GB2193036B - Method of fabricating a semiconductor integrated circuit device - Google Patents

Method of fabricating a semiconductor integrated circuit device

Info

Publication number
GB2193036B
GB2193036B GB8717473A GB8717473A GB2193036B GB 2193036 B GB2193036 B GB 2193036B GB 8717473 A GB8717473 A GB 8717473A GB 8717473 A GB8717473 A GB 8717473A GB 2193036 B GB2193036 B GB 2193036B
Authority
GB
United Kingdom
Prior art keywords
fabricating
integrated circuit
semiconductor integrated
circuit device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB8717473A
Other versions
GB8717473D0 (en
GB2193036A (en
Inventor
Tadashi Hirao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61174861A external-priority patent/JPH0734452B2/en
Priority claimed from JP18059786A external-priority patent/JPS6337642A/en
Priority claimed from JP61216730A external-priority patent/JPH0734453B2/en
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB8717473D0 publication Critical patent/GB8717473D0/en
Publication of GB2193036A publication Critical patent/GB2193036A/en
Application granted granted Critical
Publication of GB2193036B publication Critical patent/GB2193036B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248Combination of bipolar and field-effect technology
    • H01L21/8249Bipolar and MOS technology
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251Diffusion into or out of group IV semiconductors
    • H01L21/2254Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H01L21/2257Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer being silicon or silicide or SIPOS, e.g. polysilicon, porous silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28525Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising semiconducting material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
GB8717473A 1986-07-24 1987-07-23 Method of fabricating a semiconductor integrated circuit device Expired - Lifetime GB2193036B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61174861A JPH0734452B2 (en) 1986-07-24 1986-07-24 Method for manufacturing semiconductor integrated circuit device
JP18059786A JPS6337642A (en) 1986-07-31 1986-07-31 Semiconductor integrated circuit device
JP61216730A JPH0734453B2 (en) 1986-09-12 1986-09-12 Method for manufacturing semiconductor integrated circuit device

Publications (3)

Publication Number Publication Date
GB8717473D0 GB8717473D0 (en) 1987-08-26
GB2193036A GB2193036A (en) 1988-01-27
GB2193036B true GB2193036B (en) 1990-05-02

Family

ID=27324011

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8717473A Expired - Lifetime GB2193036B (en) 1986-07-24 1987-07-23 Method of fabricating a semiconductor integrated circuit device

Country Status (1)

Country Link
GB (1) GB2193036B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993009599A2 (en) * 1991-10-30 1993-05-13 Harris Corporation Analog-to-digital converter and method of fabrication
US6265752B1 (en) * 1999-05-25 2001-07-24 Taiwan Semiconductor Manufacturing, Co., Inc. Method of forming a HVNMOS with an N+ buried layer combined with N well and a structure of the same
US6461925B1 (en) * 2000-03-30 2002-10-08 Motorola, Inc. Method of manufacturing a heterojunction BiCMOS integrated circuit
US6875648B1 (en) * 2004-07-09 2005-04-05 Atmel Corporation Fabrication of an EEPROM cell with emitter-polysilicon source/drain regions

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0052450A1 (en) * 1980-10-29 1982-05-26 Fujitsu Limited Method of manufacturing a semiconductor device with polycrystalline semiconductor cum metal electrodes
GB2179792A (en) * 1985-08-28 1987-03-11 Mitsubishi Electric Corp Bipolar transistor
EP0252206A2 (en) * 1986-07-09 1988-01-13 Hitachi, Ltd. Method of fabricating semiconductor structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0052450A1 (en) * 1980-10-29 1982-05-26 Fujitsu Limited Method of manufacturing a semiconductor device with polycrystalline semiconductor cum metal electrodes
GB2179792A (en) * 1985-08-28 1987-03-11 Mitsubishi Electric Corp Bipolar transistor
EP0252206A2 (en) * 1986-07-09 1988-01-13 Hitachi, Ltd. Method of fabricating semiconductor structure

Also Published As

Publication number Publication date
GB8717473D0 (en) 1987-08-26
GB2193036A (en) 1988-01-27

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19950810

PE20 Patent expired after termination of 20 years

Effective date: 20070722