CN214469013U

CN214469013U - Dehumidifier

Info

Publication number: CN214469013U
Application number: CN202120038967.4U
Authority: CN
Inventors: 施斌卿
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-01-07
Filing date: 2021-01-07
Publication date: 2021-10-22
Anticipated expiration: 2031-01-07

Abstract

The utility model discloses a dehumidifier, which comprises a heat exchanger, wherein the heat exchanger comprises a semiconductor refrigerator and a cooling component; the semiconductor refrigeration body has the cold junction, and the cold subassembly that looses includes first connecting piece, first heat pipe and the cold piece that looses, and first connecting piece cover is located outside the first heat pipe to be fixed in on the cold end, first connecting piece is the heat conduction component, and first heat pipe can carry out the heat transfer through first connecting piece with the cold junction, and the cold piece that looses sets up on first heat pipe, and the surface coating of the cold piece that looses has the drainage blanket. When condensed water is condensed on the cold dissipating sheet, the condensed water can be rapidly discharged by the drainage coating, the condensed water is prevented from being attached to the cold dissipating sheet, the refrigerating capacity is prevented from being absorbed by the condensed water, the refrigerating effect is improved, and the dehumidifying capacity is improved.

Description

Dehumidifier

Technical Field

The utility model belongs to the technical field of air humidity adjusting device technique and specifically relates to a dehumidifier is related to.

Background

Semiconductor cooling fins are a means of heat transfer. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end.

At present, in a dehumidifier utilizing a semiconductor refrigeration sheet, in order to improve the refrigeration effect, an aluminum alloy section bar is connected to the cold end of the semiconductor refrigeration sheet, so that the heat exchange area is enlarged, however, after some condensed water is condensed on the surface of the aluminum alloy section bar, the condensed water cannot be discharged in time, the condensed water can absorb the cold energy of the cold end of the semiconductor refrigeration sheet for cooling, and part of the cold energy is wasted, so that the daily dehumidification amount is low.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a dehumidifier for there is cold volume in solving traditional dehumidifier and is wasted, the lower problem of daily dehumidification volume.

According to the utility model discloses a dehumidifier of first aspect embodiment, the dehumidifier includes the heat exchanger, the heat exchanger includes semiconductor refrigeration body and cooling subassembly that looses; the semiconductor refrigeration body has the cold junction, it includes first connecting piece, first heat pipe and the piece that dispels the cold to dispel the cold subassembly, first connecting piece cover is located outside the first heat pipe to be fixed in the cold end is served, first connecting piece is the heat conduction component, first heat pipe with the cold junction can pass through first connecting piece carries out the heat transfer, the piece that looses the cold set up in on the first heat pipe, just the surface coating of the piece that looses the cold has drainage blanket.

According to the utility model discloses dehumidifier has following technological effect at least:

in the dehumidifier, the cold end of the semiconductor refrigerating body is provided with the cold dissipation assembly, and the cold dissipation assembly can increase the heat exchange area between the cold end of the semiconductor refrigerating body and air and improve the refrigerating efficiency. In addition, the first connecting piece is sleeved outside the first heat pipe and fixed at the cold end of the semiconductor refrigerating body, so that the connection firmness between the first heat pipe and the semiconductor refrigerating body can be increased, the first heat pipe is prevented from falling off in the using process, and the reliability is high. And when condensed water is condensed on the cold dissipating sheet, the condensed water can be rapidly discharged by the drainage coating, so that the condensed water is prevented from being attached to the cold dissipating sheet, the condensed water is prevented from absorbing refrigerating capacity, the refrigerating effect is improved, and the dehumidifying capacity is improved.

According to some embodiments of the invention, the drainage layer is a hydrophilic coating, the hydrophilic angle of the hydrophilic coating being less than 20 degrees; or the drainage layer is a hydrophobic coating, and the hydrophilic angle of the hydrophobic coating is greater than 90 degrees.

According to some embodiments of the invention, the first connecting piece has a first energy transfer plane, the first energy transfer plane with the cold junction laminating.

According to some embodiments of the present invention, the first connecting member is provided with a first mounting hole, the first heat pipe is inserted into the first mounting hole, and a first heat conducting medium is filled between the first heat pipe and a hole wall of the first mounting hole; or the first connecting piece is provided with a first mounting groove, the first heat pipe penetrates through the first mounting groove, and a first heat-conducting medium is filled between the first heat pipe and the groove wall of the first mounting groove.

According to some embodiments of the utility model, the semiconductor refrigeration body still has the hot junction, the heat exchanger still includes radiator unit, radiator unit includes second connecting piece, second heat pipe and fin, second connecting piece cover is located outside the second heat pipe, and be fixed in the hot end is last, the second connecting piece is the heat conduction component, the second heat pipe with the hot junction can pass through the second connecting piece carries out the heat transfer, the fin set up in on the second heat pipe.

According to some embodiments of the invention, the second connecting piece has a second energy transmission plane, the second energy transmission plane with the hot junction laminating.

According to some embodiments of the present invention, the second connecting member is provided with a second mounting hole, the second heat pipe is inserted into the second mounting hole, and a second heat conducting medium is filled between the second heat pipe and a hole wall of the second mounting hole; or the second connecting piece is provided with a second mounting groove, the second heat pipe penetrates through the second mounting groove, and a second heat-conducting medium is filled between the second heat pipe and the groove wall of the second mounting groove.

According to some embodiments of the utility model, the dehumidifier still include the fan, the fan produces the air current at the during operation, the air current can pass through radiator unit and/or the cooling subassembly looses.

According to some embodiments of the present invention, the fan is disposed between the heat dissipation assembly and the cold dissipation assembly, the fan having a first operating state rotating in a first direction and a second operating state rotating in a second direction opposite to the first direction;

the fan can generate airflow in the first working state to sequentially pass through the heat dissipation assembly and the cold dissipation assembly; the fan is in the air current that the second operating condition produced can pass through in proper order the cooling subassembly with radiator unit.

According to some embodiments of the utility model, the dehumidifier still include the water collector, the water collector set up in the below of cooling subassembly looses.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic view of an assembly structure of a heat exchanger and a fan according to an embodiment of the present invention;

fig. 2 is a schematic top view of a heat exchanger according to an embodiment of the present invention;

fig. 3 is a schematic view illustrating an assembly structure of a cooling module and a semiconductor cooler according to an embodiment of the present invention;

fig. 4 is a schematic view of an assembly structure of a heat dissipation assembly and a semiconductor cooler according to an embodiment of the present invention.

Reference numerals:

100. a heat exchanger; 110. a semiconductor refrigerator; 111. a cold end; 112. a hot end; 120. a cold dissipation assembly; 121. a first connecting member; 1211. a first energy transfer plane; 122. a first heat pipe; 123. cooling tablets; 130. a heat dissipating component; 131. a second connecting member; 1311. a second energy transfer plane; 132. a second heat pipe; 133. a heat sink; 200. a fan.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 and fig. 2, a dehumidifier according to an embodiment includes a heat exchanger 100, where the heat exchanger 100 includes a semiconductor cooling body 110 and a cooling dissipation assembly 120.

As shown in fig. 1, semiconductor refrigeration body 110 has a cold end 111 and a hot end 112.

The semiconductor refrigerator 110 may be a semiconductor refrigeration chip, and the semiconductor refrigerator 110 is an application of the peltier effect in the refrigeration technology. The cold end 111 of the semiconductor refrigerating body 110 is used for refrigerating, the hot end 112 is used for radiating heat outwards, main parameters of the semiconductor refrigerating body 110 are the temperature difference between the cold end 111 and the hot end 112, if the hot end 112 is good in heat radiation and low in temperature, the temperature of the cold end 111 can be correspondingly reduced, and a better refrigerating effect is achieved.

As shown in fig. 1 and 3, the cooling dissipation assembly 120 includes a first connecting member 121, a first heat pipe 122 and a cooling dissipation sheet 123, the first connecting member 121 is sleeved outside the first heat pipe 122 and fixed to the cold end 111, the first connecting member 121 is a heat conducting member, the first heat pipe 122 and the cold end 111 of the semiconductor cooling body 110 can perform heat transfer through the first connecting member 121, the cooling dissipation sheet 123 is disposed on the first heat pipe 122, and a drainage layer is coated on a surface of the cooling dissipation sheet 123.

The first connecting member 121 is made of a metal material or a composite material with good thermal conductivity, and optionally, the first connecting member 121 is made of a copper, aluminum or graphite composite material. The first connector 121 may be fixed to the cold end 111 of the semiconductor refrigerator 110 by fastening bolts or snaps, etc.

The heat dissipation plate 123 is perpendicular to the first heat pipe 122, and within an allowable error range, an angle deviation between the heat dissipation plate 123 and the first heat pipe 122 may be within 5 °.

In the dehumidifier described above, the cold dissipation assembly 120 is disposed at the cold end 111 of the semiconductor refrigerator 110, and the cold dissipation assembly 120 can increase the heat exchange area between the cold end 111 of the semiconductor refrigerator 110 and the air, thereby improving the refrigeration efficiency. In addition, the first connecting member 121 is sleeved outside the first heat pipe 122, and the first connecting member 121 is fixed to the cold end 111 of the semiconductor refrigerator 110, so that the connection firmness between the first heat pipe 122 and the semiconductor refrigerator 110 can be increased, the first heat pipe 122 is prevented from falling off in the using process, and the reliability is high. And, when the last condensation that condenses of cooling fins 123, the drainage coating can be discharged the comdenstion water rapidly, avoids the comdenstion water to adhere to cooling fins 123, avoids the comdenstion water to absorb the refrigerating output to improve refrigeration effect, and improve the dehumidification capacity.

Alternatively, the drainage layer may be an organic hydrophilic coating, such as a polyacrylic or epoxy system, having a hydrophilic angle of less than 20 degrees, such as: 0-3 degrees, 3-6 degrees, 6-9 degrees, 9-12 degrees, 12-15 degrees, 15-18 degrees, 18-20 degrees; or the drainage layer can be a hydrophobic coating, such as a fluorine/silicon material, a synthetic polymer melt polymer, etc., and the hydrophilic angle of the hydrophobic coating is greater than 90 degrees, such as 90-100 degrees, 100-110 degrees, 110-120 degrees, 120-130 degrees, 130-140 degrees, 140-150 degrees, and more than 150 degrees.

In addition, since the surface of the cooling fin 123 is coated with the drainage layer, it is also possible to prevent foreign materials such as dust from being accumulated on the cooling fin 123, thereby reducing the cooling effect.

The following table shows the test results of the examples and comparative examples:

as shown in fig. 3, in one embodiment, the first connection element 121 has a first energy transmission plane 1211, the first energy transmission plane 1211 is attached to the cold end 111 of the semiconductor refrigerator 110, and the first connection element 121 forms a first energy channel for transferring cold energy between the cold end 111 of the semiconductor refrigerator 110 and the first heat pipe 122.

By attaching the first energy transmission plane 1211 of the first connector 121 to the cold end 111 of the semiconductor refrigerator 110 and sleeving the first connector 121 outside the first heat pipe 122, the first connector 121 constructs a first energy channel for transmitting the cold energy between the cold end 111 of the semiconductor refrigerator 110 and the first heat pipe 122, and the first energy channel can transmit the cold energy a of the cold end 111 of the semiconductor refrigerator 110 to the first heat pipe 122. Compared with the energy transfer by the way that the first heat pipe 122 is in line contact with the cold end 111 of the semiconductor refrigerator 110, the first energy transmission plane 1211 of the first connecting member 121 in the heat exchanger 100 is in surface contact with the cold end 111 of the semiconductor refrigerator 110, so that the contact area is increased, the efficiency of energy transfer is higher, and the heat exchange efficiency is higher.

In one embodiment, the number of the first heat pipes 122 is multiple, and the first connectors 121 are disposed outside all the first heat pipes 122. In this way, the plurality of first heat pipes 122 can absorb the cold energy of the cold end 111 of the semiconductor refrigerator 110 at the same time, thereby further increasing the heat transfer efficiency.

Further, all the parts of the first heat pipes 122 contacting the first connectors 121 are arranged in parallel at intervals along a first preset direction, where the first preset direction is parallel to a plane where the cold ends 111 of the semiconductor coolers 110 are located.

Specifically, the cold ends 111 of the semiconductor coolers 110 are planes, all the first heat pipes 122 are arranged in parallel at intervals along a first preset direction, and the first preset direction is parallel to the plane where the cold ends 111 of the semiconductor coolers 110 are located, so that the cold energy at each position of the cold ends 111 of the semiconductor coolers 110 can be transmitted to the first heat pipes 122.

Furthermore, the first connecting member 121 is provided with a plurality of first mounting holes, the plurality of first mounting holes are arranged in parallel along a first preset direction at intervals, the plurality of first heat pipes 122 are correspondingly arranged in the plurality of first mounting holes in a penetrating manner, and a first energy channel is formed between every two adjacent first mounting holes. In other words, in the first connecting member 121, a solid body is located between two adjacent first mounting holes, and the solid body constitutes a first energy channel for transferring cold energy between the cold end 111 of the semiconductor cooler 110 and the first heat pipe 122.

Optionally, a first heat conducting medium is filled between the first heat pipe 122 and the hole wall of the first mounting hole of the first connecting member 121, and the first heat conducting medium may be heat conducting silica gel or the like, metal powder, oxide powder, graphite powder, diamond powder or the like, so that the energy transfer efficiency is improved.

In another embodiment, the first connecting member 121 is provided with a plurality of first installation grooves, the plurality of first installation grooves are arranged in parallel along a first preset direction at intervals, the plurality of first heat pipes 122 are correspondingly arranged in the plurality of first installation grooves in a penetrating manner, and a first energy channel is formed between every two adjacent first installation grooves. In other words, in the first connecting member 121, an entity is located between two adjacent first installation grooves, and the entity constitutes a first energy channel for enabling the cold end 111 of the semiconductor cooler 110 to perform cold energy transfer with the first heat pipe 122.

Optionally, a first heat conducting medium is filled between the first heat pipe 122 and the groove wall of the first mounting groove of the first connecting member 121, and the first heat conducting medium may be heat conducting silica gel or the like, metal powder, oxide powder, graphite powder, diamond powder or the like, so that the energy transfer efficiency is improved.

As shown in fig. 1 and fig. 2, in one embodiment, the heat exchanger 100 further includes a heat dissipation assembly 130 disposed at the hot end 112 of the semiconductor refrigerator 110, the heat dissipation assembly 130 includes a second connector 131, a second heat pipe 132 and a heat dissipation fin 133, the second connector 131 is sleeved outside the second heat pipe 132 and fixed to the hot end 112, the second connector 131 is a heat conduction member, the second heat pipe 132 and the hot end 112 of the semiconductor refrigerator 110 can perform heat transfer through the second connector 131, and the heat dissipation fin 133 is disposed on the second heat pipe 132.

Specifically, the second connecting member 131 is made of a metal material or a composite material with good thermal conductivity, and optionally, the second connecting member 131 is made of a copper, aluminum or graphite composite material. The second connector 131 may be fixed to the semiconductor cooler 110 by fastening bolts or snaps, etc. By fixedly connecting the second connecting member 131 to the hot end 112 of the semiconductor cooler 110 and sleeving the second connecting member 131 outside the second heat pipe 132, the connection firmness between the second heat pipe 132 and the semiconductor cooler 110 can be increased, the second heat pipe 132 is prevented from falling off during use, and the reliability is high.

The heat sink 133 is perpendicular to the second heat pipe 132, and the angular deviation between the heat sink 133 and the second heat pipe 132 may be within 5 ° within an allowable error range.

By arranging the heat dissipation assembly 130 on the hot end 112 of the semiconductor refrigerator 110, the heat dissipation assembly 130 can dissipate heat of the hot end 112 of the semiconductor refrigerator 110 as soon as possible, so that the temperature of the hot end 112 of the semiconductor refrigerator 110 is reduced, and thus, the temperature of the cold end 111 of the semiconductor refrigerator 110 can be correspondingly reduced, and a better refrigeration effect is realized.

As shown in fig. 4, further, the second connection element 131 has a second energy transmission plane 1311, the second energy transmission plane 1311 is attached to the hot end 112 of the semiconductor refrigerator 110, and the second connection element 131 is configured with a second energy channel for transferring heat between the hot end 112 of the semiconductor refrigerator 110 and the second heat pipe 132.

By attaching the second energy transmission plane 1311 of the second connecting member 131 to the hot end 112 of the semiconductor refrigerator 110 and sleeving the second connecting member 131 outside the second heat pipe 132, the second connecting member 131 constructs a second energy channel for transferring the cold energy between the hot end 112 of the semiconductor refrigerator 110 and the second heat pipe 132, and the second energy channel can transmit the heat B of the hot end 112 of the semiconductor refrigerator 110 to the second heat pipe 132. Compared with the energy transfer by the way that the second heat pipe 132 is in line contact with the hot end 112 of the semiconductor refrigerator 110, the second energy transmission plane 1311 of the second connecting piece 131 in the heat exchanger 100 is in surface contact with the hot end 112 of the semiconductor refrigerator 110, so that the contact area is increased, the efficiency of energy conduction is higher, and the heat exchange efficiency is higher.

In one embodiment, the number of the second heat pipes 132 is multiple, and the second connecting members 131 are sleeved outside all the second heat pipes 132. In this way, the plurality of second heat pipes 132 can absorb heat from the hot end 112 of the semiconductor refrigerator 110 at the same time, thereby further increasing the heat transfer efficiency.

Further, all the parts of the second heat pipes 132 contacting the second connecting member 131 are arranged in parallel and at intervals along a second predetermined direction, wherein the second predetermined direction is parallel to the plane where the hot end 112 of the semiconductor cooler 110 is located.

Specifically, the second connecting member 131 is provided with a plurality of second mounting holes, the second mounting holes are arranged in parallel and at intervals along a second preset direction, the second heat pipes 132 penetrate through the second mounting holes in a one-to-one correspondence manner, and a second energy channel is constructed between every two adjacent second mounting holes. In other words, in the second connecting member 131, there is a solid body between two adjacent second mounting holes, and the solid body constitutes a second energy path for transferring the heat B between the hot end 112 of the semiconductor refrigerator 110 and the second heat pipe 132.

Optionally, a second heat conducting medium is filled between the second heat pipe 132 and the hole wall of the second mounting hole of the second connecting member 131, and the second heat conducting medium may be heat conducting silica gel, metal powder, oxide powder, graphite powder, diamond powder, or the like, so that the energy transfer efficiency is improved.

In another embodiment, the second connecting member 131 is provided with a plurality of second mounting grooves, the plurality of second mounting grooves are arranged in parallel along a second predetermined direction at intervals, the plurality of second heat pipes 132 are correspondingly arranged in the plurality of second mounting grooves in a one-to-one manner, and a second energy channel is established between every two adjacent second mounting grooves. In other words, in the second connecting member 131, a solid body is formed between two adjacent second mounting grooves, and the solid body constitutes a second energy passage for transferring the heat B between the hot end 112 of the semiconductor cooler 110 and the second heat pipe 132.

Optionally, a second heat conducting medium is filled between the second heat pipe 132 and a groove wall of the second mounting groove of the second connecting member 131, and the second heat conducting medium may be heat conducting silica gel, metal powder, oxide powder, graphite powder, diamond powder, or the like, so that the energy transfer efficiency is improved.

In one embodiment, the surface of the heat sink 133 is coated with an anti-sticking layer, optionally, the anti-sticking layer may be made of teflon, and the anti-sticking layer can prevent dust and other impurities from being accumulated on the cooling fins 123, thereby reducing the heat dissipation effect.

In one embodiment, the dehumidifier further comprises a fan 200, wherein the fan 200 generates air flow when in operation, and the air flow can pass through the heat dissipation assembly 130 and/or the cold dissipation assembly 120.

Specifically, the fan 200 is disposed between the heat dissipation assembly 130 and the cold dissipation assembly 120, and the fan 200 has a first working state rotating in a first direction and a second working state rotating in a second direction opposite to the first direction; the air flow generated by the fan 200 in the first working state can sequentially pass through the heat dissipation assembly 130 and the cold dissipation assembly 120; the air flow generated by the fan 200 in the second operating state can sequentially pass through the cooling unit 120 and the heat dissipating unit 130.

Specifically, the first direction is counterclockwise, the second direction is clockwise reverse, when the blower 200 rotates counterclockwise, the air is heated by the heat dissipation assembly 130 and then blown toward the cold dissipation assembly 120, so as to increase the temperature of the cold dissipation assembly 120 and prevent the cold dissipation assembly 120 from freezing. When the blower 200 rotates clockwise, the air cooled by the cooling module 120 can be heated by the cooling module 130, and the cold air is prevented from blowing to other components.

In other embodiments, fan 200 operates to generate an airflow that passes only through either cold dissipation assembly 120 or heat dissipation assembly 130.

In one embodiment, the dehumidifier further comprises a water pan disposed below the cold dissipation assembly 120. The drip tray is capable of collecting condensed water dripping from the cold dispersion assembly 120 and discharging the condensed water outside the machine through a drainage passage.

Specifically, the bottom of the water pan is provided with a water outlet which is positioned at the lowest position of the water pan, so that condensed water can be conveniently discharged.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. The dehumidifier is characterized by comprising a heat exchanger, wherein the heat exchanger comprises a semiconductor refrigerator and a cooling dissipation assembly;

the semiconductor refrigeration body has the cold junction, it includes first connecting piece, first heat pipe and the piece that dispels the cold to dispel the cold subassembly, first connecting piece cover is located outside the first heat pipe to be fixed in the cold end is served, first connecting piece is the heat conduction component, first heat pipe with the cold junction can pass through first connecting piece carries out the heat transfer, the piece that looses the cold set up in on the first heat pipe, just the surface coating of the piece that looses the cold has drainage blanket.

2. The dehumidifier of claim 1 wherein the drainage layer is a hydrophilic coating having a hydrophilic angle of less than 20 degrees; or the drainage layer is a hydrophobic coating, and the hydrophilic angle of the hydrophobic coating is greater than 90 degrees.

3. The dehumidifier of claim 1 wherein the first connection has a first energy transfer plane, the first energy transfer plane abutting the cold end.

4. The dehumidifier of claim 1, wherein the first connecting member is provided with a first mounting hole, the first heat pipe is arranged in the first mounting hole in a penetrating manner, and a first heat-conducting medium is filled between the first heat pipe and the hole wall of the first mounting hole; or

The first connecting piece is provided with a first mounting groove, the first heat pipe penetrates through the first mounting groove, and a first heat-conducting medium is filled between the first heat pipe and the groove wall of the first mounting groove.

5. The dehumidifier of claim 1, wherein the semiconductor refrigerator further comprises a hot end, the heat exchanger further comprises a heat dissipation assembly, the heat dissipation assembly comprises a second connector, a second heat pipe and a heat dissipation fin, the second connector is sleeved outside the second heat pipe and fixed on the hot end, the second connector is a heat conduction member, the second heat pipe and the hot end can transfer heat through the second connector, and the heat dissipation fin is disposed on the second heat pipe.

6. The dehumidifier of claim 5 wherein said second connector has a second energy transfer plane, said second energy transfer plane abutting said hot end.

7. The dehumidifier of claim 5, wherein the second connecting member is provided with a second mounting hole, the second heat pipe is arranged in the second mounting hole in a penetrating manner, and a second heat-conducting medium is filled between the second heat pipe and the hole wall of the second mounting hole; or

The second connecting piece is provided with a second mounting groove, the second heat pipe penetrates through the second mounting groove, and a second heat-conducting medium is filled between the second heat pipe and the groove wall of the second mounting groove.

8. The dehumidifier of claim 5, further comprising a fan, wherein the fan generates an airflow when in operation, and the airflow can pass through the heat sink assembly and/or the cold sink assembly.

9. The dehumidifier of claim 8, wherein the fan is disposed between the heat sink assembly and the cold sink assembly, the fan having a first operating state rotating in a first direction and a second operating state rotating in a second direction opposite to the first direction;

10. The dehumidifier of claim 1 further comprising a water pan disposed below the cold sink assembly.