GB2193036B - Method of fabricating a semiconductor integrated circuit device - Google Patents
Method of fabricating a semiconductor integrated circuit deviceInfo
- Publication number
- GB2193036B GB2193036B GB8717473A GB8717473A GB2193036B GB 2193036 B GB2193036 B GB 2193036B GB 8717473 A GB8717473 A GB 8717473A GB 8717473 A GB8717473 A GB 8717473A GB 2193036 B GB2193036 B GB 2193036B
- Authority
- GB
- United Kingdom
- Prior art keywords
- fabricating
- integrated circuit
- semiconductor integrated
- circuit device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
- H01L21/8249—Bipolar and MOS technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2257—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer being silicon or silicide or SIPOS, e.g. polysilicon, porous silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising semiconducting material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61174861A JPH0734452B2 (en) | 1986-07-24 | 1986-07-24 | Method for manufacturing semiconductor integrated circuit device |
JP18059786A JPS6337642A (en) | 1986-07-31 | 1986-07-31 | Semiconductor integrated circuit device |
JP61216730A JPH0734453B2 (en) | 1986-09-12 | 1986-09-12 | Method for manufacturing semiconductor integrated circuit device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8717473D0 GB8717473D0 (en) | 1987-08-26 |
GB2193036A GB2193036A (en) | 1988-01-27 |
GB2193036B true GB2193036B (en) | 1990-05-02 |
Family
ID=27324011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8717473A Expired - Lifetime GB2193036B (en) | 1986-07-24 | 1987-07-23 | Method of fabricating a semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2193036B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993009599A2 (en) * | 1991-10-30 | 1993-05-13 | Harris Corporation | Analog-to-digital converter and method of fabrication |
US6265752B1 (en) * | 1999-05-25 | 2001-07-24 | Taiwan Semiconductor Manufacturing, Co., Inc. | Method of forming a HVNMOS with an N+ buried layer combined with N well and a structure of the same |
US6461925B1 (en) * | 2000-03-30 | 2002-10-08 | Motorola, Inc. | Method of manufacturing a heterojunction BiCMOS integrated circuit |
US6875648B1 (en) * | 2004-07-09 | 2005-04-05 | Atmel Corporation | Fabrication of an EEPROM cell with emitter-polysilicon source/drain regions |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0052450A1 (en) * | 1980-10-29 | 1982-05-26 | Fujitsu Limited | Method of manufacturing a semiconductor device with polycrystalline semiconductor cum metal electrodes |
GB2179792A (en) * | 1985-08-28 | 1987-03-11 | Mitsubishi Electric Corp | Bipolar transistor |
EP0252206A2 (en) * | 1986-07-09 | 1988-01-13 | Hitachi, Ltd. | Method of fabricating semiconductor structure |
-
1987
- 1987-07-23 GB GB8717473A patent/GB2193036B/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0052450A1 (en) * | 1980-10-29 | 1982-05-26 | Fujitsu Limited | Method of manufacturing a semiconductor device with polycrystalline semiconductor cum metal electrodes |
GB2179792A (en) * | 1985-08-28 | 1987-03-11 | Mitsubishi Electric Corp | Bipolar transistor |
EP0252206A2 (en) * | 1986-07-09 | 1988-01-13 | Hitachi, Ltd. | Method of fabricating semiconductor structure |
Also Published As
Publication number | Publication date |
---|---|
GB8717473D0 (en) | 1987-08-26 |
GB2193036A (en) | 1988-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
746 | Register noted 'licences of right' (sect. 46/1977) |
Effective date: 19950810 |
|
PE20 | Patent expired after termination of 20 years |
Effective date: 20070722 |