JP2001121412A - Double side surface polisher - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a double side surface polisher which can facilitate automation. SOLUTION: In this double side surface polisher in which a workpiece is arranged in a carrier meshed with a sun gear and an internal gear and is held being clamped between an upper and a lower level block, the carrier revolves around its own axis at a predetermined position without revolving around the sun gear in order to polish the workpiece.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-side polishing apparatus, and more particularly to a polishing apparatus capable of polishing an object to be polished, such as an aluminum disk or a semiconductor wafer, to a desired thickness and easily performing loading and unloading. The present invention also relates to a double-side polishing apparatus capable of coping with the above.

[0002]

2. Description of the Related Art Conventionally, in a double-side polishing apparatus for polishing an object to be polished, such as an aluminum disk or a semiconductor wafer, which is a thin plate, a hole for arranging the object to be polished is provided between an upper and lower platen forming an annular shape. A plurality of gears are provided, and a plurality of carriers having gears formed on the outer periphery are located, and the gears formed on the outer periphery of the carrier are meshed and engaged with the sun gear and the internal gear, and the sun gear and the internal gear are rotated. The carrier is rotated and revolves around the sun gear while rotating the carrier while holding the object to be polished between the upper and lower platens. The thickness of the carrier as described above is configured to be smaller than the thickness of the object to be polished after polishing.

[0003] The use of a carrier thinner than the object to be polished as described above to polish the object by rotating and revolving the carrier has the following problems. ing.

That is, if the thickness of a plurality of objects to be polished located in the holes of the carrier are all the same before polishing, when the carrier and the object to be polished are positioned between the upper and lower platens, the lower platen and the lower platen come together. The polished surface with the upper platen is parallel, and if the polishing is performed in such a state, all the objects to be polished are polished to the desired thickness while the upper and lower platens are kept parallel. can do.

In this case, when the object to be polished is polished, the polishing is always finished in a state where the object to be polished is thicker than the thickness of the carrier.
As a result, there is a problem that the upper and lower peripheral portions cannot be reliably polished.

If the upper platen is not parallel to the lower platen due to the different thicknesses of the objects to be polished in the carrier, the upper platen is not parallel to the lower platen. Since the polishing is performed to the end while the surface plate is still inclined, the thickness of the object to be polished after the polishing is different. Therefore, in order to prevent the thickness of the object to be polished after the polishing is finished, the polishing operation for preventing the dispersion of each object to be polished by rotating and revolving the carrier and the object to be polished located in the hole thereof is performed. Therefore, it is essential to rotate and revolve the carrier and the object to be polished located therein.

[0007] As described above, it is essential to rotate and revolve the carrier and the object to be polished located inside the carrier in order to eliminate the variation in the thickness of the object to be polished after polishing. It's getting worse. That is, since the loading position and the unloading position of the object to be polished are different each time the polishing operation is performed, there is a problem that the operation of positioning the object to be polished at the time of loading and unloading is complicated. This poses a serious problem when polishing an object to be polished such as a semiconductor wafer having a size of 300φ, which is considered to be the mainstream in the future, and significantly reduces the overall efficiency of the polishing operation.

An object of the present invention is to always make the loading position and the unloading position of the object to be polished the same, thereby facilitating the loading operation and the unloading operation and improving the work setup. An object of the present invention is to provide a polishing apparatus. Another object of the present invention is that even if the objects to be polished have different thicknesses, they can be polished with the same thickness after polishing without causing the outer peripheral edge to sag, and the loading position and the unloading position can be adjusted. It is an object of the present invention to provide a double-side polishing apparatus that can always perform the loading operation and the unloading operation at the same position to facilitate the preparation of the operation. Still another object of the present invention is to provide a double-side polishing apparatus capable of polishing an end face after polishing upper and lower faces.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, according to the present invention, an object to be polished is positioned in a carrier meshingly engaged with a sun gear and an internal gear, and upper and lower surfaces are sandwiched between upper and lower stools. A double-side polishing apparatus for polishing the workpiece in such a manner that the carrier rotates only at a predetermined position without revolving around the sun gear to polish the workpiece. Further, the present invention is a double-side polishing apparatus for polishing an object to be polished in a state where an object to be polished is positioned in a carrier which meshes and engages with a sun gear and an internal gear, and the upper and lower surfaces are sandwiched between upper and lower platens. In addition to using a dimensional carrier, the carrier has a configuration in which the carrier only rotates at a predetermined position without revolving around the sun gear to polish the workpiece. Further, the present invention is a double-side polishing apparatus for polishing an object to be polished in a state where an object to be polished is positioned in a carrier which meshes and engages with a sun gear and an internal gear, and the upper and lower surfaces are sandwiched between upper and lower platens. A structure is used in which a carrier is used and the carrier only rotates at a predetermined position without revolving around the sun gear to polish the object to be polished, and thereafter, the end face is polished by an edge polishing device.

[0010]

According to the present invention, the above means are adopted.
The object to be polished positioned on the carrier only rotates at the initial position and does not revolve, so that the object remains at the initial position until the polishing is completed. Since the loading position and the unloading position do not differ each time, the loading and unloading work is performed. In addition, since the carrier is a fixed-size carrier, it is polished to the thickness of the fixed-size carrier, so that there is no danger of the outer peripheral edge of the object to be polished. Furthermore, the end surface can be polished after the upper and lower surfaces are polished.

[0011]

Embodiments of the present invention shown in the drawings will be described below. FIG. 1 is a schematic plan view of a double-side polishing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic front view of the double-side polishing apparatus.

1 and 2, the double-side polishing apparatus according to the present invention is provided with an annular lower platen 1 rotatably provided in a horizontal direction, and is provided above the lower platen 1 so as to face each other, and is also provided in a horizontal direction. It is rotatable and vertically movable by a vertical movement mechanism, and is further mounted on an annular upper surface plate 3 on which an automatic alignment device 2 is mounted, and on the lower surface plate 1 and the upper surface plate 3. It has polishing pads 4 and 5.

The lower platen 1 and the upper platen 3 of the ring
A sun gear 6 is located at the center of the vehicle, and an internal gear 7 is located at the outer peripheral side. A plurality of carriers (three in the figure) that mesh with and engage with the sun gear 6 and the internal gear 7 are provided. 10 is located in a state of being sandwiched between the upper and lower platens 3 and 1, whereby the workpiece 8 held by the carrier 10 is sandwiched between the upper and lower platens 3 and 1 and polished. ing.

The carrier 10 is provided on its outer peripheral surface with teeth 12 which mesh with and engage with the teeth 11 of the sun gear 6 and the teeth 9 of the internal gear 7, and the workpiece 8 which is eccentric with the axis. And a hole 13 for accommodating the carrier 1 by positioning the object 8 to be polished inside the hole 13.
In addition to preventing the workpiece 8 from moving with respect to 0, the carrier 10 moves with respect to the upper and lower platens 3 and 1 when the carrier 10 rotates.

The carrier 10 rotates only at its initial position and does not revolve, because the carrier 10 only rotates and does not revolve according to the rotation direction and the number of rotations of the carrier 10 and the sun gear 6 and the internal gear 7. Hole 13
The object 8 to be polished is rotated at the initial position while the upper and lower platens 3,
1 and is moved and polished.

Reference numeral 14 denotes a loading device for transferring an object to be polished before polishing to a carrier at a loading position;
Reference numeral 15 denotes an unloading device such as a float chuck for moving the object to be polished to an unloading position 16, and reference numeral 17 denotes a high-pressure jet device for dressing the polishing pads 4 and 5.

As the loading device 14, various types are known. For example, a suction head capable of vacuum-sucking the object 8 to be polished {for example, a non-contact transfer device manufactured by Solar Research Laboratories) There is a device having a device｝, which sucks an unprocessed object to be polished 8 by means of a suction head that can rotate and move up and down, and transports the unprocessed material to the hole 13 of the carrier 10. The workpiece 8 is sequentially supplied to the carrier 10 which is sequentially transmitted by intermittently rotating the sun gear 6 and the internal gear 7 by a predetermined angle.

Various types of the unloading device 15 are known. For example, similarly to the loading device 14, the unloading device 15 has a suction head capable of vacuum-sucking the object 8 to be polished. After the object 8 to be polished is lifted, the object 8 is moved along the double-side polishing apparatus to convey the object 8 to the unloading position 16.

Reference numeral 30 denotes an edge polishing device which is continuously arranged at the unloading position. The edge polishing device 30 is shown in FIGS. 3 and 4, and FIG. FIG. 4 is a schematic vertical sectional view. This edge polishing apparatus 30
Has upper and lower platens 32 and 31 for holding the object 8 polished by the double-side polishing apparatus in an eccentric state, and polishing pads 33 and 34 are attached to the surfaces of the upper and lower platens 32 and 31. Have been. Rollers 35 for holding the object 8 to be polished are provided at three places outside the object 8 to be polished, and rollers 36 for holding and polishing the end face of the object 8 are provided at one place. Each is provided. In addition, if necessary, the slurry S can be supplied to the upper surface of the object 8 to be polished.

Therefore, when the upper and lower platens 32 and 31 rotate, the workpiece 8 is held at a predetermined position by the four rollers 35 and 36. Slide on the surface of. Thus, the upper and lower surfaces of the object 8 are polished by the upper and lower platens 32 and 31, and the end surface of the object 8 is polished by the polishing roller 36.

As described above, by using the edge polishing device 30 in a process subsequent to the polishing device, after polishing both surfaces of the object 8 to be polished, the object 8 is taken out from the double-side polishing device, for example, from the unloading position 16 by a float chuck or the like. ,
It is necessary to polish the contact portion with the float chuck again, but this need can be satisfied. Therefore,
The edge polishing apparatus 30 can polish not only the upper and lower surfaces but also the end surface of the object 8 to be polished.

That is, the edge polishing apparatus 3
0 may be configured as a part of the double-side polishing apparatus, or may be configured separately from the double-side polishing apparatus.

Next, the operation of the double-side polishing apparatus when the above-described edge polishing apparatus 30 is not configured as a part of the double-side polishing apparatus will be described. First, a plurality of objects 8 to be polished, which are located in an object to be polished (not shown) with respect to the carrier 10 by the loading device 14.
Supply one of the following. In this case, at the initial position, the hole 13 of the carrier 10 is located in the movement area of the arm of the loading device 14, so that the hole 1 of the carrier 10
The supply of the object to be polished 8 to 3 is easy.

Next, when the sun carrier 6 and the internal gear 7 are rotated to move the next carrier 10 to the position to which the workpiece 8 is supplied, the loading device 14 is similarly moved.
Is located in the range of movement of the arm. Therefore, the object to be polished 8 can be easily supplied to the carrier 10 in the same manner as described above, and thus the object to be polished 8 is supplied to all the carriers 10.

When the above-mentioned double-side polishing apparatus is used,
Since the polished object 8 does not revolve, the carry-in (load) position and the take-out (unload) position are constant. That is,
Since the object to be polished 8 always exists at the same position and is polished, it can be easily taken out by a float chuck or the like after the polishing is completed, which means that it is optimal for automation. It is very effective for a semiconductor wafer or the like, which is the object to be polished 8 having a size of 300φ, which is expected to become mainstream in the future.

As described above, in both cases where the edge polishing device 30 is not included as a double-side polishing device and where the edge polishing device 30 is included, the loading position and the unloading position are constant, so that automation is easy, and Since the loading position is constant, automation is easy even when the edge polishing device 30 is configured as a part of a double-side polishing device.

[0027]

As described above, according to the present invention, only the rotation is performed without revolving the carrier itself. Therefore, the loading position and the unloading position of the object to be polished are always set to the same position. The loading operation and the unloading operation can be facilitated and the operation can be set up well. In addition, while using a fixed-size carrier as the carrier, the object to be polished positioned in the hole of the fixed-size carrier is polished up to the thickness of the fixed-size carrier by rotating only without revolving the fixed-size carrier. Can be polished with the same thickness after polishing, without sagging the outer peripheral edge, and the loading and unloading positions are always set to the same position. The loading operation can be facilitated and the operation can be set up well. Furthermore, when the edge polishing apparatus is partially configured, not only the upper and lower surfaces but also the portion and the end surface that are in contact with other members by conveyance are polished, so that it is easy to automate the polishing of the entire peripheral surface of the object to be polished. This has the effect.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a double-side polishing apparatus according to the present invention.

FIG. 2 is a schematic front view of the double-side polishing apparatus shown in FIG.

FIG. 3 is a schematic plan layout view of the edge polishing apparatus.

FIG. 4 is a schematic front view of the edge polishing apparatus.

[Explanation of symbols]

 1, 31 Lower platen 2 Automatic alignment device 3, 32 Upper platen 4, 5, 33, 34 Polishing pad 6 Sun gear 7 Internal gear 8 Polished object 9, 11, 12 Tooth portion 10 Carrier 13 Hole 14 Loading device 15 Unloading device 16 Unloading position 17 High-pressure jet device 30 Edge polishing device 35, 36 Roller S ... Slurry

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Misao Sugiyama 2647 Hayakawa Hayakawa, Ayase-shi, Kanagawa Prefecture Inside Speed Farm IPEC Co., Ltd. (72) Inventor Takeshi Amano 2647 Hayakawa Hayakawa, Ayase City, Kanagawa Prefecture Inside (72) Inventor Tomohiro Aizawa 2647 Hayakawa, Ayase City, Kanagawa Prefecture Inside Speed Fam Ipec Corporation (72) Inventor Noriaki Mizuno Kanagawa 2647 Hayakawa, Ayase-shi, Iwate F-term (reference) in Speed Farm IPEC Corporation 3C058 AA07 AA16 AB06 AB08 CA01 CB03 DA06 DA09

Claims (3)

[Claims] 1. A double-side polishing apparatus for positioning an object to be polished in a carrier that meshes with and engages with a sun gear and an internal gear, and polishes the upper and lower surfaces thereof with an upper and lower platen, wherein the carrier is the sun gear A double-side polishing apparatus characterized in that the object to be polished is polished by rotating only at a predetermined position without revolving around the object. 2. A double-side polishing apparatus for polishing an object to be polished while positioning an object to be polished in a carrier meshingly engaged with a sun gear and an internal gear, with the upper and lower surfaces held between upper and lower stools. A double-side polishing apparatus, wherein a carrier is used and the carrier only rotates at a predetermined position without revolving around the sun gear to polish the object to be polished. 3. A double-side polishing apparatus for positioning an object to be polished in a carrier that meshes and engages with a sun gear and an internal gear, and polishes the upper and lower surfaces of the object while holding the upper and lower surfaces between the upper and lower surfaces. Using a carrier, the carrier only rotates at a predetermined position without revolving around the sun gear to polish the object to be polished, and thereafter, the end face is polished by an edge polishing device, and a double-side polishing is performed. apparatus.