CN208738239U - A kind of all-colour LED packaging that pin stretches out - Google Patents

Abstract

The utility model provides a kind of all-colour LED packaging that pin stretches out, it include: bracket, the first cooling fin, the second cooling fin, third cooling fin, the 4th cooling fin, the first LED chip, the second LED chip and third LED chip, there are four the connecting pins being independently arranged for the bracket setting；First cooling fin, the second cooling fin, third cooling fin, the 4th cooling fin are symmetrically disposed on the bracket, and are connected respectively with an one-to-one connecting pin；First LED chip is fixedly installed on first cooling fin, and second LED chip is fixedly installed on second cooling fin, and the third LED chip is fixedly installed on the third cooling fin.The utility model effectively increases the stability and fastness of connection, and overall structure is uniformly beautiful, easy to make, is conducive to the raising of production efficiency and production yield, reduces terminal in the circuit and conceptual design difficulty of the finished products application end such as display and backlight.

Description

A kind of all-colour LED packaging that pin stretches out

Technical field

The utility model relates to the all-colour LED packagings that a kind of LED packaging more particularly to a kind of pin stretch out.

Background technique

LED has been widely used at present as forth generation green illumination light source, and wherein color-adjustable light modulation is complete Color LED component light source can be used for the special occasions of illusion-colour and light modulation toning, such as outdoor scene brightening, market, sales counter and coffee shop Equal places.It above can be made the function of light modulation toning in application, a lamp is multi-purpose, walks before the comprehensive intelligent direction of LED illumination End.

Existing encapsulation reaches this light source effect mode and mainly uses external more SMD low-power device grouping circuits, In at present mainstream there are two types of packaged type: the first, using the conventional full-color product of small-power 3528, LED thickness height is high, nothing Method is applied to ultrathin products application, and finished-product volume is huge, and design operation space is small, can only use reflow soldering；The first, uses The 5050 0.2W product of small-power of middle size, same power is relatively low, and light extraction efficiency is low, and the occasion emitting brightness of required design is not Foot, can not highlight landscape effect, can only use reflow soldering.

There is the problems such as flexible design degree is low, brightness is relatively low and product reliability is low in both the above mode, drop significantly The problems such as low product stability, there are production yield is low and production efficiency is low, terminal is big using hidden danger.

Summary of the invention

Technical problem to be solved in the utility model is to need to provide a kind of stability that can be improved connection and securely Property, improve the all-colour LED packaging of production efficiency.

In this regard, the utility model provides a kind of all-colour LED packaging that pin stretches out, comprising: bracket, the first heat dissipation Piece, the second cooling fin, third cooling fin, the 4th cooling fin, the first LED chip, the second LED chip and third LED chip, it is described There are four the connecting pins being independently arranged for bracket setting；First cooling fin, the second cooling fin, third cooling fin, the 4th dissipate Backing is symmetrically disposed on the bracket, and is connected respectively with an one-to-one connecting pin；First LED chip It is fixedly installed on first cooling fin, second LED chip is fixedly installed on second cooling fin, the third LED chip is fixedly installed on the third cooling fin.

Further improvement of the utility model is that four connecting pins being independently arranged include that the first cathode draws Foot, the second negative pin, third negative pin and shared positive pin, first cooling fin and the first negative pin phase Connection, second cooling fin are connected with second negative pin, the third cooling fin and the third negative pin It is connected, the 4th cooling fin is connected with the shared positive pin.

Further improvement of the utility model is that the cathode of first LED chip is connected to described by gold thread The cathode of one cooling fin, second LED chip is connected to second cooling fin by gold thread, the third LED chip Cathode is connected to the third cooling fin by gold thread, and first LED chip, the second LED chip and third LED chip are just Pole passes through gold thread respectively and is connected to the 4th cooling fin.

Further improvement of the utility model is, first negative pin, the second negative pin, third negative pin It is set to the both ends of the bracket parallelly with shared positive pin.

Further improvement of the utility model is that first LED chip is red LED chip, second LED core Piece is green LED chip, and the third LED chip is blue-light LED chip.

Further improvement of the utility model is that first LED chip, the second LED chip and third LED chip are logical Thermal conductive insulation glue is crossed to be individually fixed on first cooling fin, the second cooling fin and third cooling fin.

Further improvement of the utility model is, invagination placed cavity, first LED core are provided on the bracket Piece, the second LED chip and third LED chip are arranged by first cooling fin, the second cooling fin and third cooling fin respectively In the bottom center of the invagination placed cavity.

Further improvement of the utility model is, first cooling fin, the second cooling fin, third cooling fin, the 4th Transparent envelope is filled between cooling fin, the first LED chip, the second LED chip and third LED chip and the invagination placed cavity Glue-line.

Further improvement of the utility model is that the inner wall of the invagination placed cavity is low wide and up narrow gradient inner wall.

Further improvement of the utility model is, is provided with bracket notch on an angle of the bracket.

Compared with prior art, the utility model has the beneficial effects that: bracket setting there are four be independently arranged Connecting pin, each of which connecting pin are correspondingly arranged with a cooling fin, effectively increase the stability and fastness of connection, Overall structure is uniformly beautiful, easy to make, is conducive to the raising of production efficiency；Further, the utility model is drawn using connection Foot projects in parallel out the bracket of formula structure, avoid LED SMD device can not wave soldering the problems such as, further improve production Efficiency and production yield, the circuit and conceptual design difficulty, product for reducing terminal in the finished products application end such as display and backlight are steady It is qualitative good.

Detailed description of the invention

Fig. 1 is a kind of schematic perspective view of embodiment of the utility model；

Fig. 2 is that a kind of the utility model embodiment faces the schematic diagram of the section structure；

Fig. 3 is a kind of side elevational cross-section structural schematic diagram of embodiment of the utility model.

Specific embodiment

With reference to the accompanying drawing, the preferably embodiment of the utility model is described in further detail.

As shown in Figure 1 to Figure 3, this example provides a kind of all-colour LED packaging that pin stretches out, comprising: bracket 5, first Cooling fin 1, the second cooling fin 2, third cooling fin 3, the 4th cooling fin 4, the first LED chip 6, the second LED chip 7 and third LED chip 8, there are four the connecting pins being independently arranged for the setting of bracket 5；First cooling fin 1, the second cooling fin 2, Three cooling fins 3, the 4th cooling fin 4 are symmetrically disposed on the bracket 5, and are connected respectively with an one-to-one connecting pin It connects；First LED chip 6 is fixedly installed on first cooling fin 1, and second LED chip 7 is fixedly installed on described On second cooling fin 2, the third LED chip 8 is fixedly installed on the third cooling fin 3.

Bracket 5 described in this example is pin reach bracket, preferably the thermoelectric separated bracket of plastics, for example uses PPA Plastic rubber material enhances heat resistance, and avoiding feux rouges stripping problem LED core tablet stability caused by elargol die bond has many raisings, Plastic rubber bracket is conducive to improve heat transfer efficiency and heat dissipation effect simultaneously, reduces LED chip light decay, prolongs the service life.Through reality Verify bright, the bracket 5 is preferably dimensioned to be 3.3*2.8mm, and light-emitting area is φ 1.7mm, with a thickness of 1.75mm；Described first Cooling fin 1, the second cooling fin 2, third cooling fin 3, the 4th cooling fin 4 are selected as heat dissipation bonding pad, for realizing large area Die bond.In order to realize the discrete setting of connection pin, first cooling fin 1, the second cooling fin 2, third cooling fin the 3, the 4th It is arranged independently of each other between cooling fin 4, i.e. the first cooling fin 1, the second cooling fin 2, third cooling fin 3, the 4th cooling fin 4 do not have It links together.

This example uses monoblock type encapsulating structure, Split type electric line structure, reduces and is individually first packaged into LED chip The producting process difficulty of LED monochrome lamp bead improves power and the brightness of single LED chip, reduces production cost, make it The manufacture craft of the terminal lamps and lanterns at place is simpler, designs more flexible multiplicity, application field can cover keyboard, mouse backlight with And the fields such as light modulation toning lamps and lanterns.

Four connecting pins being independently arranged described in this example are negative including the first negative pin 9, the second negative pin 10, third Pole pin 11 and shared positive pin 12, first cooling fin 1 are connected with first negative pin 9, and described second dissipates Backing 2 is connected with second negative pin 10, and the third cooling fin 3 is connected with the third negative pin 11, institute The 4th cooling fin 4 is stated to be connected with the shared positive pin 12.As shown in Figure 1, the cathode of the first LED chip 6 described in this example First cooling fin 1 is connected to by gold thread 15, and the cathode of second LED chip 7 is connected to described the by gold thread 15 The cathode of two cooling fins 2, the third LED chip 8 is connected to the third cooling fin 3, first LED core by gold thread 15 The anode of piece 6, the second LED chip 7 and third LED chip 8 is connected to the 4th cooling fin 4 by gold thread 15 respectively.It is described Gold thread 15 preferably uses the gold thread of Au >=99.99%, improves the stability, fastness and good electric conductivity of connection, avoids Overheat and glue stress lead to product electrical property failure.

That is, all-colour LED packaging described in this example preferably includes 3528 pin reach bracket, in the bracket 5 Inside have control LED three tunnels connection LED chip P the pole N connecting pin, by peripheral control unit to three LED chips Current regulation and switch control can blend the light of different-colour and color using three primary color theory.

Preferably, the first negative pin 9, the second negative pin 10 described in this example, third negative pin 11 and shared anode Pin 12 is set to the both ends of the bracket 5 parallelly.The bracket that formula structure is projected in parallel out using connection pin, can be in terminal Using realize back patch and wave soldering mode, and then avoid LED SMD device can not wave soldering the problems such as, further mention High production efficiency and production yield, the circuit and conceptual design for reducing terminal in the finished products application end such as display and backlight are difficult Degree, product stability are good.

First LED chip 6 described in this example is red LED chip, which preferably uses parallel construction double Electrode 12mil wafer chip, such as the red LED chip of 625nm；Second LED chip 7 is green LED chip, such as 525nm Green LED chip；The third LED chip 8 is blue-light LED chip, such as the blue-light LED chip of 465nm；The green light LED Chip and blue-light LED chip preferably use single bipolar electrode parallel construction chip.And first LED chip 6, the second LED core As described in piece 7 and third LED chip 8 are preferably individually fixed in by thermal conductive insulation glue (such as the high thermal conductivity insulating cement of SHIN-ETSU HANTOTAI, Japan) On first cooling fin 1, the second cooling fin 2 and third cooling fin 3.

Invagination placed cavity 13, first LED chip 6, the second LED chip 7 and third are provided on bracket 5 described in this example LED chip 8 is set to the invagination placed cavity by first cooling fin 1, the second cooling fin 2 and third cooling fin 3 respectively 13 bottom center.It is described invagination placed cavity 13 be the bracket 5 the cavity to lower recess, for place the first cooling fin 1, Second cooling fin 2, third cooling fin 3, the 4th cooling fin 4, the first LED chip 6, the second LED chip 7 and third LED chip 8 Deng.

First cooling fin 1, the second cooling fin 2 described in this example, third cooling fin 3, the 4th cooling fin 4, the first LED chip 6, Transparent adhesive layer is filled between second LED chip 7 and third LED chip 8 and the invagination placed cavity 13.That is, The transparent adhesive layer is filled in first cooling fin 1, the second cooling fin 2, third cooling fin 3, the 4th cooling fin 4, first Within space between LED chip 6, the second LED chip 7 and third LED chip 8 and the invagination placed cavity 13, that is, fill The spare space of the invagination placed cavity 13, the transparent adhesive layer is preferably the packaging silicon rubber glue-line of high-fire resistance, this is transparent Adhesive layer is the colloid of high-fire resistance and caking property, high thixotropic effects and long-term heat resistance can reach 160 DEG C.

It is further preferable that the inner wall for the placed cavity 13 that invaginates described in this example is low wide and up narrow gradient inner wall.The i.e. described invagination The bottom interior wall of placed cavity 13 is thicker than top inner wall.This low wide and up narrow gradient interior wall construction setting is the levelling for glue And increase its adhesive strength.

As depicted in figs. 1 and 2, bracket notch 14 is provided on an angle of bracket 5 described in this example.The bracket notch 14 For mark part, it is preferred for indicating the position on bracket 5 where third LED chip 8.Certainly, in practical applications, which lacks The position of mouth 14 can be adjusted and be arranged according to actual needs.

As shown in Figure 3, it is preferred that bracket 5 described in this example is realized to raise and be set by four connecting pins being independently arranged It sets, i.e., the described bracket 5, which is raised, to be set in four connecting pins being independently arranged, so that the bottom of the bracket 5 Will not directly be in contact with placed side, and then enhance its heat dissipation effect etc..

To sum up, the setting of bracket 5 described in this example is there are four the connecting pin that is independently arranged, each of which connecting pin with one Cooling fin is correspondingly arranged, and effectively increases the stability and fastness of connection, and overall structure is uniformly beautiful, easy to make, favorably In the raising of production efficiency；Further, this example projects in parallel out the bracket 5 of formula structure using connection pin, avoids LED SMD Device can not wave soldering the problems such as, further improve production efficiency and production yield, reduce terminal show and carry on the back The circuit and conceptual design difficulty of the finished products application end such as light, product stability are good.

The manufacturing process of this example this example is as follows: the first, making the bracket 5 of pin run-in index, i.e., be molded on red metal material strip Then PPA plastic rubber material uses plating mode silver coating on bracket copper material, to form circuit layer and bonding wire layer, i.e. bracket 1 includes modeling Material rack body and the silver coating being set on plastic stent ontology；Bracket 5 during fabrication can whole spliced manufacture, finally Blanking processing is carried out after dispensing is complete；

The second, carry out die bond on the bracket 5 made, the die bond be by three LED, three color chip with it is thermally conductive absolutely Edge glue fixed chip makes LED chip and bracket 5 form the heat derives channel and position of stable and consistent on respective cooling fin It sets.

LED chip P, N grade is connect by third using Au99.99% bonding line (gold thread 15) with the positive and negative grade of bracket pin On, it forms the electrode of LED chip and bracket pin and is electrically connected.

4th, the transparent enclosure glue that can reach 160 DEG C using high thixotropic effects and long-term heat resistance is welding LED Deployed transparent enclosure glue is coated on the bracket 5 of chip as needed.

6th, the LED product of coated packaging plastic is toasted, examined and is packed.

The specific embodiment of the above is the better embodiment of the utility model, and it is practical new not to limit this with this The specific implementation range of type, the scope of the utility model includes being not limited to present embodiment, all according to the utility model Shape, structure made by equivalence changes it is within the protection scope of the present utility model.

Claims (10)

1. the all-colour LED packaging that a kind of pin stretches out characterized by comprising bracket, the first cooling fin, the second heat dissipation Piece, third cooling fin, the 4th cooling fin, the first LED chip, the second LED chip and third LED chip, the bracket are provided with Four connecting pins being independently arranged；First cooling fin, the second cooling fin, third cooling fin, the 4th cooling fin are symmetrically set It is placed on the bracket, and is connected respectively with an one-to-one connecting pin；First LED chip is fixedly installed on On first cooling fin, second LED chip is fixedly installed on second cooling fin, and the third LED chip is solid Surely it is set on the third cooling fin.

2. the all-colour LED packaging that pin according to claim 1 stretches out, which is characterized in that described four independently set The connecting pin set includes the first negative pin, the second negative pin, third negative pin and shares positive pin, and described first Cooling fin is connected with first negative pin, and second cooling fin is connected with second negative pin, and described Three cooling fins are connected with the third negative pin, and the 4th cooling fin is connected with the shared positive pin.

3. the all-colour LED packaging that pin according to claim 2 stretches out, which is characterized in that first LED chip Cathode first cooling fin is connected to by gold thread, the cathode of second LED chip is connected to described by gold thread The cathode of two cooling fins, the third LED chip is connected to the third cooling fin, first LED chip, by gold thread The anode of two LED chips and third LED chip is connected to the 4th cooling fin by gold thread respectively.

4. the all-colour LED packaging that pin according to claim 2 stretches out, which is characterized in that first cathode draws Foot, the second negative pin, third negative pin are set to the both ends of the bracket parallelly with positive pin is shared.

5. the all-colour LED packaging that pin according to any one of claims 1 to 4 stretches out, which is characterized in that described First LED chip is red LED chip, and second LED chip is green LED chip, and the third LED chip is blue light LED chip.

6. the all-colour LED packaging that pin according to claim 5 stretches out, which is characterized in that first LED core Piece, the second LED chip and third LED chip are individually fixed in first cooling fin, the second cooling fin by thermal conductive insulation glue On third cooling fin.

7. the all-colour LED packaging that pin according to any one of claims 1 to 4 stretches out, which is characterized in that described Invagination placed cavity is provided on bracket, first LED chip, the second LED chip and third LED chip pass through described respectively One cooling fin, the second cooling fin and third cooling fin are set to the bottom center of the invagination placed cavity.

8. the all-colour LED packaging that pin according to claim 7 stretches out, which is characterized in that first cooling fin, Second cooling fin, third cooling fin, the 4th cooling fin, the first LED chip, the second LED chip and third LED chip with it is described Transparent adhesive layer is filled between invagination placed cavity.

9. the all-colour LED packaging that pin according to claim 7 stretches out, which is characterized in that the invagination placed cavity Inner wall be low wide and up narrow gradient inner wall.

10. the all-colour LED packaging that pin according to any one of claims 1 to 4 stretches out, which is characterized in that institute It states and is provided with bracket notch on an angle of bracket.