CN112728806A - Heat exchanger - Google Patents
Heat exchanger Download PDFInfo
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- CN112728806A CN112728806A CN202110016781.3A CN202110016781A CN112728806A CN 112728806 A CN112728806 A CN 112728806A CN 202110016781 A CN202110016781 A CN 202110016781A CN 112728806 A CN112728806 A CN 112728806A
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- energy transfer
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- energy
- heat pipe
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- 239000004065 semiconductor Substances 0.000 claims abstract description 80
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 230000005540 biological transmission Effects 0.000 claims description 42
- 238000005057 refrigeration Methods 0.000 claims description 17
- 238000009434 installation Methods 0.000 description 27
- 238000001816 cooling Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
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- 239000007787 solid Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
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- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
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- 239000004584 polyacrylic acid Substances 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat exchanger, which comprises a semiconductor refrigerating body, a heat exchanger and a heat exchanger, wherein the semiconductor refrigerating body is provided with a cold end and a hot end; the heat exchanger also comprises a cold dissipation assembly arranged at the cold end, the cold dissipation assembly comprises a first heat pipe and a first energy transfer piece with a first energy transfer plane, the first energy transfer piece is sleeved outside the first heat pipe, the first energy transfer plane is attached to the cold end, and the first energy transfer piece is provided with a first energy channel for enabling the cold end and the first heat pipe to carry out cold energy transfer; and/or the heat exchanger also comprises a heat dissipation assembly arranged at the hot end, the heat dissipation assembly comprises a second heat pipe and a second energy transfer piece with a second energy transfer plane, the second energy transfer piece is sleeved outside the second heat pipe, the second energy transfer plane is attached to the hot end, and a second energy channel enabling the hot end and the second heat pipe to carry out heat transfer is constructed on the second energy transfer piece. The heat exchanger has high heat exchange efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration, in particular to a heat exchanger.
Background
Semiconductor cooling fins are a means of heat transfer. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end.
The traditional heat exchanger using the semiconductor refrigeration piece comprises the semiconductor refrigeration piece and a heat pipe, wherein the heat pipe is in direct contact with the semiconductor refrigeration piece to transfer energy so as to achieve the purpose of cold dissipation or heat dissipation, however, the traditional heat exchanger generally has the problem of low heat exchange efficiency.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a heat exchanger, which is used for solving the problem that the conventional heat exchanger is low in heat exchange efficiency.
A heat exchanger according to an embodiment of the first aspect of the invention comprises a semiconductor refrigeration body having a cold end and a hot end; the heat exchanger further comprises a cold dissipation assembly arranged at the cold end, the cold dissipation assembly comprises a first heat pipe and a first energy transfer piece with a first energy transfer plane, the first energy transfer piece is sleeved outside the first heat pipe, the first energy transfer plane is attached to the cold end, and a first energy channel enabling the cold end and the first heat pipe to transfer cold is formed in the first energy transfer piece.
In the heat exchanger, the cold end of the semiconductor refrigerating body is provided with the cold dissipating assembly, and the cold dissipating assembly can increase the heat exchange area between the cold end of the semiconductor refrigerating body and air and improve the refrigerating efficiency. In addition, the first energy transmission plane of the first energy transmission piece is attached to the cold end of the semiconductor refrigerating body, the first energy transmission piece is sleeved outside the first heat pipe, the first energy transmission piece is provided with a first energy channel for enabling the cold end of the semiconductor refrigerating body and the first heat pipe to carry out cold quantity transmission, and the cold quantity of the cold end of the semiconductor refrigerating body can be transmitted to the first heat pipe through the first energy channel. Compared with the mode that the cold ends of the first heat pipe and the semiconductor refrigerating body are in line contact for energy transfer, the first energy transfer plane of the first energy transfer piece in the heat exchanger is in surface contact with the cold end of the semiconductor refrigerating body, the contact area is increased, the energy transfer efficiency is higher, and therefore the heat exchange efficiency is higher.
According to some embodiments of the present invention, the heat exchanger further includes a heat dissipation assembly disposed at the hot end, the heat dissipation assembly includes a second heat pipe and a second energy transfer element having a second energy transfer plane, the second energy transfer element is sleeved outside the second heat pipe, the second energy transfer plane is attached to the hot end, and the second energy transfer element is configured with a second energy channel for enabling the hot end and the second heat pipe to perform heat transfer.
In the heat exchanger, the heat dissipation assembly is arranged at the hot end of the semiconductor refrigerating body, and the heat dissipation assembly can dissipate heat at the hot end of the semiconductor refrigerating body as soon as possible, so that the temperature of the hot end of the semiconductor refrigerating body is reduced, the temperature of the cold end of the semiconductor refrigerating body can be correspondingly reduced, and a better refrigerating effect is realized. In addition, the second energy transmission plane of the second energy transmission piece is attached to the hot end of the semiconductor refrigerating body, the second energy transmission piece is sleeved outside the second heat pipe, the second energy transmission piece is provided with a second energy channel for enabling the hot end of the semiconductor refrigerating body and the second heat pipe to carry out heat transmission, and the second energy channel can enable the heat of the hot end of the semiconductor refrigerating body to be transmitted to the second heat pipe. Compared with the mode that the second heat pipe is in line contact with the hot end of the semiconductor refrigerating body for energy transfer, the second energy transfer plane of the second energy transfer piece in the heat exchanger is in surface contact with the hot end of the semiconductor refrigerating body, so that the contact area is increased, the energy transfer efficiency is higher, and the heat exchange efficiency is higher.
According to some embodiments of the invention, the first heat pipe is a plurality of heat pipes, and the first energy transfer member is sleeved outside all the first heat pipes.
According to some embodiments of the invention, all the parts of the first heat pipes, which are in contact with the first energy transfer member, are arranged in parallel at intervals along a first preset direction, and the first preset direction is parallel to a plane where the cold ends are located.
According to some embodiments of the present invention, the first energy transmission member is provided with a plurality of first installation holes, the plurality of first installation holes are arranged in parallel along the first preset direction at intervals, the plurality of first heat pipes are correspondingly arranged in the plurality of first installation holes in a penetrating manner, and the first energy channel is formed between every two adjacent first installation holes.
According to some embodiments of the present invention, the first energy transmission member is provided with a plurality of first installation grooves, the plurality of first installation grooves are arranged in parallel along the first preset direction at intervals, the plurality of first heat pipes are correspondingly arranged in the plurality of first installation grooves in a penetrating manner, and the first energy channel is established between every two adjacent first installation grooves.
According to some embodiments of the invention, the cold dissipating assembly further comprises a cold dissipating sheet disposed on the first heat pipe.
According to some embodiments of the invention, a heat conducting medium is filled between the first heat pipe and the first energy transfer member.
According to some embodiments of the invention, the second heat pipe is a plurality of second heat pipes, and the second energy transfer member is sleeved outside all the second heat pipes.
According to some embodiments of the invention, all the parts of the second heat pipe, which are in contact with the second energy transfer element, are arranged in parallel at intervals along a second preset direction, and the second preset direction is parallel to a plane where the hot end is located.
According to some embodiments of the present invention, the second energy transmission member is provided with a plurality of second installation holes, the plurality of second installation holes are arranged in parallel along the second preset direction at intervals, the plurality of second heat pipes are correspondingly arranged in the plurality of second installation holes in a penetrating manner, and the second energy channel is formed between every two adjacent second installation holes.
According to some embodiments of the present invention, the second energy transmission member is provided with a plurality of second installation grooves, the plurality of second installation grooves are arranged in parallel along the second preset direction at intervals, the plurality of second heat pipes are correspondingly arranged in the plurality of second installation grooves in a penetrating manner, and the second energy channel is established between every two adjacent second installation grooves.
According to some embodiments of the invention, the heat sink assembly further comprises a heat sink disposed on the second heat pipe.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a heat exchanger according to an embodiment of the present invention;
FIG. 2 is a schematic view of an assembly structure of a cooling module and a semiconductor cooler according to an embodiment of the present invention;
fig. 3 is a schematic view illustrating an assembly structure of a heat dissipation assembly and a semiconductor cooler according to an embodiment of the present invention.
Reference numerals:
100. a semiconductor refrigerator; 110. a cold end; 120. a hot end; 200. a cold dissipation assembly; 210. a first energy transfer member; 211. a first energy transfer plane; 220. a first heat pipe; 230. cooling tablets; 300. a heat dissipating component; 310. a second energy transfer member; 311. a second energy transfer plane; 320. a second heat pipe; 330. and a heat sink.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As described in the background art, in the conventional heat exchanger, there is a problem in that the heat exchange efficiency is low. Particularly, in traditional heat exchanger, the semiconductor refrigeration piece is flat, and general heat pipe is mostly circular or oval, heat pipe and semiconductor refrigeration piece direct contact, and the heat pipe is line contact with the semiconductor refrigeration piece, and area of contact is little, and energy conduction is inefficient to make heat exchange efficiency low.
As shown in fig. 1, an embodiment relates to a heat exchanger including a semiconductor refrigerator 100, the semiconductor refrigerator 100 having a cold end 110 and a hot end 120.
The semiconductor refrigerator 100 may be a semiconductor refrigeration chip, and the semiconductor refrigerator 100 is an application of the peltier effect in the aspect of a refrigeration technology. The cold end 110 of the semiconductor refrigeration body 100 is used for refrigeration, the hot end 120 is used for radiating heat outwards, the main parameters of the semiconductor refrigeration body 100 are the temperature difference between the cold end 110 and the hot end 120, if the hot end 120 has good heat radiation and reduced temperature, the temperature of the cold end 110 can be correspondingly reduced, and a better refrigeration effect is realized.
As shown in fig. 1 and fig. 2, further, the heat exchanger further includes a cooling component 200 disposed at the cold end 110, the cooling component 200 includes a first heat pipe 220 and a first energy transfer member 210 having a first energy transfer plane 211, the first energy transfer member 210 is sleeved outside the first heat pipe 220, the first energy transfer plane 211 is attached to the cold end 110 of the semiconductor refrigerator 100, and the first energy transfer member 210 forms a first energy channel for transferring cooling capacity between the cold end 110 of the semiconductor refrigerator 100 and the first heat pipe 220.
The first energy transmission member 210 is made of a metal material or a composite material with good thermal conductivity, and optionally, the first energy transmission member 210 is made of a copper, aluminum or graphite composite material. The first energy transmission member 210 may be fixed to the semiconductor refrigerator 100 by fastening bolts or snaps, and the first energy transmission plane 211 is attached to the cold end 110 of the semiconductor refrigerator 100. In addition, the first heat pipe 220 is connected with the semiconductor refrigerator 100 through the first energy transfer member 210, so that the connection firmness between the first heat pipe 220 and the semiconductor refrigerator 100 can be increased, the first heat pipe 220 is prevented from falling off in the using process, and the reliability is high.
As shown in fig. 1 and 2, in the heat exchanger, the cold end 110 of the semiconductor refrigerator 100 is provided with the cold dissipation assembly 200, so that the cold dissipation assembly 200 can increase the heat exchange area between the cold end 110 of the semiconductor refrigerator 100 and the air, and improve the cooling efficiency. In addition, the first energy transmission plane 211 of the first energy transmission member 210 is attached to the cold end 110 of the semiconductor refrigerator 100, and the first energy transmission member 210 is sleeved outside the first heat pipe 220, so that the first energy transmission member 210 forms a first energy channel for transmitting the cold energy between the cold end 110 of the semiconductor refrigerator 100 and the first heat pipe 220, and the first energy channel can transmit the cold energy a of the cold end 110 of the semiconductor refrigerator 100 to the first heat pipe 220. Compared with the energy transfer by the way that the first heat pipe 220 is in line contact with the cold end 110 of the semiconductor refrigerator 100, the first energy transmission plane 211 of the first energy transfer member 210 in the heat exchanger is in surface contact with the cold end 110 of the semiconductor refrigerator 100, so that the contact area is increased, the efficiency of energy conduction is higher, and the heat exchange efficiency is higher.
In one embodiment, the number of the first heat pipes 220 is multiple, and the first energy transfer member 210 is sleeved outside all the first heat pipes 220. In this way, the plurality of first heat pipes 220 can absorb the cold energy of the cold end 110 of the semiconductor refrigerator 100 at the same time, thereby further increasing the heat transfer efficiency.
Further, all the first heat pipes 220 are arranged in parallel at intervals along a first preset direction, wherein the first preset direction is parallel to a plane where the cold end 110 of the semiconductor refrigerator 100 is located.
Specifically, the cold ends 110 of the semiconductor coolers 100 are planes, all the parts of the first heat pipes 220 in contact with the first energy transfer member 210 are arranged in parallel at intervals along a first preset direction, and the first preset direction is parallel to the plane where the cold ends 110 of the semiconductor coolers 100 are located, so that the cold energy at each position of the cold ends 110 of the semiconductor coolers 100 can be transferred to the first heat pipes 220.
Furthermore, the first energy transfer member 210 has a plurality of first mounting holes, the plurality of first mounting holes are arranged in parallel along a first predetermined direction at intervals, the plurality of first heat pipes 220 are correspondingly arranged through the plurality of first mounting holes one by one, and a first energy channel is formed between every two adjacent first mounting holes. In other words, in the first energy transfer member 210, a solid body is located between two adjacent first installation holes, and the solid body constitutes a first energy channel for transferring cold energy between the cold end 110 of the semiconductor refrigerator 100 and the first heat pipe 220.
In another embodiment, the first energy transmission member 210 has a plurality of first installation grooves, the plurality of first installation grooves are arranged in parallel along a first preset direction at intervals, the plurality of first heat pipes 220 are correspondingly arranged through the plurality of first installation grooves one by one, and a first energy channel is formed between every two adjacent first installation grooves. In other words, in the first energy transfer member 210, an entity is located between two adjacent first installation grooves, and the entity constitutes a first energy channel for transferring cold energy between the cold end 110 of the semiconductor refrigerator 100 and the first heat pipe 220.
Optionally, a heat conducting medium is filled between the first heat pipe 220 and the first energy transfer member 210, and the heat conducting medium may be heat conducting silica gel or the like, metal powder, oxide powder, graphite powder, diamond powder or the like, so as to improve energy transfer efficiency.
As shown in FIG. 1, in one embodiment, the cooling assembly 200 further includes a cooling fin 230 disposed on the first heat pipe 220. The heat dissipation fins 230 increase the heat transfer area between the first heat pipe 220 and the air, thereby further improving the heat exchange efficiency.
Further, the surface of the cooling fin 230 is coated with a water drainage coating. Thus, when condensed water is condensed on the cooling fins 230, the condensed water can be rapidly discharged by the drainage coating, so that the condensed water is prevented from being attached to the cooling fins 230, the wind resistance is increased, and the refrigeration effect is reduced.
Alternatively, the drainage coating may be an organic hydrophilic coating, such as a polyacrylic acid system or an epoxy system, the hydrophilic angle of the organic hydrophilic coating being less than 20 degrees, such as: 0-3 degrees, 3-6 degrees, 6-9 degrees, 9-12 degrees, 12-15 degrees, 15-18 degrees, 18-20 degrees; or the drainage coating can be a hydrophobic coating, such as a fluorine/silicon material, a synthetic polymer melt polymer, etc., and the hydrophilic angle of the hydrophobic coating is greater than 90 degrees, such as 90-100 degrees, 100-110 degrees, 110-120 degrees, 120-130 degrees, 130-140 degrees, 140-150 degrees, and more than 150 degrees.
In addition, the drainage coating is coated on the surface of the cooling fin 230, so that the accumulation of impurities such as dust on the cooling fin 230 can be avoided, and the cooling effect can be reduced.
As shown in fig. 1 and fig. 3, further, the heat exchanger further includes a heat dissipation assembly 300 disposed at the hot end 120 of the semiconductor refrigerator 100, the heat dissipation assembly 300 includes a second heat pipe 320 and a second energy transmission member 310 having a second energy transmission plane 311, the second energy transmission member 310 is sleeved outside the second heat pipe 320, the second energy transmission plane 311 is attached to the hot end 120 of the semiconductor refrigerator 100, and the second energy transmission member 310 is configured with a second energy channel for enabling the hot end 120 of the semiconductor refrigerator 100 and the second heat pipe 320 to perform heat transmission.
Specifically, the second energy transmission member 310 is made of a metal material or a composite material with good thermal conductivity, and optionally, the second energy transmission member 310 is made of a copper, aluminum or graphite composite material. The second energy transmission element 310 may be fixed to the semiconductor refrigerator 100 by means of a fastening bolt or a snap, and the second energy transmission plane 311 is attached to the hot end 120 of the semiconductor refrigerator 100. In addition, the second heat pipe 320 is connected with the semiconductor refrigerator 100 through the second energy transfer member 310, so that the connection firmness between the second heat pipe 320 and the semiconductor refrigerator 100 can be improved, the second heat pipe 320 is prevented from falling off in the using process, and the reliability is high.
As shown in fig. 1 and 3, in the heat exchanger, the heat dissipation assembly 300 is disposed at the hot end 120 of the semiconductor refrigerator 100, and the heat dissipation assembly 300 can dissipate heat at the hot end 120 of the semiconductor refrigerator 100 as soon as possible, so as to reduce the temperature of the hot end 120 of the semiconductor refrigerator 100, and thus, the temperature of the cold end 110 of the semiconductor refrigerator 100 can be correspondingly reduced, and a better refrigeration effect can be achieved. In addition, the second energy transmission plane 311 of the second energy transmission member 310 is attached to the hot end 120 of the semiconductor refrigerator 100, and the second energy transmission member 310 is sleeved outside the second heat pipe 320, so that the second energy transmission member 310 forms a second energy channel for transmitting heat between the hot end 120 of the semiconductor refrigerator 100 and the second heat pipe 320, and the second energy channel can transmit heat B of the hot end 120 of the semiconductor refrigerator 100 to the second heat pipe 320. Compared with the energy transfer by the way that the second heat pipe 320 is in line contact with the hot end 120 of the semiconductor refrigerator 100, the second energy transmission plane of the second energy transfer member 310 in the heat exchanger is in surface contact with the hot end 120 of the semiconductor refrigerator 100, so that the contact area is increased, the efficiency of energy conduction is higher, and the heat exchange efficiency is higher.
In one embodiment, the number of the second heat pipes 320 is multiple, and the second energy transfer member 310 is sleeved outside all the second heat pipes 320. In this way, the plurality of second heat pipes 320 can absorb heat of the hot end 120 of the semiconductor refrigerator 100 at the same time, thereby further increasing the heat transfer efficiency.
Further, all the parts of the second heat pipes 320 contacting the second energy transfer element 310 are arranged in parallel and at intervals along a second predetermined direction, wherein the second predetermined direction is parallel to the plane where the hot end 120 of the semiconductor refrigerator 100 is located.
Specifically, the second energy transfer member 310 is provided with a plurality of second mounting holes, the plurality of second mounting holes are arranged in parallel along a second preset direction at intervals, the plurality of second heat pipes 320 are arranged in the plurality of second mounting holes in a penetrating manner in a one-to-one correspondence manner, and a second energy channel is constructed between every two adjacent second mounting holes. In other words, in the second energy transfer member 310, a solid body is located between two adjacent second mounting holes, and the solid body constitutes a second energy channel for transferring the heat B between the hot end 120 of the semiconductor refrigerator 100 and the second heat pipe 320.
In another embodiment, the second energy transmission member 310 has a plurality of second installation slots, the second installation slots are arranged in parallel along the second predetermined direction at intervals, the plurality of second heat pipes 320 are correspondingly arranged in the second installation slots in a one-to-one manner, and a second energy channel is formed between every two adjacent second installation slots. In other words, in the second energy transfer member 310, an entity is located between two adjacent second installation grooves, and the entity constitutes a second energy channel for transferring the heat B between the hot end 120 of the semiconductor refrigerator 100 and the second heat pipe 320.
Optionally, a heat-conducting medium (such as heat-conducting silica gel) is coated between the second heat pipe 320 and the second energy transfer member 310, or heat-conducting powder (such as metal powder, oxide powder, graphite powder, and diamond powder) is filled between the second heat pipe 320 and the second energy transfer member 310, so that the energy transfer efficiency is improved.
As shown in FIG. 1, in one embodiment, the heat dissipation assembly 300 further comprises a heat sink 330 disposed on the second heat pipe 320. The heat sink 330 increases the heat transfer area between the second heat pipe 320 and the air, thereby further improving the heat exchange efficiency.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A heat exchanger comprising a semiconductor refrigeration body having a cold end and a hot end;
the heat exchanger also comprises a cold dissipation assembly arranged at the cold end, the cold dissipation assembly comprises a first heat pipe and a first energy transfer piece with a first energy transfer plane, the first energy transfer piece is sleeved outside the first heat pipe, the first energy transfer plane is attached to the cold end, and a first energy channel enabling the cold end and the first heat pipe to carry out cold energy transfer is constructed on the first energy transfer piece; and/or the heat exchanger further comprises a heat dissipation assembly arranged on the hot end, the heat dissipation assembly comprises a second heat pipe and a second energy transfer piece with a second energy transfer plane, the second energy transfer piece is sleeved outside the second heat pipe, the second energy transfer plane is attached to the hot end, and a second energy channel enabling the hot end and the second heat pipe to carry out heat transfer is formed in the second energy transfer piece.
2. The heat exchanger of claim 1, further comprising a cold dissipation assembly disposed at the cold end, wherein the cold dissipation assembly comprises a first heat pipe and a first energy transfer member having a first energy transfer plane, the first energy transfer member is sleeved outside the first heat pipe, the first energy transfer plane is attached to the cold end, and the first energy transfer member is configured with a first energy channel for enabling the cold end and the first heat pipe to perform cold energy transfer;
the first heat pipes are multiple, and the first energy transfer pieces are sleeved outside all the first heat pipes.
3. The heat exchanger of claim 2, wherein all the portions of the first heat pipes in contact with the first energy transfer member are arranged in parallel at intervals along a first predetermined direction, and the first predetermined direction is parallel to a plane in which the cold ends are located.
4. The heat exchanger according to claim 3, wherein the first energy transfer member is provided with a plurality of first mounting holes, the plurality of first mounting holes are arranged side by side at intervals along the first preset direction, the plurality of first heat pipes are arranged in the plurality of first mounting holes in a one-to-one correspondence manner, and the first energy channel is formed between every two adjacent first mounting holes; or
The first energy transmission piece is provided with a plurality of first mounting grooves, the first mounting grooves are arranged in parallel at intervals along a first preset direction, the first heat pipes are arranged in the first mounting grooves in a one-to-one correspondence mode, and the first energy channels are formed between every two adjacent first mounting grooves.
5. The heat exchanger of claim 1, further comprising a cold dissipation assembly disposed at the cold end, wherein the cold dissipation assembly comprises a first heat pipe and a first energy transfer member having a first energy transfer plane, the first energy transfer member is sleeved outside the first heat pipe, the first energy transfer plane is attached to the cold end, and the first energy transfer member is configured with a first energy channel for enabling the cold end and the first heat pipe to perform cold energy transfer;
and a heat-conducting medium is filled between the first heat pipe and the first energy transfer member.
6. The heat exchanger of claim 1, further comprising a cold dissipation assembly disposed at the cold end, wherein the cold dissipation assembly comprises a first heat pipe and a first energy transfer member having a first energy transfer plane, the first energy transfer member is sleeved outside the first heat pipe, the first energy transfer plane is attached to the cold end, and the first energy transfer member is configured with a first energy channel for enabling the cold end and the first heat pipe to perform cold energy transfer;
the cold dissipation assembly further comprises a cold dissipation sheet arranged on the first heat pipe.
7. The heat exchanger according to claim 1, further comprising a heat dissipation assembly disposed at the hot end, wherein the heat dissipation assembly comprises a second heat pipe and a second energy transfer member having a second energy transfer plane, the second energy transfer member is sleeved outside the second heat pipe, the second energy transfer plane is attached to the hot end, and the second energy transfer member is configured with a second energy passage for transferring heat between the hot end and the second heat pipe;
the second heat pipes are multiple, and the second energy transfer pieces are sleeved outside all the second heat pipes.
8. The heat exchanger of claim 7, wherein all the portions of the second heat pipes in contact with the second energy transfer element are arranged in parallel and at intervals along a second predetermined direction, and the second predetermined direction is parallel to a plane on which the hot end is located.
9. The heat exchanger according to claim 8, wherein the second energy transmission member is provided with a plurality of second mounting holes, the plurality of second mounting holes are arranged in parallel along the second preset direction at intervals, a plurality of second heat pipes are arranged in the plurality of second mounting holes in a one-to-one correspondence manner, and a second energy channel is formed between every two adjacent second mounting holes;
or the second energy transfer piece is provided with a plurality of second mounting grooves which are arranged in parallel at intervals along the second preset direction, the plurality of second heat pipes penetrate through the plurality of second mounting grooves in a one-to-one correspondence manner, and a second energy channel is formed between every two adjacent second mounting grooves.
10. The heat exchanger according to claim 1, further comprising a heat dissipation assembly disposed at the hot end, wherein the heat dissipation assembly comprises a second heat pipe and a second energy transfer member having a second energy transfer plane, the second energy transfer member is sleeved outside the second heat pipe, the second energy transfer plane is attached to the hot end, and the second energy transfer member is configured with a second energy passage for transferring heat between the hot end and the second heat pipe;
the heat dissipation assembly further comprises a heat dissipation fin arranged on the second heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110016781.3A CN112728806A (en) | 2021-01-07 | 2021-01-07 | Heat exchanger |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110016781.3A CN112728806A (en) | 2021-01-07 | 2021-01-07 | Heat exchanger |
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| CN112728806A true CN112728806A (en) | 2021-04-30 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101922778A (en) * | 2010-09-26 | 2010-12-22 | 广东新创意专利发展有限公司 | Semiconductor refrigerating air conditioning device |
| CN104654669A (en) * | 2015-02-03 | 2015-05-27 | 青岛海尔股份有限公司 | Heat exchange device and semiconductor cryogenic refrigerator with same |
| CN108758882A (en) * | 2018-08-06 | 2018-11-06 | 奥克斯空调股份有限公司 | A kind of semiconductor refrigerating dehumidizer and its dehumanization method |
| CN209415829U (en) * | 2018-12-26 | 2019-09-20 | 广东万和新电气股份有限公司 | Cooling device and range hood with refrigerating function |
| CN214469442U (en) * | 2021-01-07 | 2021-10-22 | 施斌卿 | Heat exchanger |
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2021
- 2021-01-07 CN CN202110016781.3A patent/CN112728806A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101922778A (en) * | 2010-09-26 | 2010-12-22 | 广东新创意专利发展有限公司 | Semiconductor refrigerating air conditioning device |
| CN104654669A (en) * | 2015-02-03 | 2015-05-27 | 青岛海尔股份有限公司 | Heat exchange device and semiconductor cryogenic refrigerator with same |
| CN108758882A (en) * | 2018-08-06 | 2018-11-06 | 奥克斯空调股份有限公司 | A kind of semiconductor refrigerating dehumidizer and its dehumanization method |
| CN209415829U (en) * | 2018-12-26 | 2019-09-20 | 广东万和新电气股份有限公司 | Cooling device and range hood with refrigerating function |
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