscope constituting the endoscope apparatus. This tip 18
0, a solid-state imaging device (hereinafter, referred to as a CCD) 181 is provided, and an objective lens unit 182 is provided at a tip side of the CCD 181.

The objective lens unit 182 includes an objective lens frame 183. The objective lens frame 183 is provided with an objective lens group 184 and the objective lens group 183.
A liquid crystal lens 185 is provided immediately after 4 to form a main part.

Here, the liquid crystal lens 185 is connected to a processor processing system (not shown) via a signal line (not shown), so that two modes of normal observation and magnified observation can be selected by this processor processing system. The liquid crystal operates. That is, the liquid crystal lens 185 enables a change in the optical path length of the objective optical system and a change in the observation depth.

A first lead 181a and a second lead 181b extend from the base end of the CCD 181. A CCD cable 18 is connected to the first lead 181a.
6 is connected to the first signal line 186a, and the second lead 181b is connected to a second signal line 186b forming the CCD cable 186. Here, the signal line 186a transmits an odd-numbered line of the field signal of the output signal output from the CCD 181, and the signal line 186b transmits an even-numbered line.

These signal lines 186a and 186b are connected to a monitor 187 via a processor processing system (not shown). The monitor 187 is configured as a monitor that can simultaneously display two different images, and has one screen 188.
An image based on the image signal transmitted from the signal line 186a is displayed on the screen 189, and the signal line 18 is displayed on the other screen 189.
An image based on the image signal transmitted from the display device 6b is displayed.

That is, the liquid crystal lens 185 is operated by the processor processing system, and performs normal observation in synchronization with transmission of the CCD output signal from the signal line 186a, while transmitting the CCD output signal from the signal line 186b. It is set so that magnified observation is performed in synchronization with the operation.

According to such an embodiment, since a liquid crystal lens is used, a mechanical zoom mechanism becomes unnecessary, and the hard length can be reduced.

Further, since a part of the normal observation screen is always enlarged on the monitor, diagnosis can be performed quickly.

[Supplementary Note] (Supplementary Note 2-1) Two objective optical systems each including a first liquid crystal shutter and a second liquid crystal shutter capable of transmitting and blocking incident light, and one solid-state imaging device are provided. An endoscope apparatus wherein both of the two objective optical systems form an image on the solid-state imaging device, wherein a first field signal and a second field signal output from the solid-state imaging device are provided. Wherein the behaviors of the liquid crystal shutters are synchronized with each other.

(Supplementary Note 2-2) The objective optical system includes an objective optical system including a liquid crystal lens capable of variably setting an optical path length of incident light to at least two different optical path lengths, and one solid-state imaging device. An endoscope apparatus configured such that incident light having two different optical path lengths passing through a system both forms an image on the solid-state imaging device, wherein a first field signal output from the solid-state imaging device and a second An endoscope apparatus wherein the behavior of the liquid crystal lens is synchronized with each of the two field signals.

By the way, in an endoscope apparatus, generally,
In a solid-state imaging device, signal lines and the like of a CCD cable are connected to an imaging unit including a solid-state imaging device (hereinafter, referred to as a CCD), a circuit board, and the like. . Such solid-state imaging devices are of various standards depending on the use of the endoscope device,
Therefore, it is necessary to manufacture imaging units corresponding to solid-state imaging devices of various standards.

However, manufacturing imaging units of a plurality of standards in this manner causes a rise in manufacturing cost. In view of the above circumstances, an object of the present invention is to provide an imaging unit that can correspond to various solid-state imaging devices having different standards with one type of imaging unit.

FIG. 30 is a perspective view showing an essential part of an image pickup unit according to an embodiment of an image pickup unit which can support various solid-state image pickup devices having different standards with one kind of image pickup unit.

In the figure, reference numeral 190 denotes an image pickup unit provided in the solid-state image pickup device of the endoscope apparatus. This image pickup unit 190 is a solid-state image pickup device (hereinafter referred to as CCD) 191.
And a circuit board 192 to constitute a main part.

The circuit board 192 is made of the polyimide substrate 1
It is composed of, for example, a flexible substrate having a TAB structure in which a copper foil 198 is adhered to the 97.

In the circuit board 192, the circuit board 1
A part of the copper foil 198 constituting the pattern 92 extends from one side of the polyimide substrate 197 and is
It is formed as an inner lead 196 that can be connected to 91.

A CCD 191 is provided near the inner leads 196 on the circuit board 192, and the inner leads 196 and the bumps 19 provided on the CCD 191 are provided.
9 are fixedly connected by heat welding.

On the circuit board 192, a main pad 193 that can be connected to a signal line (not shown) is provided in the middle of the pattern extending from the inner lead 196. Auxiliary pads 194 that can be connected to the signal lines are provided on a pattern extending toward the periphery from. Here, the auxiliary pad 1
94 is formed in a larger area than the main pad 193.

[0215] The imaging unit 190 thus configured.
The connection between the signal line (not shown) and the signal line (not shown) is made when the size of the solid-state imaging device to be applied has a margin or when the cable needs to have strength. This is performed via an auxiliary pad 194 which can have a large area.

On the other hand, the connection between the image pickup unit 190 and a signal line (not shown) is required when the solid-state image pickup device needs to be miniaturized or when the durability of the cable is not regarded as important.
This is performed via the main pad 193. At this time, the circuit board 1
By cutting the 92 from the cutting boundary 195 around the main pad 193, the size of the imaging unit 190 can be reduced.

In the above embodiment, an example is described in which a TAB tape in which a copper foil is adhered to a polyimide substrate is used as a circuit board, but the present invention is not limited to this.

The circuit board may be made of, for example, a polyimide-based flexible board having no inner leads. In this case, the connection with the bump portion of the CCD is performed between the CCD and a pad provided on the flexible substrate.

If the strength of the circuit board itself is required,
A hard base material such as ceramics or glass epoxy resin may be used. Even in this case, one circuit board can support a plurality of solid-state imaging devices.

According to such an embodiment, a single type of image pickup unit can be used for a plurality of solid-state image pickup devices, so that it is possible to realize commonality of components and cost reduction.

[Supplementary Note] (Supplementary Note 3-1) In an imaging unit including a solid-state imaging device and a circuit board, two or more pads are provided at different positions on the same circuit provided on the circuit board. Imaging unit.

(Supplementary Note 3-2) The imaging unit according to Supplementary Note 3-1 wherein a cable is selectively connected to the pad according to a solid-state imaging device.

(Supplementary Note 3-3) The supplementary note 3-1 wherein the circuit board is formed of a flexible board.
The imaging unit according to supplementary note 3-2.

(Supplementary Note 3-4) The flexible substrate is
The imaging unit according to attachment 3-3, wherein the imaging unit is configured by TAB.

By the way, conventionally, a solid-state imaging device used for an electronic endoscope is provided with an insulator for insulating the solid-state imaging device from a living body. In general, ceramics and the like are often used for this insulator.

However, when the insulator is made of ceramics or the like, the distal end of the electronic endoscope tends to have a complicated structure and a large outer diameter.

In view of the above circumstances, an endoscope apparatus capable of reducing the diameter of the tip of the electronic endoscope will be described.

FIG. 31 is a sectional view of a main part of the distal end portion of the electronic endoscope according to the first embodiment of the endoscope device capable of reducing the diameter of the distal end portion of the electronic endoscope. .

[0229] In the figure, reference numeral 312 denotes a distal end of the electronic endoscope. The distal end 312 is connected to the objective optical system unit 32.
3 and a solid-state imaging device 322 disposed behind the objective optical system unit 323.

The objective optical system unit 323 includes an objective lens group 324 composed of a plurality of lenses, and an objective lens frame 328 for holding the objective lens group 324 therein. By being fitted to the frame 335, it is held at the distal end 312.

Further, a CCD holder 327 is externally fitted to the base end side of the objective lens frame 328.
The solid-state imaging device 322 is held by the objective optical system unit 323 via 27.

More specifically, a cover glass 326 facing the objective lens group 324 is held on the inner periphery of the CCD holder 327.

A solid-state image pickup device (hereinafter referred to as CCD) 325 is attached to the base end surface of the cover glass 326. This CCD 325 is a CCD chip 325
The CCD chip 325a is attached to the cover glass 326 via a cover glass 325b attached to the front surface.

A bump 325e as a contact is provided on a part of the front surface of the CCD chip 325a.
The D chip 325a is connected to the circuit board 3 via the bump 325e.
25c.

The circuit board 325c has a so-called TAB structure and includes a polyimide base 325f and a conductor pattern 325d made of copper foil provided on the polyimide base 325f. A part of the conductor pattern 325d extends from the end of the polyimide base 325f near the bump 325e, and the extended conductor pattern 325d is joined to the bump 325e to transmit and receive signals to and from the CCD chip 325a. It has become. The periphery of the joint between the conductor pattern 325d and the bump 325e is sealed with a sealing resin 325g.

A land (not shown) is provided on the circuit board 325c. The land is provided with an IC for amplifying an output signal from the CCD chip 325a, a capacitor for canceling noise, a resistor for ensuring impedance matching, and the like. Electronic component 329 is mounted. Note that the IC, the capacitor and the resistor are previously stored in the CCD chip 3.
25a may be incorporated.

The circuit board 325c has a CC
A CCD cable 330 for exchanging signals with a U (camera control unit) or the like is connected.
The CCD cable 330 is, for example, a CCD chip 3
25a, a coaxial signal line 339 for transmitting a drive signal to the
A coaxial signal line 340 for transmitting an output signal from the D chip 325a to a processor (not shown);
25a and a simple signal line 341 for power supply for driving the IC 329. These signal lines extend from the tip of the CCD cable 330 and are connected to the circuit board 325c. ing. Here, the external conductor group 342 of the plurality of coaxial signal lines is a CCD chip 325.
a is connected to the wired GND potential. Also,
As shown, the solid-state imaging device 322 is downsized,
When it is difficult to provide a plurality of signal line connection lands on the circuit board 325c, a configuration is adopted in which signal lines are arranged on electrodes of the electronic component 329.

A shield member 332 is fitted on the CCD holder 327. This shield member 3
Numeral 32 extends to the vicinity of the distal end of the CCD cable 330 to suppress unnecessary radiation and covers the outer periphery of the CCD 325, and is electrically connected to a GND line (not shown) of the CCD 325.

Further, the CCD 325 is located on the inner periphery of the shield member 332 and from the base of the CCD holder 327.
The CCD 325 has a shield member 33
An insulating member 331 for preventing a short circuit to the GND potential due to contact with the second member 2 is covered. Here, the insulating member 331 is formed of, for example, a heat-shrinkable tube.

A covering member 334 is provided on the outer periphery of the shield member 332. This covering member 3
Numeral 34 denotes a solid-state imaging device 322 covering and sealing the entire solid-state imaging device 322 from the distal end of the CCD holder 327 to the distal end of the CCD cable 330. When the covering member 334 is sealed, the CCD 325, the circuit board 325c, and each signal A filler 333 is filled around a line or the like. This filler 333
May be an epoxy-based or silicone-based adhesive, for example.

Here, the solid-state image pickup device 322 thus configured includes an objective lens group 324 and a CCD chip 325.
The CCD holder 327 is fitted and fixed to the objective lens frame 328 in a state where focusing has been performed with respect to a, and is fixed to the objective optical system unit 323. When the objective lens frame 328 and the CCD holder 327 are fixed, for example, an epoxy-based adhesive is used.

[0242] A curved first frame 337 constituting a curved tube (not shown) is connected to the base end side of the distal end frame 335.

A resin cover 336 is provided on the front side of the front frame 335, and a rubber covering member 338 is provided on the outer periphery of the front frame 335 and the curved first frame 337. The tip 312 is sealed.

According to such an embodiment, the CCD 3
Insulation member 33l over 25 outer circumferences and CCD holder 327
And the shield member 332 is provided on the outer periphery thereof. Therefore, even if the shield member 332 and the CCD 325 are set to be close to or in contact with the GND of the CCD 325, the CCD 325 does not short-circuit to the GND. . That is, conventionally, the creepage distance between the CCD 325 and the shield member 332 has been sufficiently separated so that they are not short-circuited. However, since the creepage distance can be reduced by this configuration, the size of the solid-state imaging device 322 can be reduced. Thus, the outer diameter of the endoscope can be reduced.

Further, since the insulating member 331 provided on the outer periphery of the CCD 325 is firmly fixed on the outer periphery of the CCD 325, the fixing strength between the CCD 325, the cover glass 326 and the CCD holder 327 is increased, and the reliability is improved. it can.

Further, since the insulating member 331 is not made of ceramic or the like, the manufacturing cost can be reduced.

FIG. 32 is a sectional view of a main part of a distal end portion of an electronic endoscope according to a second embodiment of an endoscope apparatus capable of reducing the diameter of the distal end portion of the electronic endoscope. FIG. In this embodiment, the same components as those in the first embodiment of the endoscope device capable of reducing the diameter of the distal end portion of the above-mentioned electronic endoscope are denoted by the same reference numerals and described. Omitted.

The following describes the solid-state imaging device 300 with reference to FIG. An objective lens group 32 is provided in the objective lens frame 3O1.
4 are provided.

A cover glass 325b is adhered to the tip of the CCD chip 325a, and a cover glass 326 is adhered to the tip of the CCD chip 325a. The cover glass 326 is fitted to the base end side of the objective lens frame 301 in a state where the CCD 325 and the objective lens group 324 are focused. That is, in this embodiment, the objective lens frame 301 is
25 also serves as a CCD holder.

A projection 302 is provided at the base end of the objective lens frame 301 so as to cover the CCD 325, and a gap 303 between the projection 302 and the CCD 325 is provided.
Is filled with an adhesive. Note that this protruding portion 302
May be provided so as to cover the entire circumference of the CCD 325,
It may be provided to face a part of the surface of the CCD 325.

Further, the outer periphery of the CCD 325 and the objective lens frame 301 is covered with an insulating member 331.

According to such an embodiment, it is possible to obtain substantially the same effects as those of the first embodiment of the endoscope apparatus capable of reducing the diameter of the distal end of the electronic endoscope. Can be.

Further, as in the present embodiment, the objective lens frame 301 is also used as a CCD holder, and the projecting portion 302 for covering the CCD 325 is provided at the base end of the objective lens frame 301, so that the CCD 325 The connection strength to the objective lens frame 301 can be further improved.

[Supplementary Note] (Supplementary Note 4-1) In an endoscope apparatus provided with an electronic endoscope having a solid-state imaging device at a distal end thereof,
A solid-state image sensor, and a shield member that covers at least the outer periphery of the solid-state image sensor, and a cover glass is attached to a front surface of the solid-state image sensor, and the solid-state image sensor is framed through at least the cover glass. connection,
An endoscope apparatus wherein the shield member is arranged on an outer periphery of the solid-state imaging device via an insulating member.

(Supplementary Note 4-2) The endoscope apparatus according to supplementary note 4-1 wherein the insulating member is formed of a heat-shrinkable tube.

By the way, conventionally, a coaxial signal line is generally used as a signal line connected to a solid-state image pickup device provided at a distal end portion of an electronic endoscope and transmitting a high-frequency signal to a control device or the like.

However, when connecting a coaxial signal line to such a solid-state imaging device, the core wire is exposed from the covering member and connected to the solid-state imaging device, and a shield wire is exposed behind the exposed core wire. Therefore, the rigid length of the distal end portion becomes longer because it is necessary to be connected to GND. Also,
Connecting not only the core wire but also the shield wire at the narrow distal hard portion causes a reduction in workability. In view of the above circumstances, an endoscope apparatus capable of shortening the rigid length of the distal end and improving the workability of signal line connection will be described.

FIG. 33 relates to an embodiment of an endoscope apparatus capable of shortening the rigid length of the distal end portion and improving the workability of signal line connection. It is sectional drawing which shows the principal part of.

[0259] Reference numeral 370 in the figure denotes the distal end of the electronic endoscope constituting the endoscope apparatus. The distal end portion 370 includes an objective optical system unit 381 and the objective optical system unit 38.
1 and a solid-state imaging device 380 disposed behind the image pickup device 1.

The objective optical system unit 381 is fitted and held in a front end frame 389 provided on the front end side of the front end portion 370.

Further, a CCD holder 384 is externally fitted to the base end side of the objective optical system unit 381, and the solid-state imaging device 380 is held via the CCD holder 384. Here, the solid-state imaging device 380 includes a solid-state imaging device (hereinafter, referred to as a CCD) 382 having an objective optical system unit 38.
1 is kept in focus. Specifically, a cover glass 383 is fitted and held on the inner periphery of the CCD holder 384.
The above-mentioned CCD 382 is adhered to the base end face of the above. Also,
The CCD 382 has a lead 382a on the base end side, and a circuit board 385 is connected to the lead 382a.

The first bending piece 3 of the bending tube 392 formed by combining a plurality of bending pieces is provided on the base end side of the tip frame 389.
92a is fitted and held. Here, the first bending piece 392a includes at least the CCD 382 and the circuit board 3
85 are provided so as to cover the outer periphery.

The circuit board 385 is connected to a plurality of coaxial signal lines extending from the tip of the CCD cable 387. Here, the CCD cable 387
Of the coaxial signal line is connected to the CCD cable 38.
7 is exposed near the front end and connected to GND (not shown). The core wire 387a constituting the coaxial line is exposed near the circuit board 385 and connected to the circuit board 385. At this time, the plurality of core wires 387a connected to the circuit board 385 are extended to the vicinity of the circuit board 385 in a state where they are stranded together.

According to such an embodiment, the shield line 387b of the coaxial signal line does not extend to the distal end hard portion of the endoscope distal end portion 370, and the GND wire is provided near the bending tube 392.
At the same time, only the core wire 387a is extended to the above-mentioned hard end portion and is connected to the circuit board 385, so that it is possible to shorten the hard end length and improve the workability of signal line connection.

Further, since the signal line in the bending tube can be narrowed, the diameter of the bending tube can be reduced. Also,
The filling rate of the signal line in the curved tube can be reduced, and the durability of the signal line is improved.

[0266]

As described above, according to the present invention, there is provided an endoscope apparatus having a cable having a structure capable of reliably reducing radiation noise even when transmitting a signal having a high transmission frequency. Can be.

[Brief description of the drawings]

FIGS. 1 to 4 relate to an embodiment of the present invention, and FIG. 1 is an overall configuration diagram showing an endoscope apparatus.

FIG. 2 is a sectional view of a main part of a distal end portion of the electronic endoscope.

FIG. 3 is a sectional view showing a main part of the CCD cable.

FIG. 4 is a sectional view showing a main part of the coaxial signal line.

FIG. 5 is a sectional view showing a main part of a CCD cable according to a modification of the embodiment;

FIG. 6 relates to an embodiment of an endoscope apparatus capable of shortening the length of a distal end portion and easily performing partial replacement of constituent members of a solid-state imaging device; Cross section of main part of the tip

7 to 9 show a first embodiment of an endoscope device capable of improving the connection strength of a CCD cable connection portion, and FIG. 7 is a cross-sectional view of a main part of a solid-state imaging device.

FIG. 8 is a bottom view of the vicinity of the circuit board in FIG. 7;

FIG. 9 is an expanded view of a cable holding member.

FIG. 10 shows a second embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connection portion, and FIG. 10 is a cross-sectional view of a main part of a solid-state imaging device.

FIG. 11 shows a third embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connection portion, and FIG. 11 is a sectional view of a main part of a solid-state imaging device;

FIG. 12 shows a fourth embodiment of an endoscope apparatus capable of improving the connection strength of a CCD cable connection portion, and FIG. 12 is a sectional view of a main part of a solid-state imaging device;

FIGS. 13 to 16 show a fifth endoscope apparatus capable of improving the connection strength of a CCD cable connection portion.
FIG. 13 is a sectional view showing a main part of a solid-state imaging device.

14 is a sectional view taken along line AA of FIG.

FIG. 15 is a perspective view of the circuit board viewed from obliquely above.

FIG. 16 is a perspective view of the circuit board viewed from obliquely below.

17 and 18 relate to an embodiment of an endoscope apparatus capable of improving the assemblability of the solid-state imaging device and the circuit board, and FIG. 17 is an exploded view of the solid-state imaging device and the circuit board. Side view

FIG. 18 is a side view showing a state where the solid-state imaging device and the circuit board are connected.

FIGS. 19 to 22 relate to an embodiment of an endoscope apparatus capable of shortening the length of a praise part.
9 is an exploded cross-sectional view showing a main part of the solid-state imaging device.

FIG. 20 is a sectional view of a main part of a solid-state imaging device.

FIG. 21 is an explanatory diagram showing another contact configuration.

FIG. 22 is an explanatory view showing still another contact configuration.

23 shows a distal end of a conventional electronic endoscope, FIG. 23 (a) is a side view of the distal end of the electronic endoscope, and FIG. 23 (b) is a sectional view taken on line AA of FIG. Sectional view

FIG. 24 shows an embodiment of an endoscope apparatus capable of reducing defects such as flare without increasing the diameter of the distal end portion. FIG. 24 (a) shows an electronic device for the upper digestive tract. FIG. 24 (b) is an explanatory diagram showing an example of an image taken by the electronic endoscope shown in FIG. 24 (a). FIG. 24 (c) is a view for explaining a lower digestive tract. FIG. 24D is an explanatory diagram showing an example of an image captured by the electronic endoscope shown in FIG. 24C.

FIG. 25 relates to an embodiment of an endoscope apparatus capable of preventing damage to a lamp, and is an explanatory view near an operation unit of the endoscope;

26 and 27 relate to a first embodiment of an endoscope apparatus capable of simultaneously configuring a plurality of observation means 2 using a single solid-state imaging device, and FIG. Sectional view of the main part of the tip of the endoscope

FIG. 27 is an explanatory diagram of an image on a monitor.

FIGS. 28 and 29 relate to a second embodiment of an endoscope apparatus capable of simultaneously configuring a plurality of observation means using a single solid-state imaging device. FIG. Sectional view of the main part of the tip of the endoscope

FIG. 29 is an explanatory diagram of an image on a monitor.

FIG. 30 is an exemplary perspective view showing an essential part of the image pickup unit according to an embodiment of an image pickup unit which can support various solid-state image pickup devices with one image pickup unit having different standards.

FIG. 31 relates to a first embodiment of an endoscope apparatus capable of reducing the diameter of a distal end portion of an electronic endoscope;
Cross-sectional view of the main part of the distal end of an electronic endoscope

FIG. 32 relates to a second embodiment of the endoscope apparatus capable of reducing the diameter of the distal end portion of the electronic endoscope,
Cross-sectional view of the main part of the distal end of an electronic endoscope

FIG. 33 relates to an embodiment of an endoscope apparatus capable of shortening a hard length of a distal end portion and improving workability of signal line connection, and relates to a distal end of an electronic endoscope. Sectional view showing main part of part

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Endoscope apparatus 25 ... Solid-state image sensor 30 ... CCD cable 39 ... Coaxial signal line 39c ... 1st external conductor 39d ... 2nd external conductor 40 ... Coaxial signal line 41 ... Simple signal line

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H040 BA00 BA03 BA04 CA02 CA12 CA22 DA12 DA21 GA03 4C061 AA01 AA04 BB02 CC06 DD03 FF45 JJ06 JJ15 JJ19 LL02 NN01 NN03 PP08 PP10 SS04 UU03 UU09 5E321 AA24 GG09

Claims (1)

[Claims] 1. An endoscope apparatus having a solid-state image sensor and a cable for transmitting input / output signals to and from the solid-state image sensor. Configure the signal line to be transmitted with a coaxial signal line,
An endoscope apparatus wherein the outer conductor of the present coaxial signal line is a double shield comprising a first outer conductor and a second outer conductor.