JP2004228426A - Shower plate for plasma treatment device, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shower plate for a plasma treatment device easy to work which supplies a process gas uniformly, prevents a micro wave from attenuating without occurring temperature change. <P>SOLUTION: A shower plate 20 for a plasma treatment device for supplying the process gas to a work 9 to be processed is provided between an antenna 6 for radiating microwave and a work 9 to be plasma-treated and between a gas supply opening 7 for supplying a process gas and a work 9 to be plasma-treated which are provided on a plasma treatment device 1. The shower plate 20 is characterised by being provided with a plate-like main body formed of porous ceramics. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a shower plate that is used in a plasma processing apparatus using microwaves and supplies a process gas to an object to be processed.
[0002]
[Prior art]
2. Description of the Related Art In general, as a semiconductor manufacturing apparatus, there is known a plasma processing apparatus including a high-frequency generator for performing a process such as etching on an object to be processed such as a semiconductor wafer by radicals and ions generated by converting a process gas into plasma by microwaves. Have been. The plasma processing apparatus includes a plasma processing device that supplies a process gas to an object to be processed, between an antenna for emitting microwaves and a gas supply port for supplying a process gas, and the object to be plasma-processed. An apparatus shower plate is provided (for example, see Non-Patent Document 1).
[0003]
Conventionally, as a shower plate used in a plasma processing apparatus, a plate-like member such as alumina having a large number of through holes is used, and a process gas passes through the shower plate and is uniformly supplied to a workpiece. That is, the density of the process gas is not high near the gas introduction part, and the density does not decrease on the other hand, and the process gas is supplied over the entire surface of the object to be processed. Thereby, uniform processing is performed on the surface of the object to be processed.
[0004]
[Non-patent document 1]
Tadahiro Omi, "Latest Technology Trends of Semiconductor Device Manufacturing Equipment", M & E, Industrial Research Committee, Inc., June 1, 2002, Vol. 29, No. 6, p.
[0005]
[Problems to be solved by the invention]
By the way, though a through-hole is formed in a ceramic plate member having a dielectric constant as low as possible, such as alumina, as the above-mentioned shower plate, the microwave irradiated from the antenna is attenuated and the plasma density is reduced. However, there has been a problem that the processing efficiency of the object to be processed is deteriorated. Furthermore, since the microwave loss changes into heat, there is a problem in that stable processing cannot be performed on the processing target due to a change in the temperature of the shower plate.
If a large number of through holes can be machined as the dielectric constant of the ceramic plate member is greatly reduced, the problem may be solved, but in practice such machining is difficult and very costly. There was a problem of becoming expensive.
[0006]
The present invention has been made under such a background, and a plasma processing apparatus that supplies a process gas uniformly, prevents microwaves from attenuating, does not generate a temperature change, and is easy to process. It is intended to provide a shower plate for use.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the present invention proposes the following means.
The shower plate for a plasma processing apparatus of the present invention is provided between a gas supply port for supplying a process gas and an antenna for radiating microwaves provided in the plasma processing apparatus, and an object to be plasma-processed. A shower plate for a plasma processing apparatus that is provided and supplies a process gas to a target object includes a gas-permeable plate-shaped main body formed of porous ceramics.
[0008]
This shower plate for a plasma processing apparatus has a plate-shaped main body made of porous ceramics having air permeability, so that a process gas can be passed therethrough and formed with a low dielectric constant. That is, since the internal structure of the shower plate for a plasma processing apparatus has a fine pore structure in which a gap is provided between ceramic powders that are in contact with each other, a process gas can be passed through the gap. By passing through such a plate-shaped main body, the process gas is uniformly supplied to the object to be processed, and the microwave is irradiated to the object without attenuation. Thus, processing such as etching can be efficiently performed on the object without reducing the plasma density. Further, since a temperature change of the shower plate for the plasma processing apparatus is suppressed, stable processing can be performed.
[0009]
Further, it is preferable that the shower plate for a plasma processing apparatus of the present invention has a three-dimensional network structure in which voids are formed between the solid skeletons of the plate-shaped main body and communicate with each other.
[0010]
In this shower plate for a plasma processing apparatus, since the plate-shaped body has a three-dimensional network structure in which voids communicating with each other are formed between the solid skeletons, the porosity of the plate-shaped body is further increased. In other words, the internal structure of the shower plate for a plasma processing apparatus can have a high porosity because voids having dimensions larger than the voids in the microporous structure described above are provided between the frameworks formed by the ceramic powder. . By using such a plate-shaped main body, the microwave attenuation is further suppressed, and the pressure loss between the gas supply port side and the object side of the plasma processing apparatus separated by the plasma processing apparatus shower plate is reduced. Is done. Thus, the process gas is optimally supplied to the object to be processed, and the processing can be performed efficiently.
[0011]
Further, the shower plate for a plasma processing apparatus of the present invention preferably includes a reinforcing layer formed on one or both surfaces of the plate-shaped main body with a porous ceramic having a lower porosity than the plate-shaped main body.
[0012]
This shower plate for a plasma processing apparatus has a reinforcing layer formed of porous ceramics having a lower porosity than the plate-shaped main body on one or both sides of the plate-shaped main body, so that only the plate-shaped main body having a high porosity is provided. It has sufficient strength compared with the case where it is comprised by. Further, the reinforcing layer desirably has air permeability. For example, by making the internal structure of the reinforcing layer a fine pore structure using ceramic powder having a smaller particle size than the plate-shaped main body, the reinforcing layer can be a dense layer having a smaller pore diameter than the plate-shaped main body, The reinforcing layer is configured so that the porosity can be made lower than that of the plate-shaped main body and the process gas can be passed therethrough. This makes it possible to form a high-strength shower plate for a plasma processing apparatus, which has a porous structure, is easy to handle such as mounting work, and has a high strength.
[0013]
Further, in the shower plate for a plasma processing apparatus of the present invention, it is preferable that the reinforcing layer has a three-dimensional network structure.
In this shower plate for a plasma processing apparatus, since the reinforcing layer has a three-dimensional network structure, the process gas is sufficiently diffused and more uniformly supplied to the object. Thereby, a favorable process can be uniformly performed.
[0014]
Further, in the shower plate for a plasma processing apparatus according to the present invention, it is preferable that a plurality of through holes extending from the surface to the plate-shaped main body be formed in the reinforcing layer.
In this shower plate for a plasma processing apparatus, since a plurality of through holes extending from the surface to the plate-shaped main body are formed in the reinforcing layer, the amount of process gas passing through the shower plate for the plasma processing apparatus is set by the through holes. That is, the porosity of the reinforcing layer and the through-holes formed in the reinforcing layer are arbitrarily configured so that the pressure between the gas supply port side of the plasma processing apparatus and the object side separated by the shower plate for the plasma processing apparatus. The difference can be set arbitrarily, and the amount of process gas passing therethrough is also specified. This makes it possible to generate an optimum plasma for performing the processing, and to perform a stable processing.
[0015]
Further, in the shower plate for a plasma processing apparatus of the present invention, it is preferable that an annular reinforcing member having higher strength than the plate-shaped main body is provided at a peripheral portion of the plate-shaped main body.
In this plasma processing apparatus shower plate, the plate-shaped main body can be reinforced from the periphery because the annular reinforcing member having a higher strength than the plate-shaped main body is provided at the peripheral portion of the plate-shaped main body, and the plasma processing apparatus shower plate can be used. By using the annular reinforcing member when mounting on the plasma processing apparatus, it is possible to securely fix the annular processing member.
[0016]
In the shower plate for a plasma processing apparatus according to the present invention, it is preferable that the annular reinforcing member is formed of porous ceramics having a lower porosity than the plate-shaped main body.
[0017]
In this shower plate for a plasma processing apparatus, since the annular reinforcing member is formed of porous ceramics having a porosity lower than that of the plate-shaped main body, it is difficult for the process gas to pass through the peripheral portion of the shower plate for the plasma processing apparatus. That is, by making the internal structure of the annular reinforcing member a microporous structure in which a gap smaller than the plate-shaped main body is provided, the porosity is reduced, and the passage of the process gas becomes difficult. Further, by arranging the plate-shaped main body only in the area facing the object to be processed and arranging the annular reinforcing member in the other area, the process gas is efficiently supplied to the object to be processed. Thereby, processing can be performed efficiently.
[0018]
A method for manufacturing a shower plate for a plasma processing apparatus according to the present invention includes an antenna for radiating microwaves provided in the plasma processing apparatus and a gas supply port for supplying a process gas; The method for manufacturing a shower plate for a plasma processing apparatus, which is provided between the first and second substrates and supplies a process gas to the object, includes a main body forming step of forming a plate-shaped main body of porous ceramics. A powdery raw material, a binder, water, and an expandable slurry mixing step of mixing an expandable slurry obtained by mixing an organic solvent; and an expandable slurry forming step of forming the expandable slurry into a plate and forming an expandable slurry formed body. A foaming step of heating and foaming the foamable slurry compact to form a foam, and sintering the foam after degreased. And having a degreasing sintering step of the plate-like body.
[0019]
In this method of manufacturing a shower plate for a plasma processing apparatus, an organic solvent mixed in a foaming slurry is vaporized by being heated in a foaming step, and a foam in which fine bubbles are continuously formed is formed. The foam is degreased and sintered to form a plate-shaped main body. Thereby, a plate-shaped main body of porous ceramics can be easily obtained, continuous pores can be uniformly formed, and porosity can be easily controlled.
[0020]
Further, the method for manufacturing a shower plate for a plasma processing apparatus of the present invention includes a reinforcing layer forming step of forming a reinforcing layer of porous ceramic provided on one or both surfaces of the plate-shaped main body. Is a non-foaming slurry mixing step of mixing a non-foaming slurry obtained by mixing a ceramic powder raw material, a binder, and water; and a non-foaming slurry forming the non-foaming slurry into a plate shape to obtain a non-foaming slurry molded body. A slurry forming step, a degreasing sintering step in which the non-foaming slurry formed body is degreased and then sintered to form a reinforcing layer plate, and one or both surfaces of a plate-shaped main body formed by the main body forming step And a heating step of bonding the reinforcing layer plate material to the plate-shaped body to form the reinforcing layer.
[0021]
In this method for manufacturing a shower plate for a plasma processing apparatus, a reinforcing layer obtained by sintering a non-foamed slurry molded body is bonded to one or both surfaces of a plate-shaped main body to form a reinforcing layer. The layer can be formed with high precision.
[0022]
Further, the method for manufacturing a shower plate for a plasma processing apparatus of the present invention includes a reinforcing layer forming step of forming a reinforcing layer of porous ceramic provided on one or both surfaces of the plate-shaped main body. A non-foaming slurry mixing step of mixing a non-foaming slurry obtained by mixing a ceramic powder raw material, a binder, and water; and forming the non-foaming slurry into a foaming slurry molded article formed by the non-foaming slurry molding step. A laminated slurry forming step of forming a laminated slurry by laminating, a foaming step of heating and foaming the laminated slurry formed body to form a foamed laminated body, and a degreasing sintering step of sintering after defoaming the foamed laminated body. It is characterized by having.
[0023]
In this method for manufacturing a shower plate for a plasma processing apparatus, since the non-foaming slurry is laminated on the foaming slurry compact and sintered, the sintering is performed by joining the plate-shaped main body and the reinforcing layer plate in a single sintering process. The layers are configured. This eliminates the need for an individual sintering step and a joining step, and makes it possible to manufacture a low-cost and sufficiently strong shower plate for a plasma processing apparatus.
[0024]
Further, the method for manufacturing a shower plate for a plasma processing apparatus of the present invention includes a hole forming step of forming a through-hole in a non-foamed slurry formed by the non-foamed slurry forming step or the laminated slurry forming step. It is characterized by having.
[0025]
In the method of manufacturing a shower plate for a plasma processing apparatus, since the through-holes are formed in the soft non-foamed slurry before sintering, a large number of through-holes can be easily formed. Thereby, a shower plate for a plasma processing apparatus can be manufactured at low cost.
[0026]
Further, the method for manufacturing a shower plate for a plasma processing apparatus of the present invention includes subjecting the shower plate for a plasma processing apparatus manufactured by the method for manufacturing a shower plate for a plasma processing apparatus of the present invention to acid pickling or vacuum heating. Features.
[0027]
In this method for manufacturing a shower plate for a plasma processing apparatus, the attached impurities are removed by performing pickling or vacuum heating on the manufactured shower plate for a plasma processing apparatus. Thus, the contamination of impurities during processing is suppressed, and a shower plate for a plasma processing apparatus suitable for use in a plasma processing apparatus for manufacturing a semiconductor can be manufactured.
[0028]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view of a plasma processing apparatus equipped with a shower plate for a plasma processing apparatus according to an embodiment of the present invention, and FIG. 2 is a partially broken perspective view of the shower plate for a plasma processing apparatus of the present embodiment. 3 shows a schematic enlarged view of the plate-shaped main body and the reinforcing layer.
[0029]
The plasma processing apparatus 1 includes a high-frequency generator 2 and a processing chamber 3 having a discharge space. The inside of the processing chamber 3 is divided into two parts by a plasma processing apparatus shower plate (hereinafter simply referred to as a shower plate) 20, one of which is a radial line slot antenna (hereinafter referred to as an antenna) 6 and a gas supply The gas inlet 8 is provided with an opening 7, and the other is a processing unit 12 provided with a workpiece 9, a workpiece holder 10, and a gas outlet 11.
[0030]
As shown in FIG. 2, in the shower plate 20, a reinforcing layer 22 formed of a porous ceramic having a porosity lower than that of the plate-shaped main body 21 is joined to both surfaces of a plate-shaped main body 21 formed of a porous ceramic. An annular reinforcing member 24 is joined to the periphery of the plate-shaped main body 21 and the reinforcing layer 22 to form a disk shape. Further, when the shower plate 20 is viewed from above, the shapes of the plate-shaped main body 21 and the reinforcing layer 22, that is, the shape of the range through which the process gas passes, have the same shape as the processing target 9 or a shape slightly larger than the processing target 9. It is formed so that it becomes.
[0031]
The plate-shaped main body 21 is formed such that pores having an average diameter of 0.02 mm to 1 mm are formed and the porosity is 60% to 98%. The internal structure of the plate-shaped main body 21 is a so-called tertiary structure in which fine solid skeletons (skeletons) as shown in FIG. 3 form a three-dimensional network and voids communicating with each other are formed between the skeletons. It has an original mesh structure. The ceramic powder raw material forming the skeleton of the plate-shaped main body 21 is mainly composed of alumina, aluminum nitride, zirconia, silicon nitride, and silicon carbide.
[0032]
The reinforcing layer 22 is formed of a ceramic having a microporous structure provided with voids through which a process gas can pass, and the porosity is set by changing the particle size of the main component of the ceramic powder raw material. . In other words, when a ceramic powder raw material having a small particle diameter is used, each powder is compacted to have a small porosity, and when a ceramic powder raw material having a large particle diameter is used, a large void is formed between the powders, resulting in an atmospheric porosity. is there. In FIG. 3, a ceramic powder raw material having the same particle size as the plate-shaped main body 21 is used. Further, the reinforcing layer 22 may have an internal structure having a three-dimensional network structure similarly to the plate-shaped main body 21. In this case, the porosity of the reinforcing layer 22 is lower than the porosity of the plate-shaped main body 21. It has a three-dimensional network structure in which the porosity is set. Further, a through hole 23 is formed from the surface of the reinforcing layer 22 to the surface joined to the plate-shaped main body 21 in accordance with the setting of the amount of the process gas passing therethrough. In particular, when the porosity is 10% or less, the process gas can be efficiently passed by providing the through holes 23.
[0033]
The annular reinforcing member 24 is formed of a ceramic having a higher strength than the plate-shaped main body 21 and having a dense structure through which a process gas does not easily pass, and is used when the shower plate 20 is attached to the plasma processing apparatus 1. I have.
[0034]
The shower plate 20 configured as described above has its components formed of ceramics, and has a low dielectric constant as a whole. As shown in FIG. 1, the plasma processing apparatus 1 is fixed by a fixing member 13 so as to partition the inside of the processing chamber 3, and is used for supplying a process gas in processes such as film formation and etching in a semiconductor manufacturing process.
A process for manufacturing a semiconductor using the plasma processing apparatus 1 will be described, and an operation of the shower plate 20 will be described.
[0035]
A process gas is supplied from the gas supply port 7 to the processing chamber 3 in a vacuum state, and the process gas fills the inside of the gas introduction unit 8 partitioned by the shower plate 20, and the process gas between the gas introduction unit 8 and the processing unit 12 is formed. The pressure passes through the shower plate 20 and fills the processing unit 12. The pressure difference at this time is set by the porosity of the plate-shaped main body 21 and the reinforcing layer 22 and the formed through-hole 23. Further, the flow of the process gas is made uniform by the internal structure of the plate-shaped main body 21 and passes through the shower plate 20.
[0036]
The microwave generated by the high-frequency generator 2 is irradiated from the antenna 6 toward the object 9 to turn the process gas into plasma, thereby generating radicals and ions having strong activity. The radicals and the ions come into contact with the object to be processed 9, and the object to be processed 9 is subjected to processing such as film formation and etching.
[0037]
As described above, since the shower plate 20 is made of ceramics, it is possible to irradiate the microwave to the processing target 9 without attenuation, and to perform a stable process without generating a temperature change. Further, the shower plate 20 can be set so that the process gas has an optimum supply amount by the porosity of the plate-shaped main body 21 and the reinforcing layer 22 and the formed through-holes 23, and a three-dimensional network structure can be obtained. Due to the internal structure of the plate-shaped main body 21, the process gas can be uniformly supplied to the processing target 9.
[0038]
Further, when the shower plate 20 is viewed from above, the plate-shaped main body 21 and the reinforcing layer 22 are formed so as to have the same shape as the processing target 9 or a shape slightly larger than the processing target 9, thereby improving the efficiency. The process gas can be supplied to the object 9 to be processed well. Further, the shower plate 20 can be securely attached to the plasma processing apparatus 1 by the annular reinforcing member 24.
[0039]
A method for manufacturing the shower plate 20 as described above will be described.
First, in a foaming slurry mixing step in a main body forming step of forming the plate-shaped main body 21, a ceramic powder raw material, a binder, water, and an organic solvent are mixed to form a foaming slurry. At this time, the ceramic powder raw material mainly contains alumina, aluminum nitride, zirconia, silicon nitride, and silicon carbide. As the organic solvent, a water-insoluble and volatile organic solvent is used. The organic solvent forms colloidal droplets inside the foamable slurry and is uniformly dispersed and distributed. By adding a surfactant as needed, the surfactant contains the organic solvent, and fine and uniform droplets of the organic solvent are formed.
As the organic solvent, neopentane, hexane, isohexane, heptane, isoheptane, benzene, octane, and toluene are preferably used.
[0040]
In the foaming slurry forming step, the foamable slurry thus mixed is formed into a predetermined shape by, for example, a known method such as a doctor blade method or a slip casting method, thereby obtaining a foamable slurry formed body. When this foamable slurry molded body is heated at a temperature of 30 ° to 50 ° in the foaming step, the organic solvent has a vapor pressure greater than that of water, so that it evaporates and evaporates from the foamable slurry molded body as a gas. . As a result, a large number of fine and sized air bubbles are generated, and a foam is formed. Thereafter, in a degreasing sintering step, the foam body is degreased and sintered to form a plate-shaped main body 21 having a three-dimensional network structure.
[0041]
On the other hand, in the non-foaming slurry mixing step in the reinforcing layer forming step, the ceramic powder raw material, the binder, and water are mixed to mix the non-foaming slurry. Into a non-foamed slurry compact. In the hole forming step, a large number of through-holes 23 are formed in the non-foaming slurry formed body, and in the degreasing sintering step, the non-foamed slurry formed body is degreased and sintered to form a reinforcing layer plate material. At this time, by using a ceramic powder raw material having an average particle size of 3 μm or less, a reinforcing layer plate material having a fine pore structure with a porosity of 10% or less can be obtained.
[0042]
Then, in the joining step, a reinforcing layer plate material is laminated and sintered on both sides or one side of the plate-shaped main body 21 formed in the above-described main body forming step. Thereby, the reinforcing layer 22 is joined to both sides or one side of the plate-shaped main body 21, and a non-foaming slurry is applied to the periphery thereof and sintered, whereby the shower plate 20 to which the annular reinforcing member 24 is joined is formed. You. By applying pickling or vacuum heating to the shower plate 20, the adhered impurities are removed.
[0043]
As described above, since the shower plate 20 in which the plate-shaped main body 21 having the three-dimensional network structure and the reinforcing layer 22 having the fine pore structure are integrally formed is manufactured, the process gas can be made uniform without attenuating the microwave. Can be manufactured. Further, since the through-hole 23 is processed on the soft non-foamed slurry molded body before sintering, the through-hole 23 can be easily processed with a needle or the like, and can be manufactured at low cost. Furthermore, since impurities are removed by pickling or vacuum heating, the shower plate 20 suitable for semiconductor manufacturing can be manufactured.
[0044]
As a manufacturing method other than the manufacturing method of individually sintering and joining the plate-shaped main body 21 and the reinforcing layer plate material, a non-foamed slurry formed body is laminated on a foamed slurry formed body to form a laminated slurry formed body. Then, there is a manufacturing method in which a foaming step and a degreasing sintering step are performed on the laminated slurry molded body to integrally form the plate-shaped main body 21 and the reinforcing layer 22.
[0045]
Further, by forming the reinforcing layer 22 using the same foaming slurry as the plate-shaped main body 21, the reinforcing layer 22 having a three-dimensional network structure is formed. In this case, the foaming slurry forming the plate-shaped main body 21 and the foaming slurry forming the reinforcing layer 22 are degreased by performing a separate foaming process, and then laminated and sintered simultaneously to form an integral body. Is done. That is, by performing a foaming method and a degreasing method different from those of the plate-shaped main body 21, the porosity of the reinforcing layer 22 is formed to be lower than the porosity of the plate-shaped main body 21. As described above, by using the reinforcing layer 22 having the three-dimensional network structure, the process gas can be further diffused and supplied to the object 9 to be processed.
[0046]
In the present embodiment, the shower plate 20 has a configuration in which the reinforcing layers 22 are bonded to both surfaces of the plate-shaped main body 21. However, the shower plate 20 may have the reinforcing layer 22 bonded to only one surface. The reinforcement layers 22 having different porosity may be used as the reinforcement layers 22 bonded to the first and second layers. Further, although the plate-shaped main body 21 has a shape in which no through-hole is formed, the plate-shaped main body 21 may have a shape in which a through-hole is formed.
[0047]
【The invention's effect】
As described above, according to the shower plate for a plasma processing apparatus of the present invention, since the shower plate for a plasma processing apparatus is formed of a plate-shaped main body formed of porous ceramics, it is supplied from the gas supply port. The process gas can be efficiently and uniformly supplied to the object. Further, since the plate-shaped main body has a very low dielectric constant, the microwave radiated from the antenna is not attenuated by the shower plate for the plasma processing apparatus, and the object can be efficiently irradiated with the microwave. Further, since a temperature change of the shower plate for the plasma processing apparatus is suppressed, stable processing can be performed.
[0048]
According to the method for manufacturing a shower plate for a plasma processing apparatus of the present invention, a ceramic powder raw material, a binder, water, and an organic solvent are mixed, and the organic solvent is vaporized by heating the foamed slurry molded body. Thus, a plate-shaped main body made of porous ceramics in which fine bubbles are formed can be obtained. Accordingly, it is possible to manufacture a shower plate for a plasma processing apparatus capable of uniformly supplying a process gas without attenuating microwaves.
[Brief description of the drawings]
FIG. 1 is an explanatory view of a plasma processing apparatus equipped with a plasma processing apparatus shower plate according to an embodiment of the present invention.
FIG. 2 is a partially cutaway perspective view of a shower plate for a plasma processing apparatus.
FIG. 3 is a schematic enlarged view of a plate-shaped main body and a reinforcing layer.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 plasma processing apparatus 6 antenna 7 gas supply port 9 workpiece 20 shower plate 21 for plasma processing apparatus plate-shaped main body 22 reinforcing layer 23 through hole 24 annular reinforcing member

Claims (12)

An antenna for radiating microwaves provided in the plasma processing apparatus and a gas supply port for supplying a process gas, and a plasma processing target are provided between a target to be processed and a process gas is supplied to the target. The plasma processing apparatus shower plate,
A shower plate for a plasma processing apparatus, comprising: a gas-permeable plate-shaped main body formed of porous ceramics. The shower plate for a plasma processing apparatus according to claim 1,
A shower plate for a plasma processing apparatus, wherein the plate-shaped body has a three-dimensional network structure in which voids communicating with each other are formed between solid skeletons. The shower plate for a plasma processing apparatus according to claim 1 or 2,
A shower plate for a plasma processing apparatus, comprising a reinforcing layer formed on one or both surfaces of the plate-shaped main body with a porous ceramic having a lower porosity than the plate-shaped main body. The shower plate for a plasma processing apparatus according to claim 3,
The shower plate for a plasma processing apparatus, wherein the reinforcing layer has a three-dimensional network structure. The plasma processing apparatus shower plate according to claim 3 or claim 4,
The shower plate for a plasma processing apparatus, wherein the reinforcing layer has a plurality of through holes extending from a surface to the plate-shaped main body. The shower plate for a plasma processing apparatus according to any one of claims 1 to 5,
A shower plate for a plasma processing apparatus, wherein an annular reinforcing member having a higher strength than the plate-shaped main body is provided at a peripheral portion of the plate-shaped main body. The plasma processing apparatus shower plate according to claim 6,
The shower plate for a plasma processing apparatus, wherein the annular reinforcing member is formed of a porous ceramic having a lower porosity than the plate-shaped main body. An antenna for radiating microwaves provided in the plasma processing apparatus and a gas supply port for supplying a process gas, and a plasma processing target are provided between a target to be processed and a process gas is supplied to the target. In a method for manufacturing a shower plate for a plasma processing apparatus,
Having a body forming step of forming a plate-shaped body of porous ceramics,
The main body forming step is a foaming slurry mixing step of mixing a foaming slurry obtained by mixing a ceramic powder raw material, a binder, water, and an organic solvent,
A foaming slurry forming step of forming the foaming slurry into a plate to form a foamable slurry formed body,
A foaming step of heating and foaming the foamable slurry molded body to form a foam;
A degreasing sintering step of degreasing and sintering the foam to obtain the plate-shaped main body. The method for manufacturing a shower plate for a plasma processing apparatus according to claim 8,
On one or both sides of the plate-shaped body, a reinforcing layer forming step of forming a reinforcing layer of porous ceramics,
The reinforcing layer forming step is a non-foaming slurry mixing step of mixing a non-foaming slurry obtained by mixing a ceramic powder raw material, a binder, and water,
A non-foaming slurry forming step of forming the non-foaming slurry into a plate to form a non-foaming slurry formed body;
A degreasing sintering step of sintering the non-foaming slurry molded body after degreasing to obtain a reinforcing layer plate material,
Bonding the reinforcing layer plate to one or both sides of the plate-shaped main body formed in the main body forming step, heating the plate, and bonding the reinforcing layer plate to the plate-shaped main body to form the reinforcing layer. A method for manufacturing a shower plate for a plasma processing apparatus, comprising: The method for manufacturing a shower plate for a plasma processing apparatus according to claim 8,
Provided on one or both sides of the plate-shaped body, having a reinforcing layer forming step of forming a reinforcing layer of porous ceramics,
The reinforcing layer forming step is a non-foaming slurry mixing step of mixing a non-foaming slurry obtained by mixing a ceramic powder raw material, a binder, and water,
A laminated slurry forming step of forming the laminated slurry by laminating the non-foamable slurry on the foamable slurry formed body formed by the foamable slurry forming step;
A foaming step of heating the foamed laminate slurry to foam to form a foamed laminate;
And a degreasing sintering step of sintering after defoaming the foamed laminated body. The method for manufacturing a shower plate for a plasma processing apparatus according to claim 9 or 10,
A method for manufacturing a shower plate for a plasma processing apparatus, comprising: a hole forming step of forming a through hole in a non-foamed slurry formed by the non-foamed slurry forming step or the laminated slurry forming step. 12. A plasma processing apparatus shower plate manufactured by the method for manufacturing a plasma processing apparatus shower plate according to claim 8, wherein the shower plate is subjected to pickling or vacuum heating. Shower plate manufacturing method.

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