DE102021108565A1 - Component connection and method for releasing a component connection - Google Patents

Abstract

Component connection, comprising a first component and a second component, which are attached to one another via an adhesive layer along a joint area, a functional layer being provided between the first component and/or the second component (2), via which the component connection is made when temperature is introduced into the joint area can be solved.

Description

The present invention relates to a component connection and a method for releasing a component connection.

Component connections of the type in question are basically known from the prior art. This can be, for example, glued connections. Such component or adhesive connections are often used, for example in the field of motor vehicle technology. For example, the DE 10 2011 088 739 A1 a housing for a battery cell with a lacquer coating for electrical insulation. The paint coating contains particles containing adhesive. Such housings of battery cells are therefore, for example, glued to one another or to one another within a battery module. The cell housing can also be attached to a cooling module by means of adhesive, etc. The problem, however, is that such adhesive connections can often only be loosened again with great effort in the event of service. Working with a cutting wire, for example, is known for releasing adhesive connections. However, the accessibility in a battery module, for example, is not sufficient. The melting of the adhesive is also difficult because, for example, a cell module is stiff and therefore cannot be levered out locally. Poor accessibility also plays a major role here. As a result, there is a risk that the melted adhesive will solidify again while the respective part is being dismantled.

It is therefore an object of the present invention to specify a component connection and a method for releasing a component connection which eliminates the aforementioned problems and in particular enables simple maintenance and service.

This object is achieved by a component connection according to claim 1 and by a method according to claim 6. Further advantages and features emerge from the subclaims and the description and the attached figures.

According to the invention, a component connection comprises a first component and a second component, which are attached to one another via at least one adhesive layer along at least one joining area, with a functional layer being provided at least between the adhesive layer and the first component and/or the second component, i.e. in particular at least in the joining area is via which the component connection can be released when temperature is introduced into the joining area. Expediently, the component connection is not released indirectly via the adhesive layer but via the functional layer. The functional layer can be applied, preferably directly, to the first component and/or to the second component, preferably at least in regions, particularly preferably completely or over the entire surface.

The functional layer expediently brings with it the technical property that it is destroyed under the influence of temperature. In other words, the cohesion of the functional layer is broken, preferably irreversibly, by increasing the temperature of the functional layer or within the functional layer above a (temperature) limit value. In other words, the cohesion of the functional layer is broken. This advantageously enables the two components to be released from one another in a controlled manner. The aforementioned limit value depends on the material of the functional layer.

It has been found that this approach is much easier to implement in practice than, for example, destroying the adhesive layer.

According to a preferred embodiment, the functional layer is a paint and/or anti-corrosion layer, in particular a KTL layer, which is applied to the first and/or the second component. Cathodic dip painting (KTL) is an electrochemical process in which a workpiece or component is coated in a dip bath. Above a temperature limit of around 230° to 260° C, the KTL layer decomposes or is destroyed. In particular, a binder or binder within the KTL layer is destroyed. As a result, the two components can be removed from each other. The functional layer can also be a lacquer, primer or a coating, etc., which is provided and applied as an adhesive base for the adhesive layer.

According to a preferred embodiment, the adhesive layer is an adhesive layer. This can be a one-component or a two-component adhesive. The adhesive material is expediently selected in such a way that its limit temperature, ie the temperature at which melting or decomposition/destruction of the adhesive material begins, is above the limit temperature of the adhesive layer.

According to a preferred embodiment, the component connection is used in a motor vehicle. According to one embodiment, the two components are, for example, battery housings of energy storage cells, such as lithium-ion cells. This can be round cells or prismatic cells, for example. The first component can, according to one embodiment also be a battery cell housing and the second component is a battery module or a structure of a battery module, such as a base and/or cooling element. In this context, the second component can, for example, also be a cooling element, such as a cooling plate or the like. Likewise, according to one embodiment, the first component can be a cover element of a high-voltage battery and the second component can be a lower part of a high-voltage battery. The first component can also be a structure or a frame of a motor vehicle, with the second component being a high-voltage battery which is fastened to the frame. The aforementioned examples are to be understood without restricting the generality.

• - Zerstören der Funktionsschicht durch Temperatureinleitung in den Fügebereich zum Lösen der Bauteilverbindung.

The invention also relates to a method for releasing a component connection according to the invention, comprising the step:

• - Destruction of the functional layer by introducing heat into the joining area to loosen the component connection.

A particularly local heat input advantageously takes place. This ensures that no limit temperatures of the surrounding components or component sections are exceeded. The expression "destroy" means in particular the irreversible breaking of a material cohesion within the functional layer.

According to a preferred embodiment, the temperature is introduced by means of induction. The joining area is expediently scanned with an induction probe or with an induction device. In particular, the introduction of temperature by means of induction enables a very targeted introduction of heat, so that surrounding components or component areas are not negatively affected.

As already mentioned, the method expediently includes destroying a binder in the functional layer. The functional layer is expediently irreversibly destroyed by the introduction of temperature.

• - Lösen der Bauteilverbindung;
• - Erneuern der Funktionsschicht.

According to one embodiment, the method comprises the steps:

• - loosening the component connection;
• - Renewal of the functional layer.

If the functional layer is destroyed, the first component can be detached from the second or the second component from the first with little additional effort. For the installation of a replacement component, the surface is expediently cleaned and provided with a repair coating/functional layer. The functional layer is therefore expediently renewed locally. A new component can then be attached.

Expediently, the temperature is monitored when the functional layer is destroyed.

Further advantages and features emerge from the following description of embodiments of the method with reference to the attached figures.

• 1: eine schematische Ansicht einer Ausführungsform einer Bauteilverbindung;
• 2: die aus der 1 bekannte Skizze nach dem Lösen der beiden Bauteile voneinander;
• 3: eine weitere schematische Ansicht einer Ausführungsform einer Bauteilverbindung;
• 4: die aus der 3 bekannte Skizze nach dem Lösen der beiden Bauteile voneinander.

Show it:

• 1 1: a schematic view of an embodiment of a component connection;
• 2 : the ones from the 1 known sketch after detaching the two components from each other;
• 3 1: a further schematic view of an embodiment of a component connection;
• 4 : the ones from the 3 known sketch after detaching the two components from each other.

1 shows a first component 1 in a schematic view. In the present case, this is, for example, a prismatic battery cell housing. The first component 1 is attached to a second component 2 . The second component 2 is, for example, part of a structure of a battery module or a cooling plate. The two components 1 and 2 are fastened to one another via adhesive layers 20. A functional layer 30 is provided on the second component 2. FIG. This is, for example, a KTL layer. The first component 1 is therefore not glued directly to the second component 2, but indirectly via the functional layer 30, see also the joining areas, which are outlined with the reference number 12. The two components 1 and 2 are now expediently separated by local introduction of heat into the joining areas 12, cf 2 .

2 shows the one from the 1 known sketch, whereby the first component 1 has already been removed from the second component 2. It is shown schematically that the functional layer 30 is locally dissolved or destroyed. As a result, the first component 1 together with the adhesive layers 20 can be removed without any problems.

3 shows a further schematic view, the first component 1 being, for example, a structure of a vehicle to which a second component 2, which is sketched here as a high-voltage storage housing, is attached by means of two adhesive layers 20. Functional layers 30 are provided in each case in the respective joining regions 12 between the adhesive layers 20 and the second component 2 . This can be about a primer or an adhesion base for the adhesive layer 20, which is expediently an adhesive layer in the present case, or a KTL layer. A detachment of the two components 1 and 2 from one another is expediently initiated by introducing a local temperature into the joining areas 12 .

4 shows the one from the 3 well-known sketch, only the right area is shown here. The two components 1 and 2 are separated from each other. This is made possible by the destruction of the functional layer 30 as a result of the introduction of temperature.

Reference List

1

first component

2

second component

12

joining area

20

adhesive layer

30

functional layer

QUOTES INCLUDED IN DESCRIPTION

This list of the documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• DE 102011088739 A1 [0002]

Claims (9)

component connection, comprising a first component (1) and a second component (2), which are attached to one another via at least one adhesive layer (20) along at least one joining area (12), a functional layer (30) being provided between the adhesive layer (20) and the first component (1) and/or the second component (2), via which the component connection can be released when temperature is introduced into the joining region (12). component connection claim 1 , wherein the functional layer (30) is designed such that it is destroyed when exposed to temperature. component connection claim 1 or 2 , wherein the functional layer (30) is a lacquer and/or anti-corrosion layer, in particular a KTL coating. Component connection according to one of the preceding claims, wherein the adhesive layer (20) is an adhesive layer. Component connection according to one of the preceding claims, wherein the component connection is used in a motor vehicle. Method for releasing a component connection according to one of the preceding claims, comprising the step: - Destroying the functional layer (30) by introducing temperature into the joining area (12) to release the component connection. procedure after claim 6 , comprising the step: - temperature introduction by induction. Procedure according to one of Claims 6 - 7 , comprise the step: - Destroying a binder in the functional layer (30). Procedure according to one of Claims 6 until 8th , comprising the steps of: - releasing the component connection; - Renewal of the functional layer (30).

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