CN217508805U

CN217508805U - Electronic device

Info

Publication number: CN217508805U
Application number: CN202220383364.2U
Authority: CN
Inventors: 李江涛
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-02-22
Filing date: 2022-02-22
Publication date: 2022-09-27
Anticipated expiration: 2032-02-22

Abstract

The application provides an electronic device, the electronic device includes: the middle frame, the main board and the microphone assembly; the middle frame comprises a middle plate and a frame extending from the edge of the middle plate, the middle plate and the frame form an accommodating space in a surrounding mode, and the frame is provided with a first sound pickup hole communicated with the accommodating space; the mainboard is accommodated in the accommodating space and is arranged on the middle plate; the microphone assembly is accommodated in the accommodating space and is connected with the middle frame; wherein, the microphone subassembly includes: the circuit board is arranged on the middle plate, the microphone is arranged on the circuit board, and the sound guide support is arranged on one side of the circuit board, which is far away from the microphone; the sound guide bracket is provided with a sound guide channel which is communicated with the first sound pickup hole and the microphone; the projection of the microphone on the middle plate and the projection of the main board on the middle plate are staggered. The electronic equipment provided by the embodiment of the application can avoid forming a structure that the microphone and the mainboard are stacked by arranging the microphone on the circuit board in a staggered manner, so that the thickness of the whole electronic equipment can be reduced.

Description

Electronic device

Technical Field

The application relates to the technical field of electronic equipment structures, in particular to electronic equipment.

Background

Acoustic devices such as microphones, which are important as accessories for electronic devices such as mobile phones, are generally mounted on a main board of the electronic device to convert sound signals into electrical signals under the control of the main board. However, based on the internal layout space limitation of the electronic device, the technical solution of the microphone on the motherboard cannot meet the thinning requirement of the electronic device.

SUMMERY OF THE UTILITY MODEL

An embodiment of the present application provides an electronic device, which includes: the middle frame, the main board and the microphone assembly; the middle frame comprises a middle plate and a frame extending from the edge of the middle plate, an accommodating space is enclosed by the middle plate and the frame, and the frame is provided with a first sound pickup hole communicated with the accommodating space; the mainboard is accommodated in the accommodating space and is arranged on the middle plate; the microphone assembly is accommodated in the accommodating space and is connected with the middle frame; wherein the microphone assembly comprises: the circuit board is arranged on the middle plate, the microphone is arranged on the circuit board, and the sound guide support is arranged on one side of the circuit board, which is far away from the microphone; the sound guide bracket is provided with a sound guide channel which is communicated with the first sound pickup hole and the microphone; the projection of the microphone on the middle plate and the projection of the main board on the middle plate are staggered.

The electronic equipment provided by the embodiment of the application can avoid forming a stacked structure of the microphone and the mainboard by arranging the microphone on the circuit board and staggering the microphone and the mainboard, so that the thickness of the whole electronic equipment can be reduced. In addition, the communication between the microphone and the first sound pickup hole is realized by the sound guide support, the position of the first sound pickup hole on the frame can be flexibly arranged, for example, the first sound pickup hole can be arranged in the middle of the frame, so that the appearance aesthetic feeling of the electronic equipment is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of an electronic device in some embodiments of the present application;

FIG. 2 is a schematic diagram of the electronic device in FIG. 1 with a split structure;

FIG. 3 is a schematic diagram of a portion of an electronic device in some embodiments of the present application;

FIG. 4 is a schematic diagram of the electronic device in FIG. 3 with a split structure;

FIG. 5 is a schematic diagram of the electronic device in FIG. 3 with a partially disassembled structure;

FIG. 6 is a schematic view of the sound guide bracket of FIG. 3 in a disassembled structure;

FIG. 7 is a cross-sectional view of the sound guide holder of the embodiment of FIG. 6 in cooperation with the middle frame;

FIG. 8 is a schematic structural diagram of a sound guide bracket in the embodiment of FIG. 6;

FIG. 9 is a block diagram illustrating the structure of an electronic device in further embodiments of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

It should be noted that the electronic device in the embodiment of the present application is mainly directed to an electronic device having a microphone. The microphone can be used for converting acoustic signals into electric signals, and the microphone is used for converting acoustic signals into electric signals. It can be understood that the electronic device in the embodiment of the present application may be a smart device with a microphone, such as a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, an in-vehicle device, and a wearable device.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device 100 according to some embodiments of the present application, and fig. 2 is a schematic structural diagram of the electronic device 100 according to fig. 1.

The electronic device 100 provided in the embodiment of the present application may specifically be a mobile phone, a tablet computer, a notebook computer, and the like, and the following description will be given by taking the electronic device 100 as a mobile phone. The electronic device 100 generally includes a display screen 10, a middle frame 20, and a rear cover 30. Wherein the display screen 10 may be coupled to one side of the middle frame 20, and the rear cover 30 may be coupled to the other opposite side of the middle frame 20. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.

Specifically, the display screen 10 may be used to provide an image display function for the electronic device 100, and the display screen 10 may be covered on one side of the middle frame 20, and may be fixed by an adhesive. The display screen 10 may include a transparent cover plate, a touch panel, and a display panel, which are sequentially stacked. The surface of the transparent cover plate can have the characteristics of flatness and smoothness, so that a user can conveniently perform touch operations such as clicking, sliding and pressing. The transparent cover plate may be made of a rigid material such as glass, or may be made of a flexible material such as Polyimide (PI) or Colorless Polyimide (CPI). The touch panel is disposed between the transparent cover and the display panel, and is configured to respond to a touch operation of a user, convert the touch operation into an electrical signal, and transmit the electrical signal to the processor of the electronic device 100, so that the electronic device 100 can make a corresponding response to the touch operation of the user. The display panel is mainly used for displaying pictures and can be used as an interactive interface to instruct a user to perform the touch operation on the transparent cover plate. The Display panel may adopt an OLED (Organic Light-Emitting Diode) or an LCD (Liquid Crystal Display) to realize an image Display function of the electronic device 100. In this embodiment, the transparent cover plate, the touch panel and the display panel may be attached together by using an optical Adhesive (OCA) or a Pressure Sensitive Adhesive (PSA). Meanwhile, the display screen 10 may be a double curved screen or a four curved screen in appearance to reduce a black edge of the display screen 10 and increase a visible area of the display screen 10. Accordingly, the display screen 10 may be a conventional flat screen, and only the display screen 10 can implement the graphic display function of the electronic device 100.

As shown in fig. 2, the middle frame 20 may include a middle plate 21 and a frame 22 surrounding at least a portion of an outer periphery of the middle plate 21, which are integrally formed by injection molding, punch forming, heat-absorbing forming, or the like. The frame 22 may be formed by extending the side wall of the middle plate 21 in the thickness direction of the middle plate 21, so that both sides of the middle frame 20 opposite to each other may form a corresponding open structure. The display screen 10 and the rear cover 30 may cover the open structures on two opposite sides of the middle frame 20, respectively, so as to form an accommodating space of the electronic device 100 together with the middle frame 20. The accommodating space may be used to mount electronic devices required by the electronic apparatus 100, such as a battery, a sensor, a circuit board, a camera, and the like. In some embodiments, the middle plate 21 and the side frame 22 may also be two independent structural members, and the two may be connected by one of assembling methods such as clamping, bonding, welding, and the like, and a combination thereof. Alternatively, the middle frame 20 may include only the rim 22.

In addition, the material of the middle frame 20 may be glass, metal, hard plastic, etc., so that the middle frame 20 has a certain structural strength. Because the middle frame 20 is generally directly exposed to the external environment, the middle frame 20 may also have certain wear-resistant, corrosion-resistant, scratch-resistant, and other properties, or the outer surface of the middle frame 20 (i.e., the outer surface of the electronic device 100) may be coated with a layer of functional material for wear-resistant, corrosion-resistant, scratch-resistant, and the like. In addition, in some embodiments, a corresponding brand identifier (LOGO) may be further disposed on the middle frame 20 to beautify the appearance of the electronic device 100 and improve brand recognition.

Further, the middle frame 20 is disposed between the display screen 10 and the rear cover 30, and is respectively connected to the display screen 10 and the rear cover 30 to form an integral structural frame of the electronic device 100. In the structural application of the electronic device 100, the middle frame 20 is generally used to carry or fix electronic components of the electronic device 100, such as a circuit board, a battery, a camera, a sensing device, or a microphone.

Referring to fig. 3 and 4, fig. 3 is a partial structural schematic diagram of an electronic device 100 according to some embodiments of the present application, and fig. 4 is a structural split schematic diagram of the electronic device 100 according to the embodiment of fig. 3. The middle frame 20 generally includes a middle plate 21 and a frame 22 surrounding at least a portion of an outer periphery of the middle plate 21, the middle plate 21 and the frame 22 surround a receiving space 101 forming the electronic device 100, and the frame 22 is opened with a first sound pickup hole 220 communicating with the receiving space 101. The electronic device 100 may further include a main board 40 and a microphone assembly 50, wherein the main board 40 is accommodated in the accommodating space 101 and is disposed on the middle plate 21. The microphone assembly 50 is accommodated in the accommodating space 101 and connected to the middle frame 20 for positioning and assembling. The microphone assembly 50 is electrically connected to the main board 40, so that the microphone assembly 50 can convert the sound signal received from the first sound pickup hole 220 into an electrical signal under the control of the main board 40.

Specifically, the main board 40 may be assembled on the middle plate 21 of the middle frame 20, and may be fixed to the middle plate 21 by bonding, snapping, welding, or the like. In one embodiment, the middle plate 21 may be provided with a connecting structure in the shape of a convex pillar, a threaded pillar, or the like for positioning and connecting the main plate 40. Of course, in other embodiments, the middle plate 21 may further have a mounting groove or a mounting hole, so that the main board 40 may be at least partially embedded in the mounting groove or the mounting hole, so as to reduce the overall thickness of the electronic device 100 to a certain extent.

It can be understood that the electronic device 100 may further include a battery accommodated in the accommodating space 101, and the main board 40 may be electrically connected to the display screen 10, the battery, and other devices respectively, so as to implement corresponding functions of the electronic device 100 under the control of the main board 40.

In one embodiment, the microphone assembly 50 generally includes a circuit board 51 disposed on the middle plate 21, a microphone 52 disposed on the circuit board 51, and a sound guide bracket 53 disposed on a side of the circuit board 51 facing away from the microphone 52. The sound guide bracket 53 is provided with a sound guide channel (not shown in the drawings and described in detail below) communicating the first sound pickup hole 220 and the microphone 52, and the sound guide channel has one end communicating with the first sound pickup hole 220 and the other end communicating with the microphone 52, so that the sound signal picked up by the first sound pickup hole 220 can be conducted to the microphone 52 through the sound guide channel. The sound guide bracket 53 can be connected and fixed with the middle frame 20 by means of bonding, fastening, welding and the like.

Preferably, the circuit board 51 has a second sound pickup hole 510 formed therein, and the second sound pickup hole 510 is disposed corresponding to the microphone 52, so that the sound signal can be transmitted to the microphone 52 through the second sound pickup hole 510. In other words, one end of the sound guide channel communicates with the first sound pickup hole 220, and the other end communicates with the second sound pickup hole 510.

Further, the circuit board 51 is disposed between the sound guide bracket 53 and the middle plate 21, the main plate 40 is disposed between the sound guide bracket 53 and the middle plate 21, and the circuit board 51 is electrically connected to the main plate 40. The circuit board 51 may be fixed to the middle plate 21 by bonding, fastening, welding, or the like, and the microphone 52 may be fixed to the circuit board 51 by a patch.

The projection of the microphone 52 on the middle plate 21 and the projection of the main board 40 on the middle plate 21 are arranged in a staggered manner, so as to avoid forming a stacked structure of the microphone 52 and the main board 40, which is not favorable for the thinning design of the electronic device 100. Preferably, the microphone 52 is disposed on a side of the circuit board 51 close to the middle plate 21, and the main board 40 is disposed on a side of the circuit board 51 away from the middle plate 21.

It can be understood that, compared with the technical scheme that the microphone 52 is directly attached to the motherboard 40, the microphone 52 is attached to the circuit board 51, and the microphone 52 and the motherboard 40 are arranged in a staggered manner, so that a structure that the microphone 52 and the motherboard 40 are stacked can be avoided, the thickness of the whole electronic device 100 can be reduced, and then the microphone 52 is controlled by electrically connecting the circuit board 51 and the motherboard 40. In addition, the communication between the microphone 52 and the first sound collecting hole 220 is realized by the sound guide bracket 53, and the position of the first sound collecting hole 220 on the frame 22 can be flexibly set, for example, the first sound collecting hole 220 can be arranged at the middle position of the frame 22 to improve the aesthetic feeling of the appearance of the electronic device 100, and the communication between the first sound collecting hole 200 and the microphone 52 can be realized by the sound guide bracket 53. Of course, the first sound pickup hole 220 may be disposed at other positions of the frame 22, so that the flexibility is strong, and therefore, the description thereof is omitted. In addition, the circuit board 51 and the main board 40 are both disposed on the middle plate 21, and the circuit board 51 and the main board 40 are disposed in a local staggered manner, so that a staggered structure can be formed between the microphone 52 and the main board 40, and the layout flexibility of the microphone 52 can be further improved.

Referring to fig. 5, fig. 5 is a schematic diagram of a partial structure of the electronic device 100 in the embodiment of fig. 3, and fig. 5 is a schematic diagram of the structure when the circuit board 51 is matched with the middle frame 20. Wherein, the middle plate 21 of the middle frame 20 is formed with a mounting groove 211, and the circuit board 51 can be embedded in the mounting groove 211 to reduce the layout space occupied by the circuit board 51. Preferably, a microphone groove 212 is formed on the bottom wall of the mounting groove 211, and the microphone 52 can be received in the microphone groove 212.

Specifically, the mounting groove 211 generally includes a first groove section 211a and a second groove section 211b that communicate with each other, the microphone groove 212 is formed in a bottom wall of the first groove section 211a, and the main plate 40 is covered on the second groove section 211 b. In an embodiment, the circuit board 51 may be a flexible circuit board or a rigid-flex board, and generally includes a first board body 51a and a second board body 51 b. The first board 51a is embedded in the first slot 211a, the second board 51b is embedded in the second slot 211b, and the microphone 52 is disposed on the first board 51a and can be accommodated in the microphone slot 212. The second board 51b is connected to the first board 51a and the main board 40 to electrically connect the microphone 52 and the main board 40. Preferably, the outer peripheral shape of the first plate body 51a substantially matches the inner wall shape of the first groove section 211a, and the outer peripheral shape of the second plate body 51b substantially matches the inner wall shape of the second groove section 211 b.

Wherein, the second plate 51b can be a flexible circuit board, and the first plate 51a and the second plate 51b can be connected by bending, so as to improve the flexibility of the connection between the circuit board 51 and the main board 40, and further improve the layout flexibility of the microphone 52. This is because, when the position of the main board 40 is fixed, one end of the second board 51b is connected to the main board 40, and the other end of the second board can flexibly adjust the connection position with the first board 51a based on the flexibility of the second board, so as to improve the layout flexibility of the first board 51a, and further improve the layout flexibility of the microphone 52. In addition, when the position of the microphone 52 is fixed, the connection position with the main board 40 can be flexibly adjusted based on the flexible characteristics of the second board body 51 b.

In an embodiment, the first board 51a may be a flexible circuit board, and a side of the first board 51a facing away from the microphone 52 may be reinforced by providing a reinforcing sheet, which may be a reinforcing plate of a flexible circuit board such as a steel sheet or an epoxy resin sheet. The second board 51b may be electrically connected to the main board 40 through a spring, a probe, a wire, a connector (e.g., a ZIF connector, a BTB connector, etc.), and the like. Wherein, one side of the second plate 51b departing from the main board 40 can be reinforced by a reinforcing sheet, and the reinforcing sheet can be a steel sheet or a flexible circuit board reinforcing plate such as an epoxy resin plate. Preferably, the first board 51a and the second board 51b may be the same flexible circuit board, and the layout flexibility thereof is improved by local bending.

It will be appreciated that the main board 40, which is an integrated board of the main electronic components of the electronic device 100, is usually a rigid printed circuit board, and the circuit board 51 mainly functions to connect the main board 40 and the microphone 52, so that a flexible circuit board may be preferably used. Obviously, the thickness of the flexible circuit board is usually much smaller than that of the rigid circuit board, and further, the circuit board 51 and the microphone 52 are respectively embedded in the mounting groove 211 and the microphone groove 212, so that the influence of the microphone 52 on the overall thickness can be avoided.

Furthermore, the projection of the first plate 51a and the main board 40 on the middle plate 21 is at least partially staggered, and the projection of the microphone 52 and the main board 40 on the middle plate 21 is staggered, so that the overall thickness of the electronic device can be further reduced by the staggered arrangement of the microphone 52 and the main board 40. The main board 40 can be covered on the second groove section 211b, that is, the main board 40 can be stacked on the second board body 51b, so as to ensure the connection stability between the main board 40 and the second board body 51 b. It should be noted that, compared with the stacking arrangement of the main board 40 and the microphone 52, the main board 40 and the second board 51b are stacked and electrically connected, and the microphone 52 and the main board 40 are arranged in a staggered manner, so that the electronic device 100 obviously has a positive effect on thinning the whole structure.

Referring to fig. 6 and 7, fig. 6 is a schematic diagram illustrating a structure of the sound guide holder 53 and the middle frame 20 in the embodiment of fig. 3, and fig. 7 is a schematic diagram illustrating a cross-sectional structure of the sound guide holder 53 and the middle frame 20 in the embodiment of fig. 6. The sound guide holder 53 is provided with a sound guide channel 530 communicating the first sound pickup hole 220 and the microphone 52, and one end of the sound guide channel 530 communicates with the first sound pickup hole 220 and the other end communicates with the microphone 52, so that the sound signal picked up by the first sound pickup hole 220 can be conducted to the microphone 52 through the sound guide channel 530. Preferably, the circuit board 51 is formed with a second sound pickup hole 510, one end of the sound guide channel 530 is connected to the first sound pickup hole 220 of the middle frame 20, and the other end is connected to the second sound pickup hole 510 of the circuit board 51.

The side of the sound guide holder 53 adjacent to the middle plate 21 has a substantially step-shaped structure, i.e., the surface of the sound guide holder 53 adjacent to the middle plate 21 substantially includes a first step surface 531 and a second step surface 532, and a connecting surface 533 connecting the first step surface 531 and the second step surface 532. The first step surface 531 is provided at a distance from the middle plate 21, and the second step surface 532 is provided adjacent to the first plate body 51a of the circuit board 51. Preferably, the second step surface 532 may be disposed in contact with the first plate 51a, and an end of the sound guide channel 530 communicating with the microphone 52 penetrates through the second step surface 532, so that the sound guide channel 530 can communicate with the second sound pickup hole 510, and the communication tightness can be ensured.

The first step surface 531 and the second step surface 532 are spaced apart from each other in the thickness direction of the electronic device 100, that is, the first step surface 531 and the second step surface 532 are spaced apart from each other in the stacking direction of the sound guide holder 53 and the middle plate 21. The main plate 40 is disposed between the first step surface 531 and the middle plate 21, and the second step surface 532 may cover the first groove section 211 a.

Referring to fig. 8, fig. 8 is a schematic structural diagram of the sound guide bracket 53 in the embodiment of fig. 6, in which the sound guide bracket 53 is disposed on a side of the middle plate 21 away from the rear cover 30, that is, the sound guide bracket 53 is disposed on a side of the middle plate 21 close to the display screen 10. In one embodiment, the sound guide bracket 53 is configured to be supported by the display screen 10. The sound guide holder 53 generally includes a main body 53a provided at a distance from the middle plate 21, and a boss portion 53b provided to protrude from the main body 53a on a side closer to the middle plate 21. The sound guide passage 530 extends from the main body portion 53a on the side close to the frame 22 into the sound guide holder 53 and penetrates the boss portion 53 b. The main board 40 is disposed between the main body 53a and the middle board 21, and the boss 53b can be covered or embedded in the first slot section 211a to abut against the circuit board 51. Obviously, the first step surface 531 is formed on a side surface of the main body portion 53a closer to the middle plate 21, and the second step surface 532 is formed on a side surface of the boss portion 53b closer to the circuit board 51. Namely, by arranging the sound guide bracket 53 in a boss shape or a step shape and arranging the circuit board 51 and the main board 40 between the sound guide bracket 53 and the middle board 21, the positions of the circuit board 51 and the main board 40 can be reasonably arranged by the structural arrangement of the sound guide bracket 53, thereby realizing the thinning of the whole thickness of the electronic device 100.

Further, the sound guide holder 53 may further include an abutting portion 53c provided on a side of the main body portion 53a closer to the frame 22, and the abutting portion 53c may abut against the frame 22. The sound guide passage 530 penetrates the abutting portion 53c so that the sound guide passage 530 can communicate with the first sound pickup hole 220.

It can be understood that the first sound pickup hole 220 can be conveniently arranged in the center or other positions of the frame 22 by flexibly adjusting the assembling position of the sound guide bracket 53.

In an embodiment, the electronic device 100 may further include a first sealing member 61 disposed between the sound guide bracket 53 and the middle plate 21, and a second sealing member 62 disposed between the sound guide bracket 53 and the bezel 22. Referring to fig. 6 to 8 again, two ends of the sound guiding channel 530 are respectively communicated with the first sound collecting hole 220 and the second sound collecting hole 510, the first sealing member 61 is disposed between the sound guiding channel 530 and the second sound collecting hole 510, and the second sealing member 62 is disposed between the sound guiding channel 530 and the first sound collecting hole 220, so as to improve the tightness of the sound signal entering from the first sound collecting hole 220 and being transmitted to the microphone 52.

Specifically, the first sealing member 61 may be provided on a side of the boss portion 53b close to the circuit board 51 and abut against the circuit board 51 to achieve a sealing effect under the clamping of the boss portion 53b and the circuit board 51. Further, the first sealing member 61 is provided with a first through hole 611, and the first through hole 611 is communicated with the sound guide channel 530 and the second sound pickup hole 510. The first sealing element 61 may be made of foam, silicone, rubber, or the like, and is substantially an annular structure. Preferably, an adhesive may be disposed on the first sealing member 61 to fix the first sealing member 61 to the sound guide holder 53 and/or the circuit board 51. Of course, in other embodiments, one side of the first sealing member 61 may be embedded on the boss portion 53b, and the other side may be connected to the circuit board 51 by glue.

The second seal 62 may be provided on a side of the abutting portion 53c close to the frame 22 and abut against the frame 22, so as to achieve a sealing effect by being sandwiched between the abutting portion 53c and the frame 22. Further, a second through hole 621 is formed on the second sealing member 62, and the second through hole 621 is communicated with the sound guide channel 530 and the first sound pickup hole 220. The second sealing element 62 may be made of foam, silicone, rubber, or the like, and is substantially an annular structure. Preferably, glue may be disposed on the second sealing member 62 to fix the second sealing member 62 to the sound guide bracket 53 and/or the frame 22. Of course, in other embodiments, one side of the second sealing element 62 may be embedded in the abutting portion 53c, and the other side may be fixed to the frame 22 by glue.

It is understood that, in other embodiments, the first sealing element 61 and the second sealing element 62 may be fixedly connected by other methods, such as a snap, a screw, a welding, and the like.

It should be noted that the terms "first" and "second" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

It can be understood that, in the actual assembly process of the electronic device provided in the embodiment of the present application, the rear cover 30 and the middle frame 20 are preferably assembled and connected, and then the circuit board 51 and the main board 40 are sequentially assembled on the middle plate 21 of the middle frame 20, so that the circuit board 51 is embedded in the mounting groove 211 on the middle plate 21, and the microphone 52 is accommodated in the microphone groove 212. In other words, the mounting slot 211 and the microphone slot 212 on the middle plate 21 can be used for mounting and positioning the circuit board 51 and the microphone 52 respectively when the electronic device 100 is assembled. After the above-described assembly of the structure is completed, the sound guide holder 53 and the middle frame 20 are assembled, the boss portion 53b of the sound guide holder 53 abuts against the circuit board 51, the abutting portion 53c abuts against the frame 22, and both ends of the sound guide passage 530 communicate with the first sound pickup hole 220 and the second sound pickup hole 510, respectively. And finally, completing the assembly of the display screen 10, namely, assembling and connecting the display screen 10 and the middle frame 20 and locating on one side of the middle plate 21, which is far away from the rear cover 30. In some embodiments, the sound guide bracket 53 may support a portion of the structure of the display screen 10, that is, a side of the sound guide bracket 53 facing away from the rear cover 30 may be supported on the display screen 10, so that the display screen 10 has better stability as a whole.

The electronic equipment provided by the embodiment of the application can avoid forming a stacked structure of the microphone and the mainboard by arranging the microphone on the circuit board and staggering the microphone and the mainboard, so that the thickness of the whole electronic equipment can be reduced. In addition, the communication between the microphone and the first sound pickup hole is realized by the sound guide support, the position of the first sound pickup hole on the frame can be flexibly arranged, for example, the first sound pickup hole can be arranged in the middle of the frame, so that the appearance aesthetic feeling of the electronic equipment is improved. In addition, through setting up first sealing member and second sealing member, can promote the leakproofness in the sound signal gets into and conducts to the microphone through leading the sound passageway from first pick-up hole.

In addition, the embodiment of the application further provides the electronic equipment. Referring to fig. 9, fig. 9 is a block diagram of an electronic device 900 according to another embodiment of the present application.

The electronic device may be, for example, a mobile electronic device, which may include: a memory 901, a processor (CPU) 902, a circuit board (not shown), a power supply circuit, and a microphone 913. The circuit board is arranged in a space enclosed by the shell; the CPU902 and the memory 901 are provided on a circuit board; the power supply circuit is used for supplying power to each circuit or device of the electronic equipment; the memory 901 is used for storing executable program codes; the CPU902 executes a computer program corresponding to the executable program code by reading the executable program code stored in the memory 901 to recognize the above-described identification information to implement the unlocking and wake-up functions.

The electronic device may further include: peripheral interface 903, RF (Radio Frequency) circuitry 905, audio circuitry 906, speakers 911, power management chip 908, input/output (I/O) subsystems and other input/control devices, touch screen 912, other input/control devices 910, and external port 904, which communicate via one or more communication buses or signal lines 907. The touch screen 912 may be the display screen 10 in the foregoing embodiments.

The memory 901 may be accessed by the CPU902, the peripheral interface 903, and the like, and the memory 901 may include high-speed random access memory and may also include non-volatile memory, such as one or more magnetic disk storage devices, flash memory devices, or other volatile solid-state storage devices. The peripherals interface 903 may connect input and output peripherals of the device to the CPU902 and the memory 901.

The I/O subsystem 909 may connect input and output peripherals on the device, such as the touch screen 912 and other input/control devices 910, to the peripheral interface 903. The I/O subsystem 909 may include a display controller 9091 and one or more input controllers 9092 for controlling other input/control devices 910. Where one or more input controllers 9092 receive electrical signals from or send electrical signals to other input/control devices 910, the other input/control devices 910 may include physical buttons (push buttons, rocker buttons, etc.), dials, slide switches, joysticks, click wheels. It is worth noting that the input controller 9092 may be connected with any one of the following: a keyboard, an infrared port, a USB interface, and a pointing device such as a mouse.

Touch screen 912 is an input and output interface between the user electronic device and the user, displaying visual output to the user, which may include graphics, text, icons, video, and the like.

The display controller 9091 in the I/O subsystem 909 receives electrical signals from the touch screen 912 or transmits electrical signals to the touch screen 912. The touch screen 912 detects a contact on the touch screen, and the display controller 9091 converts the detected contact into an interaction with a user interface object displayed on the touch screen 912, that is, to implement a human-computer interaction, where the user interface object displayed on the touch screen 912 may be an icon for running a game, an icon networked to a corresponding network, or the like.

The RF circuit 905 is mainly used to establish communication between the mobile phone and the wireless network (i.e., network side), and implement data reception and transmission between the mobile phone and the wireless network. Such as sending and receiving short messages, e-mails, etc. In particular, RF circuitry 905 receives and transmits RF signals, also referred to as electromagnetic signals, through which RF circuitry 905 converts electrical signals to or from electromagnetic signals and communicates with a communication network and other devices. The RF circuitry 905 may include known circuitry for performing these functions including, but not limited to, an antenna system, an RF transceiver, one or more amplifiers, a tuner, one or more oscillators, a digital signal processor, a CODEC (CODEC) chipset, a Subscriber Identity Module (SIM), and so forth.

The audio circuit 906 is mainly used to receive audio data from the peripheral interface 903, convert the audio data into an electric signal, and transmit the electric signal to the speaker 911. The speaker 911 is used to convert the voice signal received by the mobile phone from the wireless network through the RF circuit 905 into sound and play the sound to the user. And the power management chip 908 is used for supplying power and managing power to the hardware connected with the CPU902, the I/O subsystem and the peripheral interfaces.

It is understood that technical features not described in detail with respect to the electronic device 900 may refer to the electronic device 100 in the foregoing embodiment, and thus are not described in detail.

It should be noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the contents of the specification and the drawings, or applied directly or indirectly to other related technical fields, are all included in the scope of the present application.

Claims

1. An electronic device, characterized in that the electronic device comprises:

the middle frame comprises a middle plate and a side frame extending out from the edge of the middle plate, an accommodating space is enclosed by the middle plate and the side frame, and the side frame is provided with a first sound pickup hole communicated with the accommodating space;

the mainboard is accommodated in the accommodating space and is arranged on the middle plate; and

the microphone assembly is accommodated in the accommodating space and is connected with the middle frame; wherein,

the microphone assembly includes: the circuit board is arranged on the middle plate, the microphone is arranged on the circuit board, and the sound guide support is arranged on one side of the circuit board, which is far away from the microphone; the sound guide bracket is provided with a sound guide channel which is communicated with the first sound pickup hole and the microphone; the projection of the microphone on the middle plate and the projection of the main board on the middle plate are staggered.

2. The electronic device as claimed in claim 1, wherein the circuit board has a second sound pickup hole, the second sound pickup hole is disposed corresponding to the microphone, and one end of the sound guide channel is connected to the first sound pickup hole and the other end is connected to the second sound pickup hole.

3. The electronic device of claim 2, wherein the circuit board is disposed between the sound guide bracket and the middle plate, the main board is disposed between the sound guide bracket and the middle plate, and the circuit board and the main board are electrically connected and partially disposed in a staggered manner.

4. The electronic device of claim 3, wherein the middle plate has a mounting slot formed thereon, and the circuit board is embedded in the mounting slot.

5. The electronic device of claim 4, wherein a microphone slot is formed on a bottom wall of the mounting slot, and the microphone is accommodated in the microphone slot.

6. The electronic device of claim 5, wherein the mounting slot comprises a first slot section and a second slot section that are in communication, and the microphone slot is formed in a bottom wall of the first slot section; the circuit board comprises a first board body and a second board body, the first board body is embedded in the first groove section, and the second board body is embedded in the second groove section; the microphone is arranged on the first plate body, and the second plate body and the mainboard are arranged in a stacked mode.

7. The electronic device of claim 4, wherein the sound guide bracket comprises a main body portion spaced apart from the middle plate, and a boss portion protruding from a side of the main body portion adjacent to the middle plate; the sound guide channel extends from one side of the main body part close to the frame and penetrates through the boss part; the main board is arranged between the main body part and the middle plate, and the boss part is abutted to the circuit board.

8. The electronic device of claim 7, wherein the sound guide bracket further comprises an abutting portion disposed on a side of the main body portion close to the frame, and the abutting portion abuts against the frame; wherein the sound guide channel penetrates through the abutting part.

9. The electronic device according to claim 8, further comprising a first sealing member disposed between the sound guide bracket and the middle plate, the first sealing member abutting against the circuit board, wherein the first sealing member is provided with a first through hole communicating the sound guide channel and the second sound pickup hole.

10. The electronic device according to claim 9, further comprising a second sealing member disposed between the sound guide bracket and the bezel, the second sealing member abutting against the bezel, wherein the second sealing member is provided with a second through hole communicating the sound guide channel and the first sound pickup hole.