CN210778584U - Full-color LED packaging device with light emitting from side surface - Google Patents
Full-color LED packaging device with light emitting from side surface Download PDFInfo
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- CN210778584U CN210778584U CN201921470575.4U CN201921470575U CN210778584U CN 210778584 U CN210778584 U CN 210778584U CN 201921470575 U CN201921470575 U CN 201921470575U CN 210778584 U CN210778584 U CN 210778584U
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Abstract
The utility model provides a full-color LED encapsulation device of side light-emitting, including the side paste formula support and install in the LED chip of side paste formula support, the LED chip includes ruddiness chip, green glow chip and blue light chip, the side paste formula support is equipped with four support pins, and four support pins are ruddiness positive pole support pin, green glow positive pole support pin, blue light positive pole support pin and negative pole support pin respectively, the electrode of LED chip with the support pin links to each other, makes the electrode of LED chip with the support pin forms electrical connection. The utility model has the advantages that: the utility model discloses the LED light source can be used at the terminal and realize the side mode of pasting owing to adopt side to paste the dress structure, has changed the selection variety of light-emitting mode, has made things convenient for the design face of terminal product, has reduced the input of the cost of terminal light source.
Description
Technical Field
The utility model relates to a LED technical field especially relates to a full-color LED encapsulation device of side light-emitting.
Background
The LED is widely used as a fourth generation green lighting source, and a full-color LED device light source capable of adjusting color and light can be used in special occasions of fantasy color, light and color adjustment, such as outdoor landscape lighting, markets, counters, coffee shops, and the like. The LED lamp can be used for dimming and mixing colors, has multiple functions, and can be arranged at the front end of the LED lighting in the comprehensive intelligent direction.
The existing packaging mode for achieving the light source effect mainly adopts a plurality of external SMD low-power device combination circuits, wherein the current mainstream adopts a conventional 020/010 backlight low-power full-color product, the thickness of an LED is thin, the strength of a support is low, and a dead lamp and poor support fracture easily occur. The lamp beads need to be protected particularly when the hard board is applied, the problems of low design flexibility, low brightness, low product reliability and the like exist, the product stability is greatly reduced, the production yield is low, the production efficiency is low, and the potential hazard of terminal use is large. Therefore, the technical staff in the field needs to solve the problem of how to provide an RGB product three-in-one side-mounted product packaging product having the characteristics of high brightness, high production efficiency, low thermal resistance, good reliability, high bracket strength, various application modes and the like.
SUMMERY OF THE UTILITY MODEL
The utility model provides a full-color LED encapsulation device of side light-emitting, including the side paste formula support and install in the LED chip of side paste formula support, the LED chip includes ruddiness chip, green glow chip and blue light chip, the side paste formula support is equipped with four support pins, and four support pins are ruddiness positive pole support pin, green glow positive pole support pin, blue light positive pole support pin and negative pole support pin respectively, the electrode of LED chip with the support pin links to each other, makes the electrode of LED chip with the support pin forms electrical connection.
As a further improvement of the present invention, the P pole of the red light chip is connected to the pin of the red light anode support, and the N pole of the red light chip is connected to the pin of the cathode support; the P pole of the green chip is connected with the pin of the green anode support, and the N pole of the green chip is connected with the pin of the cathode support; the P pole of the blue light chip is connected with the pin of the blue light anode support, and the N pole of the blue light chip is connected with the pin of the cathode support.
As a further improvement, the periphery at the inside and LED chip place of side-mounted support covers has the transparent encapsulation silica gel layer of high heat resistance.
As a further improvement, the red light chip adopts a single-electrode 9mil wafer chip.
As a further improvement, the blue light chip and the green light chip adopt a single double-electrode parallel structure chip.
As a further improvement of the present invention, the electrode of the LED chip is connected to the support pin through a gold thread.
As a further improvement of the utility model, the gold thread is Au more than or equal to 99.99% gold thread.
The utility model has the advantages that: the utility model discloses the LED light source can be used at the terminal and realize the side mode of pasting owing to adopt side to paste the dress structure, has changed the selection variety of light-emitting mode, has made things convenient for the design face of terminal product, has reduced the input of the cost of terminal light source.
Drawings
Fig. 1 is a schematic plan view of the present invention;
fig. 2 is a schematic perspective view of the present invention.
Detailed Description
As shown in fig. 1 and 2, the utility model discloses a full-color LED encapsulation device of side light-emitting, including side subsides formula support 10 and install in the LED chip of side subsides formula support 10, the LED chip includes ruddiness chip 21, green glow chip 22 and blue light chip 23, side subsides formula support 10 is equipped with four support pins, and four support pins are ruddiness positive support pin 11, the anodal support pin 12 of green glow, the anodal support pin 13 of blue light and negative pole support pin 14 respectively, the electrode of LED chip with the support pin links to each other, makes the electrode of LED chip with the support pin forms electrical connection.
The P pole of the red light chip 21 is connected with the red light anode support pin 11, and the N pole of the red light chip 21 is connected with the cathode support pin 14; the P pole of the green chip 22 is connected with the green light anode support pin 12, and the N pole of the green chip 22 is connected with the cathode support pin 14; the P pole of the blue light chip 23 is connected with the blue light anode support pin 13, and the N pole of the blue light chip 23 is connected with the cathode support pin 14.
The utility model discloses in, through the current regulation and the on-off control to ruddiness chip 21, green glow chip 22 and blue light chip 23, utilize the three primary colors principle, make its light of mixing out different colour temperatures and colours.
The side pastes the periphery that formula support 10 inside and LED chip place and covers and have high heat resistance transparent encapsulation silica gel layer, this high heat resistance transparent encapsulation silica gel layer adopts the silica gel that high thixotropic effect and long-term heat resistance reach 160 ℃, and overall structure is even pleasing to the eye, and the preparation is convenient.
The red light chip 21 adopts a single-electrode 9mil wafer chip, and the bottom of the chip is physically connected by using Japanese high-heat-conductivity insulating glue.
The blue light chip 23 and the green light chip 22 adopt a single double-electrode parallel structure chip, and the bottoms of the chips are physically and fixedly connected by adopting Japanese high-heat-conductivity confidence insulating glue.
The electrode of the LED chip is connected with the support pins through gold wires, the gold wires are gold wires with Au content of more than or equal to 99.99%, connection stability and firmness are improved, and electric failure of products caused by overheating and glue stress is avoided.
The support pin is a side surface leading-out mounting structure, and a side surface welding and light emitting mode can be realized in terminal application.
The side mounting type support 10 is a side mounting structure 4020 support, the side mounting structure 4020 support adopts PPA plastic materials to enhance bending strength and heat resistance, and a welding pin adopts a side mounting structure.
The red chip 21, the green chip 22 and the blue chip 23 are 625nm red, 525nm green and 465nm blue chips, respectively.
The red light chip 21, the green light chip 22 and the blue light chip 23 are fixed at corresponding positions on the heat sink on the side-mounted bracket 10 through high-thermal-conductivity insulating glue, and high-heat-resistance and high-adhesiveness glue is filled in the side-mounted structure 4020 bracket. The stability and the fastness of connection have been improved, overall structure is even pleasing to the eye, and the preparation is convenient, the utility model discloses the pin adopts side subsides dress structural support to strengthen the lateral surface intensity, avoided the easy fracture of side subsides LED SMD (020010) device, can't be applied to the problem of flexible PCB product, the terminal of being convenient for is at the circuit and the scheme design of flexible application scene application end such as non-standard demonstration, lamp area.
The utility model also discloses a manufacturing method, including following step:
the method comprises the following steps: manufacturing a side-mounted bracket 10, namely, injecting PPA plastic material on a red copper material belt, and then plating a silver layer on the bracket copper material in an electroplating way to form a circuit layer and a welding wire layer; the bracket can be integrally spliced during manufacturing, and finally, blanking is carried out after glue dispensing is finished;
step two: carrying out die bonding on the manufactured side-mounted support 10, wherein the die bonding is to fix three-color LED chips on the inner part of the side-mounted support 10 by using insulating glue, so that the LED chips and the side-mounted support 10 form a stable and consistent heat guiding channel and position, and laying a foundation for the third step;
step three: connecting P, N levels of the LED chip with positive and negative levels of the support pins by adopting Au99.99% bonding wires by using advanced production equipment after the step II is completed, so that the electrodes of the LED chip are electrically connected with the support pins;
step four: preparing packaging glue, and adopting silica gel with high thixotropic effect and long-term heat resistance of 160 ℃;
step five: coating prepared packaging glue on the side-mounted bracket 10 welded with the LED chip as required;
step six: and baking, inspecting and packaging the LED product coated with the packaging adhesive.
The utility model discloses beneficial effect: the utility model discloses the LED light source can be used at the terminal and realize the side mode of pasting owing to adopt side to paste the dress structure, has changed the selection variety of light-emitting mode, has made things convenient for the design face of terminal product, has reduced the input of the cost of terminal light source, and adopts 112 raw materials plastic material thickened type supports, is favorable to improving heat conduction efficiency and support bending performance intensity, reduces LED chip light decay, increase of service life. Just the utility model discloses an integral packaging structure, disconnect-type circuit structure have reduced single earlier the packaging into the production technology of LED monochromatic lamp pearl with the LED chip, have promoted single LED power and luminance, have reduced manufacturing cost, make the preparation technology of whole terminal lamps and lanterns simpler, and the design is more nimble various, and the application field can be covered keyboard, mouse and be shaded, adjusts luminance mixing of colors lamps and lanterns etc. field.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (7)
1. The utility model provides a full-color LED encapsulation device of side light-emitting which characterized in that: the LED chip comprises a side-mounted support and an LED chip arranged on the side-mounted support, wherein the LED chip comprises a red light chip, a green light chip and a blue light chip, the side-mounted support is provided with four support pins, the four support pins are respectively a red light anode support pin, a green light anode support pin, a blue light anode support pin and a cathode support pin, and an electrode of the LED chip is connected with the support pins so that the electrode of the LED chip is electrically connected with the support pins.
2. The side-emitting full-color LED package device according to claim 1, wherein: the P pole of the red light chip is connected with the pin of the red light anode support, and the N pole of the red light chip is connected with the pin of the cathode support; the P pole of the green chip is connected with the pin of the green anode support, and the N pole of the green chip is connected with the pin of the cathode support; the P pole of the blue light chip is connected with the pin of the blue light anode support, and the N pole of the blue light chip is connected with the pin of the cathode support.
3. The side-emitting full-color LED package device according to claim 1, wherein: and a high-heat-resistance transparent packaging silica gel layer covers the inside of the side-mounted support and the periphery where the LED chip is located.
4. The side-emitting full-color LED package device according to claim 1, wherein: the red light chip adopts a single-electrode 9mil wafer chip.
5. The side-emitting full-color LED package device according to claim 1, wherein: the blue light chip and the green light chip adopt single double-electrode parallel structure chips.
6. The side-emitting full-color LED package device according to claim 1, wherein: and the electrode of the LED chip is connected with the support pin through a gold thread.
7. The side-emitting full-color LED package device according to claim 1, wherein: the red light chip, the green light chip and the blue light chip are fixed at the corresponding positions of the centers of the heat radiating fins on the side-mounted support through high-thermal-conductivity insulating glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921470575.4U CN210778584U (en) | 2019-09-05 | 2019-09-05 | Full-color LED packaging device with light emitting from side surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921470575.4U CN210778584U (en) | 2019-09-05 | 2019-09-05 | Full-color LED packaging device with light emitting from side surface |
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| Publication Number | Publication Date |
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| CN210778584U true CN210778584U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921470575.4U Active CN210778584U (en) | 2019-09-05 | 2019-09-05 | Full-color LED packaging device with light emitting from side surface |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112599514A (en) * | 2020-12-31 | 2021-04-02 | 南京工业大学 | High-quality full-color semiconductor light source |
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2019
- 2019-09-05 CN CN201921470575.4U patent/CN210778584U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112599514A (en) * | 2020-12-31 | 2021-04-02 | 南京工业大学 | High-quality full-color semiconductor light source |
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Address after: 518000 floor 5, building B and floor 6, building B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Liangan Technology Co.,Ltd. Address before: 518000 6 / F, block a and 6 / F, block B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN LIANGAN PHOTOELECTRICITY TECHNOLOGY CO.,LTD. |
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| CP03 | Change of name, title or address |