DE69838849D1 - Mehrchipmodulstruktur und seine herstellung - Google Patents

Mehrchipmodulstruktur und seine herstellung

Info

Publication number
DE69838849D1
DE69838849D1 DE69838849T DE69838849T DE69838849D1 DE 69838849 D1 DE69838849 D1 DE 69838849D1 DE 69838849 T DE69838849 T DE 69838849T DE 69838849 T DE69838849 T DE 69838849T DE 69838849 D1 DE69838849 D1 DE 69838849D1
Authority
DE
Germany
Prior art keywords
manufacture
modular structure
multiple modular
modular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69838849T
Other languages
English (en)
Other versions
DE69838849T2 (de
Inventor
Kenji Sekine
Hiroji Yamada
Matsuo Yamasaki
Osamu Kagaya
Kiichi Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25958997A external-priority patent/JP3840761B2/ja
Priority claimed from JP6972798A external-priority patent/JP3815033B2/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE69838849D1 publication Critical patent/DE69838849D1/de
Application granted granted Critical
Publication of DE69838849T2 publication Critical patent/DE69838849T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

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    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE69838849T 1997-08-19 1998-08-19 Mehrchip-Modulstruktur und deren Herstellung Expired - Lifetime DE69838849T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP22222997 1997-08-19
JP22222997 1997-08-19
JP25958997 1997-09-25
JP25958997A JP3840761B2 (ja) 1997-09-25 1997-09-25 マルチチップモジュールおよびその製造方法
JP6972798A JP3815033B2 (ja) 1997-08-19 1998-03-19 マルチチップモジュール用ベース基板の作製方法
JP6972798 1998-03-19
PCT/JP1998/003668 WO1999009595A1 (en) 1997-08-19 1998-08-19 Multichip module structure and method for manufacturing the same

Publications (2)

Publication Number Publication Date
DE69838849D1 true DE69838849D1 (de) 2008-01-24
DE69838849T2 DE69838849T2 (de) 2008-12-11

Family

ID=27300121

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69838849T Expired - Lifetime DE69838849T2 (de) 1997-08-19 1998-08-19 Mehrchip-Modulstruktur und deren Herstellung

Country Status (6)

Country Link
US (1) US6495914B1 (de)
EP (1) EP1030369B1 (de)
KR (1) KR100543836B1 (de)
CN (1) CN1167131C (de)
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CN1167131C (zh) 2004-09-15
EP1030369A1 (de) 2000-08-23
CN1267396A (zh) 2000-09-20
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DE69838849T2 (de) 2008-12-11
KR20010023024A (ko) 2001-03-26
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KR100543836B1 (ko) 2006-01-23
US6495914B1 (en) 2002-12-17

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