JP2002022771A - Testing probe card and probe support used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the dislocation of a contact portion of a probe in heating or cooling test. SOLUTION: This testing probe card used for measuring a measuring object in heated or cooled condition for electric properties comprises the probe 100 for contacting with an electrode pad 611 for a LSI chip, the measuring object, a board 300 having a patterned wiring 320 formed to which the probe 100 is electrically connected, and a probe support 200 provided on the rear side of the board 300 for supporting the probe 100. The probe support 200 has a plate 210 provided on the rear side of the board and a ring 220 mounted on the plate 210 for supporting the probe 100, the plate 210 and the ring 220 being formed of materials similar in expansion and contraction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test probe card used for measuring various electrical characteristics of an object to be measured in a heated state, and a probe support used therefor.

[0002]

2. Description of the Related Art A conventional test probe card of this type includes a probe contacting an electrode pad of an LSI chip, which is the object to be measured, and a substrate on which pattern wiring to which the probe is electrically connected is formed. And a ring provided on the back side of the substrate and supporting the probe. This test probe card is of a so-called cantilever type in which the probe is turned sideways.

The probe has a bent contact portion at the front end and a connection portion connected to the pattern wiring at the rear end.

[0004] The ring is formed in a rectangular shape whose center is punched out, and a tapered portion is formed on a pair of opposed long sides. When the ring is attached to the back surface of the substrate, the tapered portion is a portion facing downward, and is inclined downward toward the inside. The middle portion of the probe is fixed to the tapered portion with an insulating adhesive.

[0005]

However, in a test for measuring various electrical characteristics in a state where an LSI chip to be measured is heated or cooled, a probe caused by thermal deformation of each part constituting a probe card is used. The displacement of the contact portion becomes a problem. That is, the contact portion of the probe
Although it is designed to match the position of the electrode pad of the LSI chip, accurate measurement becomes difficult due to the displacement. In the conventional probe card, in order to solve such a problem, each part is fixed with screws.

On the other hand, the ring used for the probe card has a rectangular donut shape in order to satisfy the requirement for simultaneous measurement of a plurality of LSI chips. This long rectangular donut-shaped ring has a large short side and a short side, and therefore lacks strength in a direction perpendicular to the long side. This insufficient strength promotes displacement of the contact portion of the probe.

The present invention has been made in view of the above circumstances, and provides a test probe card capable of reducing the displacement of a contact portion of a probe even in a heating or cooling test, and a probe support used therefor. It is intended to provide.

[0008]

A test probe card according to the present invention is a test probe card used for measuring various electrical characteristics of an object to be measured in a heated or cooled state. A probe in contact with the electrode pad of the object, a substrate on which a pattern wiring to which the probe is electrically connected is formed, and a probe support provided on the back side of the substrate and supporting the probe, The probe support portion has a plate provided on the back surface side of the substrate and a ring attached to the plate and supporting the probe, and the ring and the plate have the same expansion amount or contraction amount. It is composed of materials.

Further, the probe support used in the test probe card according to the present invention is a probe support used in a test probe card used for measuring various electrical characteristics of an object to be measured in a heated or cooled state. A plate provided on the back side of the substrate constituting the test probe card, and a ring attached to the plate and supporting a probe that contacts an electrode pad of the object to be measured, The ring and the plate are made of a material having the same amount of expansion or contraction.

[0010]

FIG. 1 is a schematic exploded perspective view of a probe support used in a test probe card according to an embodiment of the present invention, and FIG. 2 is a test probe card according to an embodiment of the present invention. It is a schematic sectional drawing of.

[0011] A test probe card according to an embodiment of the present invention is a test probe card used for measuring various electrical characteristics of an object to be measured in a heated or cooled state. The probe 100 that contacts the electrode pad 611 of the chip 610 and the pattern wiring 320 to which the probe 100 is electrically connected
And a probe support 2 provided on the back side of the substrate 300 and supporting the probe 100.
The probe support 200 includes a plate 210 provided on the back side of the substrate, and a ring 220 attached to the plate 210 and supporting the probe 100.
The ring 220 and the ring 220 are made of materials having the same expansion amount or contraction amount.

In the probe 100, for example, the tip of a tungsten wire is sharpened sharply by means of electrolytic polishing or the like as a contact portion 110, and the contact portion 110 is formed to a length of 0.2 to 0.5 m.
It is bent about 100 to 105 ° with a length of about m. The wiring of the probe 100, particularly the arrangement of the contact portions 110, corresponds to the arrangement of the electrode pads 611 formed on the LSI chip 610.

The substrate 300 is a multi-layer substrate made of glass epoxy resin or the like.
20 are formed. In addition, the pattern wiring 32 of each layer
0 is electrically connected by a through hole 315. One end of the pattern wiring 320 on the back side of the substrate 300 is exposed, and the connection portion 120 at the rear end of the probe 100 is exposed.
Are electrically connected by the solder 310.

As shown in FIG. 1, the probe support section 200 has a plate 210 and a ring 220 attached to the plate 210.

The plate 210 is formed in a substantially rectangular shape. In the center of the plate 210, a rib 211 is formed along the longitudinal direction. Further, screw portions 212 having screw holes 213 are formed at four corners of the plate 210. Note that the rib 211 and the screw portion 212 are flush with each other.

On the other hand, as shown in FIG. 1, the ring 220 has recesses 221 corresponding to the screw portions 212 at four corners so as to fit into the plate 210. The center of the ring 200 is provided with the rib 2
Since the elongated hole 222 into which the hole 11 is fitted is formed, the overall shape is a rectangular donut shape. The long side portions 223, 223 of the ring 200 are tapered portions 224, 224 whose bottom faces are inclined downward toward the inside.

The plate 210 is made of, for example, NOVINITE (trademark) cast iron manufactured by Enomoto Foundry Co., Ltd. LN-5 of this novinite (trademark) cast iron
When the room temperature is 50 ° C., the coefficient of thermal expansion is 5.0, 100
In the case of ° C, it is relatively small, 5.5, and in the case of 200 ° C, 2.7.

On the other hand, the ring 220 is formed of Shupal M (trademark) manufactured by Sumikin Ceramics Co., Ltd. The thermal expansion coefficient of this Supal M (trademark) is 4.3 at 50 to 100 ° C.

In the plate 210 and the ring 220, the ring 220 is closer to the table 700 having a built-in heater or cooling device, and the ring 220 is heated and cooled by the plate 210. If it is made of a material, the amount of expansion will be different. But,
As described above, the ring 220 is made of Novinite ™,
When the plates 210 are each formed of Schupal M (trademark), the expansion amount becomes the same. As described above, the “material having the same expansion or contraction amount” in the present specification means that the expansion amounts of the probe 210 and the ring 220 become equal in consideration of the temperature difference existing between the probe 210 and the ring 220. Meaning.

The material forming the plate 210 and the ring 220 is not limited to the above-mentioned Novinite (trademark) and Schupal M (trademark), but may be any material that has the same expansion or contraction amount. I just need.

The plate 210 and the ring 220 are
It is fixed with an adhesive. That is, the concave portion 2 of the ring 220
The screw part 212 of the plate 210 is attached to the ring 220.
With the ribs 211 of the plate 210 fitted into the long holes 222, respectively, the two are fixed with an adhesive.

The probe support 200 comprising the plate 210 and the ring 220 fixed in this manner is fixed to the back side of the substrate 300 by a suitable coupling means such as screws (not shown). At this time, the tapered portion 22 of the ring 220
Make sure 4 is facing down. In addition, the probe 100
Is fixed to the tapered portion 224 of the ring 200 with an insulating adhesive and the connecting portion 120 at the rear end.
Is connected to the pattern wiring 320 of the substrate 300 by soldering. The contact portions 11 at the tips of the plurality of probes 100
0 corresponds to the arrangement of the electrode pads 611 of the LSI chip 610.

The test probe card thus configured is fixed to mother board 800 using bolts and nuts. The test is performed by mounting the LSI chip 610 in a wafer state on the table 700 having a built-in heater or cooling device. Then, not only the LSI chip 610,
The test probe card is also heated or cooled. However, the plate 210 constituting the probe support 200
Since the ribs 211 are formed, deformation due to expansion or contraction is small. Further, since the ring 220 constituting the probe support 200 is attached to the plate 210, there is little deformation due to expansion or contraction.
This is because the plate 210 and the ring 220 are made of a material having the same expansion or contraction amount, so that the expansion or contraction is equal.

[0024]

The test probe card according to the present invention is a test probe card used for measuring various electrical characteristics of a heated or cooled object to be measured, and comprises an electrode pad for the object to be measured. And a substrate on which a pattern wiring to which the probe is electrically connected is formed, and a probe support provided on the back side of the substrate and supporting the probe, wherein the probe support Has a plate provided on the back side of the substrate, and a ring attached to the plate and supporting the probe, and the ring and the plate are made of a material having the same amount of expansion or contraction. ing.

Therefore, even if heated or cooled in the test, the plate has little expansion or contraction due to the ribs.
Also, since the ring is also attached to this plate, there is little expansion or cooling. In particular, since both are made of materials having the same amount of expansion or contraction, there is no problem of displacement of the contact portion of the probe due to a difference in expansion rate.

On the other hand, the probe support used in the test probe card according to the embodiment of the present invention is used for a test probe card used for measuring various electrical characteristics of a measurement object in a heated or cooled state. A probe support used, comprising: a plate provided on the back surface side of a substrate constituting a test probe card; and a ring attached to the plate and supporting a probe that contacts an electrode pad of the measurement object. The ring and the plate are made of materials having the same expansion or contraction amount.

Therefore, even in the probe supporting portion, even if it is heated or cooled in the test, the expansion or contraction is small, so that the displacement of the contact portion at the probe tip is small.

[Brief description of the drawings]

FIG. 1 is a schematic exploded perspective view of a probe support used in a test probe card according to an embodiment of the present invention.

FIG. 2 is a schematic sectional view of a test probe card according to the embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 probe 110 contact part 200 probe support part 210 plate 211 rib 220 ring 300 substrate 610 LSI chip 611 electrode pad

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Chief Mori 2-5-113 Nishi-Nagasu-cho, Amagasaki-shi, Hyogo Japan Electronic Materials Co., Ltd. F-term (reference) 2G003 AC01 AC03 AD02 AG03 AG08 AG12 AH05 AH07 2G011 AA17 AB06 AC14 AF07 4M106 AA01 BA01 CA01 CA31 CA60 CA62 DD04 DD10 DD30

Claims (4)

[Claims] 1. A test probe card used for measuring various electrical characteristics of a heated or cooled object to be measured, wherein the probe is in contact with an electrode pad of the object to be measured, and the probe is electrically connected to the electrode pad of the object to be measured. A substrate on which a pattern wiring to be connected is formed, and a probe support provided on the back side of the substrate and supporting a probe, wherein the probe support is a plate provided on the back side of the substrate. And a ring attached to the plate and supporting the probe, wherein the ring and the plate are made of a material having the same amount of expansion or contraction. 2. The test probe card according to claim 1, wherein the plate has ribs formed along a longitudinal direction. 3. A probe supporter used for a test probe card used for measuring electrical characteristics of an object to be measured in a heated or cooled state, the back side of a substrate constituting the test probe card. And a ring attached to the plate and supporting a probe that comes into contact with the electrode pad of the object to be measured, and the ring and the plate are made of a material having the same amount of expansion or contraction. A probe support portion used for a test probe card, comprising: 4. The probe support portion used in a test probe card according to claim 3, wherein a rib is formed on the plate along a longitudinal direction.