EP2484787A4 - Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME - Google Patents
Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAMEInfo
- Publication number
- EP2484787A4 EP2484787A4 EP09849834.8A EP09849834A EP2484787A4 EP 2484787 A4 EP2484787 A4 EP 2484787A4 EP 09849834 A EP09849834 A EP 09849834A EP 2484787 A4 EP2484787 A4 EP 2484787A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper alloy
- electronic material
- producing same
- producing
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title 1
- 229910018598 Si-Co Inorganic materials 0.000 title 1
- 229910008453 Si—Co Inorganic materials 0.000 title 1
- 239000012776 electronic material Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/066794 WO2011036804A1 (en) | 2009-09-28 | 2009-09-28 | Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2484787A1 EP2484787A1 (en) | 2012-08-08 |
| EP2484787A4 true EP2484787A4 (en) | 2013-06-05 |
| EP2484787B1 EP2484787B1 (en) | 2015-01-07 |
Family
ID=43795574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP09849834.8A Active EP2484787B1 (en) | 2009-09-28 | 2009-09-28 | Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2484787B1 (en) |
| JP (1) | JP5506806B2 (en) |
| KR (1) | KR20120054099A (en) |
| CN (1) | CN102549180A (en) |
| WO (1) | WO2011036804A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8821477B2 (en) | 2007-08-06 | 2014-09-02 | Boston Scientific Scimed, Inc. | Alternative micromachined structures |
| US8795254B2 (en) | 2008-12-10 | 2014-08-05 | Boston Scientific Scimed, Inc. | Medical devices with a slotted tubular member having improved stress distribution |
| WO2011123689A1 (en) | 2010-03-31 | 2011-10-06 | Boston Scientific Scimed, Inc. | Guidewire with a flexural rigidity profile |
| JP6246454B2 (en) * | 2011-11-02 | 2017-12-13 | Ｊｘ金属株式会社 | Cu-Ni-Si alloy and method for producing the same |
| JP5770113B2 (en) * | 2012-01-13 | 2015-08-26 | Jx日鉱日石金属株式会社 | Metal foil composite, molded body and method for producing the same |
| US9901706B2 (en) | 2014-04-11 | 2018-02-27 | Boston Scientific Scimed, Inc. | Catheters and catheter shafts |
| JP6310004B2 (en) * | 2016-05-27 | 2018-04-11 | Ｊｘ金属株式会社 | Cu-Co-Ni-Si alloy for electronic parts |
| CN106244849A (en) * | 2016-10-13 | 2016-12-21 | 龙岩学院 | A kind of preparation method of intensified by ultrasonic wave high property copper alloy |
| CN108642419A (en) * | 2018-05-31 | 2018-10-12 | 太原晋西春雷铜业有限公司 | A kind of corson alloy band and preparation method thereof that bending is excellent |
| JP7451964B2 (en) * | 2019-01-16 | 2024-03-19 | 株式会社プロテリアル | Cu alloy plate and its manufacturing method |
| CN110195166A (en) * | 2019-04-17 | 2019-09-03 | 宁波兴业盛泰集团有限公司 | A kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method |
| CN112410646A (en) * | 2020-10-16 | 2021-02-26 | 扬州千裕电气有限公司 | Electronic composite material |
| CN113234958A (en) * | 2021-04-25 | 2021-08-10 | 江苏青益金属科技股份有限公司 | Alloy wire suitable for constant-temperature sheath of petroleum delivery pipeline and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040079456A1 (en) * | 2002-07-02 | 2004-04-29 | Onlin Corporation | Copper alloy containing cobalt, nickel and silicon |
| EP1876250A1 (en) * | 2005-03-31 | 2008-01-09 | Nippon Mining & Metals Co., Ltd. | Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF |
| JP2008106356A (en) * | 2006-09-27 | 2008-05-08 | Dowa Metaltech Kk | Copper alloy sheet and its manufacturing method |
| US20080190524A1 (en) * | 2007-02-13 | 2008-08-14 | Weilin Gao | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
| JP2008266783A (en) * | 2007-03-26 | 2008-11-06 | Furukawa Electric Co Ltd:The | Copper alloy for electrical/electronic device and method for manufacturing the same |
| JP2009007666A (en) * | 2007-05-31 | 2009-01-15 | Furukawa Electric Co Ltd:The | Copper alloy for electrical and electronic equipment |
| WO2009082695A1 (en) * | 2007-12-21 | 2009-07-02 | Gbc Metals Llc | Copper-nickel-silicon alloys |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01122264A (en) | 1987-11-05 | 1989-05-15 | Nec Corp | Image output device |
| JP3408021B2 (en) | 1995-06-30 | 2003-05-19 | 古河電気工業株式会社 | Copper alloy for electronic and electric parts and method for producing the same |
| WO2006101172A1 (en) | 2005-03-24 | 2006-09-28 | Nippon Mining & Metals Co., Ltd. | Copper alloy for electronic material |
| JP4596490B2 (en) * | 2008-03-31 | 2010-12-08 | Ｊｘ日鉱日石金属株式会社 | Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same |
-
2009
- 2009-09-28 JP JP2011532878A patent/JP5506806B2/en active Active
- 2009-09-28 CN CN2009801616889A patent/CN102549180A/en active Pending
- 2009-09-28 WO PCT/JP2009/066794 patent/WO2011036804A1/en active Application Filing
- 2009-09-28 EP EP09849834.8A patent/EP2484787B1/en active Active
- 2009-09-28 KR KR1020127009709A patent/KR20120054099A/en not_active Application Discontinuation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040079456A1 (en) * | 2002-07-02 | 2004-04-29 | Onlin Corporation | Copper alloy containing cobalt, nickel and silicon |
| EP1876250A1 (en) * | 2005-03-31 | 2008-01-09 | Nippon Mining & Metals Co., Ltd. | Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF |
| JP2008106356A (en) * | 2006-09-27 | 2008-05-08 | Dowa Metaltech Kk | Copper alloy sheet and its manufacturing method |
| US20080190524A1 (en) * | 2007-02-13 | 2008-08-14 | Weilin Gao | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
| JP2008266783A (en) * | 2007-03-26 | 2008-11-06 | Furukawa Electric Co Ltd:The | Copper alloy for electrical/electronic device and method for manufacturing the same |
| JP2009007666A (en) * | 2007-05-31 | 2009-01-15 | Furukawa Electric Co Ltd:The | Copper alloy for electrical and electronic equipment |
| WO2009082695A1 (en) * | 2007-12-21 | 2009-07-02 | Gbc Metals Llc | Copper-nickel-silicon alloys |
Non-Patent Citations (2)
| Title |
|---|
| H.-A. KUHN ET AL: "A new high performance copper based alloy for electro-mechanical connectors", MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, vol. 38, no. 8, 1 August 2007 (2007-08-01), pages 624 - 634, XP055060686, ISSN: 0933-5137, DOI: 10.1002/mawe.200700152 * |
| See also references of WO2011036804A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2484787A1 (en) | 2012-08-08 |
| KR20120054099A (en) | 2012-05-29 |
| JP5506806B2 (en) | 2014-05-28 |
| JPWO2011036804A1 (en) | 2013-02-14 |
| CN102549180A (en) | 2012-07-04 |
| EP2484787B1 (en) | 2015-01-07 |
| WO2011036804A1 (en) | 2011-03-31 |
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