JP3737886B2 - Probe device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a probe device that is used for an electrical test in which a contact probe is incorporated in a printed board and brought into contact with each terminal of a member to be inspected such as a semiconductor IC chip or an LSI chip.
[0002]
[Prior art]
In general, in order to perform an electrical test of a member to be inspected such as a semiconductor chip such as an IC chip or an LSI chip, a probe device in which a contact probe provided with a contact pin is mounted on a printed board is used.
As an example of such a probe device, for example, there is a device using a tungsten needle as a contact probe as shown in FIGS. In this probe apparatus 1, the printed circuit board 2 has a substantially disk shape, and an opening 3 is formed at the center thereof. On the device surface 4, which is one surface of the printed circuit board 1, contact probes 5 are disposed on the outer periphery of the opening 3 in four directions at intervals of, for example, approximately 90 °, and face each other at the opening 3.
The contact probe 5 has a plurality of tungsten needles 6 arranged, one end of which is connected to a pattern wiring (not shown) of the printed circuit board 2 by solder or the like, and the other end of the tip 6a. It protrudes from the opening 3 as a contact pin and is brought into contact with a member to be inspected such as an IC chip.
[0003]
Here, each tungsten needle 6 is inclined and arranged downward so as to be gradually separated from the device surface 4 of the printed circuit board 2 toward the tip end portion 6 a, and a holding portion made of resin attached near the opening 3 of the device surface 4. 7 is fixed at an inclined position of a predetermined angle (see FIG. 10).
Further, a reinforcing ring-shaped metal plate 9 is attached with screws or the like to the connection surface 8 for connecting to the tester which is the surface opposite to the device surface 4 of the printed circuit board 2, and is arranged around the opening 3. It is installed.
[0004]
By the way, with the high integration and miniaturization of IC chips and the like, there is a demand for narrowing the multi-pin pitch of contact pins used in the probe device. In the contact probe of the tungsten needle 6. It became difficult to respond to.
On the other hand, a contact probe technique as shown in FIG. 11 is proposed in, for example, Japanese Patent Publication No. 7-82027. In the contact probe 11, a plurality of pattern wirings 13 are formed on the resin film 12, and the tips of the pattern wirings 13 are arranged in a protruding state from the resin film 12 to form contact pins 13 a.
In this technique, for example, the tips of a plurality of pattern wirings 13 manufactured by a photolithography method are used as contact pins 13a to reduce the pitch of the multi-pins.
Such a contact probe 11 is incorporated into a probe device and used for testing an IC chip or the like.
[0005]
[Problems to be solved by the invention]
By the way, when the probe device 1 like the former is subjected to a high-temperature test of about 80 ° C. to 150 ° C. and used at a high temperature, the printed circuit board 2 is usually made of glass epoxy resin or the like, so that it thermally expands. In particular, there is a problem in that the tungsten needles 6... Expand in the thickness direction (the arrow z direction in FIG. 10), and the positional displacement of the tungsten needles 6.
Even in the case of the probe device using the latter contact probe 11, if it is similarly used for a high temperature test, the contact probe 11 connected to the wiring pattern of the printed circuit board by solder or the like is displaced, and the tip portion thereof. A similar problem arises in that the contact pin 13a is displaced from a terminal such as a pad of an IC chip, resulting in poor contact.
[0006]
  In the probe apparatus 1 using the tungsten needles 6..., A reinforcing metal plate 9 is attached as a fixing jig in order to suppress thermal expansion of the printed board 2, but is provided only on the connection surface 8 of the printed board 2. Therefore, the deformation due to the thermal expansion of the printed circuit board 2 cannot be suppressed, and the displacement of the tungsten needle 6 cannot be prevented. In particular, since the device surface 4 is provided with a wiring pattern, the device surface 4 is hotter than the connection surface 8 and is more likely to expand, which promotes deformation of the printed circuit board 2.
  Moreover, since the lower surface 9b of the metal plate 9 is in contact with the printed circuit board 2,Provided on device surface 4When the wiring pattern generates heat, it becomes high temperature and expands and curves more than the upper surface 9a. For this reason, the printed circuit board 2 is also thermally deformed and curved. Further, even when the probe device 1 is brought into a high temperature state and the tungsten needles 6 are aligned with the pads of the IC chip and the like, when the temperature drops to room temperature, the printed circuit board 2 is thermally expanded, so the shrinkage rate is small. Although it does not return to the original dimension, the metal plate 9 contracts and returns to the original dimension, so that the needle tip is displaced, and the test at room temperature cannot be performed. Thereafter, there remains a problem that even if the temperature is increased again, a good test cannot be performed due to deformation of the printed circuit board 2 or the like.
[0007]
In particular, in recent years, the inspection conditions for IC chips and LSI chips, etc. have increased in temperature and have reached about 150 ° C., so that the contact pins are not displaced from the inspected member such as the IC chip due to thermal deformation of the printed circuit board. It is more likely to occur.
In view of the above-described problems, an object of the present invention is to provide a probe apparatus capable of satisfactorily performing an electrical test at a high temperature by suppressing thermal deformation of a printed circuit board.
[0008]
[Means for Solving the Problems]
A probe device according to the present invention is a probe device in which a contact probe is connected to a printed circuit board, and contact pins forming the tip of the contact probe protrude from the opening of the printed circuit board. Fixing jigs that suppress thermal expansion are fixed on the side where the contact probe of the printed circuit board is connected.And the side where the wiring pattern is providedThe first fixture fixed on one side is,otherThe thermal expansion coefficient is smaller than that of the second fixing jig fixed to the other surface.
[0009]
  Also, the fixture is more thermally expanded than the printed circuit board.coefficientIt may be made of a small metal. Thermal expansion during high temperature testingcoefficientSince the thermal expansion of the printed circuit board can be suppressed by a small metal fixing jig, it is possible to reliably suppress the displacement of the contact pin connected to the printed circuit board with the terminal of the member to be inspected.
  The first fixing jig is a surface provided with a wiring pattern having a large thermal expansion of the printed circuit board,That is, the surface to which the contact probe is connectedProvided.
  In addition, the first fixing jig fixed to one surface on the side to which the contact probe of the printed circuit board is connected has a smaller coefficient of thermal expansion than the second fixing jig fixed to the other surface. By disposing the first fixing jig having a small thermal expansion coefficient on the surface of the printed board having the larger thermal expansion, the thermal expansion and thermal deformation of the printed board can be reliably suppressed.
[0010]
In addition, the printed circuit board that has been heat-treated in advance at a temperature that is higher than the temperature that is planned in the electrical test of the member to be inspected may be incorporated.
  If the printed circuit board is thermally expanded in advance, the shrinkage is small even if the temperature is lowered. Therefore, if the printed circuit board is thermally expanded at a temperature higher than the temperature of the high temperature test and is aligned in the probe device, In this test, it is possible to avoid the thermal expansion of the printed circuit board again and to prevent the positional deviation between the contact pin and the member to be inspected. Preferably, the thermal expansion of the fixturecoefficientIs the thermal expansion of the heat-treated printed circuit boardcoefficientIt shall be smaller.
  Further, the fixing jig may be fixed so as to surround the connection portion between the printed circuit board and the contact probe. Since the thermal expansion of the printed circuit board inside the fixing jig can be suppressed during the test in the high temperature state, the positional deviation between the contact pin and the member to be inspected can be prevented.
[0011]
In the probe device according to the present invention, the contact probe has a configuration in which the tip of the wiring pattern on which the film is mounted protrudes into a contact pin, and the fixing jig is a mechanical part that connects the contact probe to the pattern wiring on the printed circuit board. It may be fixed to the printed circuit board on the outer peripheral side.
Note that the fixing jig is formed integrally with or separate from the mechanical parts.
The fixing jig can prevent thermal deformation and thermal expansion of the opening side region of the printed circuit board in which the contact probe is fixed by mechanical parts.
The contact probe is a tungsten needle whose tip is a contact pin, and one fixing jig is printed between the pattern wiring on the printed circuit board and the contact probe connecting portion and the holding portion for fixing and holding the contact probe. It may be fixed to the substrate. The other fixing jig is attached to face one fixing jig.
The fixing jig can prevent thermal expansion of the region where the printed circuit board holding portion is provided, and can also suppress thermal expansion of the contact probe connecting portion adjacent to the outer peripheral side of the fixing jig.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings.
1 to 4 relate to the first embodiment, FIG. 1 is an exploded perspective view of the probe device according to the embodiment, FIG. 2 is a longitudinal sectional view of the probe device shown in FIG. 1, and FIG. FIG. 4 is a longitudinal sectional view of the contact probe shown in FIG.
The probe device 20 shown in FIG. 1 and FIG. 2 is schematically configured by mounting a flexible contact probe 23 with a mechanical part 24 on a disc-shaped printed circuit board 22 made of, for example, glass epoxy resin. .
The contact probe 23 is an IC probe, for example. As shown in FIGS. 3 and 4, a pattern wiring 26 formed of Ni or Ni alloy or the like is attached to one surface of a resin film 25 (film) with an adhesive. The tip of the pattern wiring 26 protrudes from the end portion of the resin film 25 to form a contact pin 26a. In addition, positioning holes 25a and 25a are formed on both sides of the resin film 25.
[0013]
The resin film 25 is a two-layer tape in which a metal film (copper foil) 27 is integrally provided on a polyimide resin PI. This metal film 27 can be used as a ground, and thus it is possible to design impedance matching up to the vicinity of the tip of the probe device, and it is possible to prevent adverse effects even when performing a test in a high frequency range.
The resin film 25 is provided with a window 29 for transmitting a signal obtained from the pattern wiring 26 to the printed circuit board 22 via the lead wiring 28.
A plurality of contact probes 23 can be arranged according to the arrangement direction of the pads of the IC chip I, and four pieces are arranged in the probe device 20 shown in FIG.
[0014]
In the probe device 20 shown in FIGS. 1 and 2, for example, a substantially rectangular opening 31 is formed at the center of the disc-shaped printed circuit board 22, and a substantially rectangular frame-shaped top is formed in the upper part near the opening 31. A clamp 32 is attached.
The contact probe 23 has a positioning pin 34 inserted into the positioning hole 25 a and is positioned on the lower surface of the mounting base 33 having a substantially rectangular frame shape and is adhered with an adhesive or the like. The upper surface of the mounting base 33 is the opening 31. Inside, it is screwed to the lower surface of the top clamp 32 with a bolt 35. As a result, the pattern wiring 26 and the IC chip I can be accurately aligned. In addition, the contact probe 23 is inclined in the direction in which the tip of the mounting base 33 is separated from the printed circuit board 22 (downward in FIG. 2), and the contact pin 26a protrudes on the extension.
In addition, the elastic body 37 of the bottom clamp 36 is pressed against the lead-out wiring 28 in the portion of the window 29 provided in the contact probe 23 so that the lead-out wiring 28 is in contact with the inner electrode 38 of the printed circuit board 22.
[0015]
Moreover, in the printed circuit board 22 of the probe device 20, the surface on which the inner electrode 38 on the side where the contact probe 23 is mounted is provided as the device surface 40A, and the opposite surface is used as the connection surface 40B. On the outer peripheral side of the connection surface 40B, an outer electrode 41 for connection with a tester (not shown) is disposed in the circumferential direction.
Further, the outer electrode 41 is electrically connected to the inner electrode 38 connected to the lead-out wiring 28 of the contact probe 23 through a cord wiring 42 and a radial wiring pattern (not shown) on the printed board 22. The signal obtained from the pattern wiring 26 can be transmitted to an external tester through the outer electrode 41.
[0016]
  Further, in the probe apparatus 20, as shown in FIGS. 1 and 2, a substantially ring-shaped first metal plate 45 for reinforcement, for example, is provided on the device surface 40A of the printed board 22 outside the bottom clamp 36 for the first fixing treatment. It is installed as a tool. A substantially ring-shaped second metal plate 46 for reinforcement similar to the first metal plate 45 is mounted on the connection surface 40B of the printed board 22 between the top clamp 32 and the cord wiring 42 as a second fixing jig. ing.
  The metal plates 45 and 46 are preferably provided at opposing positions, and are connected and fixed to each other with the fastening bolt 47 sandwiching the printed circuit board 22. Here, the metal plates 45 and 46 are thermally expanded.coefficientFor example, Kovar, which is an Fe-based low thermal expansion alloy, may be used.
  AlsoPrinted circuit board 22The device surface 40A has a pattern arrangement.LineSince it is provided, the temperature tends to be higher than that of the connection surface 40B. Therefore, the first metal plate 45 attached to the device surface 40A is made of a material having a smaller thermal expansion coefficient than the second metal plate 46 attached to the connection surface 40B. .
[0017]
  The printed circuit board 22 is made of, for example, glass epoxy resin, and is heat-expanded by heat treatment in advance. The printed circuit board 22 is incorporated into the probe device 20 and aligned with the contact probe 23, the IC chip I, or the like via the mechanical part 24. It is like that. Here, the heat treatment means that when the probe apparatus 20 is used for a test at a high temperature or the like, the printed circuit board 22 is thermally expanded in advance by a heat treatment at a temperature higher than a predetermined temperature. Even if the temperature is lowered thereafter, the degree of thermal shrinkage is reduced and does not return to the original size, and the degree of thermal expansion is reduced even if the temperature is set again. Preferably, the metal plates 45 and 46 are more thermally expanded than the heat-treated printed circuit board 22.coefficientIs small.
[0018]
  Since the probe device 20 according to the present embodiment is configured as described above, the contact pins 26a... Protruding from the opening 31 of the probe device 20 are overdriven to the IC chip I which is a member to be inspected. For example, an electrical test is performed at a high temperature. In this case, the temperature is set to 150 ° C., for example. At this time, since the printed circuit board 22 has been heat-treated in advance, the rate of thermal expansion is small even when placed at a high temperature of 150 ° C., for example. Moreover, metal plates 45 and 46 are arranged on both sides of the printed circuit board 22 and bolted.
Moreover, the device surface 40A of the printed circuit board 22 on which the first metal plate 45 is mounted is likely to be hotter than the connection surface 40B on the opposite side, and thus is likely to thermally expand.Both metal plates 45 and 46 are thermally expandedcoefficientIs smaller and the first metal plate 45 of the device surface 40A has a smaller thermal expansion.coefficientIn addition, since the printed circuit board 22 is expanded at the same time, the printed circuit board 22 is not curved toward one surface side, and is only slightly expanded in the thickness direction and the radial direction. Also more thermal expansioncoefficientThe thermal expansion of the printed circuit board 22 is suppressed by the small metal plates 45 and 46.
[0019]
  Even if the temperature is lowered after the high temperature test, the degree of shrinkage is small because the printed circuit board 22 has already been thermally expanded. Moreover, the metal plates 45 and 46 fixed on both sides of the printed circuit board 22 are more thermally expanded.coefficientTherefore, the shrinkage of the dimensions of the printed circuit board 22 is suppressed even when shrinking. For this reason, the contact pin 26a of the contact probe 23 is only slightly displaced even at a high temperature and then returned to the normal temperature state, and does not cause a contact failure with the pad of the IC chip I.
[0020]
  As described above, according to the present embodiment, even if the probe device 20 is used at a high temperature, the thermal expansion in the thickness direction and the radial direction of the printed circuit board 22 is suppressed, and even at a high temperature and at a subsequent normal temperature. In this case, the contact pin 26a is not displaced from the pad of the IC chip I which is a member to be inspected, and no contact failure occurs.
  In particular, in the present embodiment, the ring-shaped metal plates 45 and 46 are fixed to the outer peripheral side of the contact probe 23 fixed to the printed circuit board 22 by the mechanical part 24. Therefore, the contact probe 23 of the printed circuit board 22 is attached. From the region to the contact pin 26a on the opening 31 side, it is possible to reliably prevent displacement due to a temperature change during a test in a high temperature state. In addition, the first metal plate 45 on the device surface 40A, which has a higher temperature, is more thermally expanded than the second metal plate 46 on the connection surface 40B.coefficientTherefore, warping and bending of the printed circuit board 22 can be reliably prevented.
[0021]
Next, a second embodiment of the present invention will be described with reference to FIGS. 5 is a plan view showing the device surface of the printed circuit board according to the second embodiment, FIG. 6 is a plan view showing the connection surface of the printed circuit board shown in FIG. 5, and FIG. 7 is a central longitudinal section of the printed circuit board shown in FIG. FIG.
The second embodiment relates to a probe device using a tungsten needle. In this probe device 50, a printed circuit board 51 has, for example, a disk shape, and one surface of the printed circuit board 51 is connected to a device surface 52A. The opposite surface is a connection surface 52B with the tester. For example, a substantially rectangular opening 53 is formed at the center of the printed circuit board 51. A wiring pattern (not shown) is arranged radially on the device surface 52A from the periphery of the opening 53 toward the outer periphery.
Also in this printed board 51, the probe apparatus 50 is used that has been heated and expanded in advance to a high temperature equal to or higher than the heating temperature in the high temperature test or the like, similarly to the printed board 22 according to the first embodiment. .
[0022]
On the device surface 52A, a plurality of tungsten needles 54 are arranged around the opening 53, and the tungsten needles 54 constitute a contact probe 55. In the contact probe 55, one end portion 54b of the tungsten needle 54 is connected and fixed to an electrode of a wiring pattern (not shown) on the device surface 52A by solder or the like, and is gradually separated from the device surface 52A toward the other end (see FIG. The contact pins 54a... Are projected into the opening 53 in plan view.
[0023]
  The device surface 52 </ b> A is formed with a substantially rectangular cylindrical holding frame (holding portion) 56 made of a suitable resin material so as to surround the opening 53 around the opening 53. A middle portion of the tungsten needles 54 is fixed and held at a predetermined angle. That is, as shown in FIG. 7, the holding frame 56 is in contact with tungsten needles 54 arranged in an inclined state on the first holding frame 57, and the tungsten needles 54. A second holding frame 58 to be fixed is bonded and fixed. Each tungsten needle 54 has a contact pin 54a protruding inward from the holding frame 56, and can be connected to the pad of the IC chip I disposed in the opening 53 in plan view by the contact pin 54a. . In addition, in the device surface 52A, a ring-shaped thermal expansion occurs between the one end 54b of the tungsten needles 54 connected to the wiring pattern and the holding frame 56 inside thereof.coefficientA small first metal plate 60 is fixed. Similarly, the connection surface 52B opposite to the device surface 52A is also ring-shaped and thermally expanded.coefficientA small second metal plate 61 is fixed, and both metal plates 60 and 61 sandwiching the printed circuit board 51 are fixed tightly to each other by, for example, fastening bolts 62. The metal plates 60 and 61 are made of the same material as the metal plates 45 and 46 shown in the first embodiment, and their thermal expansion.coefficientIs smaller than the heat-treated printed circuit board 51 and the thermal expansion of the first metal plate 60coefficientIs the thermal expansion of the second metal plate 61coefficientIt shall be smaller.
[0024]
  Since the probe device 50 according to the present embodiment is configured as described above, as in the first embodiment, the contact pin 54a protruding from the opening 53 of the printed circuit board 51 is used as an IC chip to be inspected. An I-pad is brought into contact with overdrive, and an electrical test is performed at a high temperature of about 150 ° C., for example. At this time, since the printed circuit board 22 has been heat-treated in advance, the degree of thermal expansion is small even when placed at a high temperature, and the reinforcing metal plates 60 and 61 are further thermally expanded.coefficientTherefore, the metal plates 60 and 61 can suppress the thermal expansion in the thickness direction and the radial direction of the printed circuit board 22. Moreover, both metal plates 60 and 61 expand simultaneously, and the first metal plate 60 expands more thermally.coefficientTherefore, the printed circuit board 22 does not bend toward the connection surface 52B side and expands only in a small amount in the radial direction.
[0025]
  In particular, in the present embodiment, the ring-shaped metal plates 60 and 61 are located adjacent to and inside the tungsten needles 54 and the connection portions 54b between the wiring patterns, and further inside the metal plates 60 and 61, the tungsten needles are located. 54 ... are provided, and are firmly fixed by two metal plates 60, 61 from the region of the printed circuit board 51 where the contact probe 55 is mounted to the inner periphery thereof. It is possible to reliably prevent misalignment due to a temperature change, such as a test in a high temperature state by preventing thermal expansion. Even if the temperature is lowered after the test at a high temperature, the shrinkage rate is small because the printed circuit board 51 is already thermally expanded, and the metal plates 60 and 61 fixed on both surfaces of the printed circuit board 51 are heated. expansioncoefficientTherefore, shrinkage of the printed circuit board 51 can be suppressed by the metal plates 60 and 61. Therefore, even when the temperature is high and when the temperature is returned to the normal temperature after that, the positional displacement of the tungsten needles 54 of the contact probe 55 is very small and does not cause a contact failure with the pad of the IC chip I.
[0026]
  Next, FIG. 8 is an exploded perspective view showing a probe device showing a modification of the first embodiment. In the probe apparatus 70 shown in FIG. 8, the top clamp 71 is formed by integrally forming the second metal plate 46 and the top clamp 32 in the first embodiment, and the bottom clamp 72 is also formed of the first metal. The plate 45 and the bottom clamp 36 are integrally formed. Therefore, the top clamp 71 includes a top clamp portion 71A that supports the mounting base 33 and a second metal portion 71B, and the bottom clamp 72 includes a bottom clamp portion 72A and a first metal portion 72B. Moreover, both the top clamp 71 and the bottom clamp 72 are thermally expanded.coefficientOf a small material such as Kovar, which is an Fe-based low thermal expansion alloy. Further, the bottom clamp 72 is more thermally expanded than the top clamp 71.coefficientMay be made of a small material. If such a configuration is adopted, the configuration and the assembly become easier than those of the above-described embodiments, and the contact area with the printed circuit board 22 becomes larger, so that the thermal expansion can be further suppressed.
[0027]
  In the probe apparatus shown in FIGS. 1 and 2 having the contact probe 23 as shown in FIG. 3, the top clamp 32 and the bottom clamp 36 that support the contact probe 23 are made of low heat such as Kovar, which is an Fe-based low thermal expansion alloy. expansioncoefficientThe first and second metal plates 45 and 46 may be omitted. In this case, the top clamp 32 and the bottom clamp 36 also serve as the first and second metal plates 45 and 46 (fixing jigs) for suppressing thermal expansion.
[0028]
  Note that the metal plates 45, 46, 60, 61 and the metal portions 71B, 72B used in the above-described embodiments are insulated from the wiring of the printed board by an insulating layer or the like. In the above-described embodiment, the metal plates 45, 46, 60, and 61 are fixed to both sides of the printed boards 22 and 51 that have been heat-treated in advance. No thermal expansion on both sides of the printed circuit boardcoefficientThe metal plates 45, 46, 60, 61 having a small diameter may be connected and fixed to each other. Also in this case, the thermal expansion of the printed board can be suppressed by the metal plate. Further, the contact probes 23 and 55 used in each embodiment are provided corresponding to the four sides of the IC chip. Needless to say, the contact probes 23 and 55 having an arbitrary arrangement can be arranged corresponding to the member to be inspected such as a chip. The present invention is not limited to the above-described embodiments, and can be employed in various probe devices.
[0029]
【The invention's effect】
As described above, in the probe device according to the present invention, since the fixing jig for suppressing the thermal expansion of the printed circuit board is fixed to the upper and lower surfaces of the printed circuit board, respectively, Although the printed circuit board thermally expands, thermal deformation of the printed circuit board is suppressed by the fixing jig, and the contact pin of the contact probe connected to the printed circuit board can be prevented from being displaced from the terminal of the member to be inspected.
[0030]
  Also, the fixture is thermally expandedcoefficientSince it is made of a small metal, the thermal expansion of the printed circuit board can be suppressed by the fixing jig, and the displacement of the contact pin can be reliably suppressed.
Also for printed circuit boardsDevice surface (surface with contact probe connected and wiring pattern with large thermal expansion)The first fixing jig fixed to the other surface,That is, the connection surfaceThe thermal expansion coefficient is smaller than that of the second fixing jig fixed to the base plate.With this configuration, although the device surface of the printed circuit board tends to be hotter than the connecting surface on the opposite side and easily expands, it is possible to reliably suppress thermal deformation of the printed circuit board and Can perform well. Further, since the printed circuit board is thermally expanded in advance, the degree of shrinkage of the printed circuit board is reduced even when the temperature is lowered, and the degree of thermal expansion during the test in a high temperature state is also reduced. In addition, since the fixture is fixed so as to surround the connection between the printed circuit board and the contact probe, the thermal expansion of the printed circuit board on the inner side of the fixed jig must be reliably suppressed during testing at high temperatures. Thus, the positional deviation between the contact pin and the member to be inspected can be prevented.
[0031]
In the probe device according to the present invention, the contact probe has a configuration in which the tip end portion of the wiring pattern on which the film is mounted protrudes into a contact pin, and the fixing jig is a mechanical part that connects the contact probe to the pattern wiring on the printed circuit board. Since it is fixed to the printed circuit board on the outer peripheral side of the printed circuit board, the fixing jig can prevent thermal deformation and thermal expansion of the printed circuit board on which the contact probe is fixed with mechanical parts.
The contact probe is a tungsten needle whose tip is a contact pin, and one fixing jig is printed between the pattern wiring of the printed circuit board and the contact probe connecting portion and the holding portion for fixing and holding the contact probe. Because it is fixed to the board, the fixing jig can prevent thermal expansion of the area where the printed board holding part is provided, and at the same time, it suppresses thermal expansion of the contact probe connecting part adjacent to the outer periphery of the fixing jig. it can.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a probe apparatus according to a first embodiment of the present invention.
FIG. 2 is a central longitudinal sectional view of a probe device according to an embodiment.
FIG. 3 is a plan view of a contact probe used in the probe apparatus according to the embodiment.
4 is a cross-sectional view of the contact probe shown in FIG. 3 taken along line AA.
FIG. 5 is a plan view showing a device surface of a printed circuit board of a probe apparatus according to a second embodiment of the present invention.
6 is a plan view showing a connection surface of a printed circuit board of the probe device shown in FIG. 5. FIG.
7 is a central longitudinal sectional view of the probe device shown in FIG. 5. FIG.
FIG. 8 is an exploded perspective view of a probe apparatus according to a modification of the first embodiment.
FIG. 9 is a plan view showing a device surface of a printed circuit board of a probe apparatus using a conventional tungsten needle.
10 is a central longitudinal sectional view of the probe device shown in FIG. 9. FIG.
FIG. 11 is a perspective view of a tip side portion of a conventional contact probe.
FIG.
[Explanation of symbols]
20, 50 probe device
22,51 Printed circuit board
23,55 Contact probe
24 Mechanical parts
26a Contact pin
45,60 1st metal plate
46,61 Second metal plate
54 Tungsten needle
I IC chip

Claims (6)

In a probe device in which a contact probe is connected to a printed circuit board, and contact pins forming the tip of the contact probe protrude from the opening of the printed circuit board, thermal expansion of the printed circuit board is suppressed on the upper and lower surfaces of the printed circuit board. fixed fixture, respectively, said the side printed the contact probe of the substrate are connected, and the first fixture wiring pattern is fixed to one surface which is the side that is provided, the other side A probe device characterized in that the thermal expansion coefficient is smaller than that of the second fixing jig fixed to the surface. The probe apparatus according to claim 1, wherein the fixing jig is made of a metal having a smaller thermal expansion coefficient than the printed board. The probe apparatus according to claim 1 or 2, wherein the printed circuit board is preliminarily heat-expanded at a temperature equal to or higher than a temperature expected in an electrical test of a member to be inspected . The fixture, probe device according to any one of claims 1 to 3, characterized in that it is fixed so as to surround the connecting portion between the printed circuit board and the contact probe. The contact probe has a configuration in which a tip of a wiring pattern on which a film is mounted is projected to be a contact pin, and the fixing jig is on the outer peripheral side of a mechanical part that connects the contact probe to a pattern wiring on a printed circuit board. probe device according to any one of claims 1 to 4, characterized in that it is fixed to the printed circuit board. The contact probe is a tungsten needle whose tip is a contact pin, and one of the fixing jigs is between the pattern wiring of the printed circuit board and the connection portion of the contact probe, and the holding portion for fixing and holding the contact probe. probe device according to any one of claims 1 to 4, characterized in that it is fixed to the printed circuit board.

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